嵌入式芯片封装技术市场：2023-2028 年按平台、行业和地区划分

到 2022 年，嵌入式芯片封装技术的全球市场规模将达到 8100 万美元。 展望未来，IMARC Group 预测到 2028 年将达到 1.7689 亿美元，2023 年至 2028 年的增长率 (CAGR) 为 12.80%。

嵌入式芯片封装技术用于通过多步製造工艺将组件嵌入基板中。 它由倒装芯片级芯片级封装（FC CSP）和晶圆级芯片级封装（WL CSP）组成，以提高系统效率。 缩小整个印刷电路板 (PCB) 解决方案可为其他组件创造更多空间。 它还提供表面贴装技术 (SMT) 集成和灵活的布线解决方案，以减小印刷电路板 (PCB) 的尺寸。 它使灵活的设计能够从 2D 过渡到 3D，同时减少失真和功率损耗。 因此，嵌入式芯片封装技术在全球电子、信息技术 (IT)、汽车、医疗保健和电信行业得到广泛应用。

嵌入式芯片封装技术市场趋势

• 目前，世界各地的微电子设备中的电子电路都变得越来越小。 这是随着半导体行业的快速增长而推动市场的重要因素之一。 此外，嵌入式芯片封装技术为 OEM 提供了多项优势，例如改进的电气和热性能、混合装载和简化的物流，有助于市场增长。 自主机器人也越来越多地被部署在各个行业提供专业服务，为行业投资者提供有利可图的增长机会。 此外，智能手机和可穿戴设备越来越多地使用嵌入式芯片封装技术来扩展可用空间并集成更多组件，这对市场产生了积极影响。我来了。 此外，全球对集成物联网 (IoT) 的嵌入式芯片封装技术的需求也在不断增长。 再加上笔记本电脑、电脑、平板电脑、电子阅读器、智能手机、MP3 播放器、无人机和电子玩具等便携式电子设备销量的增长，正在推动市场增长。

主要市场细分

• IMARC Group 分析了全球嵌入式芯片封装技术市场报告每个子部分的主要趋势，并预测了 2023 年至 2028 年在全球、区域和国家层面的情况。 该报告根据平台和行业对市场进行分类。

按平台细分

• 将芯片嵌入 IC 封装基板
• 刚性基板上的嵌入式芯片
• 内置柔性基板

各行业构成比例：

• 消费类电子产品
• IT/通信领域
• 车载
• 医疗保健
• 其他

按地区划分

• 北美
• 美国
• 加拿大
• 亚太地区
• 中国
• 日本
• 印度
• 韩国
• 澳大利亚
• 印度尼西亚
• 其他
• 欧洲
• 德国
• 法国
• 英国
• 意大利
• 西班牙
• 俄罗斯
• 其他
• 拉丁美洲
• 巴西
• 墨西哥
• 其他
• 中东和非洲

本报告中回答的关键问题

• 1.2022 年全球嵌入式芯片封装技术市场规模有多大？
• 2. 2023-2028年全球嵌入式芯片封装技术市场的预期增长率是多少？
• 3. 推动全球嵌入式芯片封装技术市场发展的关键因素是什么？
• 4.COVID-19 对全球嵌入式芯片封装技术市场有何影响？
• 5. 按平台划分的全球嵌入式芯片封装技术市场情况如何？
• 6. 嵌入式芯片封装技术的全球细分市场有哪些？
• 7. 全球嵌入式芯片封装技术市场的主要区域有哪些？
• 8. 全球嵌入式芯片封装技术市场的主要参与者/公司有哪些？

内容

第一章前言

第 2 章研究方法和范围

• 调查的目的
• 利益相关者
• 数据来源
  • 主要信息
  • 次要信息
• 市场评估
  • 自下而上的方法
  • 自上而下的方法
• 预测方法

第 3 章执行摘要

第四章介绍

• 概览
• 主要行业趋势

第 5 章嵌入式芯片封装技术的全球市场

• 市场概览
• 市场结果
• COVID-19 的影响
• 市场预测

第 6 章按平台划分的市场细分

• 芯片嵌入型IC封装基板
  • 市场趋势
  • 市场展望
• 芯片键合到刚性基板
  • 市场趋势
  • 市场展望
• 在柔性基板中嵌入模具
  • 市场趋势
  • 市场展望

