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1636008

2025-2033 年嵌入式晶片封装技术市场（按平台、垂直产业和地区划分）

Embedded Die Packaging Technology Market by Platform, Industry Vertical, and Region 2025-2033

出版日期: 2025年01月10日 | 出版商:

IMARC | 英文 142 Pages | 商品交期: 2-3个工作天内

价格

简介目录图表

2024年，全球嵌入式晶片封装技术IMARC Group规模达到1.026亿美元。不断增长的半导体行业以及便携式电子设备销售的成长正在推动市场发展。

嵌入式晶片封装技术用于透过多步骤製造製程将组件嵌入基板内。它包括倒装晶片尺寸封装（FC CSP）和晶圆级晶片尺寸封装（WL CSP），以提高系统的效率。它透过缩小印刷电路板 (PCB) 中的整体解决方案，为其他组件创造更多空间。它还提供表面贴装技术 (SMT) 整合和灵活的布线解决方案，以缩小印刷电路板 (PCB) 尺寸。它提供从 2D 转变为 3D 的设计灵活性，同时减少失真和功耗。因此，嵌入式晶片封装技术在全球电子、资讯和技术 (IT)、汽车、医疗保健和电信行业中得到广泛应用。

嵌入式晶片封装技术市场趋势：

目前，世界范围内微电子装置中的电子电路的小型化程度不断提高。这与蓬勃发展的半导体产业一起，是推动市场的关键因素之一。此外，嵌入式晶片封装技术还具有多种优势，例如昇级的电气和热性能、异质整合以及原始设备製造商 (OEM) 的简化物流，这些都有助于市场的成长。此外，各行业也越来越多地采用自主机器人提供专业服务，为产业投资者提供了利润丰厚的成长机会。除此之外，智慧型手机和穿戴式装置中越来越多地利用嵌入式晶片封装技术来扩大可用空间并整合更多组件，这对市场产生了积极影响。此外，全球范围内对整合物联网 (IoT) 的嵌入式晶片封装技术的需求也在增加。再加上笔记型电脑、电脑、平板电脑、电子阅读器、智慧型手机、MP3播放器、无人机和电子玩具等便携式电子设备销售的不断增长，正在推动市场的成长。

本报告回答的关键问题

2024 年全球嵌入式晶片封装技术市场规模有多大？ 2025-2033年全球嵌入式晶片封装技术市场的预期成长率是多少？
推动全球嵌入式晶片封装技术市场的关键因素是什么？
COVID-19 对全球嵌入式晶片封装技术市场有何影响？
基于该平台的全球嵌入式晶片封装技术市场的细分情况如何？
基于垂直产业的全球嵌入式晶片封装技术市场的细分情况如何？
全球嵌入式晶片封装技术市场的关键区域有哪些？
全球嵌入式晶片封装技术市场的主要参与者/公司有哪些？

北美洲
- 美国
- 加拿大
亚太
- 中国
- 日本
- 印度
- 韩国
- 澳洲
- 印尼
- 其他的
欧洲
- 德国
- 法国
- 英国
- 义大利
- 西班牙
- 俄罗斯
- 其他的
拉丁美洲
- 巴西
- 墨西哥
- 其他的
中东和非洲
- 市场趋势
- 市场细分：按国家/地区
- 市场预测

第 9 章：SWOT 分析

概述
优势
弱点
机会
威胁

第 10 章：价值链分析

第 11 章：波特五力分析

概述
买家的议价能力
供应商的议价能力
竞争程度
新进入者的威胁
替代品的威胁

第 12 章：价格分析

第13章：竞争格局

市场结构
关键参与者
关键参与者简介
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fujikura Ltd.
- Infineon Technologies AG
- Microsemi Corporation (Microchip Technology Inc.)
- Schweizer Electronic AG
- TDK Electronics AG (TDK Corporation)

简介目录图表

Product Code: SR112025A6580

The global embedded die packaging technology market size reached USD 102.6 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 266.1 Million by 2033, exhibiting a growth rate (CAGR) of 10.62% during 2025-2033. The increasing semiconductor industry, along with the growing sales of portable electronic devices, are propelling the market.

Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.

Embedded Die Packaging Technology Market Trends:

At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.

Key Market Segmentation:

Breakup by Platform:

Embedded Die in IC Package Substrate

Embedded Die in Rigid Board

Embedded Die in Flexible Board

Breakup by Industry Vertical:

Consumer Electronics

IT and Telecommunication

Automotive

Healthcare

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report

1. What was the size of the global embedded die packaging technology market in 2024?
2. What is the expected growth rate of the global embedded die packaging technology market during 2025-2033?
3. What are the key factors driving the global embedded die packaging technology market?
4. What has been the impact of COVID-19 on the global embedded die packaging technology market?
5. What is the breakup of the global embedded die packaging technology market based on the platform?
6. What is the breakup of the global embedded die packaging technology market based on the industry vertical?
7. What are the key regions in the global embedded die packaging technology market?
8. Who are the key players/companies in the global embedded die packaging technology market?

