封面
市场调查报告书
商品编码
1677902

焊料材料市场规模、份额及成长分析(按合金类型、助焊剂类型、应用、形式、製程和地区)-2025-2032 年产业预测

Solder Materials Market Size, Share, and Growth Analysis, By Alloy Type (Lead-Based Solder, Lead-Free Solder), By Flux Type (Rosin-Based Flux, No-Clean Flux), By Applications, By Form, By Process, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 185 Pages | 商品交期: 3-5个工作天内

价格
简介目录

预计焊料材料市场规模将在 2023 年达到 300 亿美元,从 2024 年的 312 亿美元成长到 2032 年的 427 亿美元,预测期内(2025-2032 年)的复合年增长率为 4.0%。

受智慧型手机、平板电脑和笔记型电脑等电子设备需求不断增长的推动,全球焊料材料市场呈上升趋势。特别是5G、AI等技术的快速进步极大地推动了市场的成长,而小型化趋势则对具有优异导电性和导热性的焊料材料产生了需求。此外,人们的环保意识不断增强,推动了无铅焊料的普及。人们对具有耐腐蚀性和极端温度下稳定性的高性能材料的需求不断增长。汽车和航太等行业需要先进的电子系统,因此代表着巨大的商机。随着电动和混合动力汽车产量的增加,电子产业将继续成为主要驱动力,确保未来四年对焊料的需求强劲。

目录

介绍

  • 调查目的
  • 研究范围
  • 定义

调查方法

  • 资讯采购
  • 二次资料和一次资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 细分机会分析

市场动态与展望

  • 市场概览
  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 限制与挑战
  • 波特的分析

关键市场考察

  • 关键成功因素
  • 竞争程度
  • 主要投资机会
  • 市场生态系统
  • 市场吸引力指数(2024年)
  • PESTEL分析
  • 总体经济指标
  • 价值链分析
  • 定价分析

焊料市场规模(按合金类型和复合年增长率) (2025-2032)

  • 市场概览
  • 含铅焊料
  • 无铅焊料
  • 特殊焊料

焊锡材料市场规模(依助焊剂类型及复合年增长率)(2025-2032)

  • 市场概览
  • 松香基助焊剂
  • 免清洗助焊剂
  • 水溶性助焊剂

焊锡材料市场规模(按应用划分)及复合年增长率(2025-2032)

  • 市场概览
  • 电子产品
  • 航太
  • 工业机械

焊锡材料市场规模(按类型及复合年增长率) (2025-2032)

  • 市场概览
  • 贴上
  • 金属丝
  • 酒吧
  • 预製棒

焊料材料市场规模(按工艺和复合年增长率) (2025-2032)

  • 市场概览
  • 波峰焊/回流焊接
  • 网版印刷
  • 雷射
  • 机器人

焊锡材料市场规模(按地区)及复合年增长率(2025-2032)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 德国
    • 西班牙
    • 法国
    • 英国
    • 义大利
    • 其他欧洲国家地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他亚太地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东和非洲地区

竞争资讯

  • 前五大公司对比
  • 主要企业市场定位(2024年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市场占有率分析(2024年)
  • 主要企业简介
    • 公司详情
    • 产品系列分析
    • 公司分部份额分析
    • 收益与前一年同期比较对比(2022-2024 年)

主要企业简介

  • Indium Corporation(USA)
  • Alpha Assembly Solutions(USA)
  • AIM Solder(Canada)
  • Kester(USA)
  • Senju Metal Industry Co., Ltd.(Japan)
  • Nihon Superior Co., Ltd.(Japan)
  • Heraeus Holding GmbH(Germany)
  • MBO Osswald GmbH & Co. KG(Germany)
  • Qualitek International, Inc.(USA)
  • TAMURA Corporation(Japan)
  • Inventec Performance Chemicals(France)
  • Fusion Incorporated(USA)
  • KOKI Company Limited(Japan)
  • Metallic Resources, Inc.(USA)
  • Shenzhen Jufeng Solder Co., Ltd.(China)
  • Canfield Technologies(USA)
  • Balver Zinn Josef Jost GmbH & Co. KG(Germany)
  • Stannol GmbH & Co. KG(Germany)
  • Advanced Joining Technology(USA)
  • Henkel AG & Co. KGaA(Germany)

结论和建议

简介目录
Product Code: SQMIG45N2110

Solder Materials Market size was valued at USD 30.0 billion in 2023 and is poised to grow from USD 31.2 billion in 2024 to USD 42.7 billion by 2032, growing at a CAGR of 4.0% during the forecast period (2025-2032).

