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市场调查报告书
商品编码
1905109

日本抗辐射加固电子产品市场报告（按产品类型、材料类型、技术（设计抗辐射加固、製程抗辐射加固、软体抗辐射加固）、元件类型、应用和地区划分，2026-2034年）

Japan Radiation Hardened Electronics Market Report by Product Type, Material Type, Technique (Radiation Hardening by Design, Radiation Hardening by Process, Radiation Hardening by Software ), Component Type, Application, and Region 2026-2034
出版日期: | 出版商: IMARC | 英文 115 Pages | 商品交期: 5-7个工作天内

价格
简介目录

2025年，日本抗辐射电子产品市场规模达8,760万美元。展望未来， IMARC Group预计到2034年，该市场规模将达到1.31亿美元，2026年至2034年间的复合年增长率（CAGR）为4.58%。商业航太专案的不断增加以及半导体产业的扩张是推动市场成长的主要因素。

本报告解答的关键问题：

  • 日本抗辐射电子产品市场目前表现如何？未来几年又将如何发展？
  • 新冠疫情对日本抗辐射电子产品市场产生了哪些影响？
  • 日本抗辐射电子产品市场依产品类型分類的组成是怎样的？
  • 日本抗辐射电子产品市场依材料类型分類的组成是怎样的？
  • 日本抗辐射电子产品市场依技术分類的组成是怎样的？
  • 日本抗辐射电子产品市场依元件类型分類的组成是怎样的？
  • 日本抗辐射电子产品市场依应用领域分類的组成是怎样的？
  • 日本抗辐射电子产品市场价值链的各个阶段有哪些？
  • 日本抗辐射电子产品的关键驱动因素和挑战是什么？
  • 日本抗辐射电子产品市场的结构是怎么样的？主要参与者有哪些？
  • 日本抗辐射电子产品市场的竞争程度如何？

目录

第一章：序言

第二章：范围与方法

  • 研究目标
  • 利害关係人
  • 数据来源
  • 市场估算
  • 预测方法

第三章：执行概要

第四章：日本抗辐射电子产品市场－简介

  • 概述
  • 市场动态
  • 产业趋势
  • 竞争情报

第五章：日本抗辐射电子产品市场概况

  • 历史及当前市场趋势（2020-2025）
  • 市场预测（2026-2034）

第六章：日本抗辐射电子产品市场－依产品类型划分

  • 客製化
  • 现成商用产品

第七章：日本抗辐射电子产品市场－依材料类型划分

  • 硅
  • 碳化硅
  • 氮化镓
  • 其他的

第八章：日本抗辐射电子产品市场－依技术细分

  • 抗辐射加固设计（RHBD）
  • 製程辐射硬化（RHBP）
  • 软体抗辐射加固（RHBS）

第九章：日本抗辐射加强电子产品市场－依元件类型划分

  • 电源管理
  • 应用专用积体电路
  • 逻辑
  • 记忆
  • 现场可程式闸阵列
  • 其他的

第十章：日本抗辐射电子产品市场－依应用领域划分

  • 太空卫星
  • 商业卫星
  • 军队
  • 航太与国防
  • 核电厂
  • 其他的

第十一章：日本抗辐射电子产品市场－按地区划分

  • 关东地区
  • 关西/近畿地区
  • 中部/中部地区
  • 九州·冲绳地区
  • 东北部地区
  • 中国地区
  • 北海道地区
  • 四国地区

第十二章：日本抗辐射电子产品市场－竞争格局

  • 概述
  • 市场结构
  • 市场参与者定位
  • 最佳制胜策略
  • 竞争格局分析
  • 公司评估象限

第十三章：关键参与者简介

第十四章：日本抗辐射电子产品市场－产业分析

  • 驱动因素、限制因素和机会
  • 波特五力分析
  • 价值链分析

第十五章：附录

简介目录
Product Code: SR112026A18908

Japan radiation hardened electronics market size reached USD 87.6 Million in 2025. Looking forward, IMARC Group expects the market to reach USD 131.0 Million by 2034, exhibiting a growth rate (CAGR) of 4.58% during 2026-2034. The rising number of commercial space projects, along with the expanding semiconductor industry, is primarily driving the market growth.

Radiation-hardened electronics encompass a range of electronic elements, packages, and items specifically designed for use in high-altitude environments. These components are crafted from materials such as silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon. In line with this, their distinctive feature is their resilience to the detrimental effects of ionizing radiation, high-energy radiation, as well as gamma and neutron radiation typically emitted by nuclear reactors. These specialized electronics are widely deployed in an array of applications including satellites, aircraft, and nuclear power plants, where they serve essential roles as switching regulators, microprocessors, and power supply devices. As a result of their unique properties, they find extensive use in diverse industries, including aviation, space exploration, and military and defense sectors across Japan.