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

4.1 Overview
4.2 Key Industry Trends

5 Global Embedded Die Packaging Technology Market

5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast

6 Market Breakup by Platform

6.1 Embedded Die in IC Package Substrate
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
6.2 Embedded Die in Rigid Board
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
6.3 Embedded Die in Flexible Board
- 6.3.1 Market Trends
- 6.3.2 Market Forecast

7 Market Breakup by Industry Vertical

7.1 Consumer Electronics
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
7.2 IT and Telecommunication
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
7.3 Automotive
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
7.4 Healthcare
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
7.5 Others
- 7.5.1 Market Trends
- 7.5.2 Market Forecast

8 Market Breakup by Region

8.1 North America
- 8.1.1 United States
  - 8.1.1.1 Market Trends
  - 8.1.1.2 Market Forecast
- 8.1.2 Canada
  - 8.1.2.1 Market Trends
  - 8.1.2.2 Market Forecast
8.2 Asia-Pacific
- 8.2.1 China
  - 8.2.1.1 Market Trends
  - 8.2.1.2 Market Forecast
- 8.2.2 Japan
  - 8.2.2.1 Market Trends
  - 8.2.2.2 Market Forecast
- 8.2.3 India
  - 8.2.3.1 Market Trends
  - 8.2.3.2 Market Forecast
- 8.2.4 South Korea
  - 8.2.4.1 Market Trends
  - 8.2.4.2 Market Forecast
- 8.2.5 Australia
  - 8.2.5.1 Market Trends
  - 8.2.5.2 Market Forecast
- 8.2.6 Indonesia
  - 8.2.6.1 Market Trends
  - 8.2.6.2 Market Forecast
- 8.2.7 Others
  - 8.2.7.1 Market Trends
  - 8.2.7.2 Market Forecast
8.3 Europe
- 8.3.1 Germany
  - 8.3.1.1 Market Trends
  - 8.3.1.2 Market Forecast
- 8.3.2 France
  - 8.3.2.1 Market Trends
  - 8.3.2.2 Market Forecast
- 8.3.3 United Kingdom
  - 8.3.3.1 Market Trends
  - 8.3.3.2 Market Forecast
- 8.3.4 Italy
  - 8.3.4.1 Market Trends
  - 8.3.4.2 Market Forecast
- 8.3.5 Spain
  - 8.3.5.1 Market Trends
  - 8.3.5.2 Market Forecast
- 8.3.6 Russia
  - 8.3.6.1 Market Trends
  - 8.3.6.2 Market Forecast
- 8.3.7 Others
  - 8.3.7.1 Market Trends
  - 8.3.7.2 Market Forecast
8.4 Latin America
- 8.4.1 Brazil
  - 8.4.1.1 Market Trends
  - 8.4.1.2 Market Forecast
- 8.4.2 Mexico
  - 8.4.2.1 Market Trends
  - 8.4.2.2 Market Forecast
- 8.4.3 Others
  - 8.4.3.1 Market Trends
  - 8.4.3.2 Market Forecast
8.5 Middle East and Africa
- 8.5.1 Market Trends
- 8.5.2 Market Breakup by Country
- 8.5.3 Market Forecast

9 SWOT Analysis

9.1 Overview
9.2 Strengths
9.3 Weaknesses
9.4 Opportunities
9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
- 13.3.1 Amkor Technology Inc.
  - 13.3.1.1 Company Overview
  - 13.3.1.2 Product Portfolio
  - 13.3.1.3 Financials
  - 13.3.1.4 SWOT Analysis
- 13.3.2 ASE Technology Holding Co. Ltd.
  - 13.3.2.1 Company Overview
  - 13.3.2.2 Product Portfolio
  - 13.3.2.3 Financials
- 13.3.3 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  - 13.3.3.1 Company Overview
  - 13.3.3.2 Product Portfolio
  - 13.3.3.3 Financials
- 13.3.4 Fujikura Ltd.
  - 13.3.4.1 Company Overview
  - 13.3.4.2 Product Portfolio
  - 13.3.4.3 Financials
  - 13.3.4.4 SWOT Analysis
- 13.3.5 Infineon Technologies AG
  - 13.3.5.1 Company Overview
  - 13.3.5.2 Product Portfolio
  - 13.3.5.3 Financials
  - 13.3.5.4 SWOT Analysis
- 13.3.6 Microsemi Corporation (Microchip Technology Inc.)
  - 13.3.6.1 Company Overview
  - 13.3.6.2 Product Portfolio
  - 13.3.6.3 SWOT Analysis
- 13.3.7 Schweizer Electronic AG
  - 13.3.7.1 Company Overview
  - 13.3.7.2 Product Portfolio
  - 13.3.7.3 Financials
- 13.3.8 TDK Electronics AG (TDK Corporation)
  - 13.3.8.1 Company Overview
  - 13.3.8.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

