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市场调查报告书
商品编码
1886042

全球混合记忆体立方体（HMC）和高频宽记忆体（HBM）市场

Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM)
出版日期: | 出版商: Market Glass, Inc. (Formerly Global Industry Analysts, Inc.) | 英文 385 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年，全球混合储存立方体 (HMC) 和高频宽记忆体 (HBM) 市场规模将达到 191 亿美元。

2024年，全球混合记忆体立方体（HMC）和高频宽记忆体（HBM）市场规模预计为38亿美元，到2030年将达到191亿美元，在分析期间（2024-2030年）内复合年增长率（CAGR）为30.9%。本报告分析的细分市场之一－混合记忆体立方体（HMC）预计将以29.3%的复合年增长率成长，并在分析期间结束时达到105亿美元。高频宽记忆体（HBM）细分市场预计在分析期间内将以33.2%的复合年增长率成长。

美国市场规模估计为14亿美元，而中国市场预计将以37.1%的复合年增长率成长。

预计到2024年，美国混合储存立方体（HMC）和高频宽记忆体（HBM）市场规模将达到14亿美元。作为世界第二大经济体，中国预计到2030年市场规模将达到44亿美元，在2024年至2030年的分析期间内，复合年增长率（CAGR）将达到37.1%。其他值得关注的区域市场分析包括日本和加拿大，预计在分析期内，这两个市场的复合年增长率将分别达到23.0%和25.6%。在欧洲，德国预计将以约30.7%的复合年增长率成长。

全球混合储存立方体（HMC）和高频宽记忆体（HBM）市场－主要市场趋势和驱动因素概述

混合记忆体立方体（HMC）和高频宽记忆体（HBM）如何改变记忆体格局？

混合记忆体立方体 (HMC) 和高频宽记忆体 (HBM) 技术的出现，代表着记忆体架构的重大飞跃，其驱动力在于对更快、更有效率资料传输速率日益增长的需求。 HMC 和 HBM 在结构和效能方面与传统的记忆体类型（如 DDR4 和 DDR5）有显着差异。 HMC 采用 3D 堆迭结构，透过穿透硅通孔(TSV) 互连，并透过高速串列介面通讯。这种架构使 HMC 能够实现低延迟和高频宽，从而支援可扩展的平行处理任务。另一方面，HBM 采用不同的 3D 堆迭方法，并具有宽 I/O 口，使其成为对能源效率和高频宽尤为重要的应用情境的理想选择。 HBM 与处理器的紧密整合使其能够在满足功耗限制的同时，依然提供大量资料吞吐量，这在高效能运算环境中至关重要。这些记忆体类型树立了新的标准，满足了日益依赖即时资料处理和高负载应用的世界的需求。

为什么现代计算系统采用HMC与HBM

随着高效能运算应用的激增，HMC 和 HBM 在各种产品类型中正变得越来越普遍，包括图形处理器 (GPU)、中央处理器 (CPU)、加速闸阵列阵列 (FPGA) 和专用积体电路 (ASIC)。专为平行处理和密集型图形渲染而设计的 GPU 可从 HBM 的高频宽记忆体介面中获益匪浅，显着减少了资料瓶颈。对于 CPU 而言，HMC 技术透过实现高速资料传输来提高多核心效率，为资料分析和 AI 模型训练等应用提供至关重要的效能。整合了 CPU 和 GPU 功能的 APU 利用 HBM 来管理密集型任务，同时降低功耗。 FPGA 以其高度可配置的架构而闻名，可利用 HMC 的高速资料传输来实现低延迟网路和高速资料路由应用。同时，ASIC 通常用于深度学习和边缘运算的客製化系统中，可受益于 HBM 提供的频宽和效率。这些整合案例表明，各种计算系统正日益依赖先进的记忆体技术来突破传统的效能极限。

