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下一代记忆体全球市场规模、份额和行业趋势分析报告:2023-2030年按技术、晶圆尺寸、行业和地区分類的展望和预测Global Next Generation Memory Market Size, Share & Industry Trends Analysis Report By Technology, By Wafer Size (300 mm, and 200 mm), By Vertical, By Regional Outlook and Forecast, 2023 - 2030 |
2030年,下一代记忆体市场规模预计将达到218亿美元,预测期内市场年复合成长率率为17.2%。
根据 KBV Cardinal Matrix 发表的分析,三星电子预计到 2030 年将达到 218 亿美元。三星电子有限公司是该市场的领导者。美光科技公司、霍尼韦尔国际公司和英飞凌科技股份公司等公司是该市场的主要创新者。 2023 年 10 月,美光科技推出 16Gb DDR5 内存,以加强产品系列。此新产品采用 4 相时脉、时脉接收器和高 k CMOS 元件技术。此外,与上一代产品相比,新产品的性能提高了 50%,每瓦性能提高了 33%。
市场成长要素
对高效能资料处理的需求不断增长
资料密集型应用的复杂性不断增加,以及需要更有效率的记忆体解决方案来满足不断增长的处理要求,推动了对高效能资料处理需求的快速成长。包括 MRAM、PCM 等在内的下一代储存技术具有独特的优势来满足这些需求,并且它们与各个领域的整合带来了一些显着的发展。需求增加的显着结果之一是下一代记忆体产业技术创新的加速。下一代记忆体解决方案对于记忆体内运算的成功也至关重要,因为它们提供记忆体内运算所需的高速资料存取。总之,对高效能资料处理的需求不断增长正在推动市场转型。
扩大新兴技术的使用
随着技术不断进步以及边缘运算、物联网 (IoT)、5G 和人工智慧 (AI) 等新范式的发展势头,对能够满足性能和可靠性要求的内存解决方案的需求不断增长。 。这种协同效应作用最显着的成果之一是下一代记忆体技术和边缘运算的融合。边缘运算需要在网路外围、靠近资料来源的地方有效率地处理资料。新一代记忆体的快速资料存取和低延迟使其成为边缘设备和网关的理想合作伙伴。随着边缘运算对于自动驾驶汽车、智慧城市和工业自动化等应用变得至关重要,下一代记忆体技术将确保边缘的快速资料处理和即时决策。随着人工智慧不断发展和塑造医疗保健、金融和自主系统等产业,对先进储存技术的需求只会增加。因此,新兴市场的所有这些开拓都将支持市场扩张。
市场抑制因素
製造成本大幅急剧上升
开发和製造 MRAM 和 3D XPoint 等下一代记忆体需要复杂且专业的流程。这些过程通常需要先进的製造设施、设备和熟练的劳动力。建立此类基础设施所需的初始投资可能令人望而却步,导緻小型企业难以在市场上竞争。此外,高製造成本直接影响下一代记忆体产品的定价。当製造成本增加时,製造商通常会将这些成本转嫁给消费者,导致零售价格上涨。在价格敏感的消费性电子领域,下一代记忆体技术的采用可能会因其相对成本而受到阻碍。
技术展望
依技术,市场分为波动性和非波动性。在 2022 年的市场中,非波动性细分市场的收益占有率最高。非挥发性技术具有许多对现代企业至关重要的优势。即使在断电的情况下也能保存资料,这是其最显着的属性之一。非挥发性技术可实现更快的启动时间并提高资料完整性,这对于金融交易和资料储存等资料一致性至关重要的应用程式至关重要。需要非挥发性记忆体来提高能源效率、延长行动装置的电池寿命并降低资料中心的营运成本。
晶圆尺寸展望
依晶圆尺寸,市场分为200nm和300nm。 2022 年,200 奈米细分市场将在市场中占据重要的收益占有率。半导体产业从 200mm 晶圆尺寸的使用中受益匪浅。成本效益是一个主要优势,因为生产较小的晶圆通常更便宜。这对于希望在不牺牲下一代记忆体组件的性能和品质的情况下降低成本和简化製造流程的公司来说很有吸引力。当小产量就足够时,200mm 晶圆对于专业应用和利基市场特别有吸引力。其弹性使公司能够满足特定客户的需求,而无需大型生产设施。
产业展望
依产业划分,可分为 BFSI、消费性电子、政府、通讯、资讯科技、企业储存、汽车/运输等。 2022年,企业储存市场将占据最大的收益占有率。与NAND快闪记忆体等传统储存解决方案相比,MRAM 和 PCM 等新一代储存技术可大幅缩短资料存取时间。这减少了延迟,使企业能够更快地存取和处理资料。减少延迟是即时资料分析、高频交易和资料库应用程式的游戏规则改变者。大多数新一代记忆体都是非挥发性的,这意味着即使电源关闭它也能保留资料。这在企业储存系统中是有利的,因为它可以保证资料完整性并在断电和断电期间保留关键资讯。
区域展望
从区域来看,我们对北美、欧洲、亚太地区和拉丁美洲/中东/非洲的市场进行了分析。 2022 年,亚太地区占据市场最大收益占有率。随着商业环境的变化,该地区正在迅速采用下一代记忆体技术。亚太国家物联网设备的快速成长增加了对节能记忆体解决方案的需求,这些解决方案即使在断电情况下也能保留资料。该地区智慧型设备的普及和精通技术的消费者群直接推动了这一需求。亚太地区以其强大的製造生态系统已成为半导体製造的热点。
下一代记忆体市场部署的最新策略
伙伴关係、联盟和协议:
产品公告和产品扩展:
收购和合併
地理扩张
The Global Next Generation Memory Market size is expected to reach $21.8 billion by 2030, rising at a market growth of 17.2% CAGR during the forecast period.
