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市场调查报告书

商品编码

1640104

电子包装市场规模、份额和成长分析（按类型、包装材料、包装技术、应用和地区）- 2025-2032 年产业预测

Electronic Packaging Market Size, Share, Growth Analysis, By Type (Corrugated Boxes, Paperboard Boxes), By Packaging Material (Plastic, Metal), By Packaging Technology, By Application, By Region - Industry Forecast 2025-2032

出版日期: 2025年01月21日 | 出版商:

SkyQuest | 英文 184 Pages | 商品交期: 3-5个工作天内

价格

简介目录

预计到2023年全球电子封装市场规模将达到348.2亿美元，预计到2032年将由2024年的362.8亿美元扩大到504.2亿美元，预测期内（2025-2032年）的复合年增长率为4.2%。

物联网、人工智慧和先进电子产品的整合正在推动家电和汽车领域对复杂电子封装的需求。近日，安姆科科技与三星电子合作开发了创新的H-Cube解决方案，以增强混合基板立方体技术在高性能半导体应用方面的能力。向 5G 的过渡，尤其是采用 MIMO 的 802.11ac，有望实现高达 1.3GHz 的速度，进一步推动市场需求。简约和创新的设计也在影响成长，例如 Smurfit Kappa 斥资 3,300 万美元扩建其在巴西的包装解决方案工厂。在电动车 (EV) 广泛普及的推动下，汽车产业占据了最大的细分市场，预计到 2025 年印度电动车市场规模将达到 70.9 亿美元，到 2030 年将带来价值 2,060 亿美元的进一步发展机会，从而推动电子封装技术的进步。

北美洲
- 美国
- 加拿大
欧洲
- 德国
- 西班牙
- 法国
- 英国
- 义大利
- 其他欧洲国家地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 其他亚太地区
拉丁美洲
- 巴西
- 其他拉丁美洲国家
中东和非洲
- 海湾合作委员会国家
- 南非
- 其他中东和非洲地区

竞争资讯

前 5 家公司对比
主要企业市场定位（2024年）
主要市场参与者所采用的策略
近期市场趋势
公司市场占有率分析（2024 年）
主要企业简介
- 公司简介
- 产品系列分析
- 按细分市场分析市场份额
- 收益与前一年同期比较对比（2022-2024 年）

主要企业简介

Amkor Technology, Inc.（United States）
ASE Technology Holding Co., Ltd.（Taiwan）
Jabil Inc.（United States）
BE Semiconductor Industries NV（Besi）（Netherlands）
Kulicke & Soffa Industries, Inc.（Singapore）
Tokyo Electron Limited（Japan）
Toppan Inc.（Japan）
Shinko Electric Industries Co., Ltd.（Japan）
Unimicron Technology Corporation（Taiwan）
Samsung Electro-Mechanics Co., Ltd.（South Korea）
LG Innotek Co., Ltd.（South Korea）
ASE Group（Taiwan）
SPIL（Siliconware Precision Industries Co., Ltd.）（Taiwan）
Powertech Technology Inc.（Taiwan）
JCET Group Co., Ltd.（China）
Tongfu Microelectronics Co., Ltd.（China）
Hana Micron Inc.（South Korea）
ASE Technology Holding Co., Ltd.（Taiwan）
Nepes Corporation（South Korea）

结论和建议

简介目录

Product Code: SQMIG15F2168

Global Electronic Packaging Market size was valued at USD 34.82 billion in 2023 and is poised to grow from USD 36.28 billion in 2024 to USD 50.42 billion by 2032, growing at a CAGR of 4.2% during the forecast period (2025-2032).

The convergence of IoT, AI, and advanced electronics is propelling the demand for sophisticated electronic packaging in consumer electronics and automotive sectors. Recently, Amcor Technology collaborated with Samsung Electronics to develop the innovative H-Cube solution, enhancing the capabilities of Hybrid-Substrate Cube technology for high-performance semiconductor applications. The transition to 5G, specifically 802.11ac with MIMO, promises speeds up to 1.3 GHz, further driving market demand. Innovative designs with minimalism are also influencing growth, as seen in Smurfit Kappa's $33 million facility expansion in Brazil for packaging solutions. The automotive sector, fueled by electric vehicle (EV) adoption, represents the largest market segment, with projections indicating the Indian EV market could reach $7.09 billion by 2025, driven by further opportunities worth $206 billion by 2030, thus stimulating electronic packaging advancements.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Electronic Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Electronic Packaging Market Segmental Analysis

