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市场调查报告书
商品编码
1844254

远端资讯处理半导体市场机会、成长动力、产业趋势分析及 2025 - 2034 年预测

Telematics Semiconductors Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034
出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3个工作天内

价格
简介目录

2024 年全球远端资讯处理半导体市场价值为 149 亿美元，预计到 2034 年将以 10.9% 的复合年增长率成长至 419 亿美元。

远端资讯处理半导体市场 - IMG1

这项快速扩张的动力源自于连网汽车技术的蓬勃发展、人工智慧与远端资讯处理控制单元 (TCU) 的整合、车联网 (V2X) 通讯系统的普及以及嵌入式 GNSS 模组的广泛应用。汽车製造商正增加对高性能、高能源效率远端资讯处理半导体的投资，以支援即时追踪、车队安全合规、预测分析、无线更新和保固优化等功能。随着互联汽车平台和智慧交通网路的发展，远端资讯处理晶片正成为整个出行领域数位转型的核心组成部分。汽车原始设备製造商 (OEM) 正在整合远端资讯处理功能，以符合安全法规、提高营运效率并支援下一代出行即服务模式。对安全即时资料处理和更佳车辆系统整合的需求日益增长，促使先进的远端资讯处理 SoC、低功耗无线收发器和汽车级微控制器广泛应用。智慧出行生态系统和数位化车辆生命週期平台在多个地区和车型领域的兴起进一步推动了这一转变。

市场范围
起始年份 2024
预测年份 2025-2034
起始值 149亿美元
预测值 419亿美元
复合年增长率 10.9%

系统单晶片 (SoC) 解决方案占 34.2% 的市场份额，预计 2025 年至 2034 年的复合年增长率为 10.5%。 SoC 因其能够将处理、连接和安全功能整合到一个紧凑的解决方案中而日益受到青睐。其整合架构可提升效能、降低功耗并减少硬体占用空间。汽车製造商正转向 SoC，因为 SoC 具有可扩展性、低延迟设计以及处理即时资料的能力，可用于预测性维护、车辆诊断、位置追踪和 OTA 韧体更新等应用。连网汽车架构的日益普及进一步推动了对基于 SoC 的远端资讯处理解决方案的需求。

嵌入式远端资讯处理领域在2024年占据了55%的市场份额，预计到2034年将实现9.6%的复合年增长率。嵌入式解决方案凭藉其原厂安装的特性、高可靠性以及符合严格的资料保护要求，在原始设备製造商（OEM）和大型车队营运商中日益受到青睐。这些整合模组可在各种车辆平台和地理区域实现无缝追踪、远端诊断和改进的车队治理。嵌入式远端资讯处理模组还支援先进的车辆电子基础设施，被认为是现代车队管理的关键，尤其是在商用和电动车领域。

美国远端资讯处理半导体市场占83%的市场份额，2024年市场规模达45亿美元。美国市场的强劲表现得益于连网汽车平台的快速普及、监管机构对车辆安全和资料透明度的重视，以及对下一代远端资讯处理基础设施的快速投资。人工智慧SoC、V2X通讯模组和嵌入式晶片组的使用日益增多，正在推动乘用车、商用车队和电动车之间远端资讯处理的整合。美国市场在汽车半导体领域的创新、可扩展性和即时连接性方面继续保持领先地位。

全球远端资讯处理半导体市场的领导公司包括高通、联发科、瑞萨电子、义法半导体、亚德诺半导体、德州仪器、村田製作所、广和通、恩智浦半导体和英飞凌科技。为了巩固市场地位，远端资讯处理半导体领域的公司正专注于技术创新、策略合作伙伴关係和产品组合扩展等多种方式。许多公司正在投资开发低功耗、高效能晶片组，以支援人工智慧远端资讯处理功能、网路安全和V2X通讯。与汽车原始设备製造商和一级供应商的合作有助于确保更紧密地整合到车辆平台中。各公司也正在扩大研发活动，以缩短设计週期并增强即时处理能力。

