焊料材料市场机会、成长动力、产业趋势分析与预测 2024 - 2032

Solder Materials Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年09月10日 | 出版商:

Global Market Insights Inc. | 英文 210 Pages | 商品交期: 2-3个工作天内

价格

简介目录

2023 年全球焊料材料市场价值为 47 亿美元，预计 2024 年至 2032 年复合年增长率为 3.4%。随着科技的进步，特别是在穿戴式装置、智慧型装置和物联网等领域，可靠焊接材料的需求激增。此外，欧洲和北美等地区的环境法规正在加速向无铅焊料材料的转变，鼓励製造商采用更环保的替代品并推动市场扩张。焊接材料市场按产品类型、形式、工艺和应用进行分类。

市场分为无铅焊料和铅基焊料。无铅焊料在 2023 年占据市场主导地位，价值 27 亿美元，预计到 2032 年将以 3.6% 的复合年增长率增长。无铅焊料通常由锡、银和铜等合金製成，可与含铅替代品的性能相媲美，同时对环境更安全。消费者对环保电子产品日益偏好，进一步推动了向永续实践的转变。

依形状划分，市场分为线材、棒材、糊剂、预成型件和粉末。 2023年，焊丝占了40.2%的市场份额，这主要是由于其在电子製造中的广泛使用。焊丝对于手动焊接和返工工艺至关重要，可确保各行业 PCB 的可靠连接。儘管电子产品生产的自动化程度不断提高，但对焊锡丝的需求仍然强劲，保持了其在市场上的主导地位。

市场范围
开始年份	2023年
预测年份	2024-2032
起始值	47 亿美元
预测值	63 亿美元
复合年增长率	3.4%

该市场还按工艺细分，包括网版印刷、波峰/回流焊接和选择性焊接。波峰焊/回流焊因其在电子元件大规模生产中的广泛应用而占据主导地位。这种方法可提供高精度和一致的质量，使其成为製造复杂 PCB 的关键。电子产业引领市场，占 60% 的份额。

电信和运算等产业对可靠焊接的需求不断增长，进一步支持了这种主导地位。小型化元件的日益普及巩固了电子领域的领先地位。亚太地区以强大的电子製造基地引领焊接材料市场。该地区先进的基础设施和技术投资进一步有助于其在全球市场需求中的领先地位。

The Global Solder Materials Market was valued at USD 4.7 billion in 2023 and is projected to reach grow at a CAGR of 3.4% from 2024 to 2032. This growth is largely driven by the increasing demand for electronics and consumer devices. As technology advances, particularly in areas such as wearables, smart devices, and IoT, the need for reliable solder materials has surged. Additionally, environmental regulations in regions like Europe and North America are accelerating the shift towards lead-free solder materials, encouraging manufacturers to adopt more eco-friendly alternatives and fueling market expansion. The solder materials market is categorized by product type, form, process, and application.

The market is segmented into lead-free and lead-based solder. Lead-free solder dominated the market with a value of USD 2.7 billion in 2023 and is projected to grow at a CAGR of 3.6% by 2032. This growth is mainly driven by environmental regulations that restrict the use of hazardous materials. Lead-free solder, often made from alloys like tin, silver, and copper, matches the performance of lead-based alternatives while being safer for the environment. The shift towards sustainable practices is further bolstered by consumers' increasing preference for eco-friendly electronics.

By form, the market is segmented into wire, bar, paste, preforms, and powder. In 2023, wire solder held a 40.2% share of the market, largely due to its extensive use in electronics manufacturing. Wire solder is essential for manual soldering and rework processes, ensuring reliable connections in PCBs across various industries. Despite growing automation in electronics production, the demand for wire solder remains strong, maintaining its dominant position in the market.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$4.7 Billion
Forecast Value	$6.3 Billion
CAGR	3.4%

The market is also segmented by process, including screen printing, wave/reflow, and selective soldering. Wave/reflow soldering dominates due to its widespread application in the mass production of electronic components. This method delivers high precision and consistent quality, making it essential in manufacturing complex PCBs. The electronics sector leads the market, holding a 60% share.

The rising demand for reliable soldering in sectors, such as telecommunications and computing further supports this dominance. The increasing use of miniaturized components has solidified the electronics segment's leading position. The Asia Pacific region leads the solder materials market, attributed to a strong electronics manufacturing base. This region's advanced infrastructure and technology investments further contribute to its leadership in global market demand.

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360° synopsis

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
- 3.1.1 Key manufacturers
- 3.1.2 Distributors
- 3.1.3 Profit margins across the industry
3.2 Industry impact forces
- 3.2.1 Growth drivers
- 3.2.2 Market challenges
- 3.2.3 Market opportunity
  - 3.2.3.1 New opportunities
  - 3.2.3.2 Growth potential analysis
3.3 Raw material landscape
3.4 Sustainable manufacturing
3.5 Pricing trends (USD/Ton), 2021 to 2032
3.6 Regulations & market impact
3.7 Porter's analysis
3.8 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company matrix analysis
4.3 Company market share analysis
- 4.3.1 Company Market share analysis by region
  - 4.3.1.1 North America
  - 4.3.1.2 Europe
  - 4.3.1.3 Asia Pacific
  - 4.3.1.4 Latin America
  - 4.3.1.5 Middle East Africa
4.4 Competitive positioning matrix
4.5 Strategic dashboard

Chapter 5 Market Size and Forecast, By Product Type, 2021-2032 (USD Billion, Kilo Tons)

5.1 Key trends
5.2 Lead-based solder
5.3 Lead-free solder

Chapter 6 Market Size and Forecast, By Form, 2021-2032 (USD Billion, Kilo Tons)

6.1 Key trends
6.2 Wire
6.3 Paste
6.4 Bar
6.5 Preforms
6.6 Powder

Chapter 7 Market Size and Forecast, By Process, 2021-2032 (USD Billion, Kilo Tons)

7.1 Key trends
7.2 Screen printing
7.3 Wave/reflow
7.4 Selective soldering

Chapter 8 Market Size and Forecast, By Application, 2021-2032 (USD Billion, Kilo Tons)

8.1 Key trends
8.2 Electronics
8.3 Automotive
8.4 Aerospace
8.5 Industrial

Chapter 9 Market Size and Forecast, By Region, 2021-2032 (USD Billion, Kilo Tons)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 Germany
- 9.3.2 UK
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 Australia
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Argentina
9.6 MEA
- 9.6.1 Saudi Arabia
- 9.6.2 UAE
- 9.6.3 South Africa