外延片市场机会、成长驱动因素、产业趋势分析及2024-2032年预测

2023年全球外延片市场价值为48亿美元，预计2024年至2032年复合年增长率将超过13%。着推动外延片市场。随着消费性电子、汽车和电信等产业的扩张，对高效、紧凑的半导体元件的需求不断增加。需求的激增推动了外延晶圆的采用，外延晶圆以其卓越的电气性能和热稳定性而闻名。再生能源正在推动外延晶圆的需求显着增加。

整个外延晶圆产业根据晶圆类型、晶圆尺寸、最终用途、应用、沉积方法和地区进行分类。市场依沉积方法分类，包括分子束外延（MBE）、化学气相沉积（CVD）、金属有机化学气相沉积（MOCVD）、液相外延（LPE）等。值得注意的是，分子束外延 (MBE) 领域预计在预测期内复合年增长率将超过 15%。分子束外延 (MBE) 在外延晶圆市场中脱颖而出，因其能够生产具有原子级精度和纯度的外延层而闻名。

MBE 通常用于研发，在製造专用半导体装置（包括量子点、雷射二极体和高电子迁移率电晶体 (HEMT)）方面也至关重要。依最终用途产业细分，市场涵盖半导体製造、光电子、电力电子、光伏电池等，包括 LED 製造。半导体製造领域预计将主导全球市场，预计到 2032 年收入将超过 50 亿美元。在这一领域，外延片有助于製造高品质、无缺陷的层，增强电晶体、二极体和积体电路等装置的电气性能。

2023年，亚太地区引领全球外延片市场，比重超过30%。亚太地区由中国、日本、韩国和台湾等半导体製造强国主导，是电子产品生产的巨头。从消费性电子产品到汽车和电信等产业，对外延片的需求强劲。在电动车(EV) 和再生能源投资的推动下，5G 基础设施的迅速推出，扩大了对先进半导体装置的需求，推动了亚太地区外延片市场的成长。的巨额投资巩固该地区在这一领域的主导地位。

目录

第 1 章：方法与范围

第 2 章：执行摘要

第 3 章：产业洞察

• 产业生态系统分析
• 供应商矩阵
• 利润率分析
• 技术与创新格局
• 专利分析
• 重要新闻和倡议
• 监管环境
• 衝击力
  • 成长动力
    • 对先进半导体元件的需求不断增长
    • 电动车 (EV) 市场的成长
    • 光子学和光电子学的进步
    • 越来越多地采用化合物半导体
    • 增加半导体製造投资
  • 产业陷阱与挑战
    • 製造成本高
    • 技术挑战和复杂性
• 成长潜力分析
• 波特的分析
• PESTEL分析

第 4 章：竞争格局

• 介绍
• 公司市占率分析
• 竞争定位矩阵
• 战略展望矩阵

第 5 章：市场估计与预测：按晶圆类型，2021-2032 年

• 主要趋势
• 硅基外延晶圆
• 砷化镓 (GaAs) 外延晶圆
• 碳化硅 (SiC) 外延晶圆
• 氮化镓 (GaN) 外延晶圆
• 其他材料

第 6 章：市场估计与预测：依晶圆尺寸，2021-2032 年

• 主要趋势
• 2吋晶圆
• 4吋晶圆
• 6吋晶圆
• 8吋晶圆
• 12吋晶圆
• 其他尺寸

第 7 章：市场估计与预测：按应用划分，2021-2032 年

• 主要趋势
• 消费性电子产品
• 汽车
• 工业的
• 电信
• 卫生保健
• 国防和航太
• 其他的

第 8 章：市场估计与预测：依沉积法，2021-2032

• 主要趋势
• 化学气相沉积（CVD）
• 分子束外延 (MBE)
• 金属有机化学气相沉积（MOCVD）
• 液相外延 (LPE)
• 其他沉积技术

第 9 章：市场估计与预测：依最终用途产业，2021-2032 年

• 主要趋势
• 半导体製造
• 光电
• 电力电子
• 光伏电池
• 其他的

第 10 章：市场估计与预测：按地区划分，2021-2032 年

• 主要趋势
• 北美洲
  • 我们
  • 加拿大
• 欧洲
  • 英国
  • 德国
  • 法国
  • 义大利
  • 西班牙
  • 欧洲其他地区
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳新银行
  • 亚太地区其他地区
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 拉丁美洲其他地区
• MEA
  • 阿联酋
  • 南非
  • 沙乌地阿拉伯
  • MEA 的其余部分

