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市场调查报告书
商品编码
1602423

先进IC封装市场：按类型、应用划分 - 2025-2030 年全球预测

Advanced IC Packaging Market by Type (2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit), Application (Aerospace & Defense, Automotive & Transportation, Consumer Electronics) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 184 Pages | 商品交期: 最快1-2个工作天内

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预计2023年先进IC封装市场规模为450.2亿美元，2024年预计将达485.1亿美元，复合年增长率为8.26%，2030年将达785亿美元。

先进IC封装是指用于组装和封装积体电路（IC）以提高其性能、效率和扩充性的技术。消费性电子、汽车、通讯和医疗保健等领域对更高性能、低耗电量和更小尺寸电子产品的持续需求推动了对先进IC封装的需求。先进IC封装的应用包括行动电话、穿戴式装置、人工智慧、物联网设备和汽车电子，其中在不同条件下的高可靠性和稳健性能是关键要求。最终用途范围广泛，涵盖云端运算、边缘设备和半导体製造等垂直领域。该市场受到5G技术兴起、人工智慧使用增加以及智慧设备增加等关键成长要素的推动。此外，消费性电子产品的发展和汽车电子产品市场的扩张提供了新的成长途径。然而，初始成本高、製造流程复杂、供应链瓶颈等挑战是主要限制因素。目前市场在异质整合和系统级封装（SiP）技术等领域提供了潜在的机会。公司可以透过投资研发来利用这些机会，以增强温度控管和电气性能。最佳创新领域包括开发提供卓越电气和热性能、更低功耗和更小占地面积的封装解决方案。半导体製造商和最终用户公司之间的合作也可以促进价值创造。在全球范围内，市场竞争激烈，主要参与者不断创新以获得优势。儘管面临挑战，但对高效、紧凑和强大电子产品不断增长的需求确保了持续增长。对于希望在先进IC封装领域实现业务成长最大化的市场参与者来说，策略重点关注人工智慧和物联网的新兴应用至关重要。

主要市场统计
基准年[2023] 450.2亿美元
预测年份 [2024] 485.1亿美元
预测年份 [2030] 785亿美元
复合年增长率（%） 8.26%

市场动态：揭示快速发展的先进IC封装市场的关键市场洞察

供应和需求的动态相互作用正在改变先进IC封装市场。了解这些不断变化的市场动态可以帮助企业做出明智的投资决策、策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时消费行为及其对製造成本的影响以及对采购趋势的影响。

  • 市场驱动因素
    • 消费性电子产品的需求不断增长和激增
    • 国防部门对小型电子产品的需求不断增长
    • 各经济区域的交通运输业电气化正在取得进展
  • 市场限制因素
    • 先进IC封装製程高成本
  • 市场机会
    • 新型先进IC封装解决方案的演变与开发
    • 加大半导体製造业投资
  • 市场挑战
    • 与先进IC封装相关的可靠性、功率损耗和用电挑战

波特五力：驾驭先进IC封装市场的策略工具

波特的五力架构是了解先进IC封装市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解先进IC封装市场的外部影响

外部宏观环境因素在塑造先进IC封装市场的表现动态方面发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并为他们做出积极主动的决策做好准备。

市场占有率分析 了解先进IC封装市场的竞争状况

对先进IC封装市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV 定位矩阵供应商在先进IC封装市场的绩效评估

FPNV定位矩阵是评估先进IC封装市场供应商的重要工具。此矩阵允许业务组织根据供应商的商务策略和产品满意度评估供应商，从而做出符合其目标的明智决策。这四个象限使您能够清晰、准确地划分供应商，以确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析和建议描绘了先进IC封装市场的成功之路

对于想要加强在全球市场的影响力的公司来说，先进IC封装市场的策略分析至关重要。透过考虑关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：详细检视当前市场环境、主要企业的广泛资料、评估其在市场中的影响力和整体影响力。

2. 市场开拓：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 消费性电子产品的需求和采用增加
      • 国防部门对小型电子产品的需求增加
      • 各国交通系统电气化正在取得进展
    • 抑制因素
      • 先进IC封装製程高成本
    • 机会
      • 新型先进IC封装解决方案的演变与开发
      • 加大半导体製造业投资
    • 任务
      • 与先进IC封装相关的可靠性、电力消耗和用电挑战
  • 市场区隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章先进IC封装市场：依类型

  • 2.5D积体电路
  • 二维积体电路
  • 3D积体电路
  • 扇出硅封装
  • 扇出晶圆级封装
  • 覆晶
  • 晶圆级晶片规模封装

第七章先进IC封装市场：依应用分类

  • 航太和国防
  • 汽车/交通
  • 家电
  • 资讯科技和通讯

第八章美洲先进IC封装市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第九章亚太地区先进IC封装市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十章 欧洲、中东和非洲先进IC封装市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十一章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
  • 战略分析和建议

