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市场调查报告书
商品编码
1356572

嵌入式晶片封装技术市场报告：2030 年趋势、预测与竞争分析

Embedded Die Packaging Technology Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

嵌入式晶片封装技术市场趋势与预测

预计到 2030 年，全球嵌入式晶片封装技术市场将达到 8.2 亿美元，2024 年至 2030 年年复合成长率为 27.1%。该市场的主要驱动因素是微电子设备中电路小型化的需求不断增长、专业服务中自主机器人的采用不断增加，以及全球对消费性电子和 5G 网路技术的需求不断增长。全球嵌入式晶片封装技术市场前景广阔，家用电子电器、IT/通讯、汽车和医疗保健市场蕴藏商机。

嵌入式晶片封装技术市场洞察

Lucintel 预测，在预测期内，柔性基板中的晶片嵌入将经历最高的成长。

家用电子电器将继续成为该市场的最大细分市场。

预计北美地区在预测期内将出现最高的成长。

本报告回答了 11 个关键问题：

  • Q.1. 细分市场中最有前途和高成长的机会是什么？
  • Q.2.哪个细分市场将以更快的速度成长？为什么？
  • Q.3.您认为哪些地区未来会出现更快的成长？为什么？
  • Q.4. 影响市场动态的主要因素有哪些？市场的主要挑战和业务风险是什么？
  • Q.5. 这个市场的商业风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场客户需求有何改变？
  • Q.8. 该市场有哪些新发展以及哪些公司处于领先地位？
  • Q.9.这个市场的主要企业有哪些？主要企业采取哪些策略配合措施来发展业务？
  • Q.10. 该市场上的竞争产品有哪些？由于材料或产品替代而导致市场占有率下降的威胁有多大？
  • Q.11.过去年度发生了哪些併购事件，对产业产生了哪些影响？

目录

第1章执行摘要

第2章全球嵌入式晶片封装技术市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第3章2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球嵌入式晶片封装技术市场趋势（2018-2023）与预测（2024-2030）
  • 按平台分類的全球嵌入式晶片封装技术市场
    • 晶片嵌入 IC 封装基板中
    • 模具嵌入刚性板
    • 嵌入柔性基板的晶片
  • 按最终用途产业分類的全球嵌入式晶片封装技术市场
    • 家用电器
    • 资讯科技/通讯
    • 汽车
    • 卫生保健
    • 其他的

第4章2018-2030年分地区市场趋势及预测分析

  • 全球嵌入式晶片封装技术市场（按地区）
  • 北美嵌入式晶片封装技术市场
  • 欧洲嵌入式晶片封装技术市场
  • 其他区域嵌入式晶片封装技术市场

第5章竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第6章成长机会与策略分析

  • 成长机会分析
    • 全球嵌入式晶片封装技术市场成长机会（按平台）
    • 最终用途产业的全球嵌入式晶片封装技术市场成长机会
    • 全球嵌入式晶片封装技术市场区域成长机会
  • 全球嵌入式晶片封装技术市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 扩大全球嵌入式晶片封装技术市场的产能
    • 全球嵌入式晶片封装技术市场的合併、收购与合资企业
    • 认证和许可

第7章主要企业概况

  • Amkor Technology
  • TDK Corporation
  • Microsemi
  • ASE Group
  • AT&S
  • General Electric
  • Taiwan Semiconductor
  • Infenion Technologies
  • Schweizer Electronic
  • Fujikura
简介目录

Embedded Die Packaging Technology Market Trends and Forecast

The future of the global embedded die packaging technology market looks promising with opportunities in the consumer electronic, it and telecommunication, automotive, and healthcare markets. The global embedded die packaging technology market is expected to reach an estimated $0.82 billion by 2030 with a CAGR of 27.1% from 2024 to 2030. The major drivers for this market are growing requirement for circuit miniaturization in the microelectronic devices, rising adoption of autonomous robots for professional services, and increase in demand for consumer electronics and 5G network technology across the globe.

A more than 150-page report is developed to help in your business decisions.

Embedded Die Packaging Technology Market by Segment

The study includes a forecast for the global embedded die packaging technology market by platform, end use industry, and region.

