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市场调查报告书
商品编码
1580897

电子封装市场：按材料、技术和应用分类 - 2025-2030 年全球预测

Electronic Packaging Market by Material (Glass, Metal, Plastic), Technology (Chip-on-Board, Surface Mount Technology, Through-Hole Technology), Application - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 184 Pages | 商品交期: 最快1-2个工作天内

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2023年电子封装市场价值为31.9亿美元，预计到2024年将达到36.9亿美元，复合年增长率为16.55%，到2030年将达到93.2亿美元。

电子封装市场包括用于保护和整合设备内电子元件的材料和方法。免受物理、热和电磁干扰的保护可确保功能性、可靠性和使用寿命。电子封装的需求源自于对更小、更轻和更有效率的电子产品日益增长的需求。先进封装在家用电子电器、汽车、医疗保健、航太和通讯等多个领域都有应用，而先进封装技术对于优化设备性能至关重要。最终用途范围广泛，包括半导体、印刷基板(PCB)、感测器、光电元件等。主要市场驱动因素包括快速成长的消费性电子市场、物联网 (IoT) 设备的进步以及需要先进电力电子封装解决方案的电动车的日益普及。 5G和人工智慧等新兴技术也正在重振市场，为更高密度整合和增强温度控管解决方案提供机会。然而，市场面临挑战，例如与先进封装技术相关的高成本以及需要持续创新以满足不断变化的设备要求。包装材料也存在严格的法规和环境影响等限制。机会在于提高性能同时缩小尺寸和成本的创新，例如 3D 封装、系统级封装(SiP) 解决方案以及奈米技术的进步。环保永续的包装材料也是解决市场需求和监管压力的重要研究途径。随着公司寻求成长，投资智慧包装解决方案和环保替代品的研发至关重要。市场动态是动态的，趋势倾向于整合、小型化和永续性，需要不断适应和投资最尖端科技以保持竞争力。探索跨行业应用并专注于客製化也将为这个不断发展的领域的扩展和创新开闢新的途径。

主要市场统计
基准年[2023] 31.9亿美元
预测年份 [2024] 36.9亿美元
预测年份 [2030] 93.2亿美元
复合年增长率（%） 16.55%

市场动态：揭示快速发展的电子封装市场的关键市场洞察

电子封装市场正因供需的动态交互作用而转变。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，并了解消费行为及其对製造成本的影响，并更清楚地了解对采购趋势的影响。

  • 市场驱动因素
    • 半导体产业的成长对先进电子封装的需求
    • 汽车产业扩张，重点是电子元件和感测器
    • 对环境永续性的兴趣日益浓厚，导致环保包装材料的开发
    • 政府法规和标准要求提高电子封装的可靠性和性能
  • 市场限制因素
    • 持续的技术进步对维持电子封装标准提出了挑战
    • 原物料价格波动影响整个电子封装市场的製造成本与价格稳定性
  • 市场机会
    • 5G技术的扩展及其对电子封装要求的影响
    • 扩大系统级封装(SiP) 技术在高效能应用的使用
    • 创新电子封装温度控管解决方案，防止过热并提高可靠性
  • 市场挑战
    • 解决密集电子电路中的电磁干扰与讯号完整性问题
    • 整合先进材料和奈米技术，满足特定行业的电子封装要求

波特五力：驾驭电子封装市场的策略工具

波特的五力架构是了解电子封装市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解电子封装市场的外部影响

外部宏观环境因素在塑造电子封装市场的表现动态方面发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并帮助他们做出积极主动的决策。

市场占有率分析 了解电子封装市场的竞争格局

对电子封装市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵电子封装市场供应商绩效评估

FPNV定位矩阵是评估电子封装市场供应商的重要工具。此矩阵允许业务组织根据供应商的商务策略和产品满意度评估供应商，从而做出符合其目标的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

制定电子封装市场成功之路的策略分析与建议

电子封装市场的策略分析对于旨在加强其在全球市场的影响力的公司至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：详细检视当前市场环境、主要企业的广泛资料、评估其在市场中的影响力和整体影响力。

2. 市场开拓：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 半导体产业的成长推动了对先进技术的需求
      • 汽车产业扩张，重点是电子元件和感测器
      • 人们对环境永续性的兴趣日益浓厚，导致了环保包装材料的开发。
      • 政府法规和标准要求提高电子封装的可靠性和性能
    • 抑制因素
      • 不断的技术进步创造了一个难以跟上电子封装标准的环境
      • 原物料价格的波动影响整体製造成本和价格稳定性。电子封装市场
    • 机会
      • 5G技术的扩展及其对电子封装要求的影响
      • 提高高效能应用系统级封装(SiP) 技术的使用率
      • 电子封装温度控管解决方案的创新，可防止过热并提高可靠性
    • 任务
      • 解决密集电子电路中的电磁干扰与讯号完整性问题
      • 整合尖端材料和奈米技术，满足特定产业的电子封装要求
  • 市场区隔分析
    • 材质：热稳定性增加了玻璃在电子封装中的使用
    • 应用：电子包装在医疗保健领域的新兴应用与生物相容性包装
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章电子封装市场：依材料分类

