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市场调查报告书
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1833606

2032 年远端资讯系统晶片市场预测：按处理器核心、节点大小、核心组件整合、车辆类型、应用和地区进行的全球分析

Telematics Systems-on-Chips Market Forecasts to 2032 - Global Analysis By Processing Core (ARM-based, x86-based, RISC-V based), Node Size (>20 nm, 20-10 nm, <10-7 nm, <7 nm), Core Component Integration, Vehicle Type, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球远端资讯系统晶片市场预计在 2025 年达到 56 亿美元，到 2032 年将达到 116 亿美元，预测期内的复合年增长率为 10.9%。

远端资讯系统晶片整合了先进的半导体平台，将运算、通讯和定位技术相结合，为连网汽车生态系统提供动力。这些系统单晶片 (SoC) 支援即时导航、资讯娱乐、车联网 (V2X)通讯和车队管理解决方案。随着自动驾驶汽车、电动车和连网物流的兴起，该市场正在迅速扩张。原始设备製造商 (OEM) 和服务供应商越来越多地采用 SoC 来提供高效、可扩展且安全的远端资讯处理解决方案。随着对智慧交通系统需求的不断增长，该市场在塑造全球汽车互联的未来方面正发挥关键作用。

对提高处理能力的需求

消费者和监管机构不断推动更智慧、更互联的汽车，这是推动远端资讯处理系统晶片 (SoC) 处理能力提升的主要驱动力。现代远端资讯处理单元不再仅仅用于导航，它们也是即时数据分析、ADAS（高级驾驶辅助系统）和 V2X通讯的枢纽。这需要 SoC 拥有强大的运算能力，能够同时无延迟地处理来自多个感测器和摄影机的资料。因此，半导体公司正在优先开发高效能多核心处理器，以满足这些严苛的要求，从而加速其市场扩张。

开发成本高

开发系统晶片需要复杂的架构、专有IP核的授权以及在尖端半导体节点上昂贵的製造流程。获得汽车级可靠性和寿命认证又会增加成本。这些不断上升的成本可能会阻碍小型企业的发展，甚至会对成熟企业的研发预算造成压力，这可能会减缓市场创新和整合的步伐，最终只有资金雄厚的竞争对手才能跟上脚步。

自动驾驶和联网汽车的成长

全球自动驾驶汽车和连网汽车平台的加速部署，为车联网SoC製造商的显着成长铺平了道路。这些汽车依赖车联网系统作为其通讯神经系统，需要能够处理大量资料吞吐量的SoC，以实现即时地图绘製、感测器融合和车联网（V2X）互动。从基础车联网到关键自动驾驶功能的演进，催生了对更精密、更安全、更强大的晶片的需求。能够提供符合自动驾驶严格安全标准的整合解决方案的公司，将有望在这个新兴市场中获得巨大收益。

智慧财产权（IP）安全风险

随着远端资讯处理SoC变得越来越复杂和互联，网路安全漏洞和智慧财产权盗窃的威胁也愈发严峻。这些晶片包含宝贵的专有设计，并处理敏感的车辆和用户数据，因此很容易成为恶意攻击者的目标。成功的骇客攻击可能导致车辆系统未授权存取、隐私被侵犯，甚至昂贵的研发投资被盗。此外，此类安全漏洞可能严重损害品牌声誉，削弱消费者对联网汽车技术的信任，从而导致采用率下降，并增加製造商的责任。

COVID-19的影响：

疫情最初扰乱了远端资讯处理SoC市场，导致工厂关闭和严重的供应链瓶颈，导致生产停顿，汽车製造放缓。然而，这场危机加速了数位化和互联互通的长期趋势。为了确保业务永续营运连续性，企业更加重视非接触式服务和车队管理，这刺激了最初停工后对远端资讯处理解决方案的需求。这导致市场呈现V型復苏，不仅復苏，而且进入了新的成长阶段，因为各行各业都认识到可靠的连结在韧性营运模式中发挥的关键作用。

预测期内，基于 ARM 的架构部分预计将成为最大的市场

预计基于 ARM 架构的细分市场将在预测期内占据最大市场份额，这得益于其在性能和能源效率之间的出色平衡，而这正是汽车远端资讯处理单元始终在线连接的关键要求。此外，ARM 成熟的生态系统和授权模式为联网汽车。