简介目录图表

List of Figures

Figure 1: Global: Embedded Die Packaging Technology Market: Major Drivers and Challenges
Figure 2: Global: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019-2024
Figure 3: Global: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 4: Global: Embedded Die Packaging Technology Market: Breakup by Platform (in %), 2024
Figure 5: Global: Embedded Die Packaging Technology Market: Breakup by Industry Vertical (in %), 2024
Figure 6: Global: Embedded Die Packaging Technology Market: Breakup by Region (in %), 2024
Figure 7: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market: Sales Value (in Million USD), 2019 & 2024
Figure 8: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 9: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market: Sales Value (in Million USD), 2019 & 2024
Figure 10: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 11: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market: Sales Value (in Million USD), 2019 & 2024
Figure 12: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 13: Global: Embedded Die Packaging Technology (Consumer Electronics) Market: Sales Value (in Million USD), 2019 & 2024
Figure 14: Global: Embedded Die Packaging Technology (Consumer Electronics) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 15: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market: Sales Value (in Million USD), 2019 & 2024
Figure 16: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 17: Global: Embedded Die Packaging Technology (Automotive) Market: Sales Value (in Million USD), 2019 & 2024
Figure 18: Global: Embedded Die Packaging Technology (Automotive) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 19: Global: Embedded Die Packaging Technology (Healthcare) Market: Sales Value (in Million USD), 2019 & 2024
Figure 20: Global: Embedded Die Packaging Technology (Healthcare) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 21: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market: Sales Value (in Million USD), 2019 & 2024
Figure 22: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 23: North America: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 24: North America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 25: United States: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 26: United States: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 27: Canada: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 28: Canada: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 29: Asia-Pacific: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 30: Asia-Pacific: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 31: China: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 32: China: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 33: Japan: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 34: Japan: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 35: India: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 36: India: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 37: South Korea: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 38: South Korea: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 39: Australia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 40: Australia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 41: Indonesia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 42: Indonesia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 43: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 44: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 45: Europe: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 46: Europe: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 47: Germany: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 48: Germany: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 49: France: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 50: France: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 51: United Kingdom: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 52: United Kingdom: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 53: Italy: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 54: Italy: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 55: Spain: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 56: Spain: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 57: Russia: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 58: Russia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 59: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 60: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 61: Latin America: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 62: Latin America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 63: Brazil: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 64: Brazil: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 65: Mexico: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 66: Mexico: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 67: Others: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 68: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 69: Middle East and Africa: Embedded Die Packaging Technology Market: Sales Value (in Million USD), 2019 & 2024
Figure 70: Middle East and Africa: Embedded Die Packaging Technology Market: Breakup by Country (in %), 2024
Figure 71: Middle East and Africa: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million USD), 2025-2033
Figure 72: Global: Embedded Die Packaging Technology Industry: SWOT Analysis
Figure 73: Global: Embedded Die Packaging Technology Industry: Value Chain Analysis
Figure 74: Global: Embedded Die Packaging Technology Industry: Porter's Five Forces Analysis

List of Tables

Table 1: Global: Embedded Die Packaging Technology Market: Key Industry Highlights, 2024 and 2033
Table 2: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Platform (in Million USD), 2025-2033
Table 3: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Industry Vertical (in Million USD), 2025-2033
Table 4: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Region (in Million USD), 2025-2033
Table 5: Global: Embedded Die Packaging Technology Market: Competitive Structure
Table 6: Global: Embedded Die Packaging Technology Market: Key Players

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License/价格

2025-2033 年嵌入式晶片封装技术市场（按平台、垂直产业和地区划分）

Embedded Die Packaging Technology Market by Platform, Industry Vertical, and Region 2025-2033

嵌入式晶片封装技术市场趋势：

本报告回答的关键问题

目录

第一章：前言

第 2 章：范围与方法

第 3 章：执行摘要

第 4 章：简介

第 5 章：全球嵌入式晶片封装技术市场

第 6 章：市场区隔：依平台

第 7 章：市场区隔：依垂直产业

第 8 章：市场区隔：按地区

第 9 章：SWOT 分析

第 10 章：价值链分析

第 11 章：波特五力分析

第 12 章：价格分析

第13章：竞争格局

Embedded Die Packaging Technology Market Trends:

Key Market Segmentation:

Breakup by Platform:

Breakup by Industry Vertical:

Breakup by Region:

Competitive Landscape:

Key Questions Answered in This Report

Table of Contents

1 Preface

2 Scope and Methodology

3 Executive Summary

4 Introduction

5 Global Embedded Die Packaging Technology Market

6 Market Breakup by Platform

7 Market Breakup by Industry Vertical

8 Market Breakup by Region

9 SWOT Analysis

10 Value Chain Analysis

11 Porters Five Forces Analysis

12 Price Analysis

13 Competitive Landscape

List of Figures

List of Tables