查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1617236

2030 年预成型焊片市场预测：按类型、形式、应用、最终用户和地区进行的全球分析

Solder Preform Market Forecasts to 2030 - Global Analysis By Type (Solid Solder Preforms, Flux-Cored Solder Preforms, Composite Solder Preforms, Paste Solder Preforms and Other Types), Form, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球预成型焊片市场在预测期内将以 8.5% 的复合年增长率成长。

预成型焊料是用于各种电子、机械和工业组装过程的预成型焊接材料。它们由锡、铅、银、金和其他金属等合金製成，具有标准形状，如圆盘、垫圈、带状和自订配置。透过保持一致的焊接品质并向目标区域提供正确数量的焊料来消除浪费。它在航太、汽车、医疗设备和半导体製造等高可靠性应用中特别有效。它与回流焊接等自动化製程相容，在受控热量下熔化，形成牢固的接头。助焊剂通常掺入预成型件中或单独涂布。

电子产品的需求不断增长

家用电子电器、汽车、航太和医疗设备等领域对精密焊接的需求增加了电子设备中对可靠、耐用焊点的需求。预成型焊料非常适合这些应用，因为它们可确保均匀的焊料分布并增强组件的机械和电气完整性。因此，预成型焊片的采用率不断提高，其市占率也不断增加。

小企业的技术壁垒

中小型企业在采用新技术将预成型焊片纳入生产线时经常面临财务挑战。自动化设备和机械（例如回流焊接炉和精密贴装系统）的初始成本高昂，令许多公司望而却步。因此，预成型焊片的优点（例如提高精度和减少焊料浪费）无法充分利用，阻碍了市场成长。

製造自动化的进展

製造中的自动化技术优先考虑与预成型焊片的优势相匹配的精度和一致性。这些预成型件可提供均匀且精确的焊料分布，这对于高品质电子组件至关重要。机械臂、焊接设备和回流焊接炉等自动化系统可以高精度定位和熔化焊料预成型件，最大限度地减少缺陷并创建可靠的接头。这提高了家用电子电器和汽车系统的产品性能并降低了故障率。

与替代焊接方法的竞争

预成型焊料对于精密接头非常有效，但在客製化复杂应用方面有其限制。助焊剂和焊膏印刷等替代方案具有更大的适应性，可以适应不同的元件尺寸和基板配置。这种灵活性对于需要专门焊接解决方案的製造商特别有吸引力，从而减少了对基于预成型件的焊接的需求并阻碍了市场成长。

COVID-19 的影响

COVID-19 大流行扰乱了供应链、导致生产延误并造成原材料短缺，对预成型焊片市场产生了重大影响。製造工厂面临裁员和关闭，导致产量减少和计划延误。疫情也导致需求格局发生变化，家电、医疗设备等电子产业的需求因消费行为变化和医疗设备需求增加而波动。然而，随着製造业的稳定和疫情后电子产品需求的持续成长，市场正在復苏。

预计固体预成型焊片细分市场在预测期内将是最大的

由于固体焊料预成型件具有稳定的品质和可靠性，可生产高品质焊点，预计在预测期内将出现最大需求，特别是在航太、汽车和医疗设备等行业。固态焊料预成型件也适用于电子组装等自动化製造工艺，以提高营运效率和产量。因此，随着製造商寻求简化生产和降低人事费用，基于预成型坯的焊接解决方案市场正在扩大。

在预测期内，LED 製造领域的复合年增长率最高。

LED製造领域需要高温焊接以实现有效散热，因此需要由能够承受高温的材料製成的固体焊料预成型件。由于需要提高高温下的稳定性和性能以及提高效率和速度，LED 製造对特种材料的需求不断增加，使得焊料预成型件适合自动化组装，并且 LED 领域的需求不断增加。

比最大的地区

由于家用电子电器、工业自动化、通讯和汽车领域的整合，对电子设备的需求持续强劲，北美，尤其是美国和加拿大，将在预测期内占据最大的市场占有率。电子产业的扩张是预成型焊片市场的关键驱动因素，因为预成型焊片对于电子元件的组装和焊接至关重要。随着更小、更有效率的电子设备的普及，对确保可靠连接和高耐用性的高品质焊料预成型件的需求不断增加。