Japan Radiation Hardened Electronics Market Trends:

The market in Japan is predominantly steered by the escalating number of space missions and exploratory endeavors within the country. Concurrently, the surging requirement for communication satellites catering to intelligence, surveillance, and reconnaissance (ISR) operations is fostering market expansion. Radiation-hardened electronics play a pivotal role in safeguarding electronic apparatus against physical harm and malfunction caused by detrimental radiations encountered in outer space, thereby further positively influencing the regional market. Furthermore, the widespread adoption of these electronics in the production of power management devices is contributing positively to market growth. These electronics also find applications in manufacturing diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military purposes, which is also acting as another significant growth-inducing factor. Additionally, continuous technological advancements, such as the refinement of highly dependable integrated circuits and enhancements in field-programmable gate array (FPGA) technology, are creating a favorable market landscape. Other factors, including substantial growth within the electronics sector and extensive research and development (R&D) endeavors, are poised to further propel market expansion in the coming years.

Japan Radiation Hardened Electronics Market Segmentation:

Product Type Insights:

  • Custom Made
  • Commercial-Off-the-Shelf

Material Type Insights:

  • Silicon
  • Silicon Carbide
  • Gallium Nitride
  • Others

Technique Insights:

  • Radiation Hardening by Design (RHBD)
  • Radiation Hardening by Process (RHBP)
  • Radiation Hardening by Software (RHBS)

Component Type Insights:

  • Power Management
  • Application Specific Integrated Circuit
  • Logic
  • Memory
  • Field-Programmable Gate Array
  • Others

Application Insights:

  • Space Satellites
  • Commercial Satellites
  • Military
  • Aerospace and Defense
  • Nuclear Power Plants
  • Others

Regional Insights:

  • Kanto Region
  • Kansai/Kinki Region
  • Central/ Chubu Region
  • Kyushu-Okinawa Region
  • Tohoku Region
  • Chugoku Region
  • Hokkaido Region
  • Shikoku Region
  • The report has also provided a comprehensive analysis of all the major regional markets, which include Kanto Region, Kansai/Kinki Region, Central/ Chubu Region, Kyushu-Okinawa Region, Tohoku Region, Chugoku Region, Hokkaido Region, and Shikoku Region.

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

  • How has the Japan radiation hardened electronics market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the Japan radiation hardened electronics market?
  • What is the breakup of the Japan radiation hardened electronics market on the basis of product type?
  • What is the breakup of the Japan radiation hardened electronics market on the basis of material type?
  • What is the breakup of the Japan radiation hardened electronics market on the basis of technique?
  • What is the breakup of the Japan radiation hardened electronics market on the basis of component type?
  • What is the breakup of the Japan radiation hardened electronics market on the basis of application?
  • What are the various stages in the value chain of the Japan radiation hardened electronics market?
  • What are the key driving factors and challenges in the Japan radiation hardened electronics?
  • What is the structure of the Japan radiation hardened electronics market and who are the key players?
  • What is the degree of competition in the Japan radiation hardened electronics market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Japan Radiation Hardened Electronics Market - Introduction

  • 4.1 Overview
  • 4.2 Market Dynamics
  • 4.3 Industry Trends
  • 4.4 Competitive Intelligence

5 Japan Radiation Hardened Electronics Market Landscape

  • 5.1 Historical and Current Market Trends (2020-2025)
  • 5.2 Market Forecast (2026-2034)

6 Japan Radiation Hardened Electronics Market - Breakup by Product Type

  • 6.1 Custom Made
    • 6.1.1 Overview
    • 6.1.2 Historical and Current Market Trends (2020-2025)
    • 6.1.3 Market Forecast (2026-2034)
  • 6.2 Commercial-Off-the-Shelf
    • 6.2.1 Overview
    • 6.2.2 Historical and Current Market Trends (2020-2025)
    • 6.2.3 Market Forecast (2026-2034)

7 Japan Radiation Hardened Electronics Market - Breakup by Material Type

  • 7.1 Silicon
    • 7.1.1 Overview
    • 7.1.2 Historical and Current Market Trends (2020-2025)
    • 7.1.3 Market Forecast (2026-2034)
  • 7.2 Silicon Carbide
    • 7.2.1 Overview
    • 7.2.2 Historical and Current Market Trends (2020-2025)
    • 7.2.3 Market Forecast (2026-2034)
  • 7.3 Gallium Nitride
    • 7.3.1 Overview
    • 7.3.2 Historical and Current Market Trends (2020-2025)
    • 7.3.3 Market Forecast (2026-2034)
  • 7.4 Others
    • 7.4.1 Historical and Current Market Trends (2020-2025)
    • 7.4.2 Market Forecast (2026-2034)