第 11 章：公司简介

• Advanced Wireless Semiconductor Company (AWSC)
• AXT, Inc.
• Cree, Inc. (Now Wolfspeed, Inc.)
• Epistar Corporation
• Freiberger Compound Materials GmbH
• GlobalWafers Co., Ltd.
• IQE plc
• NanoSystec GmbH
• Nichia Corporation
• Saint-Gobain
• Shin-Etsu Chemical Co., Ltd.
• Siltronic AG
• Sino-American Silicon Products Inc. (SAS)
• SK Siltron
• Soitec
• SUMCO Corporation
• Sumitomo Electric Industries, Ltd.
• Topsil Semiconductor Materials A/S
• WaferPro
• Wafer World, Inc.
• Xiamen Powerway Advanced Material Co., Ltd.

The Global Epitaxial Wafer Market was valued at USD 4.8 billion in 2023 and is projected to grow at a CAGR exceeding 13% from 2024 to 2032. The surging demand for advanced semiconductor devices, including high-performance integrated circuits (ICs) and power devices, significantly propels the epitaxial wafer market. As sectors like consumer electronics, automotive, and telecommunications expand, the demand for efficient and compact semiconductor components intensifies. This surge in demand fuels the adoption of epitaxial wafers, known for their superior electrical properties and thermal stability. Renewable energy sources are driving a notable uptick in the demand for epitaxial wafers.

The overall epitaxial wafer industry is classified based on type of wafer, wafer size, end-use, application, deposition method, and region. The market, categorized by deposition methods, includes Molecular Beam Epitaxy (MBE), Chemical Vapor Deposition (CVD), Metalorganic Chemical Vapor Deposition (MOCVD), Liquid Phase Epitaxy (LPE), among others. Notably, the Molecular Beam Epitaxy (MBE) segment is anticipated to witness a CAGR surpassing 15% during the forecast period. Molecular Beam Epitaxy (MBE) stands out in the epitaxial wafer market, celebrated for its capability to produce epitaxial layers with atomic-level precision and purity.

Commonly employed in research and development, MBE is also pivotal in crafting specialized semiconductor devices, including quantum dots, laser diodes, and high-electron-mobility transistors (HEMTs). Segmented by end-use industry, the market encompasses semiconductor manufacturing, optoelectronics, power electronics, photovoltaic cells, and others, including LED manufacturing. The semiconductor manufacturing domain is poised to dominate the global market, projecting revenues exceeding USD 5 billion by 2032. As foundational elements for a myriad of semiconductor devices, epitaxial wafers play a pivotal role in the expansive semiconductor manufacturing industry. Within this sector, epitaxial wafers are instrumental in crafting high-quality, defect-free layers, bolstering the electrical properties of devices like transistors, diodes, and integrated circuits.

In 2023, the Asia-Pacific region led the global epitaxial wafer market, commanding a share exceeding 30%. Dominated by semiconductor manufacturing powerhouses like China, Japan, South Korea, and Taiwan, the Asia-Pacific region is a titan in electronics production. Industries ranging from consumer electronics to automotive and telecommunications drive a robust demand for epitaxial wafers. The swift rollout of 5G infrastructure, bolstered by investments in electric vehicles (EVs) and renewable energy, amplifies the demand for advanced semiconductor devices, propelling the epitaxial wafer market's growth in Asia-Pacific.Furthermore, government initiatives and hefty investments in semiconductor fabrication facilities solidify the region's dominance in this arena.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definition
• 1.2 Base estimates & calculations
• 1.3 Forecast calculation
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Industry 360° synopsis, 2021-2032

