嵌入式晶片封装市场－2025-2030年预测

预计到 2025 年，嵌入式晶片封装市场规模将达到 677,131,000 美元，到 2030 年将达到 1,690,993,000 美元，复合年增长率为 20.09%。

电子产业对技术进步的不懈追求正在推动嵌入式晶片封装市场的成长。这种封装技术满足了现代电子设备的几项关键需求，包括更小的晶片尺寸、更高的电气性能和更优异的互连密度。该技术的主要优势在于其对小型化的贡献。基板本身允许多层组件的集成，从而实现更灵活、更复杂的基板布局。这种方法为製造商和设计人员带来了许多益处，包括更高的封装强度和可靠性，以及快速适应客製化设计的能力。

全球嵌入式晶片封装市场的扩张主要受两大相互关联的趋势驱动：一是先进消费性电子产品的日益普及，二是5G网路技术的全球部署。智慧型手机、笔记型电脑、平板电脑和穿戴式装置等现代消费性电子产品整合了大量嵌入式处理器，以实现更好的使用者介面和更高的整体效能。这些处理器是电源管理电路（例如DC-DC转换器）、相机模组以及其他各种子系统的关键元件。同时，5G连接的整合也催生了对嵌入式晶片封装的需求，尤其是在需要高速资料处理和低延迟的应用领域，例如汽车高级驾驶辅助系统（ADAS）和智慧影像监控系统。整个产业对微电子元件电路小型化的迫切需求，使得嵌入式晶片封装成为越来越有吸引力的解决方案。

嵌入式晶片封装技术相较于其他积体电路（IC）封装方法，其固有的优势，例如比系统级封装（SiP）技术占用空间更小，是其价值提案和市场成长的核心所在。然而，市场成长并非一帆风顺。嵌入式晶片封装技术的高昂初始成本构成了其普及应用的一大障碍，并可能阻碍市场扩张的步伐。儘管面临这项挑战，物联网（IoT）解决方案的普及仍蕴藏着未来巨大的成长机会。物联网设备对紧凑、可靠和高效能电子元件的独特需求，预计将在预测期内为嵌入式晶片封装技术带来盈利的市场前景。

主要市场驱动因素

嵌入式晶片封装市场的主要驱动因素是全球消费性电子产品消费量的成长以及5G基础设施的部署。消费性电子产品是全球最受欢迎的产品类型之一。家庭领域电子设备的日益普及正在推动该行业的显着成长。在竞争激烈的市场环境中，製造商正大力投资将先进的数位技术整合到产品中，并高度重视提供高品质的使用者体验。这种对性能和创新的关注，加上主要市场参与者不断增加的研发投入，正在催生出一系列具有尖端功能的新产品，而这些产品都依赖先进的封装解决方案，例如嵌入式晶粒技术。

另一个关键驱动因素是对软式电路板内晶粒整合日益增长的需求。可拉伸电子领域持续发展，呈现多种形式并开拓新的应用领域。这项技术通常采用标准印刷电路基板，尤其重视软式电路板。先进的製造工艺，例如采用液态射出成型嵌入弹性体的可拉伸电子电路，正被用于打造耐用可靠的产品。这些柔性嵌入式解决方案的潜在应用非常广泛。例如，在军事和国防领域，轻巧柔性衝击感测器的研发正在取得进展，这些感测器可以直接嵌入製服和防弹背心。这些创新能够提供有关战斗伤亡的关键数据，并代表着一系列日益增长的高价值应用，这些应用正在推动嵌入式晶片封装向柔性形式演进。

区域市场展望

预计亚太地区将占据全球嵌入式晶片封装市场的主要份额，并有望在整个预测期内保持主导地位。这一主导地位归功于该地区主要电子产品製造商和半导体行业关键参与者的强大实力。亚太地区预计也将实现最高的成长率。这一成长主要得益于各大公司和政府机构在开发下一代半导体解决方案方面的大量投资。这些努力尤其着重于利用嵌入式晶片封装技术来提高电气和热性能、机械稳定性以及整体可靠性。半导体产业对技术进步的这种共同推动预计将成为亚太地区嵌入式晶片封装市场扩张的主要驱动力。