Integrating next generation memory technologies brings significant benefits to the forefront of the BFSI industry. These solutions' rapidity and effectiveness are essential for enhancing data analytics and real-time transaction processing capabilities. Therefore, the BFSI sector would generate 1/5th share of the market by 2030. Financial institutions are able to make decisions more quickly and accurately, which is crucial in markets where even milliseconds can have a significant impact. Additionally, data integrity is guaranteed by the non-volatile nature of some next generation memory types, which is crucial for upholding regulatory compliance and preserving trust. Enhancing operational efficiency as well as data security in the BFSI sector is mainly dependent on next generation memory due to the growing volume of financial data and the requirement for strong security measures.
The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, In October, 2023, Everspin Technologies, Inc. launched the EMxxLX to enhance the high-density STT-MRAM product family. The EMxxLX is an xSPI serial interface for persistent memory. The new product has the features of a clock frequency of 200 MHz and a bandwidth of 400 megabytes per second using eight I/O signals. Additionally, In July, 2023, Samsung Electronics Co. Ltd. launched the Graphics Double Data Rate 7 (GDDR7) DRAM. The new product helps enhance user experiences and provides exceptional graphics performance on game consoles and workstations. Additionally, the new product has applications in AI and automotive vehicles.
Based on the Analysis presented in the KBV Cardinal matrix; Samsung Electronics Co. Ltd. is the forerunner in the Market. Companies such as Micron Technology, Inc., Honeywell International, Inc., Infineon Technologies AG are some of the key innovators in the Market. In October, 2023, Micron Technology, Inc. launched the 16Gb DDR5 memory to enhance its 1B (1-beta) process node technology product portfolio. The new product has the features of 4-phase clocking, clock-sync and high-k CMOS device technology. Additionally, the new product helps to increase performance by 50% and provides an improvement in performance per watt of 33% over the previous generation.
Market Growth Factors
Rising demand for high-performance data processing
The surge in demand for high-performance data processing is driven by the growing complexity of data-intensive applications and the need for more efficient memory solutions that can keep pace with the escalating processing requirements. Next Generation Memory technologies, including MRAM, PCM, and others, are uniquely positioned to meet these demands, and their integration into various sectors has ushered in several notable developments. One prominent consequence of this heightened demand is the acceleration of innovation within the Next Generation Memory industry. Next Generation Memory solutions are also crucial for the success of in-memory computing, as they provide the high-speed data access required for this approach. In conclusion, the growing demand for high-performance data processing has been a catalyst for transformative change within the market.