预计安全和安保整合部门在预测期内将实现最高复合年增长率

随着汽车产业向更高自主性迈进，功能安全成为不可或缺的要素，预计安全与安防整合领域将在预测期内实现最高成长率。严格的法规和消费者安全意识的提升迫使汽车製造商将强大的基于硬体的安全功能直接整合到SoC晶片中，以抵御网路攻击。此外，要取得ISO 26262等功能安全认证，需要专用的安全子系统，而这些子系统如今已成为现代远端资讯处理SoC的标准元件。监管压力和技术需求的融合，使得安全与安防整合成为晶片设计中成长最快、最关键的功能。

占比最大的地区：

在预测期内，北美预计将占据最大的市场份额，这得益于主要汽车原始设备製造商 (OEM) 的布局以及其强大的科技行业——该行业是先进远端资讯处理和车联网服务的早期采用者。该地区消费者的高可支配收入推动了对配备先进资讯娱乐和 ADAS 功能的高端汽车的需求，而这些功能都依赖先进的远端资讯处理系统晶片 (SoC)。此外，政府推出的车辆安全法规以及完善的自动驾驶汽车测试基础设施，正在为下一代远端资讯处理系统的部署和创新创造有利环境，进一步巩固该地区的主导地位。

复合年增长率最高的地区：

在预测期内，由于汽车产销的爆炸性成长，尤其是在中国、日本和韩国，亚太地区预计将呈现最高的复合年增长率。该地区是全球半导体製造和电子产品的中心，确保了关键零件的稳健供应链。此外，都市化的加快、智慧城市基础设施投资的增加以及政府对车辆追踪和安全要求的不断加强，正在催生对远端资讯处理系统的巨大需求。蓬勃发展的中阶对新车联网功能的需求，为远端资讯处理系统晶片 (SoC) 供应商提供了一个巨大的尚未开发的市场，从而推动了卓越的成长。

免费客製化服务：

此报告的订阅者可以使用以下免费自订选项之一：

  • 公司简介
    • 对最多三家其他市场公司进行全面分析
    • 主要企业的SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户兴趣对主要国家进行的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球远端资讯处理系统晶片市场（按处理器核心）

  • 基于ARM的架构
  • 基于 x86 的架构
  • 基于RISC-V的架构

6. 全球远端资讯系统晶片市场（依节点大小）

  • 20 奈米以上（传统节点）
  • 20奈米至10奈米（主流节点）
  • 10 奈米至 7 奈米（先进节点）
  • 高达 7 奈米（前沿节点）

7. 全球远端资讯处理系统晶片市场（依核心组件整合）

  • 数据机集成
    • 4G/LTE
    • 5G（NSA 和 SA）
    • C-V2X（PC5和Uu介面）
  • GNSS集成
  • 连接集成
  • 综合安全保障

8. 全球远端资讯系统晶片市场（依车辆类型）

  • 乘用车（PV）
  • 轻型商用车（LCV）
  • 重型商用车（HCV）

9. 全球远端资讯系统晶片市场（按应用）

  • 安全与保障
  • 资讯娱乐和导航
  • 车辆管理
  • 车队管理和追踪
  • 基于使用情况的保险（UBI）

第十章。按地区分類的全球远端资讯系统晶片市场

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十二章 公司概况

  • Qualcomm
  • NXP Semiconductors
  • Renesas Electronics
  • Infineon Technologies
  • STMicroelectronics
  • MediaTek
  • Texas Instruments
  • NVIDIA
  • Broadcom
  • Mobileye
  • Robert Bosch
  • Continental
  • HARMAN
  • u-blox
  • Quectel
  • Sierra Wireless
Product Code: SMRC31439

According to Stratistics MRC, the Global Telematics Systems-on-Chips Market is accounted for $5.6 billion in 2025 and is expected to reach $11.6 billion by 2032 growing at a CAGR of 10.9% during the forecast period. Telematics Systems-on-Chips integrates advanced semiconductor platforms combining computing, communication, and positioning technologies to power connected vehicle ecosystems. These SoCs enable real-time navigation, infotainment, vehicle-to-everything (V2X) communication, and fleet management solutions. Driven by the rise of autonomous vehicles, electric mobility, and connected logistics, the market is expanding rapidly. OEMs and service providers are increasingly adopting SoCs to deliver efficient, scalable, and secure telematics solutions. With accelerating demand for intelligent transport systems, this market is becoming pivotal in shaping the future of automotive connectivity worldwide.