复合年增长率最高的地区：

由于智慧型手机、平板电脑、穿戴式装置和智慧家庭产品等家用电子电器的需求激增，将显着推动亚太预成型焊片市场的发展，预计亚太地区的复合年增长率将达到最高。家用电子电器需要精密焊接以确保可靠的性能和耐用性。这导致对高品质焊料预成型件的需求不断增长，特别是那些满足小型化和高组件集成度特定行业标准的焊料预成型件。

提供免费客製化

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争标基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 司机
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球预成型焊片市场：依类型

  • 固体预成型焊料
  • 助焊剂芯预成型焊料
  • 复合预成型焊料
  • 预成型焊膏
  • 其他类型

第六章 全球预成型焊片市场：依格式分类

  • 片材和铝箔
  • 线材和棒材
  • 戒指
  • 自订形状
  • 其他形式

第七章 全球预成型焊片市场：依应用分类

  • PCB（印刷基板）组装
  • 半导体封装
  • LED製造
  • 电池製造和汽车电子
  • 军事和航太电子
  • 穿戴式医疗设备
  • 电池和能源储存
  • 工业控制系统
  • 其他用途

第八章全球预成型焊片市场：依最终用户分类

  • 电子产品
  • 车
  • 卫生保健
  • 能源和电力
  • 消费品
  • 其他最终用户

第九章全球预成型焊片市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第10章 主要进展

  • 合约、伙伴关係、合作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十一章 公司概况

  • AIM
  • Alpha Assembly Solutions
  • AMETEK Coining
  • FCT Assembly
  • Fromosol
  • Fusite Co.
  • Harris Products
  • Indium Corporation
  • Kester
  • Nihon Superior
  • Qualitek International
  • Senju Metal Industry Co. Ltd
  • Shanghai Huaqing
  • Solderwell Advanced Materials
  • Stella Welding Alloys
  • Teka Interconnection Systems Co. Ltd
Product Code: SMRC28116

According to Stratistics MRC, the Global Solder Preform Market is growing at a CAGR of 8.5% during the forecast period. A solder preform is a pre-shaped piece of solder material used in various electronic, mechanical, and industrial assembly processes. Made from alloys like tin, lead, silver, gold, or other metals, they come in standardized shapes like discs, washers, ribbons, or custom configurations. They ensure consistent soldering quality and reduce waste by delivering an exact amount of solder to a targeted area. They are particularly effective in high-reliability applications like aerospace, automotive, medical devices, and semiconductor manufacturing. They are compatible with automated processes like reflow soldering, where they melt under controlled heat to create strong bonds. Flux is often integrated into preforms or applied separately.

Market Dynamics:

Driver:

Growing demand for electronics

The demand for reliable and durable solder joints in electronic devices is increasing due to the need for precision soldering in sectors like consumer electronics, automotive, aerospace, and medical devices. Solder preforms are ideal for these applications as they ensure uniform solder distribution, enhancing component mechanical and electrical integrity. This has led to higher adoption of solder performs boosting its markets presence.

Restraint:

Technological barriers for smaller companies

Smaller companies often face financial difficulties when adopting new technologies for integrating solder preforms into their production lines. High upfront costs of automated equipment and machinery, such as reflow ovens and precision placement systems, can be prohibitive for many businesses. This can hinder their ability to fully utilize the benefits of solder preforms, such as improved accuracy and reduced solder waste hampering the market growth.

Opportunity:

Increased automation in manufacturing

Automation technologies in manufacturing prioritize precision and consistency, which align with the benefits of solder preforms. These preforms deliver uniform and accurate solder distribution, essential for high-quality electronic assemblies. Automated systems like robotic arms, soldering machines, and reflow ovens can place and melt solder preforms with high accuracy, minimizing defects and ensuring reliable joints. This leads to improved product performance and reduced failure rates in consumer electronics and automotive systems.

Threat:

Competition from alternative soldering methods

Solder preforms are effective for precise joints, but they have limitations in customization for complex applications. Alternative methods like flux-cored solder wire and solder paste printing offer greater adaptability, suitable for various component sizes and board configurations. This flexibility is particularly appealing to manufacturers needing specialized soldering solutions, decreasing the demand for preform-based soldering impeding growth of the market.