公司名单

  • Amkor Technology, Inc.
  • ASE Technology Holding Co, Ltd.
  • ASMPT
  • Broadcom, Inc.
  • Cadence Design Systems, Inc.
  • Carsem（M）Sdn Bhd
  • Faraday Technology Corporation
  • FormFactor, Inc.
  • Intel Corporation
  • Jiangsu Changdian Technology Co., Ltd.
  • KYOCERA Corporation
  • Microchip Technology Inc.
  • Micross Components, Inc.
  • NHanced Semiconductors, Inc.
  • NXP Semiconductors NV
  • Optima Technology Associates, Inc.
  • Pac Tech-Packaging Technologies GmbH
  • Powertech Technology Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Tektronix, Inc.
  • Texas Instruments Incorporated
  • United Microelectronics Corporation
Product Code: MRR-8903005C4AE1

The Advanced IC Packaging Market was valued at USD 45.02 billion in 2023, expected to reach USD 48.51 billion in 2024, and is projected to grow at a CAGR of 8.26%, to USD 78.50 billion by 2030.

Advanced IC Packaging refers to the technologies used in the assembly and encapsulation of integrated circuits (ICs) that improve their performance, efficiency, and scalability. The necessity for advanced IC packaging stems from the continual demand for increased performance, reduced power consumption, and miniaturization in electronics across sectors like consumer electronics, automotive, telecommunications, and healthcare. Applications of advanced IC packaging include mobile phones, wearables, AI, IoT devices, and automotive electronics, where the demand for high reliability and robust performance under diverse conditions is critical. The end-use scope is vast, touching verticals such as cloud computing, edge devices, and semiconductor manufacturing. The market is propelled by key growth factors like the rise of 5G technology, increased use of AI, and the growth of smart devices. Furthermore, evolving consumer electronics and expanding automotive electronics markets present new growth avenues. However, challenges such as high initial costs, complex manufacturing processes, and supply chain bottlenecks pose considerable limitations. The market currently offers potential opportunities in areas such as heterogeneous integration and System-in-Package (SiP) technologies. Companies can capitalize on these opportunities by investing in R&D to enhance thermal management and electrical performance. Best areas for innovation include developing packaging solutions that offer superior electrical and thermal performance, lower power consumption, and smaller footprints. Collaborations between semiconductor manufacturers and end-user companies could also drive value creation. Globally, the market is competitive with key players constantly innovating to gain an edge. Despite the challenges, the increasing need for efficient, compact, and powerful electronics ensures ongoing growth. A strategic focus on emerging applications in AI and IoT will be crucial for market players aiming to maximize business growth in the advanced IC packaging domain.

KEY MARKET STATISTICS
Base Year [2023] USD 45.02 billion
Estimated Year [2024] USD 48.51 billion
Forecast Year [2030] USD 78.50 billion
CAGR (%) 8.26%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Advanced IC Packaging Market

The Advanced IC Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increasing demand and adoption of consumer electronic devices
    • Gowing demand for miniaturized electronic products from defense sector
    • Ongoing electrification of transportation sector across economies
  • Market Restraints
    • High cost of advanced IC packaging processes
  • Market Opportunities
    • Evolution and development of new advanced IC packaging solutions
    • Rising investment in semiconductor manufacturing industry
  • Market Challenges
    • Reliablity, power dissipation and power usage challenges associated with advanced IC packaging

Porter's Five Forces: A Strategic Tool for Navigating the Advanced IC Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Advanced IC Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Advanced IC Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Advanced IC Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Advanced IC Packaging Market

A detailed market share analysis in the Advanced IC Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Advanced IC Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Advanced IC Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Advanced IC Packaging Market

A strategic analysis of the Advanced IC Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Advanced IC Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Technology Holding Co, Ltd., ASMPT, Broadcom, Inc., Cadence Design Systems, Inc., Carsem (M) Sdn Bhd, Faraday Technology Corporation, FormFactor, Inc., Intel Corporation, Jiangsu Changdian Technology Co., Ltd., KYOCERA Corporation, Microchip Technology Inc., Micross Components, Inc., NHanced Semiconductors, Inc., NXP Semiconductors N.V., Optima Technology Associates, Inc., Pac Tech - Packaging Technologies GmbH, Powertech Technology Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Tektronix, Inc., Texas Instruments Incorporated, and United Microelectronics Corporation.

