市场调查报告书
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1351138
2030 年电子封装市场预测:按材料、类型、封装技术、技术、最终用户和地区进行的全球分析Electronic Packaging Market Forecasts to 2030 - Global Analysis By Material, Type, Packaging Technology (Chip Scale Packages, Surface Mount Technology and Through Hole Mounting), Technology, End User and By Geography |
根据Stratistics MRC的数据,2023年全球电子封装市场规模为17.6亿美元,预计到2030年将达到64.9亿美元,预测期内年复合成长率为20.51%。
电子封装是指从大型电脑和单一半导体等电子零件到整个系统的各种机壳的设计和製造。这可以防止机械损坏、冷却、射频杂讯发射和静电放电。高效的电气和半导体封装用于智慧型手机、电视、平板电脑、机上盒和数数位适配器等消费性电子设备的生产,以保护零件免受灰尘、腐蚀、水和静电放电的影响。
据 IBEF 称,到 2025 年,印度电动车(EV) 市场规模预计将达到 5,000 亿印度卢比(70.9 亿美元)。此外,根据CEEW能源金融中心的一项研究,到2030年,印度的电动车商机将达到2,060亿美元。
消费性电子产品之所以成为引人注目的产业,是因为其内建的技术进步能够降低成本并增加利润。随着产业包装设计的快速发展,电子封装业务面临产业技术进步的压力。此外,随着技术的进步,对电子封装的需求也不断增加和变化。硅IC技术的快速进步是电子封装市场的主要特征之一。
人们对环境永续性的兴趣日益浓厚,对环保包装材料和製造技术的需求也随之增加。然而,找到满足性能目标、预算限制和环境法规的可行替代方案可能很困难。此外,潜在的可靠性问题可能会限制市场扩张,因为将零件焊接到电路基板会使零件承受压力,并且需要复杂且困难的维护。
消费性电子产品的商品化、消费者购买趋势的变化以及产品生命週期的缩短是推动电子封装市场扩张的主要要素。此外,智慧型手机、穿戴式科技、电视、数位相机和平板电脑等消费性电子产品以及用于抵御恶劣天气的泡沫包装和气枕等创新包装产品的使用日益增多,也导致了市场的扩大。此外,路由器、网路伺服器和感测器等敏感电子产品对防风雨保护包装的需求也不断增加。由于各个新兴经济体中行动电话和智慧运算设备的使用不断增加,预计该市场将会扩大。
电子封装产业涉及尖端封装概念、方法和技术的创造。智慧财产权 (IP) 保护对于促进创新和防止未经授权的使用和复製至关重要。保护智慧财产权的挑战可能很困难,特别是在智慧财产权法律和执法实践宽鬆的地区。然而,电子封装对材料成本、製造工序和设备要求较高。这使得业务资源有限的中小型企业难以采用尖端的包装方法。
政府为应对 COVID-19 疫情而实施的限制迫使电子封装製造商暂停生产,扰乱了半导体製造和供应业务的供应链。由于 COVID-19 的爆发,对配备半导体的产品的需求正在减少。由于封锁情况,小工具的生产已经停止。全球电子封装市场的整个供应链因此被扰乱。
由于对资料处理设备、资料显示设备、电脑以及飞机导引和控制组件等军事和航太设备的需求不断增加,预计航太和国防领域在预测期内将占据最大的市场份额。此外,航太航太和国防领域(例如海军军舰、卫星通讯载通道和武器控制系统)对优质军用级封装的需求也推动了电子封装市场收入的成长。
预计金属类别在预测期内将经历最高的年复合成长率,因为金属机械强度高,提供电磁屏蔽,并且可以以最小的原型和小批量生产的特殊模具成本快速製造。此外,金属由于其优异的机械性能、导电性、导热性和屏蔽性能而经常用于各种包装用途。
由于汽车基础设施的扩张和电动车销量的增加,预计亚太地区在预测期内将占据最大的市场份额。由于充满活力的年轻人口和不断增长的中等收入群体,汽车领域的需求可能会增加。 IBEF 预测,到 2022 年 6 月,小客车、三轮车、两轮车和四轮车的产量将总合2,081,148 辆,为该地区的市场扩张提供动力。
由于电子领域的需求、技术进步以及医疗保健设备和包装解决方案的大量应用领域,预计亚太地区将实现盈利增长。在不久的将来,预计该地区的市场成长将受到各种电子产品的电子设备和商品日益萎缩的推动。根据国家投资促进和便利化局(NIPFA)的报告,印度对电子产品的需求大幅增加。凭藉强有力的法规支持、多个相关人员的大量投资以及对电子产品不断增长的需求,预计到 2025 年,电子设备部门将达到 2,200 亿美元。
According to Stratistics MRC, the Global Electronic Packaging Market is accounted for $1.76 billion in 2023 and is expected to reach $6.49 billion by 2030 growing at a CAGR of 20.51% during the forecast period. Electronic packaging is the design and manufacture of enclosures for electronic components, such as mainframe computers or individual semiconductors, up to entire systems. This guards against mechanical harm, cooling, the emission of radio frequency noise, and electrostatic discharge. When making consumer electronics like smartphones, TVs, tablets, set-top boxes, and digital media adapters, efficient electrical and semiconductor packaging is used to shield the components from dust, corrosion, water, and electrostatic discharge.
