查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1651008

全球先进电子封装市场

Advanced Electronic Packaging
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 78 Pages | 商品交期: 最快1-2个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

预计到 2030 年全球先进电子封装市场规模将达 132 亿美元

2024 年全球先进电子封装市场规模估计为 79 亿美元，预计到 2030 年将达到 132 亿美元，2024 年至 2030 年的复合年增长率为 9.0%。晶圆级晶片规模封装是报告分析的细分市场之一，预计在分析期结束时复合年增长率为 8.5%，达到 75 亿美元。在分析期间内，硅穿孔(Tsv) 封装部分预计以 9.8% 的复合年增长率成长。

美国市场规模估计为 20 亿美元，中国市场预估年复合成长率为 11.9%

预计 2024 年美国先进电子封装市场规模将达 20 亿美元。作为世界第二大经济体的中国，预计到 2030 年市场规模将达到 30 亿美元，2024-2030 年分析期内的复合年增长率为 11.9%。其他值得注意的区域市场包括日本和加拿大，预计在分析期间的复合年增长率分别为 5.8% 和 7.2%。在欧洲，预计德国的复合年增长率约为 6.8%。

全球先进电子封装市场-主要趋势与驱动因素摘要

先进的电子封装将如何改变半导体製造？

先进的电子封装正在透过实现更高效、更强大、更紧凑的设备彻底改变半导体产业。涉及简单的引线接合法技术的传统封装方法正在让位于系统级封装(SiP)、3D 堆迭和晶圆层次电子构装(WLP) 等复杂的封装解决方案。这些先进的封装技术能够在单一封装内整合多个组件，从而提高性能并减少电子设备的整体占用空间。这种演进对于满足现代应用需要更快的处理速度、更低功耗和更小尺寸的需求至关重要。例如，智慧型手机、物联网设备和高效能运算系统都受益于提供卓越温度控管和讯号完整性的先进封装技术。这些技术的整合不仅增强了设备功能，而且还推动了汽车、医疗保健和通讯等不同领域的创新。

哪些创新正在塑造先进的电子封装？

技术创新是电子封装进步的核心，推动效能、可靠性和扩充性的提升。一项关键突破是 3D IC（积体电路）技术的开发，该技术允许垂直堆迭多个半导体晶粒。这种 3D 方法显着提高了处理能力和记忆体容量，同时降低了延迟。另一项关键创新是扇出型晶圆级封装（FOWLP）的出现，它提供更高的整合密度和卓越的热性能。此外，人们正在利用硅中介层和有机基板等先进材料来提高电气性能和散热性能。穿透硅通孔（TSV）和微凸块技术的采用进一步提高了封装的连接性和性能。这些技术进步对于满足现代电子系统日益复杂的性能要求至关重要。

市场趋势如何影响先进封装解决方案的采用？

市场趋势在先进封装解决方案的采用中发挥着至关重要的作用。对更小、更快、更有效率的电子设备的需求不断增长，推动着向先进封装技术的转变。家用电子电器，尤其是智慧型手机和穿戴式设备，需要高水准的整合度和性能，而这可以透过先进的封装来实现。汽车产业对电动车 (EV) 和自动驾驶系统的发展也需要先进的封装来支援这些应用所需的高效能运算和感测器整合。此外，5G 技术的日益普及也加速了对能够支援更高频率和资料速率的先进封装解决方案的需求。资料中心和云端处理基础设施对改善温度控管和电源效率的需求正在推动先进封装的采用。这些趋势正在塑造市场格局，鼓励製造商创新并采用尖端的包装技术。

哪些因素推动了先进电子封装市场的成长？

先进电子封装市场的成长受到多种因素的推动。半导体製造和封装技术的进步提高了电子设备的性能和可靠性，使其对最终用户更具吸引力。家用电子电器、汽车系统和通讯设备的复杂性和功能性日益增加，对先进封装解决方案的需求庞大。向 5G 网路和物联网 (IoT) 的转变为高效能、紧凑和节能的封装技术创造了新的机会。此外，对电子设备的能源效率和温度控管的日益重视也推动了尖端材料和封装技术的采用。政府对半导体研发的措施和投资也促进了市场成长，特别是在寻求提高半导体製造能力的地区。这些因素，加上对小型化和性能提升的不懈追求，正在推动先进电子封装市场向前发展。