Chapter 3 Industry Insights

• 3.1 Industry ecosystem analysis
• 3.2 Vendor matrix
• 3.3 Profit margin analysis
• 3.4 Technology & innovation landscape
• 3.5 Patent analysis
• 3.6 Key news and initiatives
• 3.7 Regulatory landscape
• 3.8 Impact forces
  • 3.8.1 Growth drivers
    • 3.8.1.1 Rising demand for advanced semiconductor devices
    • 3.8.1.2 Growth in electric vehicles (EVs) market
    • 3.8.1.3 Advancements in photonics and optoelectronics
    • 3.8.1.4 Growing adoption of compound semiconductors
    • 3.8.1.5 Increasing investments in semiconductor manufacturing
  • 3.8.2 Industry pitfalls & challenges
    • 3.8.2.1 High manufacturing costs
    • 3.8.2.2 Technological challenges and complexity
• 3.9 Growth potential analysis
• 3.10 Porter's analysis
  • 3.10.1 Supplier power
  • 3.10.2 Buyer power
  • 3.10.3 Threat of new entrants
  • 3.10.4 Threat of substitutes
  • 3.10.5 Industry rivalry
• 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

• 4.1 Introduction
• 4.2 Company market share analysis
• 4.3 Competitive positioning matrix
• 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type of Wafer, 2021-2032 (USD Million & Units)

• 5.1 Key trends
• 5.2 Silicon-based epi wafers
• 5.3 Gallium arsenide (GaAs) epi wafers
• 5.4 Silicon carbide (SiC) epi wafers
• 5.5 Gallium nitride (GaN) epi wafers
• 5.6 Other materials

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Million & Units)

• 6.1 Key trends
• 6.2 2-inch wafers
• 6.3 4-inch wafers
• 6.4 6-inch wafers
• 6.5 8-inch wafers
• 6.6 12-inch wafers
• 6.7 Other sizes

Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million & Units)

• 7.1 Key trends
• 7.2 Consumer electronics
• 7.3 Automotive
• 7.4 Industrial
• 7.5 Telecommunications
• 7.6 Healthcare
• 7.7 Defense and aerospace
• 7.8 Others

Chapter 8 Market Estimates & Forecast, By Deposition Method, 2021-2032 (USD Million & Units)

• 8.1 Key trends
• 8.2 Chemical vapor deposition (CVD)
• 8.3 Molecular beam epitaxy (MBE)
• 8.4 Metalorganic chemical vapor deposition (MOCVD)
• 8.5 Liquid phase epitaxy (LPE)
• 8.6 Other deposition techniques

Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million & Units)

• 9.1 Key trends
• 9.2 Semiconductor manufacturing
• 9.3 Optoelectronics
• 9.4 Power electronics
• 9.5 Photovoltaic cells
• 9.6 Others

Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Million & Units)

• 10.1 Key trends
• 10.2 North America
  • 10.2.1 U.S.
  • 10.2.2 Canada
• 10.3 Europe
  • 10.3.1 UK
  • 10.3.2 Germany
  • 10.3.3 France
  • 10.3.4 Italy
  • 10.3.5 Spain
  • 10.3.6 Rest of Europe
• 10.4 Asia Pacific
  • 10.4.1 China
  • 10.4.2 India
  • 10.4.3 Japan
  • 10.4.4 South Korea
  • 10.4.5 ANZ
  • 10.4.6 Rest of Asia Pacific
• 10.5 Latin America
  • 10.5.1 Brazil
  • 10.5.2 Mexico
  • 10.5.3 Rest of Latin America
• 10.6 MEA
  • 10.6.1 UAE
  • 10.6.2 South Africa
  • 10.6.3 Saudi Arabia
  • 10.6.4 Rest of MEA

Chapter 11 Company Profiles

• 11.1 Advanced Wireless Semiconductor Company (AWSC)
• 11.2 AXT, Inc.
• 11.3 Cree, Inc. (Now Wolfspeed, Inc.)
• 11.4 Epistar Corporation
• 11.5 Freiberger Compound Materials GmbH
• 11.6 GlobalWafers Co., Ltd.
• 11.7 IQE plc
• 11.8 NanoSystec GmbH
• 11.9 Nichia Corporation
• 11.10 Saint-Gobain
• 11.11 Shin-Etsu Chemical Co., Ltd.
• 11.12 Siltronic AG
• 11.13 Sino-American Silicon Products Inc. (SAS)
• 11.14 SK Siltron
• 11.15 Soitec
• 11.16 SUMCO Corporation
• 11.17 Sumitomo Electric Industries, Ltd.
• 11.18 Topsil Semiconductor Materials A/S
• 11.19 WaferPro
• 11.20 Wafer World, Inc.
• 11.21 Xiamen Powerway Advanced Material Co., Ltd.