目录

第一章：方法论

  • 市场范围和定义
  • 研究设计
    • 研究方法
    • 资料收集方法
  • 资料探勘来源
    • 全球的
    • 地区/国家
  • 基础估算与计算
    • 基准年计算
    • 市场评估的主要趋势
  • 初步研究和验证
    • 主要来源
  • 预报
  • 研究假设和局限性

第 2 章：执行摘要

第三章：行业洞察

  • 产业生态系统分析
    • 供应商格局
      • 晶片製造商
      • 连接和通讯模组提供者
      • 平台和软体供应商
      • 分销商和聚合商
      • 原始设备製造商
      • 系统整合商和服务提供者
      • 最终用途
    • 利润率分析
    • 每个阶段的增值
    • 影响价值链的因素
    • 中断
  • 产业衝击力
    • 成长动力
      • 连网汽车的快速普及
      • 监理推动安全和合规
      • OEM注重营运效率
      • OTA和云端整合系统需求不断成长
    • 产业陷阱与挑战
      • 开发和整合成本高
      • 网路安全与资料隐私风险
    • 机会
      • 新兴市场和区域扩张
      • 与电动汽车和自动驾驶平台的集成
      • 转向软体定义汽车
      • 出行即服务 (MaaS) 和车队远端资讯处理的成长
  • 监管格局
    • 全球规范架构概述
    • 区域合规要求
    • 新兴监管趋势
    • 监理合规成本分析
    • 政策变化对市场动态的影响
  • 技术与创新格局
    • 当前技术趋势
    • 新兴技术评估
    • 技术采用曲线
    • 创新热点分析
    • 科技融合趋势
    • 颠覆性技术的影响
    • 研发投资模式
    • 技术路线图分析
  • 定价分析
    • 按地区
    • 按产品
  • 专利分析
  • 成长潜力分析
  • 波特的分析
  • PESTEL分析
  • 永续性和环境方面
    • 永续生产实践
    • 减少废弃物的策略
    • 生产中的能源效率
    • 环保材料的使用
    • 循环经济实施
    • 环境合规成本
  • 风险评估框架
    • 技术风险分析
    • 供应链风险评估
    • 市场风险评估
    • 监理风险分析
    • 财务风险评估
    • 营运风险因素
    • 风险缓解策略
  • 供应链弹性评估
    • 供应链脆弱性分析
    • 单点故障识别
    • 多元化策略
    • 供应链透明度
    • 风险缓解框架
    • 替代采购选项

第四章：竞争格局

  • 介绍
  • 公司市占率分析
    • 北美洲
    • 欧洲
    • 亚太地区
    • 拉丁美洲
    • 多边环境协定
  • 主要市场参与者的竞争分析
  • 竞争定位矩阵
  • 战略展望矩阵
  • 关键进展
    • 併购
    • 伙伴关係与合作
    • 新产品发布
    • 扩张计划和资金

第五章：市场估计与预测：按类型，2021 - 2034

  • 主要趋势
  • 微控制器（MCU）
  • 系统单晶片（SoC）
  • 通信IC
  • 电源管理IC（PMIC）
  • 记忆体和储存

第六章：市场估计与预测：依连结性，2021 - 2034

  • 主要趋势
  • 嵌入式
  • 繫留
  • 融合的

第七章：市场估计与预测：依车型，2021 - 2034

  • 主要趋势
  • 搭乘用车
    • 袖珍的
    • 中型
    • 奢华
    • SUV
  • 商用车
    • 轻型商用车（LCV）
    • 重型商用车（HCV）
    • 公车
  • 电动和混合动力车

第八章：市场估计与预测：按地区，2021 - 2034

  • 主要趋势
  • 北美洲
    • 我们
    • 加拿大
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 西班牙
    • 义大利
    • 俄罗斯
    • 北欧人
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 澳新银行
    • 东南亚
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中东和非洲
    • 阿联酋
    • 沙乌地阿拉伯
    • 南非