第 7 章行业市场细分

• 消费类电子产品
  • 市场趋势
  • 市场预测
• IT/通信领域
  • 市场趋势
  • 市场预测
• 汽车相关
  • 市场趋势
  • 市场展望
• 医疗保健
  • 市场趋势
  • 市场展望
• 其他
  • 市场趋势
  • 市场预测

第 8 章按区域划分的市场细分

• 北美
  • 美国
    • 市场趋势
    • 市场预测
  • 加拿大
    • 市场趋势
    • 市场展望
• 亚太地区
  • 中国
    • 市场趋势
    • 市场展望
  • 日本
    • 市场趋势
    • 市场预测
  • 印度
    • 市场趋势
    • 市场展望
  • 韩国市场
    • 市场趋势
    • 市场展望
  • 澳大利亚
    • 市场趋势
    • 市场展望
  • 印度尼西亚
    • 市场趋势
    • 市场展望
  • 其他
    • 市场趋势
    • 市场预测
• 欧洲
  • 德国
    • 市场趋势
    • 市场展望
  • 法国
    • 市场趋势
    • 市场预测
  • 英国
    • 市场趋势
    • 市场预测
  • 意大利
    • 市场趋势
    • 市场展望
  • 西班牙
    • 市场趋势
    • 市场展望
  • 俄罗斯
    • 市场趋势
    • 市场展望
  • 其他
    • 市场趋势
    • 市场预测
• 拉丁美洲
  • 巴西
    • 市场趋势
    • 市场展望
  • 墨西哥
    • 市场趋势
    • 市场展望
  • 其他
    • 市场趋势
    • 市场预测
• 中东和非洲
  • 市场趋势
  • 按国家/地区划分的市场细分
  • 市场展望

第9章SWOT分析

• 概览
• 强度
• 弱点
• 机会
• 威胁

第 10 章价值链分析

第11章波特五力分析

• 概览
• 买家的议价能力
• 供应商的议价能力
• 竞争程度
• 新进入者的威胁
• 替代品的威胁

第 12 章：价格分析

第13章竞争格局

• 市场结构
• 主要公司
• 主要公司简介
  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Fujikura Ltd.
  • Infineon Technologies AG
  • Microsemi Corporation（Microchip Technology Inc.）
  • Schweizer Electronic AG
  • TDK Electronics AG（TDK Corporation）

本报告中提及的公司名称仅为部分，本报告中提及的所有公司名称。

The global embedded die packaging technology market size reached US$ 81.0 Million in 2022. Looking forward, IMARC Group expects the market to reach US$ 176.89 Million by 2028, exhibiting a growth rate (CAGR) of 12.80% during 2023-2028.

Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.

Embedded Die Packaging Technology Market Trends:

• At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.

Key Market Segmentation:

• IMARC Group provides an analysis of the key trends in each sub-segment of the global embedded die packaging technology market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on platform and industry vertical.

Breakup by Platform:

• Embedded Die in IC Package Substrate
• Embedded Die in Rigid Board
• Embedded Die in Flexible Board

Breakup by Industry Vertical:

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Healthcare
• Others

Breakup by Region:

• North America
• United States
• Canada
• Asia-Pacific
• China
• Japan
• India
• South Korea
• Australia
• Indonesia
• Others
• Europe
• Germany
• France
• United Kingdom
• Italy
• Spain
• Russia
• Others
• Latin America
• Brazil
• Mexico
• Others
• Middle East and Africa

Competitive Landscape:

• The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

• 1. What was the size of the global embedded die packaging technology market in 2022?
• 2. What is the expected growth rate of the global embedded die packaging technology market during 2023-2028?
• 3. What are the key factors driving the global embedded die packaging technology market?
• 4. What has been the impact of COVID-19 on the global embedded die packaging technology market?
• 5. What is the breakup of the global embedded die packaging technology market based on the platform?
• 6. What is the breakup of the global embedded die packaging technology market based on the industry vertical?
• 7. What are the key regions in the global embedded die packaging technology market?
• 8. Who are the key players/companies in the global embedded die packaging technology market?