Market Dynamics:

Driver:

Demand for Enhanced Processing Power

The relentless consumer and regulatory push for smarter, more connected vehicles is the primary catalyst for the need for enhanced processing power in Telematics SoCs. Modern telematics units are no longer just for navigation; they are the hub for real-time data analytics, advanced driver-assistance systems (ADAS), and V2X communication. This requires SoCs with immense computational capabilities to process data from multiple sensors and cameras simultaneously without latency. Consequently, semiconductor companies are prioritizing the development of high-performance, multi-core processors to meet these rigorous demands, directly fueling market growth

Restraint:

High Development Costs

Developing a system-on-chip involves complex architecture, licensing of proprietary IP cores, and expensive fabrication processes at cutting-edge semiconductor nodes. Moreover, achieving automotive-grade certification for reliability and longevity adds another layer of cost. These soaring expenses can deter smaller players and strain the R&D budgets of even established companies, potentially slowing the pace of innovation and consolidation in the market as only the well-funded competitors can keep pace.

Opportunity:

Growth of Autonomous and Connected Vehicles

The accelerating global rollout of autonomous and connected vehicle platforms unlocks a substantial growth avenue for Telematics SoC manufacturers. These vehicles rely on telematics systems as their communication nervous system, requiring SoCs that can handle massive data throughput for real-time mapping, sensor fusion, and vehicle-to-everything (V2X) interactions. This evolution from basic telematics to critical autonomous driving functions creates a need for more sophisticated, secure, and powerful chips. Companies that can deliver integrated solutions meeting the stringent safety standards of autonomous driving are positioned to capture a significant and lucrative share of this emerging market.

Threat:

Intellectual Property (IP) Security Risks

As Telematics SoCs become more complex and interconnected, they face escalating threats from cybersecurity breaches and intellectual property theft. These chips contain valuable proprietary designs and process sensitive vehicle and user data, making them attractive targets for malicious actors. A successful hack could lead to unauthorized access to vehicle systems, privacy violations, or the theft of costly R&D investments. Moreover, such security failures can severely damage a brand's reputation and erode consumer trust in connected car technologies, potentially leading to slowed adoption rates and increased liability for manufacturers.

Covid-19 Impact:

The pandemic initially disrupted the Telematics SoC market through factory closures and severe supply chain bottlenecks, halting production and delaying vehicle manufacturing. However, the crisis also accelerated the long-term trend towards digitalization and connectivity. The heightened focus on contactless services and fleet management to ensure business continuity stimulated demand for telematics solutions post the initial lockdowns. This created a V-shaped recovery, where the market not only rebounded but entered a new phase of growth, as industries recognized the critical role of reliable connectivity in a resilient operational model.

The ARM-based architecture segment is expected to be the largest during the forecast period

The ARM-based architecture segment is expected to account for the largest market share during the forecast period attributed to its exceptional balance of performance and energy efficiency, a critical requirement for the always-on nature of telematics units in vehicles. Furthermore, ARM's established ecosystem and licensing model provide a scalable and cost-effective foundation for semiconductor companies to build upon, reducing time-to-market. Its widespread adoption across the mobile and embedded industries has created a vast repository of software and developer expertise, making it the de facto choice for automakers and Tier-1 suppliers seeking reliable and versatile processing solutions for their connected car portfolios.

The safety and security integration segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the safety and security integration segment is predicted to witness the highest growth rate driven by the automotive industry's transition towards higher levels of autonomy, where functional safety is non-negotiable. Stringent regulations and consumer awareness are forcing automakers to integrate robust hardware-based security features directly into the SoC silicon to protect against cyberattacks. Additionally, achieving certifications like ISO 26262 for functional safety requires dedicated security subsystems, which are now becoming a standard component in modern Telematics SoCs. This convergence of regulatory pressure and technological necessity makes safety and security integration the fastest-growing critical function within the chip design.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share anchored by the presence of major automotive OEMs and a strong technology sector that is an early adopter of advanced telematics and connected car services. High consumer disposable income in the region fuels demand for premium vehicles equipped with sophisticated infotainment and ADAS features, all of which rely on advanced Telematics SoCs. Moreover, supportive government regulations promoting vehicle safety and the well-established infrastructure for testing autonomous vehicles create a conducive environment for the deployment and innovation of next-generation telematics systems, solidifying the region's dominant position.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR propelled by the explosive expansion of its automotive production and sales, particularly in China, Japan, and South Korea. This region is a global hub for semiconductor manufacturing and electronics, ensuring a robust supply chain for key components. Furthermore, rising urbanization, increasing investments in smart city infrastructure, and growing governmental mandates for vehicle tracking and safety are creating massive demand for telematics systems. The burgeoning middle class's appetite for connected features in new vehicles provides a vast, untapped market for Telematics SoC vendors, driving exceptional growth.