本报告的主要优势：

• 深入分析：提供对主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、行业垂直领域和其他细分市场。
• 竞争格局：了解全球主要参与者的策略倡议，并了解透过正确的策略实现市场渗透的潜力。
• 市场驱动因素与未来趋势：探讨影响市场的动态因素和关键趋势及其对未来市场发展的影响。
• 可操作的建议：利用这些见解，在快速变化的环境中製定策略决策，发展新的商业机会和收入来源。
• 受众广泛：适用于Start-Ups、研究机构、顾问公司、中小企业和大型企业，且经济实惠。

公司如何使用我们的报告范例

产业与市场分析、机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法规结构及影响、新产品开发、竞争情报

报告范围：

• 2022年至2024年的历史数据和2025年至2030年的预测数据
• 成长机会、挑战、供应链前景、法规结构与趋势分析
• 竞争定位、策略和市场占有率分析
• 按业务板块和地区分類的收入成长和预测评估，包括国家/地区
• 公司概况（策略、产品、财务资讯、关键发展等）

目录

第一章执行摘要

第二章 市场概览

• 市场概览
• 市场定义
• 调查范围
• 市场区隔

第三章 商业情境

• 市场驱动因素
• 市场限制
• 市场机会
• 波特五力分析
• 产业价值链分析
• 政策与法规
• 策略建议

第四章 技术展望

第五章嵌入式晶片封装市场（依平台划分）

• 介绍
• IC构装基板
• 刚性基板
• 软式电路板

第六章 依应用分類的嵌入式晶片封装市场

• 介绍
• 医学领域
• 消费性电子产品
• 军队
• 产业

第七章嵌入式晶片封装市场（按地区划分）

• 介绍
• 北美洲
  • 美国
  • 加拿大
  • 墨西哥
• 南美洲
  • 巴西
  • 阿根廷
  • 其他的
• 欧洲
  • 德国
  • 法国
  • 英国
  • 西班牙
  • 其他的
• 中东和非洲
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 其他的
• 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 印尼
  • 泰国
  • 其他的

第八章 竞争格局与分析

• 主要企业和策略分析
• 市占率分析
• 合併、收购、协议和合作
• 竞争对手仪錶板

第九章：公司简介

• ASE Group
• Microsemi Corporation
• Fujikura Ltd
• Infineon Technologies AG
• AT&S Company
• Schweizer Electronic AG
• Intel Corporation
• TSMC
• Shinko Electric Industries Co Ltd
• Amkor Technology

第十章附录

• 货币
• 先决条件
• 基准年和预测年时间表
• 相关人员的主要收益
• 调查方法
• 简称

The Embedded Die Packaging Market, with a 20.09% CAGR, is expected to grow to USD 1,690.993 million in 2030 from USD 677.131 million in 2025.

The embedded die packaging market is being propelled by the relentless pursuit of technological advancement in the electronics industry. This packaging technique addresses several critical requirements for modern electronics, including the demand for a reduced chip footprint, enhanced electrical performance, and superior interconnect density. A key advantage of this technology is its contribution to miniaturization; by allowing components to be stacked within multiple layers of the substrate itself, it enables more flexible and complex board layouts. This approach offers significant benefits to manufacturers and designers, including improved package robustness and reliability, as well as the capacity for rapid turnaround times for customized designs.

The expansion of the global embedded die packaging market is primarily driven by two interconnected mega-trends: the rising consumption of sophisticated consumer electronics and the global rollout of 5G network technologies. Modern consumer devices, such as smartphones, laptops, tablets, and wearables, integrate numerous embedded processors to deliver a superior user interface and enhanced overall performance. These processors are critical components within power management circuits (like DC-DC converters), camera modules, and various other subsystems. Concurrently, the integration of 5G connectivity is creating demand for embedded die packaging in applications requiring high-speed data processing and low latency, such as the advanced driver-assistance systems (ADAS) and smart video surveillance in automobiles. The urgent industry-wide need for further circuit miniaturization in microelectronic devices makes embedded die packaging an increasingly attractive solution.