HMC和HBM技术如何改变各个产业？

HMC 和 HBM 的强大功能正在革新包括图形、高效能运算 (HPC)、网路和资料中心在内的众多应用领域。在图形领域，这些记忆体技术对于实现游戏和专业视觉化中的超逼真渲染和身临其境型体验至关重要，因为这些应用需要以极低的延迟处理和显示大规模资料集。它们也对高效能运算产生了变革性的影响。 HBM 的速度和效率使模拟和复杂计算受益匪浅，显着加快了气候建模、基因组学研究、金融模拟等任务的执行速度。网路基础设施也越来越依赖这些记忆体技术来实现低延迟资料传输和高速封包处理处理，这在 5G 和云端基础服务时代至关重要。作为现代资讯基础设施的骨干，资料中心利用 HMC 和 HBM 来提高资料吞吐量和能源效率，从而能够无缝处理来自云端服务、人工智慧和巨量资料分析的运算工作负载。这些技术对于满足各领域不断增长的大量需求并实现前所未有的性能提升至关重要。

哪些因素正在推动HMC和HBM市场的成长？

HMC 和 HBM 市场的成长受到多种因素的驱动，这些因素与现代技术趋势和应用需求紧密相关。首先，人工智慧、机器学习和即时分析带来的资料量呈指数级增长，迫使资料中心部署速度更快、能效更高的记忆体解决方案。由于传统记忆体系统无法满足所需的资料传输速率和功耗限制，这种需求正在推动向 HBM 和 HMC 的转型。其次，GPU 和 FPGA 等先进计算系统在汽车（用于自动驾驶）和医疗保健（用于即时诊断成像）等领域的广泛应用，也推动了这些记忆体技术的发展。对高解析度图形和虚拟实境应用的需求，也促使记忆体升级的大量投资，尤其是在游戏和媒体产业。此外，向 5G 和边缘运算基础设施的转型需要低延迟、高频宽的通讯，而 HMC 和 HBM 在这方面具有竞争优势。最后，永续性和能源效率提升的倡议推动了对兼顾效能和功耗的记忆体架构的追求，使这些技术成为绿色运算计画的重要组成部分。在快速变化的市场环境中，先进的运算需求、以数据为中心的成长以及永续性议题共同推动了 HMC 和 HBM 的采用。

部分：

记忆体类型（混合记忆体立方体 (HMC)、高频宽记忆体 (HBM)）、产品类型（中央处理器 (CPU)、图形处理器 (GPU)、现场可程式闸阵列(FPGA)、加速处理器 (APU)、专用积体电路 (ASIC)）、应用（高效能运算应用、图形应用、资料中心应用、网路应用、其他应用）

受访公司范例

  • Samsung Group
  • Intel Corporation
  • Micron Technology, Inc.
  • Xilinx, Inc.
  • Synopsys, Inc.
  • Cadence Design Systems, Inc.
  • SK Hynix, Inc.
  • Samsung Semiconductor, Inc.（SSI）
  • Arm Ltd.
  • Rambus, Inc.
  • Open-Silicon, Inc.

人工智慧集成

我们正在利用检验的专家内容和人工智慧工具，革新市场和竞争情报分析。

Market Glass, Inc. 并没有采用典型的 LLM 或产业专用的SLM 方法，而是建立了一个由世界各地领域专家精心策划的内容库，其中包括影片转录、部落格、搜寻引擎研究以及大量的公司、产品/服务和市场数据。

关税影响係数

在最新发布的报告中，Market Glass, Inc. 将关税对地理市场的影响纳入考量，并根据公司总部所在地、製造地以及进出口（成品和OEM产品）情况，预测企业竞争地位的变化。这种复杂多变的市场现实会从多个方面影响竞争对手，包括增加销货成本、降低盈利和重组供应链，同时也会影响微观和宏观市场动态。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章 市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲
  • 亚太地区
  • 世界其他地区

第四章 竞赛

简介目录
Product Code: MCP12479

Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market to Reach US$19.1 Billion by 2030

The global market for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) estimated at US$3.8 Billion in the year 2024, is expected to reach US$19.1 Billion by 2030, growing at a CAGR of 30.9% over the analysis period 2024-2030. Hybrid Memory Cube (HMC), one of the segments analyzed in the report, is expected to record a 29.3% CAGR and reach US$10.5 Billion by the end of the analysis period. Growth in the High-Bandwidth Memory (HBM) segment is estimated at 33.2% CAGR over the analysis period.

The U.S. Market is Estimated at US$1.4 Billion While China is Forecast to Grow at 37.1% CAGR

The Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market in the U.S. is estimated at US$1.4 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$4.4 Billion by the year 2030 trailing a CAGR of 37.1% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 23.0% and 25.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 30.7% CAGR.

Global Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market - Key Trends & Drivers Summarized

How Are Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Reshaping the Memory Landscape?

The advent of Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) technologies marks a significant leap in memory architecture, driven by the increasing demands for faster, more efficient data transfer speeds. HMC and HBM differ substantially from traditional memory types like DDR4 and DDR5 in terms of structure and performance. HMC utilizes a 3D stacked structure, interconnected by through-silicon vias (TSVs), and communicates through a high-speed serial interface. This architecture allows HMC to deliver higher bandwidth with reduced latency, supporting scalable and parallel processing tasks. HBM, on the other hand, employs a different 3D stacking approach with wide I/O, making it particularly well-suited for use cases where power efficiency and high bandwidth are critical. HBM's close integration with processors enables it to address power constraints while still supporting massive data throughput, which is crucial for high-performance computing environments. These memory types are setting new standards, meeting the needs of a world increasingly reliant on real-time data processing and intensive workloads.

Why Are Modern Compute Systems Turning to HMC and HBM?

The proliferation of high-compute applications has driven the widespread adoption of HMC and HBM in various product types, such as Graphics Processing Units (GPUs), Central Processing Units (CPUs), Accelerated Processing Units (APUs), Field Programmable Gate Arrays (FPGAs), and Application-Specific Integrated Circuits (ASICs). GPUs, designed for parallel processing and heavy graphics rendering, benefit immensely from HBM's wide memory interface, reducing data bottlenecks. In CPUs, HMC technology enhances multi-core efficiency by delivering faster data transfers, essential for applications like data analytics and AI model training. APUs, which combine CPU and GPU functionalities, leverage HBM to manage intensive tasks with reduced power consumption. FPGAs, known for their configurability, take advantage of HMC's high data rates for applications in low-latency networking and high-speed data routing. Meanwhile, ASICs, often used in custom-designed systems for deep learning and edge computing, are empowered by the bandwidth and efficiency that HBM provides. These integrations demonstrate how diverse compute systems are increasingly reliant on advanced memory technologies to break through conventional performance barriers.

How Are HMC and HBM Technologies Transforming Various Sectors?

The capabilities of HMC and HBM are revolutionizing a range of applications including graphics, high-performance computing (HPC), networking, and data centers. In graphics, these memory technologies are pivotal for ultra-realistic rendering and immersive experiences in gaming and professional visualization, where large datasets need to be processed and displayed with minimal lag. High-performance computing is another area seeing transformative impacts, as simulations and complex computations benefit from the speed and efficiency of HBM, reducing execution times for tasks like climate modeling, genomics research, and financial simulations. Networking infrastructure has also started to rely on these memory types for low-latency data transmission and high-speed packet processing, essential in the era of 5G and cloud-based services. Data centers, the backbone of modern information infrastructure, use HMC and HBM to enhance data throughput and energy efficiency, ensuring that computational workloads from cloud services, AI, and big data analytics can be handled seamlessly. These technologies are indispensable for supporting the vast and growing demands across these sectors, delivering unparalleled performance enhancements.

What Factors Are Driving the Growth in the HMC and HBM Market?

The growth in the HMC and HBM market is driven by several factors that are tightly interwoven with the demands of contemporary technology trends and applications. Firstly, the exponential increase in data generation from AI, machine learning, and real-time analytics is pressuring data centers to adopt faster and more energy-efficient memory solutions. This demand has fueled a shift toward HBM and HMC, as traditional memory systems cannot keep up with the necessary data transfer speeds or power constraints. Secondly, the widespread integration of advanced computing systems like GPUs and FPGAs into sectors such as automotive (for autonomous driving) and healthcare (for real-time imaging and diagnostics) is catalyzing the adoption of these memory technologies. The need for high-resolution graphics and virtual reality applications has also driven significant investments in memory upgrades, especially for gaming and media industries. Additionally, the move toward 5G and edge computing infrastructure necessitates low-latency, high-bandwidth communication, where HMC and HBM provide a competitive edge. Lastly, the drive for sustainability and energy efficiency is prompting organizations to seek memory architectures that minimize power consumption while maximizing performance, making these technologies integral in green computing initiatives. Overall, the interplay of advanced computing needs, data-centric growth, and sustainability concerns is propelling the adoption of HMC and HBM in a rapidly evolving market landscape.