Table of Contents

1 Preface

2 Scope and Methodology

• 2.1 Objectives of the Study
• 2.2 Stakeholders
• 2.3 Data Sources
  • 2.3.1 Primary Sources
  • 2.3.2 Secondary Sources
• 2.4 Market Estimation
  • 2.4.1 Bottom-Up Approach
  • 2.4.2 Top-Down Approach
• 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

• 4.1 Overview
• 4.2 Key Industry Trends

5 Global Embedded Die Packaging Technology Market

• 5.1 Market Overview
• 5.2 Market Performance
• 5.3 Impact of COVID-19
• 5.4 Market Forecast

6 Market Breakup by Platform

• 6.1 Embedded Die in IC Package Substrate
  • 6.1.1 Market Trends
  • 6.1.2 Market Forecast
• 6.2 Embedded Die in Rigid Board
  • 6.2.1 Market Trends
  • 6.2.2 Market Forecast
• 6.3 Embedded Die in Flexible Board
  • 6.3.1 Market Trends
  • 6.3.2 Market Forecast

7 Market Breakup by Industry Vertical

• 7.1 Consumer Electronics
  • 7.1.1 Market Trends
  • 7.1.2 Market Forecast
• 7.2 IT and Telecommunication
  • 7.2.1 Market Trends
  • 7.2.2 Market Forecast
• 7.3 Automotive
  • 7.3.1 Market Trends
  • 7.3.2 Market Forecast
• 7.4 Healthcare
  • 7.4.1 Market Trends
  • 7.4.2 Market Forecast
• 7.5 Others
  • 7.5.1 Market Trends
  • 7.5.2 Market Forecast

8 Market Breakup by Region

• 8.1 North America
  • 8.1.1 United States
    • 8.1.1.1 Market Trends
    • 8.1.1.2 Market Forecast
  • 8.1.2 Canada
    • 8.1.2.1 Market Trends
    • 8.1.2.2 Market Forecast
• 8.2 Asia-Pacific
  • 8.2.1 China
    • 8.2.1.1 Market Trends
    • 8.2.1.2 Market Forecast
  • 8.2.2 Japan
    • 8.2.2.1 Market Trends
    • 8.2.2.2 Market Forecast
  • 8.2.3 India
    • 8.2.3.1 Market Trends
    • 8.2.3.2 Market Forecast
  • 8.2.4 South Korea
    • 8.2.4.1 Market Trends
    • 8.2.4.2 Market Forecast
  • 8.2.5 Australia
    • 8.2.5.1 Market Trends
    • 8.2.5.2 Market Forecast
  • 8.2.6 Indonesia
    • 8.2.6.1 Market Trends
    • 8.2.6.2 Market Forecast
  • 8.2.7 Others
    • 8.2.7.1 Market Trends
    • 8.2.7.2 Market Forecast
• 8.3 Europe
  • 8.3.1 Germany
    • 8.3.1.1 Market Trends
    • 8.3.1.2 Market Forecast
  • 8.3.2 France
    • 8.3.2.1 Market Trends
    • 8.3.2.2 Market Forecast
  • 8.3.3 United Kingdom
    • 8.3.3.1 Market Trends
    • 8.3.3.2 Market Forecast
  • 8.3.4 Italy
    • 8.3.4.1 Market Trends
    • 8.3.4.2 Market Forecast
  • 8.3.5 Spain
    • 8.3.5.1 Market Trends
    • 8.3.5.2 Market Forecast
  • 8.3.6 Russia
    • 8.3.6.1 Market Trends
    • 8.3.6.2 Market Forecast
  • 8.3.7 Others
    • 8.3.7.1 Market Trends
    • 8.3.7.2 Market Forecast
• 8.4 Latin America
  • 8.4.1 Brazil
    • 8.4.1.1 Market Trends
    • 8.4.1.2 Market Forecast
  • 8.4.2 Mexico
    • 8.4.2.1 Market Trends
    • 8.4.2.2 Market Forecast
  • 8.4.3 Others
    • 8.4.3.1 Market Trends
    • 8.4.3.2 Market Forecast
• 8.5 Middle East and Africa
  • 8.5.1 Market Trends
  • 8.5.2 Market Breakup by Country
  • 8.5.3 Market Forecast

9 SWOT Analysis

• 9.1 Overview
• 9.2 Strengths
• 9.3 Weaknesses
• 9.4 Opportunities
• 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

• 11.1 Overview
• 11.2 Bargaining Power of Buyers
• 11.3 Bargaining Power of Suppliers
• 11.4 Degree of Competition
• 11.5 Threat of New Entrants
• 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