8 Japan Radiation Hardened Electronics Market - Breakup by Technique

  • 8.1 Radiation Hardening by Design (RHBD)
    • 8.1.1 Overview
    • 8.1.2 Historical and Current Market Trends (2020-2025)
    • 8.1.3 Market Forecast (2026-2034)
  • 8.2 Radiation Hardening by Process (RHBP)
    • 8.2.1 Overview
    • 8.2.2 Historical and Current Market Trends (2020-2025)
    • 8.2.3 Market Forecast (2026-2034)
  • 8.3 Radiation Hardening by Software (RHBS)
    • 8.3.1 Overview
    • 8.3.2 Historical and Current Market Trends (2020-2025)
    • 8.3.3 Market Forecast (2026-2034)

9 Japan Radiation Hardened Electronics Market - Breakup by Component Type

  • 9.1 Power Management
    • 9.1.1 Overview
    • 9.1.2 Historical and Current Market Trends (2020-2025)
    • 9.1.3 Market Forecast (2026-2034)
  • 9.2 Application Specific Integrated Circuit
    • 9.2.1 Overview
    • 9.2.2 Historical and Current Market Trends (2020-2025)
    • 9.2.3 Market Forecast (2026-2034)
  • 9.3 Logic
    • 9.3.1 Overview
    • 9.3.2 Historical and Current Market Trends (2020-2025)
    • 9.3.3 Market Forecast (2026-2034)
  • 9.4 Memory
    • 9.4.1 Overview
    • 9.4.2 Historical and Current Market Trends (2020-2025)
    • 9.4.3 Market Forecast (2026-2034)
  • 9.5 Field-Programmable Gate Array
    • 9.5.1 Overview
    • 9.5.2 Historical and Current Market Trends (2020-2025)
    • 9.5.3 Market Forecast (2026-2034)
  • 9.6 Others
    • 9.6.1 Historical and Current Market Trends (2020-2025)
    • 9.6.2 Market Forecast (2026-2034)

10 Japan Radiation Hardened Electronics Market - Breakup by Application

  • 10.1 Space Satellites
    • 10.1.1 Overview
    • 10.1.2 Historical and Current Market Trends (2020-2025)
    • 10.1.3 Market Forecast (2026-2034)
  • 10.2 Commercial Satellites
    • 10.2.1 Overview
    • 10.2.2 Historical and Current Market Trends (2020-2025)
    • 10.2.3 Market Forecast (2026-2034)
  • 10.3 Military
    • 10.3.1 Overview
    • 10.3.2 Historical and Current Market Trends (2020-2025)
    • 10.3.3 Market Forecast (2026-2034)
  • 10.4 Aerospace and Defense
    • 10.4.1 Overview
    • 10.4.2 Historical and Current Market Trends (2020-2025)
    • 10.4.2 Market Forecast (2026-2034)
  • 10.5 Nuclear Power Plants
    • 10.5.1 Overview
    • 10.5.2 Historical and Current Market Trends (2020-2025)
    • 10.5.3 Market Forecast (2026-2034)
  • 10.6 Others
    • 10.6.1 Historical and Current Market Trends (2020-2025)
    • 10.6.2 Market Forecast (2026-2034)