Increasing use of emerging technologies
As technology continues to advance and new paradigms such as edge computing, the Internet of Things (IoT), 5G, and artificial intelligence (AI) gain momentum, the demand for memory solutions that can meet the performance and reliability requirements grows. One of the most noteworthy outcomes of this synergy is the convergence of Next Generation Memory technologies with edge computing. Edge computing requires efficient data handling at the network's periphery, close to data sources. Next-generation memory's high-speed data access and low latency make it an ideal companion for edge devices and gateways. As edge computing becomes integral to applications like autonomous vehicles, smart cities, and industrial automation, Next Generation Memory technologies ensure rapid data processing and real-time decision-making at the edge. As AI continues to evolve and shape industries such as healthcare, finance, and autonomous systems, the demand for advanced memory technologies will intensify. Therefore, all of these developments will aid in the expansion of the market.
Market Restraining Factors
Significantly high manufacturing costs
The development and production of next-generation memory, such as MRAM and 3D XPoint, involves intricate and specialized processes. These processes often require sophisticated manufacturing facilities, equipment, and a skilled workforce. The initial investment needed to establish such infrastructure can be prohibitively high, making it challenging for smaller players to compete in the market. Moreover, high manufacturing costs directly impact the pricing of Next Generation Memory products. When production expenses are substantial, manufacturers often transfer these costs to consumers, resulting in higher retail prices. In the consumer electronics sector, where price sensitivity is prevalent, the adoption of these technologies may be hampered by their relatively high cost.
Technology Outlook
Based on technology, the market is bifurcated into volatile and non-volatile. The non-volatile segment garnered the highest revenue share in the market in 2022. Non-volatile technology offers a number of benefits that are essential for contemporary enterprises. Their capacity to store data even in the absence of power is one of their most notable qualities. Faster boot times and better data integrity are made possible by non-volatile technology, which is essential for applications like financial transactions and crucial data storage where data consistency is vital. Non-volatile memory is necessary for improving energy efficiency, extending mobile device battery life, and lowering data center operating expenses.
Wafer Size Outlook
On the basis of wafer size, the market is divided into 200 nm and 300 nm. The 200 nm segment recorded a substantial revenue share in the market in 2022. The semiconductor industry benefits significantly from the use of 200 mm wafer size. Cost-effectiveness is a major advantage since producing smaller wafers is typically less expensive. This is appealing to companies looking to cut costs and streamline their manufacturing processes without sacrificing the performance and quality of next generation memory components. When smaller production volumes are adequate, 200 mm wafers are especially appealing for specialized applications and niche markets. Their flexibility enables businesses to meet specific customer needs without requiring large-scale production facilities.
Vertical Outlook
By vertical, the market is segmented into BFSI, consumer electronics, government, telecommunications, information technology, enterprise storage, automotive & transportation, and others. The enterprise storage region witnessed the largest revenue share in the market in 2022. Next Generation memory technologies, such as MRAM and PCM, provide significantly faster data access times compared to traditional storage solutions like NAND flash. This translates to reduced latency, allowing enterprises to access and process data more quickly. In real-time data analysis, high-frequency trading, and database applications, reduced latency is a game-changer. Many next generation memory types are non-volatile, meaning they retain data even when power is removed. This is advantageous in enterprise storage systems, as it guarantees data integrity and preserves critical information in the event of power failures or outages.
Regional Outlook
Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific region acquired the maximum revenue share in the market in 2022. Next Generation memory technology is rapidly being adopted in this region due to a number of factors that are in line with the changing business environment in the region. The demand for energy-efficient memory solutions to preserve data in power-off scenarios has increased due to the rapid development of IoT devices throughout Asia Pacific countries. The proliferation of smart devices and the tech-savvy consumer base in the region are the direct causes of this demand. Asia Pacific is a hotspot for the production of semiconductors due to its robust manufacturing ecosystem.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co. Ltd., Micron Technology, Inc., Fujitsu Limited, Toshiba Corporation, Honeywell International, Inc., Microchip Technology, Inc., Everspin Technologies, Inc., Infineon Technologies AG, Kingston Technology Company, Inc., and Intel Corporation.