第九章：公司简介

  • 全球参与者
    • Analog Devices
    • Broadcom
    • Infineon Technologies
    • Microchip Technology
    • NXP Semiconductors
    • ON Semiconductor
    • Qualcomm
    • Renesas Electronics
    • STMicroelectronics
    • Texas Instruments
  • 区域参与者
    • Fibocom Wireless
    • MediaTek
    • Murata Manufacturing
    • Quectel Wireless Solutions
    • ROHM Semiconductor
    • Samsung Semiconductor
    • Sierra Wireless
    • Sony Semiconductor Solutions
    • Telit Communications
    • u-blox AG
  • 新兴玩家
    • Altair Semiconductor
    • Cavli Wireless
    • Nordic Semiconductor
    • Sequans Communications
    • Silicon Labs
简介目录
Product Code: 14795

The Global Telematics Semiconductors Market was valued at USD 14.9 billion in 2024 and is estimated to grow at a CAGR of 10.9% to reach USD 41.9 billion by 2034.

Telematics Semiconductors Market - IMG1

The rapid expansion is fueled by the surge in connected vehicle technologies, the integration of AI in telematics control units (TCUs), the adoption of vehicle-to-everything (V2X) communication systems, and the widespread use of embedded GNSS modules. Automakers are increasingly investing in high-performance, energy-efficient telematics semiconductors to support features like real-time tracking, fleet safety compliance, predictive analytics, over-the-air updates, and warranty optimization. As connected vehicle platforms and intelligent transportation networks evolve, telematics chips are becoming a core component of digital transformation across the mobility landscape. Automotive OEMs are incorporating telematics capabilities to align with safety regulations, improve operational efficiencies, and enable next-gen mobility-as-a-service models. Growing demand for secure, real-time data processing and better integration of vehicle systems has led to widespread adoption of advanced telematics SoCs, low-power wireless transceivers, and automotive-grade microcontrollers. This transition is further supported by the rise of smart mobility ecosystems and digital vehicle lifecycle platforms across multiple regions and vehicle segments.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$14.9 Billion
Forecast Value$41.9 Billion
CAGR10.9%

The system-on-chip (SoC) solutions segment held 34.2% share and is expected to grow at a CAGR of 10.5% from 2025 through 2034. SoCs are increasingly favored due to their ability to combine processing, connectivity, and security features into a single compact solution. Their integrated architecture allows for improved performance, lower power consumption, and reduced hardware footprint. Automakers are turning to SoCs for their scalability, low-latency design, and ability to handle real-time data for applications such as predictive maintenance, vehicle diagnostics, location tracking, and OTA firmware updates. The increasing shift to connected vehicle architectures is further driving the demand for SoC-based telematics solutions.

The embedded telematics segment held a 55% share in 2024 and is expected to register a CAGR of 9.6% through 2034. Embedded solutions are gaining momentum among OEMs and large fleet operators due to their factory-installed nature, high reliability, and compliance with stringent data protection requirements. These integrated modules enable seamless tracking, remote diagnostics, and improved fleet governance across a wide range of vehicle platforms and geographical regions. Embedded telematics modules also support advanced vehicle electronics infrastructure and are considered essential for modern-day fleet management, especially in commercial and electric vehicle segments.

United States Telematics Semiconductors Market held an 83% share, generating USD 4.5 billion in 2024. The strong performance of the U.S. market is attributed to the fast adoption of connected vehicle platforms, regulatory emphasis on vehicle safety and data transparency, and rapid investments in next-gen telematics infrastructure. Increased use of AI-powered SoCs, V2X communication modules, and embedded chipsets is driving the integration of telematics across passenger cars, commercial fleets, and electric vehicles. The U.S. market continues to lead in terms of innovation, scalability, and real-time connectivity in the automotive semiconductor space.

Leading companies in the Global Telematics Semiconductors Market include Qualcomm, MediaTek, Renesas Electronics, STMicroelectronics, Analog Devices, Texas Instruments, Murata Manufacturing, Fibocom Wireless, NXP Semiconductors, and Infineon Technologies. To strengthen their foothold, companies operating in the telematics semiconductors space are focusing on a mix of technological innovation, strategic partnerships, and product portfolio expansion. Many are investing in the development of low-power, high-performance chipsets tailored to support AI-enabled telematics functions, cybersecurity, and V2X communication. Collaborations with automotive OEMs and Tier-1 suppliers help ensure tighter integration into vehicle platforms. Firms are also scaling R&D activities to shorten design cycles and enhance real-time processing capabilities.

