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市场调查报告书
商品编码
1356855

电子封装市场报告：2030 年趋势、预测与竞争分析

Electronic Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

电子封装趋势与预测

全球电子封装市场预计到 2030 年将达到 34 亿美元，2024 年至 2030 年年复合成长率为 12.3%。该市场的主要驱动力是消费性电子产品的需求不断增长、智慧型手机的普及不断提高以及物联网和无线设备在全球范围内的使用不断增加。全球电子封装市场前景广阔，家用电子电器、航太和国防、汽车和通讯市场蕴藏机会。

电子封装市场洞察

Lucintel 预测，金属将在预测期内呈现最高成长。

预计亚太地区在预测期内将出现最高成长。

本报告回答了 11 个关键问题：

  • Q.1. 细分市场中最有前途和高成长的机会是什么？
  • Q.2.哪个细分市场将以更快的速度成长？为什么？
  • Q.3.您认为哪些地区未来会出现更快的成长？为什么？
  • Q.4. 影响市场动态的主要因素有哪些？市场的主要挑战和业务风险是什么？
  • Q.5. 这个市场的商业风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场客户需求有何改变？
  • Q.8. 该市场有哪些新发展以及哪些公司处于领先地位？
  • Q.9.这个市场的主要企业有哪些？主要企业采取哪些策略配合措施来发展业务？
  • Q.10. 该市场上的竞争产品有哪些？由于材料或产品替代而导致市场占有率下降的威胁有多大？
  • Q.11.过去年度发生了哪些併购事件，对产业产生了哪些影响？

目录

第1章执行摘要

第2章全球电子封装市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第3章2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球电子封装市场趋势（2018-2023）与预测（2024-2030）
  • 按材料划分：全球电子封装市场
    • 塑胶
    • 金属
    • 玻璃
    • 其他的
  • 依封装技术：全球电子封装市场
    • 通孔安装
    • 表面表面黏着技术[SMD]
    • 晶片级封装 [CSP]
  • 按最终用途产业分類的全球电子封装市场
    • 家用电器
    • 航太和国防
    • 汽车
    • 通讯
    • 其他的

第4章2018-2030年分地区市场趋势及预测分析

  • 按地区划分：全球电子封装市场
  • 北美电子封装市场
  • 欧洲电子封装市场
  • 亚太地区电子封装市场
  • 其他区域电子封装市场

第5章竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第6章成长机会与策略分析

  • 成长机会分析
  • 全球电子封装市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 扩大全球电子封装市场产能
    • 全球电子封装市场的合併、收购与合资企业
    • 认证和许可

第7章主要企业概况

  • Ametek
  • Dordan Manufacturing Company
  • DuPont de Nemours
  • GY Packaging
  • Plastiform
  • Kiva Container Corporation
  • Quality Foam Packaging
  • Sealed Air Corporation
  • The Box
  • UFP Technologies
简介目录

Electronic Packaging Trends and Forecast

The future of the global electronic packaging market looks promising with opportunities in the consumer electronic, aerospace & defense, automotive, and telecommunication markets. The global electronic packaging market is expected to reach an estimated $3.4 billion by 2030 with a CAGR of 12.3% from 2024 to 2030. The major drivers for this market are the demand for consumer electronics is on the rise, growing adoption of smartphones, and there is an increasing utilization of IoT and wireless devices across the globe.

A more than 150-page report is developed to help in your business decisions.

Electronic Packaging by Segment

The study includes a forecast for the global electronic packaging by material, packaging technology, end use industry, and region.

Electronic Packaging Market by Material [Shipment Analysis by Value from 2018 to 2030]:

  • Plastic
  • Metal
  • Glass
  • Others

Electronic Packaging Market by Packaging Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Through-Hole Mounting
  • Surface Surface-Mount Technology [SMD]
  • Chip-Scale Packages [CSP]

Electronic Packaging Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Aerospace & Defense
  • Automotive
  • Telecommunication
  • Others

Electronic Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Electronic Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies electronic packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the electronic packaging companies profiled in this report include-

  • Ametek
  • Dordan Manufacturing Company
  • Dupont de Nemours
  • GY Packaging
  • Plastiform
  • Kiva Container Corporation
  • Quality Foam Packaging
  • Sealed Air Corporation
  • The Box
  • UFP Technologies

Electronic Packaging Market Insights

Lucintel forecasts that metal is expected to witness highest growth over the forecast period.