The technology's intrinsic benefits over alternative integrated circuit (IC) packaging methods, such as its ability to occupy significantly less space than System-in-Package (SiP) technology, are central to its value proposition and market growth. However, the market's trajectory is not without constraints. The high initial costs associated with establishing embedded die packaging capabilities present a significant barrier to adoption and may hinder the pace of market expansion. Despite this challenge, a substantial opportunity for future growth lies in the proliferation of Internet of Things (IoT) solutions. The unique demands of IoT devices for compact, reliable, and high-performance electronics are expected to create lucrative prospects for embedded die packaging technology over the forecast period.

Primary Market Drivers

A dominant driver for the embedded die packaging market is the increased global consumption of consumer electronics and the deployment of 5G infrastructure. Consumer electronics represent one of the most ubiquitous product categories worldwide. The household sector's adoption of an increasingly diverse array of electronic devices has led to substantial growth for the industry. In this highly competitive landscape, manufacturers are making significant investments to integrate advanced digital technologies into their products, with a strong emphasis on delivering a high-quality user experience. This focus on performance and innovation, supported by rising research and development expenditures from leading market players, is resulting in a continuous stream of new products with cutting-edge features, all of which rely on advanced packaging solutions like embedded die technology.

Another significant driver is the growing demand for die integration within flexible boards. The field of stretchable electronics is evolving, taking on various forms and finding new applications. This technology often utilizes standard printed circuit boards, with a notable emphasis on flexible substrates. Advanced manufacturing processes, such as liquid injection molding of elastomer-embedded stretchable electronic circuits, are being employed to create durable and reliable products. The application potential for these flexible, embedded solutions is vast. For example, in the military and defense sector, there is development of lightweight, flexible impact sensors that can be embedded directly into uniforms and body armor. Such innovations could provide critical data on injuries sustained in combat, demonstrating the high-value applications that are pushing the boundaries of embedded die packaging into flexible formats.

Geographical Market Outlook

The Asia Pacific region is projected to be the prominent market shareholder in the global embedded die packaging market and is anticipated to maintain this leadership position throughout the forecast period. This dominance is attributed to the strong presence of major electronics manufacturers and semiconductor industry players within the region. Asia Pacific is also expected to register the fastest growth rate. A key contributor to this growth is the significant investment from both leading corporations and government entities in the development of next-generation semiconductor solutions. These initiatives specifically focus on leveraging embedded die packaging technology to achieve enhancements in electrical and thermal performance, mechanical stability, and overall reliability. This concerted push for technological advancement in the semiconductor sector is anticipated to be the primary fuel for the expansion of the embedded die packaging market within the Asia Pacific region.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation:

• EMBEDDED DIE PACKAGING MARKET BY PLATFORM
• IC package substrate
• Rigid Board
• Flexible Board
• EMBEDDED DIE PACKAGING MARKET BY APPLICATION
• Medical
• Consumer Electronics
• Military
• Industrial
• EMBEDDED DIE PACKAGING MARKET BY GEOGRAPHY
• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• India
• Japan
• South Korea
• Indonesia
• Thailand
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. EMBEDDED DIE PACKAGING MARKET BY PLATFORM

• 5.1. Introduction
• 5.2. IC package substrate
• 5.3. Rigid Board
• 5.4. Flexible Board

6. EMBEDDED DIE PACKAGING MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. Medical
• 6.3. Consumer Electronics
• 6.4. Military
• 6.5. Industrial

7. EMBEDDED DIE PACKAGING MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East and Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. India
  • 7.6.3. Japan
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Thailand
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. ASE Group
• 9.2. Microsemi Corporation
• 9.3. Fujikura Ltd
• 9.4. Infineon Technologies AG
• 9.5. AT&S Company
• 9.6. Schweizer Electronic AG
• 9.7. Intel Corporation
• 9.8. TSMC
• 9.9. Shinko Electric Industries Co Ltd
• 9.10. Amkor Technology

10. APPENDIX

• 10.1. Currency
• 10.2. Assumptions
• 10.3. Base and Forecast Years Timeline
• 10.4. Key Benefits for the Stakeholders
• 10.5. Research Methodology
• 10.6. Abbreviations