Table of Contents

Chapter 1 Methodology

  • 1.1 Market scope and definition
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Data mining sources
    • 1.3.1 Global
    • 1.3.2 Regional/country
  • 1.4 Base estimates and calculations
    • 1.4.1 Base year calculation
    • 1.4.2 Key trends for market estimation
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
  • 1.6 Forecast
  • 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

  • 2.1 Industry 3600 synopsis, 2021-2034
  • 2.2 Key market trends
    • 2.2.1 Regional
    • 2.2.2 Type
    • 2.2.3 Connectivity
    • 2.2.4 Vehicle
  • 2.3 TAM Analysis, 2025-2034
  • 2.4 CXO perspectives: Strategic imperatives
    • 2.4.1 Key decision points for industry executives
    • 2.4.2 Critical success factors for market players
  • 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Supplier landscape
      • 3.1.1.1 Chip Manufacturers
      • 3.1.1.2 Connectivity and Communication Module Providers
      • 3.1.1.3 Platform and Software Vendors
      • 3.1.1.4 Distributors and Aggregators
      • 3.1.1.5 OEMs
      • 3.1.1.6 System Integrators and Service Providers
      • 3.1.1.7 End use
    • 3.1.2 Profit margin analysis
    • 3.1.3 Value addition at each stage
    • 3.1.4 Factor affecting the value chain
    • 3.1.5 Disruptions
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Rapid connected vehicle adoption
      • 3.2.1.2 Regulatory push for safety and compliance
      • 3.2.1.3 OEM focus on operational efficiency
      • 3.2.1.4 Rising Demand for OTA and Cloud-Integrated Systems
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High development and integration costs
      • 3.2.2.2 Cybersecurity and data privacy risks
    • 3.2.3 Opportunities
      • 3.2.3.1 Emerging markets & regional expansion
      • 3.2.3.2 Integration with EV and autonomous platforms
      • 3.2.3.3 Shift to software-defined vehicles
      • 3.2.3.4 Growth of Mobility-as-a-Service (MaaS) and Fleet Telematics
  • 3.3 Regulatory Landscape
    • 3.3.1 Global Regulatory Framework Overview
    • 3.3.2 Regional Compliance Requirements
    • 3.3.3 Emerging Regulatory Trends
    • 3.3.4 Regulatory Compliance Costs Analysis
    • 3.3.5 Impact of Policy Changes on Market Dynamics
  • 3.4 Technology & Innovation Landscape
    • 3.4.1 Current Technological Trends
    • 3.4.2 Emerging Technologies Assessment
    • 3.4.3 Technology Adoption Curves
    • 3.4.4 Innovation Hotspots Analysis
    • 3.4.5 Technology Convergence Trends
    • 3.4.6 Disruptive Technology Impact
    • 3.4.7 R&D Investment Patterns
    • 3.4.8 Technology Roadmap Analysis
  • 3.5 Pricing analysis
    • 3.5.1 By Region
    • 3.5.2 By Product
  • 3.6 Patent analysis
  • 3.7 Growth potential analysis
  • 3.8 Porter’s analysis
  • 3.9 PESTEL analysis
  • 3.10 Sustainability & Environmental Aspects
    • 3.10.1 Sustainable Manufacturing Practices
    • 3.10.2 Waste Reduction Strategies
    • 3.10.3 Energy Efficiency in Production
    • 3.10.4 Eco-friendly Material Usage
    • 3.10.5 Circular Economy Implementation
    • 3.10.6 Environmental Compliance Costs
  • 3.11 Risk Assessment Framework
    • 3.11.1 Technology Risk Analysis
    • 3.11.2 Supply Chain Risk Assessment
    • 3.11.3 Market Risk Evaluation
    • 3.11.4 Regulatory Risk Analysis
    • 3.11.5 Financial Risk Assessment
    • 3.11.6 Operational Risk Factors
    • 3.11.7 Risk Mitigation Strategies
  • 3.12 Supply Chain Resilience Assessment
    • 3.12.1 Supply Chain Vulnerability Analysis
    • 3.12.2 Single Point of Failure Identification
    • 3.12.3 Diversification Strategies
    • 3.12.4 Supply Chain Transparency
    • 3.12.5 Risk Mitigation Frameworks
    • 3.12.6 Alternative Sourcing Options

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
    • 4.2.1 North America
    • 4.2.2 Europe
    • 4.2.3 Asia Pacific
    • 4.2.4 LATAM
    • 4.2.5 MEA
  • 4.3 Competitive analysis of major market players
  • 4.4 Competitive positioning matrix
  • 4.5 Strategic outlook matrix
  • 4.6 Key developments
    • 4.6.1 Mergers & acquisitions
    • 4.6.2 Partnerships & collaborations
    • 4.6.3 New Product Launches
    • 4.6.4 Expansion Plans and funding

Chapter 5 Market Estimates & Forecast, By Type, 2021 - 2034 ($Bn, Units)

  • 5.1 Key trends
  • 5.2 Microcontrollers (MCUs)
  • 5.3 System-on-Chip (SoC)
  • 5.4 Communication ICs
  • 5.5 Power Management ICs (PMICs)
  • 5.6 Memory and Storage

Chapter 6 Market Estimates & Forecast, By Connectivity, 2021 - 2034 ($Bn, Units)

  • 6.1 Key trends
  • 6.2 Embedded
  • 6.3 Tethered
  • 6.4 Integrated

Chapter 7 Market Estimates & Forecast, By Vehicle, 2021 - 2034 ($Bn, Units)

  • 7.1 Key trends
  • 7.2 Passenger Vehicles
    • 7.2.1 Compact
    • 7.2.2 Mid-Size
    • 7.2.3 Luxury
    • 7.2.4 SUV
  • 7.3 Commercial Vehicles
    • 7.3.1 Light Commercial Vehicles (LCV)
    • 7.3.2 Heavy Commercial Vehicles (HCV)
    • 7.3.3 Buses
  • 7.4 Electric & Hybrid Vehicles

Chapter 8 Market Estimates & Forecast, By Region, 2021 - 2034 ($Bn, Units)

  • 8.1 Key trends
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 France
    • 8.3.3 UK
    • 8.3.4 Spain
    • 8.3.5 Italy
    • 8.3.6 Russia
    • 8.3.7 Nordics
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 India
    • 8.4.3 Japan
    • 8.4.4 South Korea
    • 8.4.5 ANZ
    • 8.4.6 Southeast Asia
  • 8.5 Latin America
    • 8.5.1 Brazil
    • 8.5.2 Mexico
    • 8.5.3 Argentina
  • 8.6 Middle East and Africa
    • 8.6.1 UAE
    • 8.6.2 Saudi Arabia
    • 8.6.3 South Africa

Chapter 9 Company Profiles

  • 9.1 Global Players
    • 9.1.1 Analog Devices
    • 9.1.2 Broadcom
    • 9.1.3 Infineon Technologies
    • 9.1.4 Microchip Technology
    • 9.1.5 NXP Semiconductors
    • 9.1.6 ON Semiconductor
    • 9.1.7 Qualcomm
    • 9.1.8 Renesas Electronics
    • 9.1.9 STMicroelectronics
    • 9.1.10 Texas Instruments
  • 9.2 Regional Players
    • 9.2.1 Fibocom Wireless
    • 9.2.2 MediaTek
    • 9.2.3 Murata Manufacturing
    • 9.2.4 Quectel Wireless Solutions
    • 9.2.5 ROHM Semiconductor
    • 9.2.6 Samsung Semiconductor
    • 9.2.7 Sierra Wireless
    • 9.2.8 Sony Semiconductor Solutions
    • 9.2.9 Telit Communications
    • 9.2.10 u-blox AG
  • 9.3 Emerging Players
    • 9.3.1 Altair Semiconductor
    • 9.3.2 Cavli Wireless
    • 9.3.3 Nordic Semiconductor
    • 9.3.4 Sequans Communications
    • 9.3.5 Silicon Labs