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市场调查报告书
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1598759

底部填充材料市场：按材料和应用分类 - 2025-2030 年全球预测

Underfill Materials Market by Material (Capillary Underfill, Molded Underfill, No Flow Underfill), Application (Ball Grid Array, Chip Scale Packaging, Flip Chips) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 189 Pages | 商品交期: 最快1-2个工作天内

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2023年底部填充材料市场价值为9.8476亿美元，预计到2024年将达到10.2418亿美元，复合年增长率为7.02%，到2030年将达到15.8433亿美元。

底部填充材料在微电子领域至关重要，可确保机械支撑、提高可靠性并保护敏感元件免受环境应力和热膨胀不匹配的影响。随着电子元件小型化的趋势，这些材料主要应用于晶片级封装、覆晶应用和先进封装技术等领域。最终用途跨越多个领域，包括消费性电子、汽车、通讯和军事，反映了其多功能性和广泛的影响。对更高性能和更紧凑设备的需求正在推动底部填充材料的采用。该市场的主要成长要素包括家用电子电器需求的增加、5G引入带来的通讯基础设施的进步以及电动车和自动驾驶汽车带来的汽车电子产品产业的快速成长。此外，加大研发投入以创新环保、高效能的底部填充解决方案也正在创造新的机会。公司可以透过专注于生物相容性和生物分解性材料并响应消费者向永续性的转变来利用这些优势。然而，市场也面临挑战，例如先进底部填充材料的高成本以及与其整合和应用流程相关的复杂性，阻碍了广泛采用。产业的快速发展需要持续的技术进步，因此持续创新和跨产业合作可以产生显着的效益。潜在的创新领域包括开发具有改进的导热性和稳定性的材料，以及减少固化时间以提高组装过程的效率。此外，探索能够承受极端温度和机械应力的新组合物可能会开闢新的市场途径。整体而言，为了保持竞争力并在竞争格局中展现领导地位，公司必须透过投资创新研究和采用绿色实践来克服自身限制。

主要市场统计
基准年[2023] 98476万美元
预计年份 [2024] 1,024,180,000 美元
预测年份 [2030] 1,584.33 百万美元
复合年增长率（%） 7.02%

市场动态：快速发展的底部填充材料市场的关键市场洞察

供需的动态交互作用正在改变底部填充材料市场。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时也能帮助消费行为及其对製造业的影响。

  • 市场驱动因素
    • 全球对电子设备小型化的关注日益增加
    • 半导体製造领域的投资与倡议不断增加
    • 电子元件在航太和汽车领域的使用增加
  • 市场限制因素
    • 开发和生产高品质底部填充材料的成本较高
  • 市场机会
    • 开发环保底部填充材料以满足永续性倡议
    • 新产品的推出以及底部填充材料成分和製造程序的创新
  • 市场挑战
    • 与底部填充材料相关的技术限制

波特五力：驾驭底部填充材料市场的策略工具

波特的五力框架是了解底部填充材料市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解底部填充材料市场的外部影响

外部宏观环境因素在塑造底部填充材料市场的绩效动态方面发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并帮助他们做出积极主动的决策。

市场占有率分析 了解底部填充材料市场的竞争状况

对底部填充材料市场的详细市场占有率分析可以对供应商的表现进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵底部填充材料市场供应商绩效评估

FPNV定位矩阵是评估底部填充材料市场供应商的重要工具。此矩阵允许业务组织根据商务策略和产品满意度评估供应商，从而做出与其目标相符的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析和建议描绘了底部填充材料市场的成功之路

底部填充材料市场的策略分析对于旨在加强其在全球市场的影响力的公司至关重要。透过考虑关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：详细检视当前市场环境、主要企业的广泛资料、评估其在市场中的影响力和整体影响力。

2. 市场开拓：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监管核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 电子设备的小型化正在引起全世界越来越多的关注。
      • 加大半导体製造投入与力度
      • 航太和汽车领域电子元件的增加
    • 抑制因素
      • 开发和生产高品质底部填充材料的成本很高。
    • 机会
      • 开发环保底部填充材料以满足永续性倡议
      • 新产品的推出以及底部填充材料成分和製造程序的创新
    • 任务
      • 与底部填充材料相关的技术限制
  • 市场区隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章底部填充材料市场：依材料分类

  • 毛细管底部填充
  • 模压底部填充
  • 无流动底部填充

第七章底部填充材料市场：依应用分类

  • 球栅阵列
  • 晶片级封装
  • 覆晶

第八章北美和南美底部填充材料市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第九章亚太地区底部填充材料市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第10章欧洲、中东和非洲底部填充材料市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十一章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
  • 战略分析和建议