Global Electronic Packaging Market is segmented by Type, Packaging Material, Packaging Technology, Application and region. Based on Type, the market is segmented into Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags and Pouches, Blister packs and Clamshell, Protective, Flexible Packaging and Rigid Packaging. Based on Packaging Material, the market is segmented into Plastic, Metal, Glass and Paperboard. Based on Packaging Technology, the market is segmented into Thermal Packaging, Protective Packaging and Modified Atmosphere Packaging. Based on Application, the market is segmented into Consumer Electronics, Industrial Electronics, Telecommunications and Automotive Electronics. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Electronic Packaging Market

The Global Electronic Packaging market is significantly propelled by the ongoing advancements in miniaturization. As the demand for compact electronics like smartphones and wearable IoT devices continues to grow, there is an increasing need for improved semiconductor packaging techniques. Miniaturization not only helps reduce the size and weight of electronic devices, enhancing their performance, but it also facilitates the integration of multiple functions and features within a single compact unit. This evolution in packaging technology enables manufacturers to create more efficient and powerful devices, ultimately driving innovation and expanding the capabilities of electronic products in the market.

Restraints in the Global Electronic Packaging Market

The Global Electronic Packaging market faces several constraints, with financial limitations being a significant factor. The use of advanced packaging technologies necessitates intricate components, specialized machinery, and high-quality materials, all contributing to elevated production costs. Additionally, manufacturers often encounter challenges related to ongoing investments in innovative packaging technologies and equipment. The competitive landscape, along with pricing pressures from customers, further complicates profitability, potentially hindering the willingness of manufacturers to adopt enhanced packaging solutions. As a result, the financial strain experienced by companies in this sector can significantly impact their ability to innovate and improve their product offerings.

Market Trends of the Global Electronic Packaging Market

The Global Electronic Packaging market is experiencing a notable upward trend, driven by the surging demand for electronic products, particularly in regions like India and China. As the electronics sector in India is projected to reach USD 220 billion by 2025, bolstered by robust regulatory frameworks and increased capital investment, the need for efficient packaging solutions is escalating. Additionally, China's industrial growth, fueled by advancements in technology and

Introduction

Objectives of the Study
Scope of the Report
Definitions

Research Methodology

Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Overview
Market Size
Market Dynamics
- Drivers & Opportunities
- Restraints & Challenges
Porters Analysis
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers

Key Market Insights

Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2024
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis

Global Electronic Packaging Market Size by Type & CAGR (2025-2032)

Market Overview
Corrugated Boxes
Paperboard Boxes
Thermoformed Trays
Bags and Pouches
Blister packs and Clamshell
Protective
Flexible Packaging
Rigid Packaging

Global Electronic Packaging Market Size by Packaging Material & CAGR (2025-2032)

Market Overview
Plastic
Metal
Glass
Paperboard

Global Electronic Packaging Market Size by Packaging Technology & CAGR (2025-2032)

Market Overview
Thermal Packaging
Protective Packaging
Modified Atmosphere Packaging

Global Electronic Packaging Market Size by Application & CAGR (2025-2032)

Market Overview
Consumer Electronics
Industrial Electronics
Telecommunications
Automotive Electronics

Global Electronic Packaging Market Size & CAGR (2025-2032)

North America (Type, Packaging Material, Packaging Technology, Application)
- US
- Canada
Europe (Type, Packaging Material, Packaging Technology, Application)
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific (Type, Packaging Material, Packaging Technology, Application)
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America (Type, Packaging Material, Packaging Technology, Application)
- Brazil
- Rest of Latin America
Middle East & Africa (Type, Packaging Material, Packaging Technology, Application)
- GCC Countries
- South Africa
- Rest of Middle East & Africa

Competitive Intelligence

Top 5 Player Comparison
Market Positioning of Key Players, 2024
Strategies Adopted by Key Market Players
Recent Developments in the Market
Company Market Share Analysis, 2024
Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

Amkor Technology, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Technology Holding Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Jabil Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
BE Semiconductor Industries N.V. (Besi) (Netherlands)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Kulicke & Soffa Industries, Inc. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Tokyo Electron Limited (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Toppan Inc. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Shinko Electric Industries Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Unimicron Technology Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electro-Mechanics Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
LG Innotek Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Group (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SPIL (Siliconware Precision Industries Co., Ltd.) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Powertech Technology Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
JCET Group Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Tongfu Microelectronics Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Hana Micron Inc. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Technology Holding Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nepes Corporation (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments