首页 > 市场调查报告书 > 电子零件/半导体

半导体生产设备半导体製造设备

市场调查报告书

商品编码

1620437

薄晶圆加工和切割设备市场机会、成长驱动因素、产业趋势分析与预测 2024 - 2032 年

Thin Wafer Processing and Dicing Equipment Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年10月08日 | 出版商:

Global Market Insights Inc. | 英文 240 Pages | 商品交期: 2-3个工作天内

价格

简介目录

2023 年，全球薄晶圆加工和切割设备市场估值为 7.103 亿美元，预计 2024 年至 2032 年年复合成长率(CAGR) 为7%。需求不断增长而推动的。 5G等技术的出现和电动车的日益普及提高了对精密晶圆加工的需求。碳化硅 (SiC) 和氮化镓 (GaN) 等先进材料进一步强调了有效製造微晶片和感测器所需的精细生产流程的必要性。此外，基于雷射的切割技术的创新以其速度、准确性和成本效益而闻名，透过生产更薄、更耐用的半导体元件来推动市场扩张。

薄晶圆加工和切割设备市场可以根据设备类型分为减薄设备和切割设备。预计到 2032 年，切割设备市场将超过 8 亿美元。在电子元件小型化趋势的推动下，对复杂切割解决方案的需求不断增长。精确且高效的切割方法对于提高产量和整体性能至关重要。

在应用方面，该市场涵盖各个领域，包括CMOS影像感测器、记忆体和逻辑（硅通孔或TSV）、MEMS装置、功率装置和RFID。 MEMS 装置领域预计成长最快，在预测期内复合年增长率超过 8%。这种成长是由众多应用中对 MEMS 装置不断增长的需求所推动的。随着 MEMS 技术因其紧凑的尺寸和多功能性而成为现代电子产品中不可或缺的一部分，製造商正在投资先进的晶圆加工技术，以确保高产量和最佳性能。

市场范围
开始年份	2023年
预测年份	2024-2032
起始值	7.103 亿美元
预测值	12.5 亿美元
复合年增长率	7%

到 2023 年，北美将占全球薄晶圆加工和切割设备市场的 25% 以上。这种趋势在各个行业都很明显，特别强调小型化以提高性能和效率。此外，旨在促进国内半导体製造以应对全球供应链挑战的政府措施正在加速对晶圆加工技术的投资。这种成长轨迹也受到越来越多的尖端应用的采用的支持，这些应用需要高性能、紧凑的晶片，所有这些都受益于先进的薄晶圆加工解决方案。

产业生态系统分析
- 影响价值链的因素
- 利润率分析
- 干扰
- 未来展望
- 製造商
- 经销商
供应商格局
利润率分析
重要新闻和倡议
监管环境
衝击力
- 成长动力
  - 对小型电子设备的需求不断增长
  - 5G和物联网应用的扩展
  - 增加先进半导体材料的使用
  - 汽车电子和电动车的成长
- 产业陷阱与挑战
  - 先进刮片设备成本高
  - 减薄晶圆的脆性增加
成长潜力分析
波特的分析
PESTEL分析

第 4 章：竞争格局

介绍
公司市占率分析
竞争定位矩阵
战略展望矩阵

第 5 章：市场估计与预测：按设备类型，2021-2032 年

主要趋势
疏伐设备
刮片设备
- 刀片划片
- 雷射切割
- 隐形切割
- 等离子切割

第 6 章：市场估计与预测：依晶圆尺寸，2021-2032 年

主要趋势
小于4英寸
5寸和6寸
8寸
12寸

第 7 章：市场估计与预测：按应用划分，2021-2032 年

主要趋势
CMOS影像感测器
记忆体和逻辑 (TSV)
微机电系统元件
功率元件
射频识别
其他的

第 8 章：市场估计与预测：依最终用途产业，2021-2032 年

主要趋势
消费性电子产品
汽车
电信
卫生保健
航太与国防
工业的
其他的

第 9 章：市场估计与预测：按地区，2021-2032 年

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 英国
- 德国
- 法国
- 义大利
- 西班牙
- 俄罗斯
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 澳洲
拉丁美洲
- 巴西
- 墨西哥
MEA
- 南非
- 沙乌地阿拉伯
- 阿联酋

第 10 章：公司简介

Advanced Dicing Technologies
ASMPT
AXUS TECHNOLOGY
Citizen Chiba Precision Co., Ltd.
DISCO Corporation
Dynatex International
EV Group (EVG)
HANMI Semiconductor
Han's Laser Technology Co., Ltd.
KLA Corporation
Lam Research Corporation
Loadpoint Ltd.
Modutek Corporation
NeonTech Co.,Ltd.
Panasonic Connect Co., Ltd.
Plasma-Therm
SPTS Technologies Ltd.
Suzhou Delphi Laser Co., Ltd.
Synova SA
Tokyo Electron Limited
TOKYO SEIMITSU CO., LTD (Accretech)