  • 玻璃
  • 金属
  • 塑胶

第七章电子封装市场：依技术分类

  • 板载晶片
  • 表面黏着技术
  • 通孔技术

第八章电子封装市场：依应用分类

  • 车
  • 家电
  • 卫生保健
  • 产业
  • 通讯

第九章美洲电子封装市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第十章亚太地区电子封装市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十一章欧洲、中东和非洲电子封装市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十二章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
    • Specialized Packaging Group 收购 Clark Foam，增强泡棉包装领域的能力和市场覆盖范围
    • 美光和 Namtech 合作培养技术纯熟劳工并加强印度半导体封装行业
    • 肖特透过先进的封装解决方案提高航太电子产品的可靠性
  • 战略分析和建议

公司名单

  • Advanced Micro Devices, Inc.
  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding Co, Ltd
  • Avnet, Inc.
  • Broadcom Inc.
  • DuPont de Nemours, Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • Jabil, Inc.
  • Microchip Technology Inc.
  • Micron Technology, Inc.
  • NXP BV
  • ON Semiconductor Corporation
  • Power Integrations, Inc.
  • Qualcomm Technologies, Inc
  • Renesas Electronics Corporation
  • ROHM Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • Schott AG
  • Skyworks Solutions, Inc.
  • Smart Global Holdings, Inc
  • Smurfit Kappa Group PLC
  • Sonoco Products Company
  • Specialized Packaging Group, Inc.
  • STMicroelectronics International NV
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • Vishay Intertechnology, Inc.
Product Code: MRR-3C68ED2D0EE7

The Electronic Packaging Market was valued at USD 3.19 billion in 2023, expected to reach USD 3.69 billion in 2024, and is projected to grow at a CAGR of 16.55%, to USD 9.32 billion by 2030.

The electronic packaging market encompasses the materials and methods used to protect and integrate electronic components within devices. It ensures functionality, reliability, and longevity by shielding from physical, thermal, and electromagnetic interference. The necessity for electronic packaging arises from the growing demand for miniaturized, lightweight, and more efficient electronic products. Applications span across multiple sectors, including consumer electronics, automotive, healthcare, aerospace, and telecommunications, where advanced packaging technologies are crucial for optimal device performance. The end-use scope is broad, covering semiconductors, printed circuit boards (PCBs), sensors, and optoelectronic components. Key growth drivers include the burgeoning consumer electronics market, advancements in Internet of Things (IoT) devices, and the increasing adoption of electric vehicles, which demand sophisticated packaging solutions for power electronics. Emerging technologies such as 5G and AI also fuel the market, presenting opportunities for high-density integration and enhanced thermal management solutions. However, the market faces challenges such as high costs associated with advanced packaging technologies and the need for continuous innovation to meet evolving device requirements. Limitations include stringent regulations and the environmental impact associated with packaging materials. Opportunities lie in innovations like 3D packaging, system-in-package (SiP) solutions, and advancements in nanotechnology that can enhance performance while reducing size and cost. Eco-friendly and sustainable packaging materials also represent a critical research avenue, addressing both market demand and regulatory pressures. As businesses seek growth, investing in R&D for smart packaging solutions and eco-friendly alternatives will be pivotal. The electronic packaging market is dynamic, with trends leaning towards integration, miniaturization, and sustainability, necessitating continuous adaptation and investment in cutting-edge technology to maintain competitive edge. Exploring cross-industry applications and focusing on customization will also open new avenues for expansion and innovation in this evolving field.

KEY MARKET STATISTICS
Base Year [2023] USD 3.19 billion
Estimated Year [2024] USD 3.69 billion
Forecast Year [2030] USD 9.32 billion
CAGR (%) 16.55%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Electronic Packaging Market

The Electronic Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growth in semiconductor industry driving the need for advanced electronic packaging
    • Expansion of the automotive industry with emphasis on electronic components and sensors
    • Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
    • Government regulations and standards mandating improved reliability and performance of electronic packaging
  • Market Restraints
    • Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
    • Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
  • Market Opportunities
    • Expansion of 5G technology and its impact on electronic packaging requirements
    • Increased utilization of system-in-package (SiP) technology for high-performance applications
    • Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
  • Market Challenges
    • Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
    • Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements

Porter's Five Forces: A Strategic Tool for Navigating the Electronic Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Electronic Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Electronic Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Electronic Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Electronic Packaging Market

A detailed market share analysis in the Electronic Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Electronic Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Electronic Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Electronic Packaging Market