APAC is expected to witness highest growth over the forecast period.

Features of the Global Electronic Packaging Market

Market Size Estimates: Electronic packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Electronic packaging market size by material, packaging technology, end use industry, and region. in terms of value ($B).

Regional Analysis: Electronic packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different materials, packaging technologies, end use industries, and region.s for the electronic packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the electronic packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1. What is the electronic packaging market size?

Answer: The global electronic packaging market is expected to reach an estimated $3.4 billion by 2030.

Q.2. What is the growth forecast for electronic packaging market?

Answer: The global electronic packaging market is expected to grow with a CAGR of 12.3% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the electronic packaging market?

Answer: The major drivers for this market are the demand for consumer electronics is on the rise, growing adoption of smartphones, and there is an increasing utilization of IoT and wireless devices across the globe.

Q.4. What are the major segments for electronic packaging market?

Answer: The future of the electronic packaging market looks promising with opportunities in the consumer electronic, aerospace & defense, automotive, and telecommunication markets.

Q.5. Who are the key electronic packaging market companies?

Answer: Some of the key electronic packaging companies are as follows:

  • Ametek
  • Dordan Manufacturing Company
  • DuPont de Nemours
  • GY Packaging
  • Plastiform
  • Kiva Container Corporation
  • Quality Foam Packaging
  • Sealed Air Corporation
  • The Box
  • UFP Technologies

Q.6. Which electronic packaging market segment will be the largest in future?

Answer: Lucintel forecasts that xx is expected to witness highest growth over the forecast period.

Q.7. In electronic packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the electronic packaging market by material (plastic, metal, glass, and others), packaging technology (through-hole mounting, surface surface-mount technology [SMD] and chip-scale packages [CSP]), end use industry (consumer electronics, aerospace & defense, automotive, telecommunication, and others), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Electronic Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Electronic Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Electronic Packaging Market by Material
    • 3.3.1: Plastic
    • 3.3.2: Metal
    • 3.3.3: Glass
    • 3.3.4: Others
  • 3.4: Global Electronic Packaging Market by Packaging Technology
    • 3.4.1: Through-Hole Mounting
    • 3.4.2: Surface Surface-Mount Technology [SMD]
    • 3.4.3: Chip-Scale Packages [CSP]
  • 3.5: Global Electronic Packaging Market by End Use Industry
    • 3.5.1: Consumer Electronics
    • 3.5.2: Aerospace & Defense
    • 3.5.3: Automotive
    • 3.5.4: Telecommunication
    • 3.5.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Electronic Packaging Market by Region
  • 4.2: North American Electronic Packaging Market
    • 4.2.2: North American Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others
  • 4.3: European Electronic Packaging Market
    • 4.3.1: European Electronic Packaging Market by Material: Plastic, Metal, Glass, and Others
    • 4.3.2: European Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others
  • 4.4: APAC Electronic Packaging Market
    • 4.4.1: APAC Electronic Packaging Market by Material: Plastic, Metal, Glass, and Others
    • 4.4.2: APAC Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others
  • 4.5: ROW Electronic Packaging Market
    • 4.5.1: ROW Electronic Packaging Market by Material: Plastic, Metal, Glass, and Others
    • 4.5.2: ROW Electronic Packaging Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Automotive, Telecommunication, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Electronic Packaging Market by Material
    • 6.1.2: Growth Opportunities for the Global Electronic Packaging Market by Packaging Technology
    • 6.1.3: Growth Opportunities for the Global Electronic Packaging Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global Electronic Packaging Market by Region
  • 6.2: Emerging Trends in the Global Electronic Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Electronic Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Electronic Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ametek
  • 7.2: Dordan Manufacturing Company
  • 7.3: DuPont de Nemours
  • 7.4: GY Packaging
  • 7.5: Plastiform
  • 7.6: Kiva Container Corporation
  • 7.7: Quality Foam Packaging
  • 7.8: Sealed Air Corporation
  • 7.9: The Box
  • 7.10: UFP Technologies