According to IBEF, India's electric vehicle (EV) market is expected to reach INR 50,000 crores (USD 7.09 billion) by 2025. Further, a CEEW Centre for Energy Finance study shows India's USD 206 billion in opportunities for electric vehicles by 2030.
Consumer electronics products have a compelling case for business because of the technological advancement that is integrated into them and has the ability to lower costs and boost profits. Electronic packaging businesses are under pressure from technological advancements in the industry since the industry's package design is developing rapidly. Additionally, the requirements for electronic packaging increase and change as technology advances. The rapid advancement of silicon IC technology is one of the key characteristics of the electronics packaging market.
There is a rising demand for environmentally friendly packaging materials and manufacturing techniques as environmental sustainability becomes more and more of a concern. However, it can be difficult to locate viable alternatives that satisfy performance objectives, budgetary restrictions, and environmental regulations. Also, potential reliability difficulties could limit market expansion because soldering components onto circuit boards exposes them to stress and requires complicated, challenging maintenance.
The commoditization of consumer electronics devices, evolving consumer purchasing trends, and shortening product life cycles are key drivers boosting the electronics packaging market's expansion. Additionally, the market is expanding due to the increasing use of consumer electronics devices like smartphones, wearable technology, televisions, digital cameras, and tablets that have innovative packaging products like air bubble wrap and air pillows to protect them from bad weather. Moreover, demand for all-weather protective packaging for delicate electronic products, including routers, network servers, and sensors, is also increasing. The market is expected to rise as a result of the increasing use of mobile phones and smart computing devices in various developing economies.
The industry of electronic packaging involves the creation of cutting-edge packaging concepts, methods, and technology. It is essential to protect intellectual property (IP) rights to promote innovation and prevent unauthorized use or replication. Enforcing IP protection, can be challenging, especially in areas with lax IP laws and enforcement practices. However, electronic packaging can have expensive material costs, production procedures, and equipment requirements. This may make it more difficult for smaller businesses with limited resources to adopt cutting-edge packaging methods.
Government limitations placed into effect in the wake of the COVID-19 epidemic have prompted the manufacturers of electronic packages to halt production, disrupting the supply chain for the whole semiconductor manufacturing and supply business. The demand for products powered by semiconductors has decreased as a result of the COVID-19 epidemic. Due to the lockdown situation, gadget production has stopped. The worldwide electronic packaging market's entire supply chain has been disrupted as a result.
Due to the rising demand for military and aerospace devices, such as data processing units, data display devices, computers, and aircraft guidance-control assemblies, the aerospace and defense segment is anticipated to hold the largest market share over the projection period. Furthermore, boosting the market revenue for electronic packaging is the need for high-grade military-grade packaging in the aerospace and defense sectors for naval warships, satellite communication onboard channels, and weapon control systems.
Because metal is mechanically robust, offers electromagnetic shielding, and can be quickly fabricated for prototypes and small production runs with minimal special tooling expense, the metal category is predicted to have the highest CAGR throughout the projection period. Moreover, because of their superior mechanical qualities, electrical conductivity, thermal conductivity, and shielding characteristics, metals are frequently used in a variety of packaging applications.
Due to expanding automotive infrastructure and rising sales of electric vehicles, the Asia-Pacific region is anticipated to hold the largest share of the market over the projection period. A strong youth population and rising middle-class incomes could increase demand in the automotive sector. IBEF estimates that 2,081,148 units of passenger cars, three-wheelers, two-wheelers, and quadricycles were produced in total in June 2022, which will fuel market expansion in the region.
Because of the demand from the electronics sector, technological advances, and substantial utilization areas in healthcare devices and packaging solutions, Asia-Pacific is predicted to have profitable growth. In the near future, market growth in the region is anticipated to be driven by an increase in the shrinking of electronic devices and goods across a wide range of electronic products. The National Investment Promotion and Facilitation Agency (NIPFA) reports that the demand for electronic products has significantly increased in India. Due to strong regulatory support, significant investments made by numerous stakeholders, and an increase in demand for electronic goods, it is predicted that the electronic manufacturing sector will reach US$220 billion by 2025.
Some of the key players in Electronic Packaging market include: AMETEK Inc., Blue Spark Technology, Dordan Manufacturing Company, E. I. du Pont de Nemours and Company, Excellatron Solid State, GY Packaging, Plastiform Inc., Infinite Power Solutions, Kiva Container Corporation, Primex Design & Fabrication, Quality Foam Packaging Inc., Sealed Air Corporation, The Box Co-Op and UFP Technologies, Inc.
In June 2022, Digimarc Corporation announced a partnership with Sealed Air, a global leader in digital printing and packaging, to bring product digitization to markets such as eCommerce fulfillment, industrials, and consumer goods at scale via smart packaging.
In March 2022, Intel revealed the first phase of its efforts to invest up to EUR 80 billion (USD 84 billion) in the European Union over the following decade across the semiconductor value chain, from Research and Development to production to advanced packaging technologies.