Market Segmentation & Coverage

This research report categorizes the Advanced IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across 2.5D Integrated Circuit, 2D Integrated Circuit, 3D Integrated Circuit, Fan Out Silicon In Package, Fan Out Wafer Level Package, Flip Chip, and Wafer Level Chip Scale Package.
  • Based on Application, market is studied across Aerospace & Defense, Automotive & Transportation, Consumer Electronics, and IT & Telecom.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increasing demand and adoption of consumer electronic devices
      • 5.1.1.2. Gowing demand for miniaturized electronic products from defense sector
      • 5.1.1.3. Ongoing electrification of transportation sector across economies
    • 5.1.2. Restraints
      • 5.1.2.1. High cost of advanced IC packaging processes
    • 5.1.3. Opportunities
      • 5.1.3.1. Evolution and development of new advanced IC packaging solutions
      • 5.1.3.2. Rising investment in semiconductor manufacturing industry
    • 5.1.4. Challenges
      • 5.1.4.1. Reliablity, power dissipation and power usage challenges associated with advanced IC packaging
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Advanced IC Packaging Market, by Type

  • 6.1. Introduction
  • 6.2. 2.5D Integrated Circuit
  • 6.3. 2D Integrated Circuit
  • 6.4. 3D Integrated Circuit
  • 6.5. Fan Out Silicon In Package
  • 6.6. Fan Out Wafer Level Package
  • 6.7. Flip Chip
  • 6.8. Wafer Level Chip Scale Package

7. Advanced IC Packaging Market, by Application

  • 7.1. Introduction
  • 7.2. Aerospace & Defense
  • 7.3. Automotive & Transportation
  • 7.4. Consumer Electronics
  • 7.5. IT & Telecom

8. Americas Advanced IC Packaging Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Advanced IC Packaging Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Advanced IC Packaging Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Amkor Technology, Inc.
  • 2. ASE Technology Holding Co, Ltd.
  • 3. ASMPT
  • 4. Broadcom, Inc.
  • 5. Cadence Design Systems, Inc.
  • 6. Carsem (M) Sdn Bhd
  • 7. Faraday Technology Corporation
  • 8. FormFactor, Inc.
  • 9. Intel Corporation
  • 10. Jiangsu Changdian Technology Co., Ltd.
  • 11. KYOCERA Corporation
  • 12. Microchip Technology Inc.
  • 13. Micross Components, Inc.
  • 14. NHanced Semiconductors, Inc.
  • 15. NXP Semiconductors N.V.
  • 16. Optima Technology Associates, Inc.
  • 17. Pac Tech - Packaging Technologies GmbH
  • 18. Powertech Technology Inc.
  • 19. Renesas Electronics Corporation
  • 20. Samsung Electronics Co., Ltd.
  • 21. Taiwan Semiconductor Manufacturing Company, Ltd.
  • 22. Tektronix, Inc.
  • 23. Texas Instruments Incorporated
  • 24. United Microelectronics Corporation

LIST OF FIGURES

  • FIGURE 1. ADVANCED IC PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. ADVANCED IC PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. ADVANCED IC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. ADVANCED IC PACKAGING MARKET DYNAMICS
  • TABLE 7. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 2.5D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 2D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY 3D INTEGRATED CIRCUIT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT SILICON IN PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FAN OUT WAFER LEVEL PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY WAFER LEVEL CHIP SCALE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY AUTOMOTIVE & TRANSPORTATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL ADVANCED IC PACKAGING MARKET SIZE, BY IT & TELECOM, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 23. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. ARGENTINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 25. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 26. BRAZIL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 27. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. CANADA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 29. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. MEXICO ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 31. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 32. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 33. UNITED STATES ADVANCED IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 34. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 35. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 36. ASIA-PACIFIC ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 37. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 38. AUSTRALIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 39. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. CHINA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 41. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 42. INDIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 43. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. INDONESIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 45. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 46. JAPAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 47. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. MALAYSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 49. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. PHILIPPINES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 51. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. SINGAPORE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 53. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. SOUTH KOREA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 55. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. TAIWAN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 57. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 58. THAILAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 59. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. VIETNAM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 61. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. EUROPE, MIDDLE EAST & AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 64. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 65. DENMARK ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 66. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 67. EGYPT ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 68. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. FINLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 70. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. FRANCE ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 72. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 73. GERMANY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 74. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. ISRAEL ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 76. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. ITALY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 78. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 79. NETHERLANDS ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 80. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. NIGERIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 82. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 83. NORWAY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 84. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. POLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 86. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. QATAR ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 88. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 89. RUSSIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 90. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. SAUDI ARABIA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 92. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. SOUTH AFRICA ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 94. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 95. SPAIN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 96. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. SWEDEN ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 98. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. SWITZERLAND ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 100. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 101. TURKEY ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 102. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. UNITED ARAB EMIRATES ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 104. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 105. UNITED KINGDOM ADVANCED IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 106. ADVANCED IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 107. ADVANCED IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023