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市场调查报告书
商品编码
1765432

全球底部填充材料市场

Underfill Materials
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 273 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年全球底部填充市场规模将达到 6.488 亿美元

全球底部填充材料市场规模预计在2024年为4.344亿美元，预计到2030年将达到6.488亿美元，在2024-2030年的分析期内，复合年增长率为6.9%。毛细管底部填充材料（CUF）是本报告分析的细分市场之一，预计其复合年增长率为7.5%，到分析期结束时将达到3.846亿美元。无流动底部填充材料（NUF）细分市场在分析期间的复合年增长率预计为6.4%。

美国市场规模估计为 1.208 亿美元，而中国市场预计复合年增长率为 6.4%

美国底部填充材料市场规模预计在2024年达到1.208亿美元。作为世界第二大经济体，中国预计在2024-2030年的分析期内实现6.4%的复合年增长率，并在2030年达到1亿美元的市场规模。其他值得关注的区域市场包括日本和加拿大，预计在分析期间的复合年增长率分别为6.5%和5.5%。在欧洲，预计德国的复合年增长率为5.5%。

全球底部填充材料市场—关键趋势与驱动因素

为什么底部填充材料在现代电子製造中如此重要？

底部填充材料在提高电子设备的性能、可靠性和使用寿命方面发挥着至关重要的作用，使其成为电子製造业的重要组成部分。但这些材料究竟是什么呢？底部填充材料是专门的环氧树脂或树脂化合物，用于填充覆晶、球栅阵列 (BGA) 和晶片级封装 (CSP) 组件中微晶片与其基板之间的空间。此过程称为底部填充，可显着增强焊点的机械完整性，保护焊点免受晶片和基板之间的热膨胀不匹配而导致的应力和热故障。随着电子设备变得更小、更强大，对能够承受机械衝击、热循环和湿气侵入的坚固互连的需求呈指数级增长。底部填充材料能够在整个微电子封装中均匀分布应力，已成为确保设备可靠性和性能的重要解决方案。

高密度电子封装的快速发展和积体电路 (IC) 日益复杂的特性推动了底部填充材料的采用。随着对更小、更轻、更强大设备的需求不断增长，製造商依赖覆晶和 3D 封装等先进封装技术，这些技术需要底部填充材料来稳定结构，防止运行过程中发生翘曲和开裂。在智慧型手机、平板电脑、汽车电子产品和物联网设备等机械稳定性和温度控管至关重要的应用中，底部填充材料可帮助关键组件在恶劣条件下保持其功能。微型化和更高性能的趋势进一步推动了市场成长，这给焊点带来了额外的压力，需要更先进的底部填充解决方案。随着电子元件尺寸越来越小，功率密度越来越高，底部填充材料在提供结构支撑和增强散热方面的作用变得更加突出。

技术进步如何影响底部填充材料的发展？

底部填充材料市场已取得重大技术进步，以满足现代电子製造不断发展的需求。但推动这些发展的关键创新是什么呢？一项重大突破是低温固化和高流动性底部填充材料的开发，这提高了底部填充工艺的简易性和效率。传统底部填充材料通常需要在高温下长时间固化，这会导致敏感元件产生热应力和翘曲。相较之下，固化温度更低、流动更快的新配方使底部填充製程更加可控、更加高效，最大限度地降低了损坏精密基板的风险并缩短了週期时间。这些进步在涉及细间距元件和高密度互连的应用方面尤其有益，因为在这些应用中，底部填充的精确应用和均匀分布至关重要。