部分

技术（晶圆级晶片规模封装、硅通孔 (TSV) 封装）

受访企业范例（共38家）

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation（SMIC）
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.（TSMC）
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章 市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 西班牙
  • 俄罗斯
  • 其他欧洲国家
  • 亚太地区
  • 澳洲
  • 印度
  • 韩国
  • 其他亚太地区
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲国家
  • 中东
  • 伊朗
  • 以色列
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 其他中东地区
  • 非洲

第四章 竞赛

简介目录
Product Code: MCP-1203

Global Advanced Electronic Packaging Market to Reach US$13.2 Billion by 2030

The global market for Advanced Electronic Packaging estimated at US$7.9 Billion in the year 2024, is expected to reach US$13.2 Billion by 2030, growing at a CAGR of 9.0% over the analysis period 2024-2030. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is expected to record a 8.5% CAGR and reach US$7.5 Billion by the end of the analysis period. Growth in the Through Silicon via (Tsv) Packaging segment is estimated at 9.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.0 Billion While China is Forecast to Grow at 11.9% CAGR

The Advanced Electronic Packaging market in the U.S. is estimated at US$2.0 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.0 Billion by the year 2030 trailing a CAGR of 11.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.8% and 7.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 6.8% CAGR.

Global Advanced Electronic Packaging Market - Key Trends and Drivers Summarized

How Is Advanced Electronic Packaging Transforming Semiconductor Manufacturing?

Advanced electronic packaging is revolutionizing the semiconductor industry by enabling more efficient, powerful, and compact devices. Traditional packaging methods, which involved simple wire bonding techniques, are being replaced by sophisticated packaging solutions such as system-in-package (SiP), 3D stacking, and wafer-level packaging (WLP). These advanced techniques allow for the integration of multiple components within a single package, enhancing performance and reducing the overall footprint of electronic devices. This evolution is critical in meeting the demands of modern applications that require high-speed processing, low power consumption, and miniaturization. For instance, smartphones, IoT devices, and high-performance computing systems all benefit from advanced packaging technologies that provide superior thermal management and signal integrity. The integration of these technologies is not only enhancing device capabilities but also driving innovation across various sectors, including automotive, healthcare, and telecommunications.

What Technological Innovations Are Shaping Advanced Electronic Packaging?

Technological innovations are at the heart of advancements in electronic packaging, driving improvements in performance, reliability, and scalability. One of the significant breakthroughs is the development of 3D IC (integrated circuit) technology, which allows for the vertical stacking of multiple semiconductor dies. This 3D approach significantly enhances processing power and memory capacity while reducing latency. Another key innovation is the advent of fan-out wafer-level packaging (FOWLP), which offers higher integration density and better thermal performance. Additionally, advanced materials such as silicon interposers and organic substrates are being utilized to improve electrical performance and heat dissipation. The incorporation of through-silicon vias (TSVs) and micro-bumping techniques further enhances the connectivity and performance of these packages. These technological advancements are crucial in addressing the growing complexity and performance requirements of modern electronic systems.

How Are Market Trends Influencing the Adoption of Advanced Packaging Solutions?

Market trends are playing a pivotal role in influencing the adoption of advanced packaging solutions. The increasing demand for smaller, faster, and more efficient electronic devices is driving the shift towards advanced packaging technologies. Consumer electronics, particularly smartphones and wearable devices, require high levels of integration and performance, which advanced packaging can deliver. The automotive industry's push towards electric vehicles (EVs) and autonomous driving systems also necessitates advanced packaging to support the high-performance computing and sensor integration required in these applications. Additionally, the growing adoption of 5G technology is accelerating the demand for advanced packaging solutions that can handle higher frequencies and greater data rates. The need for improved thermal management and power efficiency in data centers and cloud computing infrastructures is further driving the adoption of advanced packaging. These trends are shaping the market landscape, pushing manufacturers to innovate and adopt cutting-edge packaging technologies.

What Factors Are Driving Growth in the Advanced Electronic Packaging Market?