公司名单

  • AI Technology, Inc.
  • AIM Metals & Alloys LP
  • Bondline Electronic Adhesives, Inc.
  • CAPLINQ Corporation
  • Chemtronics International Ltd
  • Dycotec Materials Ltd
  • Epoxy Technology Inc
  • Essemtec AG
  • HB Fuller Company
  • Henkel AG & Co. KGaA
  • Hitachi Chemical Company
  • Indium Corporation
  • MacDermid Alpha Electronics Solutions
  • Master Bond, Inc.
  • NAGASE（EUROPA）GmbH
  • Namics Corporation
  • Nordson Corporation
  • Panasonic Corporation
  • Parker Hannifin Corporation
  • Shenzhen Cooteck Electronic Material Technology Co., Ltd
  • SOMAR Corporation
  • Sumitomo Bakelite Co., Ltd.
  • Won Chemical Co.,Ltd.
  • YINCAE Advanced Materials, LLC
  • Zymet, Inc.
Product Code: MRR-C002B1C9975E

The Underfill Materials Market was valued at USD 984.76 million in 2023, expected to reach USD 1,024.18 million in 2024, and is projected to grow at a CAGR of 7.02%, to USD 1,584.33 million by 2030.

Underfill materials are crucial in microelectronics for ensuring mechanical support, enhancing reliability, and protecting delicate components from environmental stress and thermal expansion mismatches. Necessitated by the growing trend towards miniaturization in electronic devices, these materials are primarily applied in areas such as chip-scale packaging, flip-chip applications, and advanced packaging technologies. The end-use scope spans across various sectors including consumer electronics, automotive, telecommunications, and military sectors, reflecting their versatility and wide-reaching impact. The demand for higher performance, more compact devices drives the adoption of underfill materials. Key growth factors in this market include the rising consumer electronics demand, advancements in telecommunication infrastructure with 5G implementation, and the burgeoning automotive electronics sector driven by electric and autonomous vehicles. Additionally, the increasing investments in research and development to innovate environmentally friendly and high-performance underfill solutions present fresh opportunities. Companies can capitalize on these by focusing on biocompatible and biodegradable materials, meeting the consumer shift towards sustainability. However, the market does face challenges, including the high cost of advanced underfill materials and the complexities associated with their integration and application processes, which can hinder widespread adoption. The industry's rapid evolution requires consistent technological advancements; hence, continuous innovation and cross-industry collaborations can present significant benefits. Potential areas for innovation include developing materials with enhanced thermal conductivity and stability, alongside reduced curing times to improve efficiency in the assembly processes. Additionally, exploring new compositions that can withstand extreme temperatures and mechanical stresses could open new market avenues. Overall, while the market for underfill materials is vibrant and poised for growth, businesses must navigate its limitations by investing in innovative research and embracing environmentally friendly practices to sustain competitiveness and leadership in this evolving landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 984.76 million
Estimated Year [2024] USD 1,024.18 million
Forecast Year [2030] USD 1,584.33 million
CAGR (%) 7.02%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Underfill Materials Market

The Underfill Materials Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Growing focus on miniaturization of electronic devices worldwide
    • Rising investments and initiatives for semiconductor manufacturing
    • Increasing deployment of electronic components across aerospace and automotive sectors
  • Market Restraints
    • High cost of development and production of high-quality underfill materials
  • Market Opportunities
    • Development of eco-friendly underfills materials to meet sustainability initiatives
    • Novel product launches and innovations in underfill material composition and manufacturing procedures
  • Market Challenges
    • Technical limitations associated with underfill materials

Porter's Five Forces: A Strategic Tool for Navigating the Underfill Materials Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Underfill Materials Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Underfill Materials Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Underfill Materials Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Underfill Materials Market

A detailed market share analysis in the Underfill Materials Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Underfill Materials Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Underfill Materials Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Underfill Materials Market

A strategic analysis of the Underfill Materials Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Underfill Materials Market, highlighting leading vendors and their innovative profiles. These include AI Technology, Inc., AIM Metals & Alloys LP, Bondline Electronic Adhesives, Inc., CAPLINQ Corporation, Chemtronics International Ltd, Dycotec Materials Ltd, Epoxy Technology Inc, Essemtec AG, H.B. Fuller Company, Henkel AG & Co. KGaA, Hitachi Chemical Company, Indium Corporation, MacDermid Alpha Electronics Solutions, Master Bond, Inc., NAGASE (EUROPA) GmbH, Namics Corporation, Nordson Corporation, Panasonic Corporation, Parker Hannifin Corporation, Shenzhen Cooteck Electronic Material Technology Co., Ltd, SOMAR Corporation, Sumitomo Bakelite Co., Ltd., Won Chemical Co.,Ltd., YINCAE Advanced Materials, LLC, and Zymet, Inc..