此外，无流动底部填充材料的推出彻底改变了覆晶封装组装，它省去了传统底部填充材料通常需要的单独分配和固化步骤。无流动底部填充材料在晶片放置前直接应用于基板，并与回流焊接焊接製程同时固化。这项创新简化了製造工作流程，减少了步骤并提高了生产效率。可返工底部填充材料的开发进一步扩展了这些材料的多功能性和适用性，因为这样可以轻鬆移除和更换有缺陷的部件，而不会损坏基板。可返工底部填充材料在高成本组件中尤其有价值，例如用于航太、国防和通讯的组件，在这些组件中，零件的维修和再利用对于保持生产产量比率和降低总成本至关重要。这些技术进步推动了下一代底部填充材料的开发，这些材料不仅符合现代电子封装的高成本要求，而且具有更大的灵活性和性能。

推动电子製造业采用底部填充材料的市场趋势是什么？

电子製造业中底部填充材料的采用受到多种新兴市场趋势的影响，这些趋势反映了製造商和消费者不断变化的优先考虑。最突出的趋势之一是电子设备逐渐转向更小、功能更多的设备。随着消费性电子产品的不断发展，对更小、更轻、处理能力更强、消费量更低的设备的需求日益增长。这一趋势导致了覆晶和 3D 积体电路等先进封装技术的广泛采用，与传统的引线键引线接合法方法相比，这些技术提供了更高的空间效率和性能。底部填充材料在这些封装技术中发挥着至关重要的作用，它提供机械加固并保护精密焊点免受热应力和机械应力的影响，从而提高整体设备可靠性。穿戴式装置、可携式医疗设备和物联网设备等应用对小型化电子产品的需求不断增长，这加速了底部填充材料在电子组件中的应用。

推动底部填充材料应用的另一个关键趋势是车载电子设备日益复杂。随着汽车互联化、自动化和电气化程度不断提高，嵌入在车辆中的电控系统(ECU) 和感测器的数量呈指数级增长。这些组件在恶劣的环境条件下运行，包括剧烈的温度变化、机械振动以及暴露在潮湿和化学物质中。底部填充材料广泛用于汽车电子设备，以保护关键组件免受这些应力的影响，并确保长期可靠性和性能。电动车 (EV) 和自动驾驶系统的兴起进一步推动了对能够承受高功率密度并提供有效温度控管的先进底部填充材料的需求。随着汽车製造商不断突破汽车技术的极限，底部填充材料正成为保护复杂电子系统完整性的重要元素。

哪些因素推动了全球底部填充材料市场的成长？

全球底部填充材料市场的成长受到多种因素的推动，包括电子封装技术的进步、高可靠性应用的日益普及以及对电子设备小型化日益增长的需求。主要成长要素之一是覆晶和 3D 封装技术的日益普及，以满足对更小但更强大的电子设备的需求。这些先进的封装解决方案在提高性能和功能的同时，需要坚固的底部填充材料来确保结构完整性和热稳定性。随着电子设备变得越来越小、越来越复杂，对能够提供机械增强和温度控管的高性能底部填充材料的需求变得越来越重要。家用电子电器、通讯和汽车电子等行业的扩张也促进了底部填充材料市场的成长，因为这些行业需要可靠的互连，能够承受日常操作和环境暴露的严酷考验。

底部填充材料也因其在航太、国防和医疗设备等高可靠性应用中日益广泛的应用而成为主要的成长要素，因为在这些应用中，产品故障是不允许的。在这些行业中，底部填充材料用于提高关键电子组件的机械强度和可靠性，确保即使在恶劣条件下也能保持稳定的性能。电动车和自动驾驶技术的兴起进一步增加了汽车产业对底部填充材料的需求，因为这些系统中的电子元件必须承受高功率负载和严苛的热环境。此外，可返工和无流动底部填充材料的开发拓宽了其应用范围，并降低了製造流程的成本和复杂性。这些材料在组件组装和维修方面提供了更大的灵活性，对于希望优化产量比率和减少浪费的製造商来说，它们是一个相当吸引力的选择。随着技术进步不断突破电子封装的界限，全球底部填充材料市场预计将在技术创新、行业需求和不断变化的应用需求的动态相互作用的推动下实现持续增长。

部分

应用（覆晶、球栅阵列 (BGA)、晶片级封装 (CSP)）、产品类型（毛细管底部填充 (CUF)、无流动底部填充 (NUF)、模製底部填充 (MUF)）。

受访公司范例

  • ELANTAS GmbH
  • Epoxy Technology, Inc.
  • HB Fuller Company
  • Henkel AG & Co. KGaA
  • Inkron Limited
  • MacDermid Alpha Electronics Solutions
  • NAMICS Corporation
  • NORDSON Corporation
  • Panasonic Industry Co., Ltd.
  • VIETNAM PROS TECHNOLOGY CO., LTD.

人工智慧集成

我们正在利用检验的专家内容和人工智慧工具来改变市场和竞争情报。

Global 特定产业SLM 的典型规范，而是建立了一个从全球专家收集的内容库，其中包括视讯录影、部落格、搜寻引擎研究以及大量的公司、产品/服务和市场数据。

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口状况（成品和原始OEM）预测其竞争态势的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手，包括销货成本成本 (COGS) 上升、盈利下降、供应链重组以及其他微观和宏观市场动态。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 其他地区

第四章 竞赛

简介目录
Product Code: MCP16876

Global Underfill Materials Market to Reach US$648.8 Million by 2030

The global market for Underfill Materials estimated at US$434.4 Million in the year 2024, is expected to reach US$648.8 Million by 2030, growing at a CAGR of 6.9% over the analysis period 2024-2030. Capillary Underfill Material (CUF), one of the segments analyzed in the report, is expected to record a 7.5% CAGR and reach US$384.6 Million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at 6.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$120.8 Million While China is Forecast to Grow at 6.4% CAGR

The Underfill Materials market in the U.S. is estimated at US$120.8 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$100.0 Million by the year 2030 trailing a CAGR of 6.4% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.5% and 5.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR.

Global Underfill Materials Market - Key Trends & Growth Drivers Explored

Why Are Underfill Materials Crucial in Modern Electronics Manufacturing?

Underfill materials have become indispensable in the electronics manufacturing industry, serving a critical role in enhancing the performance, reliability, and longevity of electronic devices. But what exactly are these materials, and why are they so essential? Underfill materials are specialized epoxy or resin compounds used to fill the space between a microchip and its substrate in flip-chip, ball grid array (BGA), and chip-scale package (CSP) assemblies. This process, known as underfilling, significantly strengthens the mechanical integrity of solder joints, protecting them from stress and thermal-induced failures caused by mismatched thermal expansion between the chip and substrate. As electronic devices become increasingly miniaturized and powerful, the need for robust interconnects that can withstand mechanical shocks, thermal cycling, and moisture ingress has grown exponentially. Underfill materials, with their ability to distribute stress evenly across the microelectronic package, have emerged as a vital solution in ensuring device reliability and performance.

The adoption of underfill materials is driven by the rapid development of high-density electronic packages and the growing complexity of integrated circuits (ICs). As the demand for smaller, lighter, and more powerful devices increases, manufacturers are relying on advanced packaging technologies like flip-chip and 3D packaging, which necessitate the use of underfill materials to stabilize the structure and prevent warpage or cracking during operation. In applications such as smartphones, tablets, automotive electronics, and IoT devices, where mechanical stability and thermal management are crucial, underfill materials help maintain the functionality of critical components even under challenging conditions. The market’s growth is further propelled by the trend towards increased miniaturization and higher performance requirements, which place additional stress on solder joints and necessitate more advanced underfill solutions. As electronic components become smaller and their power density increases, the role of underfill materials in providing structural support and enhancing heat dissipation is becoming even more prominent.

How Are Technological Advancements Shaping the Development of Underfill Materials?