The growth in the advanced electronic packaging market is driven by several factors. Technological advancements in semiconductor fabrication and packaging are enhancing the performance and reliability of electronic devices, making them more attractive to end-users. The increasing complexity and functionality of consumer electronics, automotive systems, and communication devices are generating significant demand for advanced packaging solutions. The shift towards 5G networks and the Internet of Things (IoT) is creating new opportunities for high-performance, compact, and energy-efficient packaging technologies. Additionally, the growing emphasis on energy efficiency and thermal management in electronic devices is driving the adoption of advanced materials and packaging methods. Government initiatives and investments in semiconductor research and development are also contributing to market growth, particularly in regions aiming to strengthen their semiconductor manufacturing capabilities. These factors, coupled with the relentless pursuit of miniaturization and enhanced performance, are propelling the advanced electronic packaging market forward.

SCOPE OF STUDY:

The report analyzes the Advanced Electronic Packaging market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Technology (Wafer-Level Chip-Scale Packaging, Through Silicon Via (TSV) Packaging)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 38 Featured) -

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation (SMIC)
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • Advanced Electronic Packaging - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturization Throws the Spotlight on Advanced Packaging Solutions
    • Integration of Advanced Materials Expands Addressable Market Opportunity
    • Adoption of Fan-Out Wafer-Level Packaging (FOWLP) Spurs Growth in High-Density Applications
    • Technological Innovations Propel Growth in 3D IC Technology
    • Growing Prevalence of 5G Technology Strengthens Business Case for Advanced Packaging
    • Shift Towards Electric Vehicles (EVs) and Autonomous Driving Generates Demand for High-Performance Packaging
    • Increased Complexity in Consumer Electronics Drives Adoption of Advanced Packaging Technologies
    • Need for Improved Thermal Management in Data Centers Propels Growth in Advanced Packaging
    • Emergence of Internet of Things (IoT) Expands Addressable Market Opportunity for Compact and Efficient Packaging
    • Advancements in Through-Silicon Vias (TSVs) and Micro-Bumping Techniques Drive Market Expansion
    • Technological Integration in Automotive Systems Generates Demand for Robust Packaging Solutions
    • Increasing Use of Wearable Devices and Smart Gadgets Throws the Spotlight on Miniaturized Packaging
    • Expansion of Cloud Computing and AI Applications Propels Growth in Advanced Electronic Packaging
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Advanced Electronic Packaging Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Wafer-Level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Wafer-Level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Through Silicon via (Tsv) Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Through Silicon via (Tsv) Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 8: USA Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 9: USA 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • CANADA
    • TABLE 10: Canada Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 11: Canada 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • JAPAN
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 12: Japan Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 13: Japan 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • CHINA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 14: China Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 15: China 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • EUROPE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 16: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: Europe 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 18: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 19: Europe 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • FRANCE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 20: France Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 21: France 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • GERMANY
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 22: Germany Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 23: Germany 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ITALY
    • TABLE 24: Italy Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 25: Italy 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • UNITED KINGDOM
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 26: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: UK 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SPAIN
    • TABLE 28: Spain Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 29: Spain 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • RUSSIA
    • TABLE 30: Russia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Russia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 32: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Rest of Europe 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ASIA-PACIFIC
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 34: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 35: Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
    • TABLE 36: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • AUSTRALIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 38: Australia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Australia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • INDIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 40: India Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: India 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SOUTH KOREA
    • TABLE 42: South Korea Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: South Korea 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 44: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Rest of Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • LATIN AMERICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 46: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 47: Latin America 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
    • TABLE 48: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 49: Latin America 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ARGENTINA
    • TABLE 50: Argentina Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Argentina 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • BRAZIL
    • TABLE 52: Brazil Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Brazil 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • MEXICO
    • TABLE 54: Mexico Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Mexico 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 56: Rest of Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Rest of Latin America 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • MIDDLE EAST
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 58: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 59: Middle East 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
    • TABLE 60: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: Middle East 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • IRAN
    • TABLE 62: Iran Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Iran 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ISRAEL
    • TABLE 64: Israel Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Israel 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SAUDI ARABIA
    • TABLE 66: Saudi Arabia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Saudi Arabia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 68: UAE Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: UAE 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 70: Rest of Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Rest of Middle East 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • AFRICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 72: Africa Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Africa 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030

IV. COMPETITION