• 13.1 Market Structure
• 13.2 Key Players
• 13.3 Profiles of Key Players
  • 13.3.1 Amkor Technology Inc.
    • 13.3.1.1 Company Overview
    • 13.3.1.2 Product Portfolio
    • 13.3.1.3 Financials
    • 13.3.1.4 SWOT Analysis
  • 13.3.2 ASE Technology Holding Co. Ltd.
    • 13.3.2.1 Company Overview
    • 13.3.2.2 Product Portfolio
    • 13.3.2.3 Financials
  • 13.3.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • 13.3.3.1 Company Overview
    • 13.3.3.2 Product Portfolio
    • 13.3.3.3 Financials
  • 13.3.4 Fujikura Ltd.
    • 13.3.4.1 Company Overview
    • 13.3.4.2 Product Portfolio
    • 13.3.4.3 Financials
    • 13.3.4.4 SWOT Analysis
  • 13.3.5 Infineon Technologies AG
    • 13.3.5.1 Company Overview
    • 13.3.5.2 Product Portfolio
    • 13.3.5.3 Financials
    • 13.3.5.4 SWOT Analysis
  • 13.3.6 Microsemi Corporation (Microchip Technology Inc.)
    • 13.3.6.1 Company Overview
    • 13.3.6.2 Product Portfolio
    • 13.3.6.3 SWOT Analysis
  • 13.3.7 Schweizer Electronic AG
    • 13.3.7.1 Company Overview
    • 13.3.7.2 Product Portfolio
    • 13.3.7.3 Financials
  • 13.3.8 TDK Electronics AG (TDK Corporation)
    • 13.3.8.1 Company Overview
    • 13.3.8.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

List of Figures

• Figure 1: Global: Embedded Die Packaging Technology Market: Major Drivers and Challenges
• Figure 2: Global: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017-2022
• Figure 3: Global: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 4: Global: Embedded Die Packaging Technology Market: Breakup by Platform (in %), 2022
• Figure 5: Global: Embedded Die Packaging Technology Market: Breakup by Industry Vertical (in %), 2022
• Figure 6: Global: Embedded Die Packaging Technology Market: Breakup by Region (in %), 2022
• Figure 7: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 8: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 9: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 10: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 11: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 12: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 13: Global: Embedded Die Packaging Technology (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 14: Global: Embedded Die Packaging Technology (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 15: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 16: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 17: Global: Embedded Die Packaging Technology (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 18: Global: Embedded Die Packaging Technology (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 19: Global: Embedded Die Packaging Technology (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 20: Global: Embedded Die Packaging Technology (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 21: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market: Sales Value (in Million US$), 2017 & 2022
• Figure 22: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 23: North America: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 24: North America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 25: United States: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 26: United States: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 27: Canada: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 28: Canada: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 29: Asia-Pacific: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 30: Asia-Pacific: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 31: China: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 32: China: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 33: Japan: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 34: Japan: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 35: India: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 36: India: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 37: South Korea: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 38: South Korea: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 39: Australia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 40: Australia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 41: Indonesia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 42: Indonesia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 43: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 44: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 45: Europe: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 46: Europe: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 47: Germany: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 48: Germany: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 49: France: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 50: France: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 51: United Kingdom: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 52: United Kingdom: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 53: Italy: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 54: Italy: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 55: Spain: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 56: Spain: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 57: Russia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 58: Russia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 59: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 60: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 61: Latin America: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 62: Latin America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 63: Brazil: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 64: Brazil: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 65: Mexico: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 66: Mexico: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 67: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 68: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 69: Middle East and Africa: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
• Figure 70: Middle East and Africa: Embedded Die Packaging Technology Market: Breakup by Country (in %), 2022
• Figure 71: Middle East and Africa: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
• Figure 72: Global: Embedded Die Packaging Technology Industry: SWOT Analysis
• Figure 73: Global: Embedded Die Packaging Technology Industry: Value Chain Analysis
• Figure 74: Global: Embedded Die Packaging Technology Industry: Porter's Five Forces Analysis

List of Tables

• Table 1: Global: Embedded Die Packaging Technology Market: Key Industry Highlights, 2022 & 2028
• Table 2: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Platform (in Million US$), 2023-2028
• Table 3: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Industry Vertical (in Million US$), 2023-2028
• Table 4: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Region (in Million US$), 2023-2028
• Table 5: Global: Embedded Die Packaging Technology Market: Competitive Structure
• Table 6: Global: Embedded Die Packaging Technology Market: Key Players