Key players in the market

Some of the key players in Telematics Systems-on-Chips Market include Qualcomm, NXP Semiconductors, Renesas Electronics, Infineon Technologies, STMicroelectronics, MediaTek, Texas Instruments, NVIDIA, Broadcom, Mobileye, Robert Bosch, Continental, HARMAN, u-blox, Quectel, and Sierra Wireless.

Key Developments:

In September 2025, Qualcomm partnered with BMW to unveil the Snapdragon Ride Pilot, an advanced AI-enabled automated driving system in the BMW iX3, supporting hands-free driving on highways and smart parking, validated in over 60 countries.

In April 2025, Texas Instruments (TI) introduced a new portfolio of automotive lidar, clock and radar chips to help automakers transform vehicle safety by bringing more autonomous features to a wider range of cars. TI's new LMH13000, the industry's first integrated high-speed lidar laser driver, delivers ultra-fast rise time to improve real-time decision-making. The industry's first automotive BAW-based clocks, the CDC6C-Q1 oscillator and LMK3H0102-Q1 and LMK3C0105-Q1 clock generators, improve advanced driver assistance system (ADAS) reliability. Addressing evolving ADAS needs, TI's new AWR2944P mmWave radar sensor offers advanced front and corner radar capabilities.

In June 2025, Broadcom is now shipping its Tomahawk 6 switch chip, offering 102.4 terabits per second of bandwidth on a single chip. That's double the capacity of any current Ethernet switch and is aimed squarely at powering larger, more complex AI networks. Built to handle both scale-up and scale-out network designs, Tomahawk 6 supports 100G and 200G SerDes and co-packaged optics, giving cloud providers and hyperscalers flexible options when connecting clusters of over a million processing units. It also introduces new routing features that help networks respond to congestion and failure in real time critical for AI training and inference tasks.

Node Sizes Covered:

  • >20 nm (Legacy Nodes)
  • 20 nm - 10 nm (Mainstream Nodes)
  • <10 nm - 7 nm (Advanced Nodes)
  • <7 nm (Leading-Edge Nodes)

Core Component Integrations Covered:

  • Modem Integration
  • GNSS Integration
  • Connectivity Integration
  • Safety and Security Integration

Vehicle Types Covered:

  • Passenger Cars (PV)
  • Light Commercial Vehicles (LCV)
  • Heavy Commercial Vehicles (HCV)

Applications Covered:

  • Safety and Security
  • Infotainment and Navigation
  • Vehicle Management
  • Fleet Management and Tracking
  • Usage-Based Insurance (UBI)

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Telematics Systems-on-Chips Market, By Processing Core

  • 5.1 Introduction
  • 5.2 ARM-based Architecture
  • 5.3 x86-based Architecture
  • 5.4 RISC-V based Architecture

6 Global Telematics Systems-on-Chips Market, By Node Size

  • 6.1 Introduction
  • 6.2 >20 nm (Legacy Nodes)
  • 6.3 20 nm - 10 nm (Mainstream Nodes)
  • 6.4 <10 nm - 7 nm (Advanced Nodes)
  • 6.5 <7 nm (Leading-Edge Nodes)

7 Global Telematics Systems-on-Chips Market, By Core Component Integration

  • 7.1 Introduction
  • 7.2 Modem Integration
    • 7.2.1 4G/LTE
    • 7.2.2 5G (NSA and SA)
    • 7.2.3 C-V2X (PC5 and Uu Interfaces)
  • 7.3 GNSS Integration
  • 7.4 Connectivity Integration
  • 7.5 Safety and Security Integration

8 Global Telematics Systems-on-Chips Market, By Vehicle Type

  • 8.1 Introduction
  • 8.2 Passenger Cars (PV)
  • 8.3 Light Commercial Vehicles (LCV)
  • 8.4 Heavy Commercial Vehicles (HCV)

9 Global Telematics Systems-on-Chips Market, By Application

  • 9.1 Introduction
  • 9.2 Safety and Security
  • 9.3 Infotainment and Navigation
  • 9.4 Vehicle Management
  • 9.5 Fleet Management and Tracking
  • 9.6 Usage-Based Insurance (UBI)