简介目录

Product Code: 11811

The Global Thin Wafer Processing And Dicing Equipment Market was valued at USD 710.3 million in 2023, with projections indicating a compound annual growth rate (CAGR) of 7% from 2024 to 2032. This growth is primarily driven by the rising demand for compact and high-performance electronic devices across diverse sectors, including consumer electronics, automotive, and telecommunications. The advent of technologies such as 5G and the increasing popularity of electric vehicles have heightened the need for precision wafer processing. Advanced materials like silicon carbide (SiC) and gallium nitride (GaN) further underscore the necessity for meticulous production processes to manufacture microchips and sensors effectively. Additionally, innovations in laser-based dicing technologies, known for their speed, accuracy, and cost-effectiveness, propel market expansion by enabling the production of thinner and more durable semiconductor components.

The thin wafer processing and dicing equipment market can be categorized based on equipment type into thinning equipment and dicing equipment. The dicing equipment segment is projected to surpass USD 800 million by 2032. This equipment is essential during the wafer fabrication post-processing phase, where wafers are separated into individual chips. The demand for sophisticated dicing solutions is rising, driven by the trend toward miniaturizing electronic components. Precise and efficient dicing methods are crucial for enhancing yield and overall performance.

In terms of applications, the market encompasses various sectors, including CMOS image sensors, memory and logic (through-silicon via or TSV), MEMS devices, power devices, and RFID. The MEMS device segment is anticipated to grow the fastest, with a CAGR exceeding 8% during the forecast period. This growth is fueled by the increasing need for MEMS devices in numerous applications. As MEMS technology becomes more integral to modern electronics due to its compact size and versatility, manufacturers are investing in advanced wafer processing technologies to ensure high yields and optimal performance.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$710.3 Million
Forecast Value	$1.25 Billion
CAGR	7%

North America accounted for over 25% of the global thin wafer processing and dicing equipment market in 2023. The region, particularly the United States, is witnessing significant growth due to the rising demand for advanced semiconductor technologies. This trend is evident across various industries, with a strong emphasis on miniaturization to enhance performance and efficiency. Furthermore, government initiatives aimed at boosting domestic semiconductor manufacturing in response to global supply chain challenges are accelerating investments in wafer processing technologies. This growth trajectory is also supported by the increasing adoption of cutting-edge applications that necessitate high-performance, compact chips, all of which benefit from advanced thin wafer processing solutions.

Chapter 1 Methodology & Scope

1.1 Market scope & definitions
1.2 Base estimates & calculations
1.3 Forecast calculations
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry synopsis, 2021-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
- 3.1.1 Factor affecting the value chain
- 3.1.2 Profit margin analysis
- 3.1.3 Disruptions
- 3.1.4 Future outlook
- 3.1.5 Manufacturers
- 3.1.6 Distributors
3.2 Supplier landscape
3.3 Profit margin analysis
3.4 Key news & initiatives
3.5 Regulatory landscape
3.6 Impact forces
- 3.6.1 Growth drivers
  - 3.6.1.1 Rising demand for miniaturized electronic devices
  - 3.6.1.2. Expansion of 5 G and IoT applications
  - 3.6.1.3 Increased use of advanced semiconductor materials
  - 3.6.1.4 Growth in automotive electronics and EVs
- 3.6.2 Industry pitfalls & challenges
  - 3.6.2.1 High costs of advanced dicing equipment
  - 3.6.2.2 Increased fragility of thinned wafers
3.7 Growth potential analysis
3.8 Porter's analysis
3.9 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Equipment Type, 2021-2032 (USD Million)

5.1 Key trends
5.2 Thinning equipment
5.3 Dicing equipment
- 5.3.1 Blade dicing
- 5.3.2 Laser dicing
- 5.3.3 Stealth dicing
- 5.3.4 Plasma dicing

Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Million)

6.1 Key trends
6.2 Less than 4 inch
6.3 5 inch and 6 inch
6.4 8 inch
6.5 12 inch

Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)

7.1 Key trends
7.2 CMOS image sensors
7.3 Memory and logic (TSV)
7.4 MEMS device
7.5 Power device
7.6 RFID
7.7 Others

Chapter 8 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)

8.1 Key trends
8.2 Consumer electronics
8.3 Automotive
8.4 Telecommunications
8.5 Healthcare
8.6 Aerospace & defense
8.7 Industrial
8.8 Others

Chapter 9 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
- 9.3.6 Russia
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 Australia
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
9.6 MEA
- 9.6.1 South Africa
- 9.6.2 Saudi Arabia
- 9.6.3 UAE