Covid-19 Impact

The COVID-19 pandemic significantly impacted the solder preform market by disrupting supply chains, causing delays in production, and creating shortages of raw materials. Manufacturing plants faced workforce reductions and shutdowns, leading to decreased output and project delays. The pandemic also shifted demand patterns as electronics industries, such as consumer electronics and medical devices, saw fluctuating needs due to changes in consumer behavior and increased demand for medical equipment. However, the market is rebounding as manufacturing stabilizes, and electronic demand continues to grow post-pandemic.

The solid solder preforms segment is expected to be the largest during the forecast period

The solid solder preforms is expected to be the largest during the forecast period owing to consistent quality and reliability in producing high-quality solder joints, particularly in industries like aerospace, automotive, and medical devices. Solid solder preforms are also well-suited for automated manufacturing processes, such as electronics assembly, as they enhance operational efficiency and throughput. This has led to a growing market for preform-based soldering solutions, as manufacturers seek to streamline production and reduce labor costs.

The LED manufacturing segment is expected to have the highest CAGR during the forecast period

The LED manufacturing segment is expected to have the highest CAGR during the forecast period because LEDs require high-temperature soldering for effective heat dissipation, necessitating solid solder preforms made from materials that can withstand high temperatures. The demand for specialized materials in LED manufacturing is increasing due to the need for stability and performance at elevated temperatures which have increased efficiency and speed, making solder preforms suitable for automated assembly lines, boosting demand in the LED sector.

Region with largest share:

North America is expected to hold the largest market share during the forecast period owing to North America, particularly the United States and Canada, continues to see a robust demand for electronic devices due to their integration into consumer electronics, industrial automation, telecommunications, and automotive sectors. The expansion of the electronics industry is a significant driver for the solder preform market, as these preforms are vital for assembling and soldering electronic components. With the push towards more compact and efficient electronics, the demand for high-quality solders preforms that ensure reliable connections and high durability is on the rise.

Region with highest CAGR:

Asia Pacific is projected to hold the highest CAGR over the forecast period due to surging demand for consumer electronics, such as smartphones, tablets, wearable devices, and smart home products, has been a significant driver for the Asia-Pacific solder preform market. Consumer electronics require high-precision soldering to ensure reliable performance and durability. This has led to an increased need for high-quality solder preforms, especially those that meet specific industry standards for miniaturization and advanced component integration.

Key players in the market

Some of the key players in Solder Preform market include AIM, Alpha Assembly Solutions, AMETEK Coining, FCT Assembly, Fromosol, Fusite Co., Harris Products, Indium Corporation, Kester, Nihon Superior, Qualitek International, Senju Metal Industry Co. Ltd, Shanghai Huaqing, Solderwell Advanced Materials, Stella Welding Alloys and Teka Interconnection Systems Co. Ltd.

Key Developments:

In November 2024, Indium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil(R) in component mounting applications. NanoFoil(R) is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.

In November 2024, Shanghai Stock Exchange, Deutsche Borse Group and China Europe International Exchange signed a memorandum of understanding on special cooperation on depository receipts under the stock connect. This is an important measure for the SSE to actively promote the high-level institutional two-way opening up of the capital.

In July 2024, Indium Corporation(R) introduced new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.

Types Covered:

  • Solid Solder Preforms
  • Flux-Cored Solder Preforms
  • Composite Solder Preforms
  • Paste Solder Preforms
  • Other Types

Forms Covered:

  • Sheet & Foil
  • Wire & Rod
  • Ring
  • Custom Shapes
  • Other Forms

Applications Covered:

  • PCB (Printed Circuit Board) Assembly
  • Semiconductor Packaging
  • LED Manufacturing
  • Battery Manufacturing & Automotive Electronics
  • Military & Aerospace Electronics
  • Wearable Medical Device
  • Batteries & Energy Storage
  • Industrial Control System
  • Other Applications

End Users Covered:

  • Electronics
  • Automotive
  • Healthcare
  • Energy & Power
  • Consumer Goods
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Solder Preform Market, By Type

  • 5.1 Introduction
  • 5.2 Solid Solder Preforms
  • 5.3 Flux-Cored Solder Preforms
  • 5.4 Composite Solder Preforms
  • 5.5 Paste Solder Preforms
  • 5.6 Other Types

6 Global Solder Preform Market, By Form

  • 6.1 Introduction
  • 6.2 Sheet & Foil
  • 6.3 Wire & Rod
  • 6.4 Ring
  • 6.5 Custom Shapes
  • 6.6 Other Forms