The underfill materials market has witnessed significant technological advancements aimed at meeting the evolving demands of modern electronics manufacturing. But what are the key innovations driving these developments? One major breakthrough is the development of low-temperature cure and high-flow underfill materials, which have enhanced the ease and efficiency of underfilling processes. Traditional underfill materials often required prolonged curing times at high temperatures, which could lead to thermal stress and warping in sensitive components. In contrast, new formulations with lower curing temperatures and faster flow characteristics enable a more controlled and efficient underfilling process, minimizing the risk of damage to delicate substrates and reducing cycle times. These advancements have been particularly beneficial in applications involving fine-pitch components and high-density interconnects, where precise application and uniform distribution of underfill are critical.

Additionally, the introduction of no-flow underfills has revolutionized the assembly of flip-chip packages by eliminating the separate dispensing and curing steps typically required in traditional underfilling. No-flow underfills are applied directly to the substrate before the placement of the chip, and they cure simultaneously with the reflow soldering process. This innovation simplifies the manufacturing workflow, reduces process steps, and enhances production efficiency. The development of reworkable underfill materials, which allow for the easy removal and replacement of defective components without damaging the substrate, has further expanded the versatility and applicability of these materials. Reworkable underfills are particularly valuable in high-cost assemblies, such as those used in aerospace, defense, and telecommunications, where component repair and reusability are essential for maintaining production yield and reducing overall costs. These technological advancements have enabled the development of next-generation underfill materials that meet the stringent requirements of modern electronic packaging while offering greater flexibility and performance.

What Market Trends Are Driving the Adoption of Underfill Materials in Electronics Manufacturing?

The adoption of underfill materials in the electronics manufacturing industry is being shaped by several emerging market trends that reflect the changing priorities of manufacturers and consumers alike. One of the most prominent trends is the increasing shift towards miniaturization and higher functionality in electronic devices. As consumer electronics continue to evolve, there is a growing need for compact, lightweight devices with enhanced processing power and reduced energy consumption. This trend has led to the widespread adoption of advanced packaging technologies, such as flip-chip and 3D integrated circuits, which provide greater space efficiency and performance compared to traditional wire-bonding methods. Underfill materials play a critical role in these packaging technologies by providing mechanical reinforcement, protecting delicate solder joints from thermal and mechanical stress, and enhancing overall device reliability. The growing demand for miniaturized electronics in applications such as wearable devices, portable medical equipment, and IoT devices has therefore accelerated the use of underfill materials in electronic assemblies.

Another significant trend driving the adoption of underfill materials is the increasing complexity of automotive electronics. As vehicles become more connected, automated, and electrified, the number of electronic control units (ECUs) and sensors integrated into vehicles has surged. These components operate under harsh environmental conditions, including wide temperature variations, mechanical vibrations, and exposure to moisture and chemicals. Underfill materials are being used extensively in automotive electronics to protect critical components from these stresses, ensuring long-term reliability and performance. The rise of electric vehicles (EVs) and autonomous driving systems has further increased the demand for advanced underfill materials that can withstand high power densities and provide effective thermal management. As automotive manufacturers continue to push the boundaries of vehicle technology, underfill materials are becoming an essential element in safeguarding the integrity of complex electronic systems.

What Factors Are Driving the Growth of the Global Underfill Materials Market?

The growth in the global underfill materials market is driven by several factors, including advancements in electronic packaging technologies, increased adoption in high-reliability applications, and the growing demand for miniaturized electronics. One of the primary growth drivers is the rising adoption of flip-chip and 3D packaging technologies in response to the need for more compact and powerful electronic devices. These advanced packaging solutions provide enhanced performance and functionality but also require robust underfill materials to ensure structural integrity and thermal stability. As electronic devices continue to shrink in size and increase in complexity, the need for high-performance underfill materials that can provide mechanical reinforcement and thermal management has become more critical. The expansion of industries such as consumer electronics, telecommunications, and automotive electronics has also contributed to the growth of the underfill materials market, as these sectors require reliable interconnects that can withstand the rigors of daily operation and environmental exposure.

Another key growth driver is the increasing use of underfill materials in high-reliability applications, such as aerospace, defense, and medical devices, where product failure is not an option. In these industries, underfill materials are used to enhance the mechanical robustness and reliability of critical electronic assemblies, ensuring consistent performance under extreme conditions. The rise of electric vehicles and autonomous driving technologies has further boosted the demand for underfill materials in the automotive sector, as electronic components in these systems must withstand high power loads and challenging thermal environments. Moreover, the development of reworkable and no-flow underfill materials has expanded their applicability and reduced the cost and complexity of manufacturing processes. These materials offer greater flexibility in component assembly and repair, making them an attractive choice for manufacturers looking to optimize production yields and reduce waste. As technological advancements continue to push the boundaries of electronic packaging, the global underfill materials market is poised for sustained growth, driven by a dynamic interplay of innovation, industry demand, and evolving application requirements.

SCOPE OF STUDY:

The report analyzes the Underfill Materials market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Application (Flip Chips, Ball Grid Array (BGA), Chip Scale Packaging (CSP)); Product Type (Capillary Underfill Material (CUF), No Flow Underfill Material (NUF), Molded Underfill Material (MUF))

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 42 Featured) -

  • ELANTAS GmbH
  • Epoxy Technology, Inc.
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • Inkron Limited
  • MacDermid Alpha Electronics Solutions
  • NAMICS Corporation
  • NORDSON Corporation
  • Panasonic Industry Co., Ltd.
  • VIETNAM PROS TECHNOLOGY CO., LTD.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Underfill Materials - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increased Adoption of Underfill Materials in Semiconductor Packaging Expands Addressable Market
    • Surge in Use of Underfill Materials in Flip-Chip and Ball Grid Array (BGA) Applications Fuels Market Growth
    • Rising Adoption of Underfill Materials in Mobile and Consumer Electronics Sets the Stage for Market Growth
    • Surge in Demand for Underfill Materials in Automotive and Advanced Driver Assistance Systems (ADAS) Fuels Market Demand
    • Innovations in Low-Temperature and Fast-Curing Underfill Formulations Propel Market Growth
    • Rising Adoption of Underfill Materials in LED and Display Technologies Expands Market Opportunities
    • Surge in Demand for Underfill Materials in Flexible and Wearable Electronics Fuels Market Growth
    • Growing Use of Underfill Materials in Military and Aerospace Electronics Strengthens Business Case
    • Surge in Demand for Underfill Materials in Data Centers and Networking Equipment Expands Market Opportunities
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Underfill Materials Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Capillary Underfill Material (CUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for No Flow Underfill Material (NUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Molded Underfill Material (MUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Flip Chips by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Ball Grid Array (BGA) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Chip Scale Packaging (CSP) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 23: USA Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 24: USA Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 25: USA 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 26: USA Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 28: USA 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 29: Canada Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 30: Canada Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 31: Canada 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 34: Canada 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • JAPAN
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 35: Japan Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Japan Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 37: Japan 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 38: Japan Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 40: Japan 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • CHINA
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 41: China Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: China Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 43: China 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 44: China Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 46: China 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • EUROPE
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 47: Europe Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 48: Europe Historic Review for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 49: Europe 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 53: Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 55: Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • FRANCE
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 56: France Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 58: France 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 59: France Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: France Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 61: France 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • GERMANY
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 62: Germany Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 64: Germany 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 65: Germany Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Germany Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 67: Germany 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 68: Italy Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 70: Italy 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 71: Italy Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: Italy Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 73: Italy 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 74: UK Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 76: UK 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 77: UK Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 78: UK Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 79: UK 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 82: Rest of Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 83: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Rest of Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 85: Rest of Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 88: Asia-Pacific 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 89: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Asia-Pacific Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 91: Asia-Pacific 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 94: Rest of World 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 95: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Rest of World Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 97: Rest of World 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030

IV. COMPETITION