SCOPE OF STUDY:

The report analyzes the Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Memory Type (Hybrid Memory Cube (HMC), High-Bandwidth Memory (HBM)); Product Type (Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU), Application-Specific Integrated Circuit (ASIC)); Application (High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 29 Featured) -

  • Samsung Group
  • Intel Corporation
  • Micron Technology, Inc.
  • Xilinx, Inc.
  • Synopsys, Inc.
  • Cadence Design Systems, Inc.
  • SK Hynix, Inc.
  • Samsung Semiconductor, Inc. (SSI)
  • Arm Ltd.
  • Rambus, Inc.
  • Open-Silicon, Inc.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM): A Prelude
    • Introduction to High-Bandwidth Memory (HBM)
    • High-Bandwidth Memory Integration in High-Performance Computing
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market: Global Market Prospects & Outlook
    • Market Dynamics and Emerging Trends
    • Market Segmentation and Analysis
    • Regional Analysis
    • China and Emerging Regions Demonstrate Fast Paced Growth
    • Trade Shocks, Uncertainty, and the Structural Rewiring of Globalization Bring Global Economy Under Siege
    • Trade Wars, Policy Volatility & Geopolitical Upheaval Compound Pressures on Global Economic Growth: World Economic Growth Projections (Real Gross Domestic Product (GDP), Annual % Change) for the Years 2024 Through 2026
    • All Eyes on Global Inflation as Tariff Volatility Reignites Price Pressures and Emerges as a Flashpoint Risk Across Global Markets: Global Headline Inflation Rates (In %) for the Years 2019 through 2026
    • Oil Prices Take Center Stage as the Ultimate Barometer of Global Economic Health-Signaling Boom or Heralding Recession: Global Average Annual Brent Crude Oil Price (In US$ Per Barrel) for Years 2019 through 2026
    • Tariff Shockwaves Reshape the High-End Memory Market Landscape
    • Competitive Scenario
    • Select Innovations
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
    • Recent Market Activity
    • Domain Expert Insights
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • High-Performance Computing: Fueling Opportunities for the HMC and HBM Market
    • Rise of High Performance Computing Opens Doors for Exploiting Novel Memory Architecture & Solutions: Global High Performance Computing Market (In US$ Billion) for Years 2020, 2022, 2024 and 2026
    • Revenue Breakdown (in %) of Global High-Performance Computing by End-Use Sector
    • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2025E
    • Meeting the Rising Bandwidth and Capacity Needs of Modern Datacenters
    • As Data Reservoirs, Datacenters Have Become Information Powerhouses for Modern Day Organizations Needing Novel New Generation Memory Technologies: Global Datacenter IP Traffic (In Petabytes Per Month) for Years 2017 Through 2022
    • Rising Digitalization and the Growing Demand for Advanced Datacenter Memory Solutions
    • Datacenter Industry Trends Signal Strong Growth Potential
    • Emerging Dynamics of the Hybrid Memory Cube (HMC) Market
    • Evolution and Trends in the High-Bandwidth Memory (HBM) Market
    • High-Bandwidth Memory: The Critical Role of Advanced Testing in Semiconductor Packaging
    • The Future of High-Bandwidth Memory: A Balancing Act Between Necessity and Cost
    • The Challenges and Advances of High-Bandwidth Memory 3 in High-Performance Computing
    • Designing Efficient High-Bandwidth Memory Interfaces for HBM3
    • Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Growth
    • Global Market for Artificial Intelligence by Region (In US$ Billion) for Years 2021, 2025, 2027
    • Global AI Semiconductor Market (In US$ Billion) for Years 2020, 2023 & 2025
    • High-Bandwidth Memory Technology: Powering the Future of AI and High-Performance Computing
    • High-Bandwidth Memory: The Hidden Power Behind AI Model Training
    • High-Bandwidth Memory Pioneers Materials Innovation for the AI Revolution
    • AI and Machine Learning Fuel the Rise of High-Bandwidth Memory Technologies
    • High-Bandwidth Memory: The Engine Driving the Generative AI Boom
    • Miniaturization of Electronic Devices Benefit Market Prospects
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Analysis of Annual Sales in US$ Thousand for Years 2018 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 4: World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2018, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Hybrid Memory Cube (HMC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 7: World 12-Year Perspective for Hybrid Memory Cube (HMC) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for High-Bandwidth Memory (HBM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 10: World 12-Year Perspective for High-Bandwidth Memory (HBM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Central Processing Unit (CPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Central Processing Unit (CPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 13: World 12-Year Perspective for Central Processing Unit (CPU) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Graphics Processing Unit (GPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Graphics Processing Unit (GPU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 16: World 12-Year Perspective for Graphics Processing Unit (GPU) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Field-Programmable Gate Array (FPGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Field-Programmable Gate Array (FPGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 19: World 12-Year Perspective for Field-Programmable Gate Array (FPGA) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Accelerated Processing Unit (APU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Accelerated Processing Unit (APU) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 22: World 12-Year Perspective for Accelerated Processing Unit (APU) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Application-Specific Integrated Circuit (ASIC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Application-Specific Integrated Circuit (ASIC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 25: World 12-Year Perspective for Application-Specific Integrated Circuit (ASIC) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for High-Performance Computing Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for High-Performance Computing Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 28: World 12-Year Perspective for High-Performance Computing Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Graphics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Graphics Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 31: World 12-Year Perspective for Graphics Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Data Centers Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Data Centers Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 34: World 12-Year Perspective for Data Centers Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for Networking Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for Networking Application by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 37: World 12-Year Perspective for Networking Application by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030
    • TABLE 38: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 39: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 40: World 12-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2018, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 41: USA Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 43: USA 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 46: USA 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 47: USA Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 48: USA Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 49: USA 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • CANADA
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 52: Canada 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 55: Canada 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 56: Canada Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Canada Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 58: Canada 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • JAPAN
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 61: Japan 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 64: Japan 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 65: Japan Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Japan Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 67: Japan 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • CHINA
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 68: China Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 70: China 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 73: China 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 74: China Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: China Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 76: China 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • EUROPE
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 79: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2018, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 82: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 85: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 86: Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 88: Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • FRANCE
    • TABLE 89: France Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 91: France 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 94: France 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 95: France Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 96: France Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 97: France 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • GERMANY
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 100: Germany 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 103: Germany 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 104: Germany Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Germany Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 106: Germany 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • ITALY
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 109: Italy 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 112: Italy 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 113: Italy Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Italy Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 115: Italy 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • UNITED KINGDOM
    • TABLE 116: UK Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 118: UK 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 121: UK 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 122: UK Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 123: UK Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 124: UK 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • REST OF EUROPE
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 131: Rest of Europe Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Rest of Europe Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 133: Rest of Europe 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • ASIA-PACIFIC
    • Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 140: Asia-Pacific Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Asia-Pacific Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 142: Asia-Pacific 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030
  • REST OF WORLD
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 145: Rest of World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Memory Type - Percentage Breakdown of Value Revenues for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) for the Years 2018, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 148: Rest of World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Product Type - Percentage Breakdown of Value Revenues for Central Processing Unit (CPU), Graphics Processing Unit (GPU), Field-Programmable Gate Array (FPGA), Accelerated Processing Unit (APU) and Application-Specific Integrated Circuit (ASIC) for the Years 2018, 2025 & 2030
    • TABLE 149: Rest of World Recent Past, Current & Future Analysis for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications - Independent Analysis of Annual Revenues in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Rest of World Historic Review for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications Markets - Independent Analysis of Annual Revenues in US$ Thousand for Years 2018 through 2023 and % CAGR
    • TABLE 151: Rest of World 12-Year Perspective for Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) by Application - Percentage Breakdown of Value Revenues for High-Performance Computing Application, Graphics Application, Data Centers Application, Networking Application and Other Applications for the Years 2018, 2025 & 2030

IV. COMPETITION