市场调查报告书
商品编码
1541724
2024-2032 年分立半导体市场报告(按类型(二极体、电晶体、晶闸管、模组)、最终用户(汽车、消费性电子产品、通讯、工业等)和地区)Discrete Semiconductor Market Report by Type (Diodes, Transistors, Thyristor, Modules), End User (Automotive, Consumer Electronics, Communication, Industrial, and Others), and Region 2024-2032 |
IMARC Group年全球分立半导体市场规模达287亿美元。
分立半导体是单一装置,其构造为执行与特定配置中的两个不同装置类似的功能。双极电晶体、整流器、绝缘栅双极电晶体 (IGBT)、金属氧化物半导体场效电晶体 (MOSFET) 和晶闸管是一些常见的产品类型。它们用于执行较小的电子功能,包括电脑、智慧型手机、混合动力汽车、LED 照明、平板电脑和便携式医疗电子设备中的电源转换和电压调节。分离半导体可靠、便携、易于更换,并提供更高的运行速度和更低的功耗。因此,它们在汽车、消费性电子和电信产业中得到了广泛的应用。
全球汽车产业的显着成长正在为市场创造积极的前景。分立半导体广泛应用于具有手机整合、独立导向装置和平视显示器的车辆中。与此一致的是,电动车(EV)、混合动力电动车(HEV)、自动驾驶汽车技术和再生煞车系统的日益普及有利于市场成长。除此之外,各种产品创新,例如碳化硅 (SiC) MOSFET 的推出,可增强电动车动力系统的功率装置并提高功率密度、能源效率和可靠性,正在推动市场成长。此外,广泛使用产品来製造各种消费性电子产品,例如平板电脑、电脑、烤箱、冰箱和便携式电子产品,正在促进市场成长。其他因素包括对高能源效率设备的需求不断增加、广泛的研发活动、对高能源效率设备的需求不断增长、无线和便携式电子产品的推出以及不断增长的市场需求。 。
The global discrete semiconductor market size reached US$ 28.7 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 43.3 Billion by 2032, exhibiting a growth rate (CAGR) of 4.5% during 2024-2032.
Discrete semiconductors are singular devices that are constructed to perform a function similar to that of two different devices in a specific configuration. Bipolar transistors, rectifiers, insulated-gate bipolar transistors (IGBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs) and thyristors are some common product types. They are utilized to perform minor electronic functions, including power conversion and voltage regulation in computers, smartphones, hybrid cars, LED lighting, tablets and portable medical electronics. Discrete semiconductors are reliable, portable, and easily replaceable and offer increased operating speed and lower power consumption. As a result, they find extensive applications across the automotive, consumer electronics, and telecommunications industries.
Significant growth in the automotive industry across the globe is creating a positive outlook for the market. Discrete semiconductors are widely used in vehicles enabled with mobile phone integration, independent directing guides, and heads-up displays. In line with this, the increasing adoption of electric vehicles (EVs), hybrid electric vehicles (HEV), autonomous car technology, and regenerative braking systems are favoring the market growth. Apart from this, various product innovations, such as the launch of silicon-carbide (SiC) MOSFETs that enhance power devices for EV powertrains and increase power density, energy efficiency, and reliability, are providing a thrust to the market growth. Additionally, the widespread product utilization to manufacture various consumer electronics, such as tablets, computers, ovens, refrigerators and portable electronics, is augmenting the market growth. Other factors, including the increasing demand for high-energy and power-efficient devices, extensive research and development (R&D) activities, growing requirement for high-energy and power-efficient devices, the launch of wireless and portable electronic products, and the rising need for green energy power generation, are anticipated to drive the market growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global discrete semiconductor market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on type and end user.
Diodes
General-Purpose Rectifiers
High-Speed Rectifiers
Switching Diodes
Zener Diodes
ESD Protection Diodes
Variable-Capacitance Diodes
Transistors
MOSFET
IGBT
Bipolar Transistor
Thyristor
Modules
Automotive
Consumer Electronics
Communication
Industrial
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Diodes Incorporated, Fuji Electric Co. Ltd., Hitachi Ltd., Infineon Technologies AG, Littelfuse Inc., Microchip Technology Inc., Mitsubishi Electric Corporation, Nexperia (Wingtech Technology), NXP Semiconductors N.V., Onsemi, Qorvo, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited and Toshiba Electronic Devices & Storage Corporation (Toshiba Corporation).