The global solder materials market is on an upward trajectory, fueled by the rising demand for electronic devices such as smartphones, tablets, and laptops. Rapid technological advancements, particularly in 5G and AI, are significantly propelling market growth, while the trend toward miniaturization necessitates solder materials with superior electrical and thermal conductivity. Additionally, the rise in eco-consciousness is driving the popularity of lead-free solder options. Demand is further amplified for high-performance materials that offer corrosion resistance and stability under extreme temperatures. Industries such as automotive and aerospace present substantial opportunities as they require advanced electronic systems. As production of electric and hybrid vehicles increases, the electronic sector will continue to be the primary driver, ensuring robust demand for solder materials over the next four years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Solder Materials market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Solder Materials Market Segments Analysis

Global Solder Materials Market is segmented by Alloy Type, Flux Type, Applications, Form, Process and region. Based on Alloy Type, the market is segmented into Lead-Based Solder, Lead-Free Solder and Specialty Solder. Based on Flux Type, the market is segmented into Rosin-Based Flux, No-Clean Flux and Water-Soluble Flux. Based on Applications, the market is segmented into Electronics, Automotive, Aerospace and Industrial Machinery. Based on Form, the market is segmented into Paste, Wire, Bar and Preforms. Based on Process, the market is segmented into Wave/reflow, Screen Printing', Laser and Robotic. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Solder Materials Market

The increasing demand for consumer electronics such as smartphones, laptops, and wearable devices is a primary catalyst for the growth of the global solder materials market. As technological advancements progress, manufacturers require advanced solder materials to ensure optimal performance, enhance miniaturization, and provide long-lasting durability in increasingly complex electronic devices. This trend is fueling the need for innovative solder solutions that can meet the stringent requirements of modern electronics. Consequently, the solder materials market experiences significant expansion as industry players strive to keep up with the evolving landscape of consumer technology and its corresponding fabrication needs.

Restraints in the Solder Materials Market

The global solder materials market faces significant constraints primarily due to supply chain disruptions, which can severely impact production timelines and costs. Factors such as transportation bottlenecks, geopolitical tensions, and shortages of critical raw materials contribute to these challenges, resulting in delays in the availability of solder materials. This instability creates difficulties for manufacturers across multiple sectors, hindering their ability to meet demand and maintain efficiency. Consequently, these disruptions not only affect production schedules but also increase operational costs, posing a notable challenge for businesses operating within the solder materials market.

Market Trends of the Solder Materials Market

The solder materials market is experiencing a significant shift towards lead-free soldering solutions, propelled by stringent environmental regulations and growing health concerns associated with lead exposure. This trend reflects a broader commitment to sustainability within various industries, where manufacturers increasingly adopt eco-friendly alternatives such as SAC (Tin-Silver-Copper) alloys. As a result, the demand for innovative lead-free solder technologies is surging, prompting investments in research and development to enhance performance and reliability. The market is thus evolving, with a clear emphasis on sustainable practices, driving both product innovation and changes in manufacturing processes across the electronics and automotive sectors.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis

Global Solder Materials Market Size by Alloy Type & CAGR (2025-2032)

  • Market Overview
  • Lead-Based Solder
  • Lead-Free Solder
  • Specialty Solder

Global Solder Materials Market Size by Flux Type & CAGR (2025-2032)

  • Market Overview
  • Rosin-Based Flux
  • No-Clean Flux
  • Water-Soluble Flux

Global Solder Materials Market Size by Applications & CAGR (2025-2032)

  • Market Overview
  • Electronics
  • Automotive
  • Aerospace
  • Industrial Machinery

Global Solder Materials Market Size by Form & CAGR (2025-2032)

  • Market Overview
  • Paste
  • Wire
  • Bar
  • Preforms

Global Solder Materials Market Size by Process & CAGR (2025-2032)

  • Market Overview
  • Wave/reflow
  • Screen Printing'
  • Laser
  • Robotic

Global Solder Materials Market Size & CAGR (2025-2032)

  • North America (Alloy Type, Flux Type, Applications, Form, Process)
    • US
    • Canada
  • Europe (Alloy Type, Flux Type, Applications, Form, Process)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Alloy Type, Flux Type, Applications, Form, Process)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Alloy Type, Flux Type, Applications, Form, Process)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Alloy Type, Flux Type, Applications, Form, Process)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Indium Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Alpha Assembly Solutions (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • AIM Solder (Canada)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kester (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Senju Metal Industry Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nihon Superior Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Heraeus Holding GmbH (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • MBO Osswald GmbH & Co. KG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Qualitek International, Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • TAMURA Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Inventec Performance Chemicals (France)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Fusion Incorporated (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KOKI Company Limited (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Metallic Resources, Inc. (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shenzhen Jufeng Solder Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Canfield Technologies (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Balver Zinn Josef Jost GmbH & Co. KG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Stannol GmbH & Co. KG (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Advanced Joining Technology (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Henkel AG & Co. KGaA (Germany)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations