市场调查报告书
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1422811
2024-2032 年半导体介质蚀刻设备市场报告(按类型(湿蚀刻设备、干蚀刻设备)、应用(铸造厂、整合装置製造商 (IDM))和地区Semiconductor Dielectric Etching Equipment Market Report by Type (Wet Etching Equipment, Dry Etching Equipment), Application (Foundries, Integrated Device Manufacturers (IDMs)), and Region 2024-2032 |
2023年全球半导体介质蚀刻设备市场规模达13亿美元。展望未来, IMARC Group预计到2032年市场规模将达到18亿美元,2024-2032年复合年增长率(CAGR)为3.26%。电子产业的大幅扩张、半导体需求的不断增长以及智慧型设备的日益普及是推动市场发展的一些关键因素。
半导体介质蚀刻设备(SDEE)是指在半导体製造过程中用于抛光和去除各种介质物质(例如光阻掩模、氧化硅和氮化硅)的专用设备。它包括湿法和干蚀刻设备,与多种化学品一起使用。在某些情况下,由于更高的轮廓控制,一氧化碳也用于介电蚀刻过程。这些产品有助于雕刻出不同的物理特征,包括高纵横比 (HAR)、深沟槽和大空腔。 SDEE 在营运过程中提供更高的精确度,实现流程自动化,减少工作危险,并且更容易处置。
电子产业的大幅扩张以及智慧型手机、平板电脑和桌上型电脑等各种高性能消费性电子产品的购买量不断增加,是推动市场成长的主要因素。这可以进一步归因于半导体电路小型化的持续趋势,这促进了对介电蚀刻设备的需求。此外,最近全球范围内的工业自动化促使原始设备製造商(OEM)广泛使用该产品来製造平板显示器和非与(NAND)闪存,这是另一个成长诱导因素。与此一致的是,重大技术进步,例如用于优化半导体生产作业的电介质蚀刻设备能力的发展,正在支持市场成长。此外,机器学习(ML)、人工智慧(AI)功能、物联网(IoT)和汽车感测器的大规模整合以提供更高的精度,有利于市场成长。此外,自动驾驶汽车的不断发展进一步加剧了半导体在汽车中的使用,从而推动了市场的成长。鳍状场效电晶体 (FinFET) 架构的广泛采用也推动了市场的发展。由于FinFET设计采用电介质蚀刻作为其设计过程中主要的蚀刻步骤之一,因此预计这将促进对半导体电介质蚀刻设备的需求。其他因素,例如主要参与者最近的併购 (M&A)、最近推出更有效的产品变体的创新以及广泛的研发 (R&D) 活动,正在为市场创造积极的前景。
The global semiconductor dielectric etching equipment market size reached US$ 1.3 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 1.8 Billion by 2032, exhibiting a growth rate (CAGR) of 3.26% during 2024-2032. The significant expansion in the electronics industry, the rising demand for semiconductors, and the increasing penetration of smart devices represent some of the key factors driving the market.
Semiconductor dielectric etching equipment (SDEE) refers to specialized apparatus that is employed to polish and remove various dielectric substances, such as photo-resist mask, silicon oxide, and silicon nitride, during the semiconductor manufacturing procedure. It includes wet and dry etching equipment, which is used with numerous chemicals. In some instances, carbon monoxide is also utilized in the dielectric etching procedure due to higher profile control. These products help carve out varying physical features, including high aspect ratio (HAR), deep trenches, and large cavities. SDEE offers more precision during operations, automates processes, reduces work hazards, and is easier to dispose.
The significant expansion in the electronics sector and the increasing purchase of various high-performance consumer electronic products, such as smartphones, tablets, and desktops, represent a major factor driving the market toward growth. This can be further attributed to the ongoing trend of miniaturizing semiconductor circuits, which is facilitating the demand for dielectric etching equipment. Additionally, the recent industrial automation across the globe has prompted original equipment manufacturers (OEMs) to widely use the product to fabricate flat panel display screens and not-and (NAND) flash memory, which is acting as another growth-inducing factor. In line with this, significant technological advancements, such as the developments in the dielectric etching equipment capabilities to optimize the semiconductor production operations, are supporting the market growth. Moreover, the large-scale integration of machine learning (ML), artificial intelligence (AI) capabilities, Internet of Things (IoT), and automotive sensors to offer more precision is favoring the market growth. Furthermore, the continuous development of autonomous vehicles has further intensified the usage of semiconductors in vehicles, which is propelling the market growth. The market is also being driven by the widespread adoption of fin-shaped field effect transistor (FinFET) architecture. Since FinFET design uses dielectric etching as one of the major etching steps in its designing process, this is expected to facilitate the demand for semiconductor dielectric etching equipment. Other factors, such as the recent mergers and acquisitions (M&A) amongst key players, recent innovations to introduce more effective product variants, and extensive research and development (R&D) activities, are creating a positive outlook for the market.
IMARC Group provides an analysis of the key trends in each segment of the global semiconductor dielectric etching equipment market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type and application.
Wet Etching Equipment
Dry Etching Equipment
The report has also provided a detailed breakup and analysis of the semiconductor dielectric etching equipment market based on the type. This includes wet and dry etching equipment. According to the report, dry etching equipment represented the largest segment.
Foundries
Integrated Device Manufacturers (IDMs)
A detailed breakup and analysis of the semiconductor dielectric etching equipment market based on the application has also been provided in the report. This includes foundries and integrated device manufacturers (IDMs). According to the report, IDMs accounted for the largest market share.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for semiconductor dielectric etching equipment. Some of the factors driving the Asia Pacific semiconductor dielectric etching equipment market included extensive research and development (R&D) activities, the increasing demand for smart devices, and significant technological advancements.
The report has also provided a comprehensive analysis of the competitive landscape in the global semiconductor dielectric etching equipment market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro-Fabrication Equipment Inc. China, Applied Materials Inc., Hitachi High-Technologies Corporation (Hitachi Ltd), Lam Research Corporation, Mattson Technology, Oxford Instruments, SPTS Technologies Ltd. (KLA Corporation), Tokyo Electron Limited, etc.