11 Japan Radiation Hardened Electronics Market - Breakup by Region

  • 11.1 Kanto Region
    • 11.1.1 Overview
    • 11.1.2 Historical and Current Market Trends (2020-2025)
    • 11.1.3 Market Breakup by Product Type
    • 11.1.4 Market Breakup by Material Type
    • 11.1.5 Market Breakup by Technique
    • 11.1.6 Market Breakup by Component Type
    • 11.1.7 Market Breakup by Application
    • 11.1.8 Key Players
    • 11.1.9 Market Forecast (2026-2034)
  • 11.2 Kansai/Kinki Region
    • 11.2.1 Overview
    • 11.2.2 Historical and Current Market Trends (2020-2025)
    • 11.2.3 Market Breakup by Product Type
    • 11.2.4 Market Breakup by Material Type
    • 11.2.5 Market Breakup by Technique
    • 11.2.6 Market Breakup by Component Type
    • 11.2.7 Market Breakup by Application
    • 11.2.8 Key Players
    • 11.2.9 Market Forecast (2026-2034)
  • 11.3 Central/ Chubu Region
    • 11.3.1 Overview
    • 11.3.2 Historical and Current Market Trends (2020-2025)
    • 11.3.3 Market Breakup by Product Type
    • 11.3.4 Market Breakup by Material Type
    • 11.3.5 Market Breakup by Technique
    • 11.3.6 Market Breakup by Component Type
    • 11.3.7 Market Breakup by Application
    • 11.3.8 Key Players
    • 11.3.9 Market Forecast (2026-2034)
  • 11.4 Kyushu-Okinawa Region
    • 11.4.1 Overview
    • 11.4.2 Historical and Current Market Trends (2020-2025)
    • 11.4.3 Market Breakup by Product Type
    • 11.4.4 Market Breakup by Material Type
    • 11.4.5 Market Breakup by Technique
    • 11.4.6 Market Breakup by Component Type
    • 11.4.7 Market Breakup by Application
    • 11.4.8 Key Players
    • 11.4.9 Market Forecast (2026-2034)
  • 11.5 Tohoku Region
    • 11.5.1 Overview
    • 11.5.2 Historical and Current Market Trends (2020-2025)
    • 11.5.3 Market Breakup by Product Type
    • 11.5.4 Market Breakup by Material Type
    • 11.5.5 Market Breakup by Technique
    • 11.5.6 Market Breakup by Component Type
    • 11.5.7 Market Breakup by Application
    • 11.5.8 Key Players
    • 11.5.9 Market Forecast (2026-2034)
  • 11.6 Chugoku Region
    • 11.6.1 Overview
    • 11.6.2 Historical and Current Market Trends (2020-2025)
    • 11.6.3 Market Breakup by Product Type
    • 11.6.4 Market Breakup by Material Type
    • 11.6.5 Market Breakup by Technique
    • 11.6.6 Market Breakup by Component Type
    • 11.6.7 Market Breakup by Application
    • 11.6.8 Key Players
    • 11.6.9 Market Forecast (2026-2034)
  • 11.7 Hokkaido Region
    • 11.7.1 Overview
    • 11.7.2 Historical and Current Market Trends (2020-2025)
    • 11.7.3 Market Breakup by Product Type
    • 11.7.4 Market Breakup by Material Type
    • 11.7.5 Market Breakup by Technique
    • 11.7.6 Market Breakup by Component Type
    • 11.7.7 Market Breakup by Application
    • 11.7.8 Key Players
    • 11.7.9 Market Forecast (2026-2034)
  • 11.8 Shikoku Region
    • 11.8.1 Overview
    • 11.8.2 Historical and Current Market Trends (2020-2025)
    • 11.8.3 Market Breakup by Product Type
    • 11.8.4 Market Breakup by Material Type
    • 11.8.5 Market Breakup by Technique
    • 11.8.6 Market Breakup by Component Type
    • 11.8.7 Market Breakup by Application
    • 11.8.8 Key Players
    • 11.8.9 Market Forecast (2026-2034)

12 Japan Radiation Hardened Electronics Market - Competitive Landscape

  • 12.1 Overview
  • 12.2 Market Structure
  • 12.3 Market Player Positioning
  • 12.4 Top Winning Strategies
  • 12.5 Competitive Dashboard
  • 12.6 Company Evaluation Quadrant

13 Profiles of Key Players

  • 13.1 Company A
    • 13.1.1 Business Overview
    • 13.1.2 Product Portfolio
    • 13.1.3 Business Strategies
    • 13.1.4 SWOT Analysis
    • 13.1.5 Major News and Events
  • 13.2 Company B
    • 13.2.1 Business Overview
    • 13.2.2 Product Portfolio
    • 13.2.3 Business Strategies
    • 13.2.4 SWOT Analysis
    • 13.2.5 Major News and Events
  • 13.3 Company C
    • 13.3.1 Business Overview
    • 13.3.2 Product Portfolio
    • 13.3.3 Business Strategies
    • 13.3.4 SWOT Analysis
    • 13.3.5 Major News and Events
  • 13.4 Company D
    • 13.4.1 Business Overview
    • 13.4.2 Product Portfolio
    • 13.4.3 Business Strategies
    • 13.4.4 SWOT Analysis
    • 13.4.5 Major News and Events
  • 13.5 Company E
    • 13.5.1 Business Overview
    • 13.5.2 Product Portfolio
    • 13.5.3 Business Strategies
    • 13.5.4 SWOT Analysis
    • 13.5.5 Major News and Events

14 Japan Radiation Hardened Electronics Market - Industry Analysis

  • 14.1 Drivers, Restraints, and Opportunities
    • 14.1.1 Overview
    • 14.1.2 Drivers
    • 14.1.3 Restraints
    • 14.1.4 Opportunities
  • 14.2 Porters Five Forces Analysis
    • 14.2.1 Overview
    • 14.2.2 Bargaining Power of Buyers
    • 14.2.3 Bargaining Power of Suppliers
    • 14.2.4 Degree of Competition
    • 14.2.5 Threat of New Entrants
    • 14.2.6 Threat of Substitutes
  • 14.3 Value Chain Analysis

15 Appendix