Market Segmentation & Coverage

This research report categorizes the Underfill Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Material, market is studied across Capillary Underfill, Molded Underfill, and No Flow Underfill.
  • Based on Application, market is studied across Ball Grid Array, Chip Scale Packaging, and Flip Chips.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Growing focus on miniaturization of electronic devices worldwide
      • 5.1.1.2. Rising investments and initiatives for semiconductor manufacturing
      • 5.1.1.3. Increasing deployment of electronic components across aerospace and automotive sectors
    • 5.1.2. Restraints
      • 5.1.2.1. High cost of development and production of high-quality underfill materials
    • 5.1.3. Opportunities
      • 5.1.3.1. Development of eco-friendly underfills materials to meet sustainability initiatives
      • 5.1.3.2. Novel product launches and innovations in underfill material composition and manufacturing procedures
    • 5.1.4. Challenges
      • 5.1.4.1. Technical limitations associated with underfill materials
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Underfill Materials Market, by Material

  • 6.1. Introduction
  • 6.2. Capillary Underfill
  • 6.3. Molded Underfill
  • 6.4. No Flow Underfill

7. Underfill Materials Market, by Application

  • 7.1. Introduction
  • 7.2. Ball Grid Array
  • 7.3. Chip Scale Packaging
  • 7.4. Flip Chips

8. Americas Underfill Materials Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Underfill Materials Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Underfill Materials Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. AI Technology, Inc.
  • 2. AIM Metals & Alloys LP
  • 3. Bondline Electronic Adhesives, Inc.
  • 4. CAPLINQ Corporation
  • 5. Chemtronics International Ltd
  • 6. Dycotec Materials Ltd
  • 7. Epoxy Technology Inc
  • 8. Essemtec AG
  • 9. H.B. Fuller Company
  • 10. Henkel AG & Co. KGaA
  • 11. Hitachi Chemical Company
  • 12. Indium Corporation
  • 13. MacDermid Alpha Electronics Solutions
  • 14. Master Bond, Inc.
  • 15. NAGASE (EUROPA) GmbH
  • 16. Namics Corporation
  • 17. Nordson Corporation
  • 18. Panasonic Corporation
  • 19. Parker Hannifin Corporation
  • 20. Shenzhen Cooteck Electronic Material Technology Co., Ltd
  • 21. SOMAR Corporation
  • 22. Sumitomo Bakelite Co., Ltd.
  • 23. Won Chemical Co.,Ltd.
  • 24. YINCAE Advanced Materials, LLC
  • 25. Zymet, Inc.

LIST OF FIGURES

  • FIGURE 1. UNDERFILL MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. UNDERFILL MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL UNDERFILL MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. UNDERFILL MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. UNDERFILL MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. UNDERFILL MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL UNDERFILL MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. UNDERFILL MATERIALS MARKET DYNAMICS
  • TABLE 7. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY CAPILLARY UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY MOLDED UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY NO FLOW UNDERFILL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY BALL GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY CHIP SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL UNDERFILL MATERIALS MARKET SIZE, BY FLIP CHIPS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 16. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 17. AMERICAS UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 18. ARGENTINA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 19. ARGENTINA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 20. BRAZIL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 21. BRAZIL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 22. CANADA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 23. CANADA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 24. MEXICO UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 25. MEXICO UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 26. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 27. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. UNITED STATES UNDERFILL MATERIALS MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 29. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 30. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 31. ASIA-PACIFIC UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 32. AUSTRALIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 33. AUSTRALIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 34. CHINA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 35. CHINA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 36. INDIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 37. INDIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. INDONESIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 39. INDONESIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 40. JAPAN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 41. JAPAN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 42. MALAYSIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 43. MALAYSIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. PHILIPPINES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 45. PHILIPPINES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 46. SINGAPORE UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 47. SINGAPORE UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. SOUTH KOREA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 49. SOUTH KOREA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 50. TAIWAN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 51. TAIWAN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 52. THAILAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 53. THAILAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. VIETNAM UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 55. VIETNAM UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 56. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 57. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 58. EUROPE, MIDDLE EAST & AFRICA UNDERFILL MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 59. DENMARK UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 60. DENMARK UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 61. EGYPT UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 62. EGYPT UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. FINLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 64. FINLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 65. FRANCE UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 66. FRANCE UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 67. GERMANY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 68. GERMANY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. ISRAEL UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 70. ISRAEL UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 71. ITALY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 72. ITALY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. NETHERLANDS UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 74. NETHERLANDS UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 75. NIGERIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 76. NIGERIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 77. NORWAY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 78. NORWAY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 79. POLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 80. POLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. QATAR UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 82. QATAR UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 83. RUSSIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 84. RUSSIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. SAUDI ARABIA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 86. SAUDI ARABIA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 87. SOUTH AFRICA UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 88. SOUTH AFRICA UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 89. SPAIN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 90. SPAIN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 91. SWEDEN UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 92. SWEDEN UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 93. SWITZERLAND UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 94. SWITZERLAND UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 95. TURKEY UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 96. TURKEY UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. UNITED ARAB EMIRATES UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 98. UNITED ARAB EMIRATES UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 99. UNITED KINGDOM UNDERFILL MATERIALS MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
  • TABLE 100. UNITED KINGDOM UNDERFILL MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. UNDERFILL MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 102. UNDERFILL MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023