A strategic analysis of the Electronic Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Electronic Packaging Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., Amkor Technology, Inc., Analog Devices, Inc., ASE Technology Holding Co, Ltd, Avnet, Inc., Broadcom Inc., DuPont de Nemours, Inc., Infineon Technologies AG, Intel Corporation, Jabil, Inc., Microchip Technology Inc., Micron Technology, Inc., NXP B.V., ON Semiconductor Corporation, Power Integrations, Inc., Qualcomm Technologies, Inc, Renesas Electronics Corporation, ROHM Co., Ltd., Samsung Electronics Co., Ltd., Schott AG, Skyworks Solutions, Inc., Smart Global Holdings, Inc, Smurfit Kappa Group PLC, Sonoco Products Company, Specialized Packaging Group, Inc., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company, Ltd., Texas Instruments Incorporated, Toshiba Corporation, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Electronic Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Material, market is studied across Glass, Metal, and Plastic.
  • Based on Technology, market is studied across Chip-on-Board, Surface Mount Technology, and Through-Hole Technology.
  • Based on Application, market is studied across Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growth in semiconductor industry driving the need for advanced electronic packaging
      • 5.1.1.2. Expansion of the automotive industry with emphasis on electronic components and sensors
      • 5.1.1.3. Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
      • 5.1.1.4. Government regulations and standards mandating improved reliability and performance of electronic packaging
    • 5.1.2. Restraints
      • 5.1.2.1. Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
      • 5.1.2.2. Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
    • 5.1.3. Opportunities
      • 5.1.3.1. Expansion of 5G technology and its impact on electronic packaging requirements
      • 5.1.3.2. Increased utilization of system-in-package (SiP) technology for high-performance applications
      • 5.1.3.3. Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
    • 5.1.4. Challenges
      • 5.1.4.1. Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
      • 5.1.4.2. Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Material: Increasing applications of Glass in electronic packaging due to thermal stability
    • 5.2.2. Application: Emerging applications of electronic packaging in healthcare owing to biocompatible packaging
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Electronic Packaging Market, by Material

  • 6.1. Introduction
  • 6.2. Glass
  • 6.3. Metal
  • 6.4. Plastic

7. Electronic Packaging Market, by Technology

  • 7.1. Introduction
  • 7.2. Chip-on-Board
  • 7.3. Surface Mount Technology
  • 7.4. Through-Hole Technology

8. Electronic Packaging Market, by Application

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Consumer Electronics
  • 8.4. Healthcare
  • 8.5. Industrial
  • 8.6. Telecommunications

9. Americas Electronic Packaging Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Electronic Packaging Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Electronic Packaging Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Specialized Packaging Group Acquires Clark Foam to Boost Capabilities and Market Reach in Foam Packaging Sector
    • 12.3.2. Micron and Namtech Join Forces to Train Skilled Workforce, Strengthening India's Semiconductor Packaging Industry
    • 12.3.3. Schott Enhances Reliability of Aerospace Electronics with Advanced Packaging Solution
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Advanced Micro Devices, Inc.
  • 2. Amkor Technology, Inc.
  • 3. Analog Devices, Inc.
  • 4. ASE Technology Holding Co, Ltd
  • 5. Avnet, Inc.
  • 6. Broadcom Inc.
  • 7. DuPont de Nemours, Inc.
  • 8. Infineon Technologies AG
  • 9. Intel Corporation
  • 10. Jabil, Inc.
  • 11. Microchip Technology Inc.
  • 12. Micron Technology, Inc.
  • 13. NXP B.V.
  • 14. ON Semiconductor Corporation
  • 15. Power Integrations, Inc.
  • 16. Qualcomm Technologies, Inc
  • 17. Renesas Electronics Corporation
  • 18. ROHM Co., Ltd.
  • 19. Samsung Electronics Co., Ltd.
  • 20. Schott AG
  • 21. Skyworks Solutions, Inc.
  • 22. Smart Global Holdings, Inc
  • 23. Smurfit Kappa Group PLC
  • 24. Sonoco Products Company
  • 25. Specialized Packaging Group, Inc.
  • 26. STMicroelectronics International N.V.
  • 27. Taiwan Semiconductor Manufacturing Company, Ltd.
  • 28. Texas Instruments Incorporated
  • 29. Toshiba Corporation
  • 30. Vishay Intertechnology, Inc.

LIST OF FIGURES

  • FIGURE 1. ELECTRONIC PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. ELECTRONIC PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. ELECTRONIC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. ELECTRONIC PACKAGING MARKET DYNAMICS
  • TABLE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY GLASS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP-ON-BOARD, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH-HOLE TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 23. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 24. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 25. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 26. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 27. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 29. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 30. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 31. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 32. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 33. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 34. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 35. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 36. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 37. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 38. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 39. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 40. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 41. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 42. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 43. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 45. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 46. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 47. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 49. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 50. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 51. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 52. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 55. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 56. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 57. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 58. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 59. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 60. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 61. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 62. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 64. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 65. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 66. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 67. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 70. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 71. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 72. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 73. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 74. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 75. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 76. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 77. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 78. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 79. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 82. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 83. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 84. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 85. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 86. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 87. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 88. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 89. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 90. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 91. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 92. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 93. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 94. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 95. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 98. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 99. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 100. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 101. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 102. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 103. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 104. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 105. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 106. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 107. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 109. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 110. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 111. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 112. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 113. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 114. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 115. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 116. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 117. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 118. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 119. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 120. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 121. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 122. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 123. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 124. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 125. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 126. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 127. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 128. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 129. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 130. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 131. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 132. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 133. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 134. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 135. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 136. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 137. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 138. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 139. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 140. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 141. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 142. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 143. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 144. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 145. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 146. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 148. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 149. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023