10 Global Telematics Systems-on-Chips Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Qualcomm
  • 12.2 NXP Semiconductors
  • 12.3 Renesas Electronics
  • 12.4 Infineon Technologies
  • 12.5 STMicroelectronics
  • 12.6 MediaTek
  • 12.7 Texas Instruments
  • 12.8 NVIDIA
  • 12.9 Broadcom
  • 12.10 Mobileye
  • 12.11 Robert Bosch
  • 12.12 Continental
  • 12.13 HARMAN
  • 12.14 u-blox
  • 12.15 Quectel
  • 12.16 Sierra Wireless

List of Tables

  • Table 1 Global Telematics Systems-on-Chips Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Telematics Systems-on-Chips Market Outlook, By Processing Core (2024-2032) ($MN)
  • Table 3 Global Telematics Systems-on-Chips Market Outlook, By ARM-based Architecture (2024-2032) ($MN)
  • Table 4 Global Telematics Systems-on-Chips Market Outlook, By x86-based Architecture (2024-2032) ($MN)
  • Table 5 Global Telematics Systems-on-Chips Market Outlook, By RISC-V based Architecture (2024-2032) ($MN)
  • Table 6 Global Telematics Systems-on-Chips Market Outlook, By Node Size (2024-2032) ($MN)
  • Table 7 Global Telematics Systems-on-Chips Market Outlook, By >20 nm (Legacy Nodes) (2024-2032) ($MN)
  • Table 8 Global Telematics Systems-on-Chips Market Outlook, By 20 nm - 10 nm (Mainstream Nodes) (2024-2032) ($MN)
  • Table 9 Global Telematics Systems-on-Chips Market Outlook, By <10 nm - 7 nm (Advanced Nodes) (2024-2032) ($MN)
  • Table 10 Global Telematics Systems-on-Chips Market Outlook, By <7 nm (Leading-Edge Nodes) (2024-2032) ($MN)
  • Table 11 Global Telematics Systems-on-Chips Market Outlook, By Core Component Integration (2024-2032) ($MN)
  • Table 12 Global Telematics Systems-on-Chips Market Outlook, By Modem Integration (2024-2032) ($MN)
  • Table 13 Global Telematics Systems-on-Chips Market Outlook, By 4G/LTE (2024-2032) ($MN)
  • Table 14 Global Telematics Systems-on-Chips Market Outlook, By 5G (NSA and SA) (2024-2032) ($MN)
  • Table 15 Global Telematics Systems-on-Chips Market Outlook, By C-V2X (PC5 and Uu Interfaces) (2024-2032) ($MN)
  • Table 16 Global Telematics Systems-on-Chips Market Outlook, By GNSS Integration (2024-2032) ($MN)
  • Table 17 Global Telematics Systems-on-Chips Market Outlook, By Connectivity Integration (2024-2032) ($MN)
  • Table 18 Global Telematics Systems-on-Chips Market Outlook, By Safety and Security Integration (2024-2032) ($MN)
  • Table 19 Global Telematics Systems-on-Chips Market Outlook, By Vehicle Type (2024-2032) ($MN)
  • Table 20 Global Telematics Systems-on-Chips Market Outlook, By Passenger Cars (PV) (2024-2032) ($MN)
  • Table 21 Global Telematics Systems-on-Chips Market Outlook, By Light Commercial Vehicles (LCV) (2024-2032) ($MN)
  • Table 22 Global Telematics Systems-on-Chips Market Outlook, By Heavy Commercial Vehicles (HCV) (2024-2032) ($MN)
  • Table 23 Global Telematics Systems-on-Chips Market Outlook, By Application (2024-2032) ($MN)
  • Table 24 Global Telematics Systems-on-Chips Market Outlook, By Safety and Security (2024-2032) ($MN)
  • Table 25 Global Telematics Systems-on-Chips Market Outlook, By Infotainment and Navigation (2024-2032) ($MN)
  • Table 26 Global Telematics Systems-on-Chips Market Outlook, By Vehicle Management (2024-2032) ($MN)
  • Table 27 Global Telematics Systems-on-Chips Market Outlook, By Fleet Management and Tracking (2024-2032) ($MN)
  • Table 28 Global Telematics Systems-on-Chips Market Outlook, By Usage-Based Insurance (UBI) (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.