7 Global Solder Preform Market, By Application

  • 7.1 Introduction
  • 7.2 PCB (Printed Circuit Board) Assembly
  • 7.3 Semiconductor Packaging
  • 7.4 LED Manufacturing
  • 7.5 Battery Manufacturing & Automotive Electronics
  • 7.6 Military & Aerospace Electronics
  • 7.7 Wearable Medical Device
  • 7.8 Batteries & Energy Storage
  • 7.9 Industrial Control System
  • 7.10 Other Applications

8 Global Solder Preform Market, By End User

  • 8.1 Introduction
  • 8.2 Electronics
  • 8.3 Automotive
  • 8.4 Healthcare
  • 8.5 Energy & Power
  • 8.6 Consumer Goods
  • 8.7 Other End Users

9 Global Solder Preform Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 AIM
  • 11.2 Alpha Assembly Solutions
  • 11.3 AMETEK Coining
  • 11.4 FCT Assembly
  • 11.5 Fromosol
  • 11.6 Fusite Co.
  • 11.7 Harris Products
  • 11.8 Indium Corporation
  • 11.9 Kester
  • 11.10 Nihon Superior
  • 11.11 Qualitek International
  • 11.12 Senju Metal Industry Co. Ltd
  • 11.13 Shanghai Huaqing
  • 11.14 Solderwell Advanced Materials
  • 11.15 Stella Welding Alloys
  • 11.16 Teka Interconnection Systems Co. Ltd

List of Tables

  • Table 1 Global Solder Preform Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Solder Preform Market Outlook, By Type (2022-2030) ($MN)
  • Table 3 Global Solder Preform Market Outlook, By Solid Solder Preforms (2022-2030) ($MN)
  • Table 4 Global Solder Preform Market Outlook, By Flux-Cored Solder Preforms (2022-2030) ($MN)
  • Table 5 Global Solder Preform Market Outlook, By Composite Solder Preforms (2022-2030) ($MN)
  • Table 6 Global Solder Preform Market Outlook, By Paste Solder Preforms (2022-2030) ($MN)
  • Table 7 Global Solder Preform Market Outlook, By Other Types (2022-2030) ($MN)
  • Table 8 Global Solder Preform Market Outlook, By Form (2022-2030) ($MN)
  • Table 9 Global Solder Preform Market Outlook, By Sheet & Foil (2022-2030) ($MN)
  • Table 10 Global Solder Preform Market Outlook, By Wire & Rod (2022-2030) ($MN)
  • Table 11 Global Solder Preform Market Outlook, By Ring (2022-2030) ($MN)
  • Table 12 Global Solder Preform Market Outlook, By Custom Shapes (2022-2030) ($MN)
  • Table 13 Global Solder Preform Market Outlook, By Other Forms (2022-2030) ($MN)
  • Table 14 Global Solder Preform Market Outlook, By Application (2022-2030) ($MN)
  • Table 15 Global Solder Preform Market Outlook, By PCB (Printed Circuit Board) Assembly (2022-2030) ($MN)
  • Table 16 Global Solder Preform Market Outlook, By Semiconductor Packaging (2022-2030) ($MN)
  • Table 17 Global Solder Preform Market Outlook, By LED Manufacturing (2022-2030) ($MN)
  • Table 18 Global Solder Preform Market Outlook, By Battery Manufacturing & Automotive Electronics (2022-2030) ($MN)
  • Table 19 Global Solder Preform Market Outlook, By Military & Aerospace Electronics (2022-2030) ($MN)
  • Table 20 Global Solder Preform Market Outlook, By Wearable Medical Device (2022-2030) ($MN)
  • Table 21 Global Solder Preform Market Outlook, By Batteries & Energy Storage (2022-2030) ($MN)
  • Table 22 Global Solder Preform Market Outlook, By Industrial Control System (2022-2030) ($MN)
  • Table 23 Global Solder Preform Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 24 Global Solder Preform Market Outlook, By End User (2022-2030) ($MN)
  • Table 25 Global Solder Preform Market Outlook, By Electronics (2022-2030) ($MN)
  • Table 26 Global Solder Preform Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 27 Global Solder Preform Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 28 Global Solder Preform Market Outlook, By Energy & Power (2022-2030) ($MN)
  • Table 29 Global Solder Preform Market Outlook, By Consumer Goods (2022-2030) ($MN)
  • Table 30 Global Solder Preform Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.