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市场调查报告书
商品编码
1459019

全球先进半导体封装市场

Semiconductor Advanced Packaging
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 488 Pages | 商品交期: 最快1-2个工作天内

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简介目录

到2030年，全球半导体先进封装市场将达到680亿美元

全球半导体先进封装市场预估2023年为384亿美元，预估至2030年将达680亿美元，2023年至2030年复合年增长率为7.4%。覆晶构装是本报告分析的细分市场之一，预计复合年增长率为 7%，到分析期结束时将达到 491 亿美元。预计未来八年 2.5D/3D 封装领域的复合年增长率为 9.6%。

美国市场预估成长35亿美元，中国复合年增长率为8.5%

预计到 2023 年，美国半导体先进封装市场价值将达到 35 亿美元。作为世界第二大经济体，预计2030年中国的市场规模将达到199亿美元，2023年至2030年的分析期间复合年增长率为8.5%。其他值得注意的区域市场包括日本和加拿大，预计 2023 年至 2030 年将分别成长 5.2% 和 6.1%。在欧洲，德国的复合年增长率预计约为 5.4%。

推出 2024 年令人兴奋的新报告功能

完全访问影响者参与统计数据

免费存取数位檔案和「MarketGlass」研究平台。我们独特的 MarketGlass 平台使我们能够集体协作地释放世界各地专家的创造力和市场知识。我们的尖端工具提供世界一流的市场可视性，同时保护市场参与企业的隐私和身分。报告中的数字、统计数据和市场描述是基于该领域专家和影响者共用的全面见解。

使用即时资料模拟器工具和自订报告产生参与互动式调查。

客户全面连结同侪协作互动平台，实现企业间智慧交流

1 年免费报告更新

竞争覆盖范围，包括主要参与者的全球市场占有率

多个地区参与者的市场影响分析（强/活跃/利基/次要）

访问专家/影响者访谈、播客、新闻公告和活动主题演讲的 YouTube 视频

2024 年世界经济有何预期

货币紧缩和相关利率上升导致的地缘政治和经济不稳定将在 2024 年造成动盪的局面。一些因素将继续给復苏之路带来压力，包括中东的敌对行动和日益频繁的气候灾害。儘管存在风险，但一些积极因素正在显现，包括通货紧缩征兆更加明显、对顽固通膨的担忧有所缓解、供应链正常化以及儘管能源成本波动但价格仍有所回落。这一切已经开始发生。印度和美国等二十一国集团国家的选举可能会影响资本流动和投资策略。儘管印度作为全球投资目的地的地位日益突出，但在充满活力的人才和资本生态系统的推动下，美国科技公司将继续占据主导地位。儘管该国经济放缓，但由于国内经济富有弹性和有利的法规环境，高科技机会（尤其是硅谷）仍然对寻求高成长潜力的投资者俱有吸引力。欧洲持续应对紧缩的货币政策和景气衰退风险，但英国的前景最严峻，2024 年景气衰退的风险最高。中国仍然是通用凭证，其成长预计将受到政府支出和消费者支出改善的支持。动盪的环境可能为投资者和公司带来机会和挑战。指导投资决策的灵活性和策略远见，以及将波动性视为成长的催化剂，对于生存仍然至关重要。

受访企业范例

  • Advanced Micro Devices, Inc.
  • Applied Materials, Inc.
  • Avery Dennison Corporation
  • Amkor Technology, Inc.
  • Advantest Corporation
  • Brewer Science, Inc.
  • American Semiconductor, Inc.
  • ASM Pacific Technology Ltd.
  • ASE Technology Holding Co., Ltd.
  • AT & S Austria Technologie & Systemtechnik AG
  • BE Semiconductor Industries NV
  • Amtech Microelectronics, Inc.
  • APSTL
  • Boschman Technologies
  • ASE Korea

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 韩国
  • 台湾
  • 其他亚太地区
  • 世界其他地区

第四章 比赛

简介目录
Product Code: MCP14658

Global Semiconductor Advanced Packaging Market to Reach $68 Billion by 2030

The global market for Semiconductor Advanced Packaging estimated at US$38.4 Billion in the year 2023, is expected to reach US$68 Billion by 2030, growing at a CAGR of 7.4% over the period 2023-2030. Flip Chip Packaging, one of the segments analyzed in the report, is expected to record 7% CAGR and reach US$49.1 Billion by the end of the analysis period. Growth in the 2.5D/3D Packaging segment is estimated at 9.6% CAGR for the next 8-year period.

The U.S. Market is Estimated at $3.5 Billion, While China is Forecast to Grow at 8.5% CAGR

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3.5 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$19.9 Billion by the year 2030 trailing a CAGR of 8.5% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.2% and 6.1% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 5.4% CAGR.

Introducing Our Exciting New Report Features for 2024

Full access to influencer engagement stats

Free access to our digital archives & "MarketGlass" research platform. Our proprietary MarketGlass platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. Our state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.

Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities

Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas

Complimentary report updates for one year

Competitor coverage with global market shares of major players

Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies

Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 109 Featured) -

  • Advanced Micro Devices, Inc.
  • Applied Materials, Inc.
  • Avery Dennison Corporation
  • Amkor Technology, Inc.
  • Advantest Corporation
  • Brewer Science, Inc.
  • American Semiconductor, Inc.
  • ASM Pacific Technology Ltd.
  • ASE Technology Holding Co., Ltd.
  • AT & S Austria Technologie & Systemtechnik AG
  • BE Semiconductor Industries N.V.
  • Amtech Microelectronics, Inc.
  • APSTL
  • Boschman Technologies
  • ASE Korea

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Competitive Scenario
    • Semiconductor Supply Chain Transitions at Various Levels
    • Financial Performances of Packaging Suppliers Reveals New Growth Players
    • Unconventional Players Joining Semiconductor Advanced Packaging Bandwagon
    • Semiconductor Advanced Packaging - Global Key Competitors Percentage Market Share in 2023 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
    • Rising Semiconductor Demand Presents Bundle of Joy for Advanced Packaging Market
    • Prominent Factors Stirring Semiconductor Advanced Packaging Market
    • Global Market Prospects & Outlook
    • Flip-Chip: Key Contributing Segment
    • Rising Investments to Benefit Market
    • Key Trends to Drive Semiconductor Advanced Packaging Market
    • Regional Analysis
    • An Introduction to Semiconductor Advanced Packaging
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Semiconductor Industry Trends Indicating Brighter Days Ahead for Advanced Packaging
    • Digital Transformation Drive to Steer Future Growth of Advanced Packaging Market
    • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
    • IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging
    • Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
    • Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
    • Increasing Functionality & Application Scope
    • New Packaging Technologies Crucial to Semiconductor Innovation
    • 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
    • 3D InCites - Advanced Packaging for 5G
    • 2.5D Packaging Emerges as Powerful Option for Next-Generation AI Products
    • Advanced Packaging Influences Design Chain
    • Led by Innovation, Semiconductor Advanced Packaging Enters into Exciting Era
    • Innovative Advanced Packaging Techniques to Flood the Market
    • Amkor Technology Leading Packaging Technology Innovation
    • Prominent Technology Trends
    • Reducing the Cost of Advanced Packaging
    • Investments in Advanced Packaging: A Critical Component for Resilient Semiconductor Supply Chain
    • Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
    • Post Pandemic Recovery in CE Sector to Augment Prospects
    • Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
    • Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
    • Smartphones
    • Tablet PCs
    • FOWLP and Challenges to Packaging Materials Suppliers
    • Automobile Electronification Trends Widen the Addressable Market
    • Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
    • Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
    • Sustained High Growth in ICT Sector Augurs Well
    • Factors Precipitating Semiconductor Advanced Packaging Demand & Challenges
    • Factors Putting Additional Demands on Packaging
    • Fan-Out Packaging: Promises & Key Challenges
    • Implications of Chiplets & Related Designs for Advanced Packaging
    • Solving Lithography Challenges
    • Warped Wafer Processing
    • UBM/RDL and PR Strip Challenges
    • UBM/RDL Etch
    • Semiconductor Supply Chain: The Complex Nature & Vulnerabilities
    • Vulnerabilities for WBG Power Semiconductors
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for Flip Chip Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for 2.5D/3D Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for FI WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for FO WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 17: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 18: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 21: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 24: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 27: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 30: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 31: World Semiconductor Advanced Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 32: USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 33: USA Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 34: USA 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 35: USA Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 36: USA Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 37: USA 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 38: Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: Canada Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 40: Canada 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 41: Canada Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 42: Canada Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 43: Canada 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • JAPAN
    • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 44: Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Japan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 46: Japan 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 47: Japan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 48: Japan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 49: Japan 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CHINA
    • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 50: China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: China Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 52: China 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 53: China Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: China Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: China 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • EUROPE
    • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 56: Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 57: Europe Historic Review for Semiconductor Advanced Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: Europe 16-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 59: Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 60: Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: Europe 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 62: Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • FRANCE
    • TABLE 65: France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: France Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: France 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 68: France Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: France Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: France 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • GERMANY
    • TABLE 71: Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: Germany Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: Germany 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 74: Germany Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Germany Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Germany 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 77: Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Italy Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Italy 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 80: Italy Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: Italy Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: Italy 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • TABLE 83: UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: UK Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: UK 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 86: UK Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: UK Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: UK 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 89: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 90: Rest of Europe Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: Rest of Europe 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Rest of Europe Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Rest of Europe 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 95: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 96: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2014, 2024 & 2030
    • TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • SOUTH KOREA
    • TABLE 104: South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: South Korea Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: South Korea 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 107: South Korea Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: South Korea Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: South Korea 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • TAIWAN
    • TABLE 110: Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 111: Taiwan Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 112: Taiwan 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 113: Taiwan Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 114: Taiwan Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 115: Taiwan 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 116: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 117: Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 118: Rest of Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 119: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 120: Rest of Asia-Pacific Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 121: Rest of Asia-Pacific 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 122: Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 123: Rest of World Historic Review for Semiconductor Advanced Packaging by Technology - Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 124: Rest of World 16-Year Perspective for Semiconductor Advanced Packaging by Technology - Percentage Breakdown of Value Revenues for Flip Chip Packaging, 2.5D/3D Packaging, FI WLP and FO WLP for the Years 2014, 2024 & 2030
    • TABLE 125: Rest of World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Revenues in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 126: Rest of World Historic Review for Semiconductor Advanced Packaging by End-Use - Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 127: Rest of World 16-Year Perspective for Semiconductor Advanced Packaging by End-Use - Percentage Breakdown of Value Revenues for Consumer Electronics, Industrial, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030

IV. COMPETITION