Embedded Die Packaging Technology Market by Platform [Shipment Analysis by Value from 2018 to 2030]:

  • Embedded Die in IC Package Substrate
  • Embedded Die in Rigid Board
  • Embedded Die in Flexible Board

Embedded Die Packaging Technology Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Others

Embedded Die Packaging Technology Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Embedded Die Packaging Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies embedded die packaging technology companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the embedded die packaging technology companies profiled in this report include-

  • Amkor Technology
  • TDK Corporation
  • Microsemi
  • ASE Group
  • AT&S
  • General Electric
  • Taiwan Semiconductor
  • Infenion Technologies
  • Schweizer Electronic
  • Fujikura

Embedded Die Packaging Technology Market Insights

Lucintel forecasts that embedded die in flexible board is expected to witness highest growth over the forecast period.

Within this market, consumer electronics will remain the largest segment.

North America is expected to witness highest growth over the forecast period.

Features of the Global Embedded Die Packaging Technology Market

Market Size Estimates: Embedded die packaging technology market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Embedded die packaging technology market size by platform, end use industry, and region. in terms of value ($B).

Regional Analysis: Embedded die packaging technology market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different platforms, end use industries, and region.s for the embedded die packaging technology market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the embedded die packaging technology market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the embedded die packaging technology market size?

Answer: The global embedded die packaging technology market is expected to reach an estimated $0.82 billion by 2030.

Q.2. What is the growth forecast for the embedded die packaging technology market?

Answer: The global embedded die packaging technology market is expected to grow with a CAGR of 27.1% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the embedded die packaging technology market?

Answer: The major drivers for this market are growing requirement for circuit miniaturization in the microelectronic devices, rising adoption of autonomous robots for professional services, and increase in demand for consumer electronics and 5G network technology across the globe.

Q.4. What are the major segments for the embedded die packaging technology market?

Answer: The future of the global embedded die packaging technology market looks promising with opportunities in the consumer electronic, it and telecommunication, automotive, and healthcare markets.

Q.5. Who are the key embedded die packaging technology market companies?

Answer: Some of the key embedded die packaging technology companies are as follows:

  • Amkor Technology
  • TDK Corporation
  • Microsemi
  • ASE Group
  • AT&S
  • General Electric
  • Taiwan Semiconductor
  • Infenion Technologies
  • Schweizer Electronic
  • Fujikura

Q.6. Which embedded die packaging technology market segment will be the largest in future?

Answer: Lucintel forecasts that embedded die in flexible board is expected to witness highest growth over the forecast period.

Q.7. In embedded die packaging technology market, which region is expected to be the largest in next 5 years?

Answer: North America is expected to witness highest growth over the forecast period.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the embedded die packaging technology market by platform (embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board), by end use industry (consumer electronics, IT and telecommunication, automotive, healthcare, and others), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Embedded Die Packaging Technology Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Embedded Die Packaging Technology Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Embedded Die Packaging Technology Market by Platform
    • 3.3.1: Embedded Die in IC Package Substrate
    • 3.3.2: Embedded Die in Rigid Board
    • 3.3.3: Embedded Die in Flexible Board
  • 3.4: Global Embedded Die Packaging Technology Market by End Use Industry
    • 3.4.1: Consumer Electronics
    • 3.4.2: IT and Telecommunication
    • 3.4.3: Automotive
    • 3.4.4: Healthcare
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Embedded Die Packaging Technology Market by Region
  • 4.2: North American Embedded Die Packaging Technology Market
    • 4.2.1: North American Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
    • 4.2.2: North American Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
  • 4.3: European Embedded Die Packaging Technology Market
    • 4.3.1: European Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
    • 4.3.2: European Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
    • 4.4.1: APAC Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board
    • 4.4.2: APAC Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others
  • 4.5: ROW Embedded Die Packaging Technology Market
    • 4.5.1: ROW Embedded Die Packaging Technology Market by Platform: Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board\
    • 4.5.2: ROW Embedded Die Packaging Technology Market by End Use Industry: Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Embedded Die Packaging Technology Market by Platform
    • 6.1.2: Growth Opportunities for the Global Embedded Die Packaging Technology Market by End Use Industry
    • 6.1.3: Growth Opportunities for the Global Embedded Die Packaging Technology Market Region
  • 6.2: Emerging Trends in the Global Embedded Die Packaging Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Embedded Die Packaging Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Embedded Die Packaging Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Amkor Technology
  • 7.2: TDK Corporation
  • 7.3: Microsemi
  • 7.4: ASE Group
  • 7.5: AT&S
  • 7.6: General Electric
  • 7.7: Taiwan Semiconductor
  • 7.8: Infenion Technologies
  • 7.9: Schweizer Electronic
  • 7.10: Fujikura