Recent Strategy Deployed in the Next-generation Memory Market
Partnerships, Collaborations, and Agreements:
Oct-2023: Micron Technology, Inc. joined hands with Qualcomm Technologies, Inc., a company engaged in developing wireless telecommunication products. Under this collaboration, Micron Technology utilized the Snapdragon 8 Gen 3 mobile platform of Qualcomm Technologies to introduce the 5X (LPDDR5X) memory, which has low power but a double data rate. The new product works at a speed grade of 9.6 gigabits per second (Gbps) and offers the fast performance required for operating generative artificial intelligence (AI).
Oct-2023: Fujitsu Limited collaborated with TOPPAN Holdings Inc., a Japanese global printing company. Under this collaboration, the analytical technology of TOPPAN Holdings was amalgamated with the data cleansing technology of Fujitsu within the boundaries of a medical record database. Additionally, this collaboration assisted the companies in conducting analysis of medical big data and provided services for enhancing research and development in healthcare.
Sep-2023: Silicon Storage Technology, Inc., a subsidiary of Microchip Technology, Inc., formed a partnership with GlobalFoundries U.S. Inc., a multinational semiconductor contract manufacturing company. Under this partnership, the SST ESF3 third-generation embedded SuperFlash technology NVM solution was introduced.
Nov-2022: Infineon Technologies AG came into a partnership with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing company. Under this partnership, the Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology of TSMC was incorporated into the AURIX microcontrollers (MCU) of Infineon Technologies.
May-2022: Samsung Electronics Co. Ltd. teamed up with Red Hat, Inc., an American software company. Under this collaboration, open-source software technologies were developed for storage and memory products. Additionally, the collaboration built an ecosystem for establishing a combination of software and hardware.
Product Launches and Product Expansions:
Oct-2023: Micron Technology, Inc. launched the 16Gb DDR5 memory to enhance its 1B (1-beta) process node technology product portfolio. The new product has the features of 4-phase clocking, clock-sync and high-k CMOS device technology. Additionally, the new product helps to increase performance by 50% and provides an improvement in performance per watt of 33% over the previous generation.
Oct-2023: Everspin Technologies, Inc. launched the EMxxLX to enhance the high-density STT-MRAM product family. The EMxxLX is an xSPI serial interface for persistent memory. The new product has the features of a clock frequency of 200 MHz and a bandwidth of 400 megabytes per second using eight I/O signals.
Sep-2023: Toshiba Electronic Devices & Storage Corporation, a subsidiary of Toshiba Corporation, launched the MG10F Series 22TB HDD, a traditional magnetic recording (CMR) HDD device. The MG10F 22TB offers 10% more capability than the previous generation 20TB model of Toshiba. Additionally, the new product has a variety of applications in both traditional datacentre and cloud-scale use cases.
Jul-2023: Samsung Electronics Co. Ltd. launched the Graphics Double Data Rate 7 (GDDR7) DRAM. The new product helps enhance user experiences and provides exceptional graphics performance on game consoles and workstations. Additionally, the new product has applications in AI and automotive vehicles.
Apr-2023: Infineon Technologies AG introduced the SEMPER X1 LPDDR Flash, a LPDDR Flash memory assisting next-generation automotive E/E architectures. The SEMPER X1 LPDDR Flash offers safe and reliable real-time code execution. Additionally, the new product offers 8 times better performance than the current NOR Flash memory and 20 times quicker transactions for real-time applications.
Feb-2023: Fujitsu Limited unveiled the Fujitsu Web3 Acceleration Platform, a platform offering a variety of service APIs based on high-performance computing and blockchain technologies. The new product provides an opportunity for individuals in start-ups and universities to develop several Web3 applications and services. Additionally, the new product connects users to the Computing as a Service Data e-TRUST modules and the Computing as a Service applications of Fujitsu.
Dec-2022: Samsung Electronics Co., Ltd. introduced the 16-gigabit (Gb) DDR5 DRAM, a technology built using the 12-nanometer (nm)-class process technology. The new product assists in developing the market-wide operations of DDR5 DRAM.
Aug-2022: Microchip Technology Inc. unveiled the SMC 2000 series of Compute Express Link (CXL)-based Smart Memory Controllers to enhance its serial-attached memory controller product portfolio. The new product helps the CPUs, SoCs and GPUs use CXL interfaces for DDR5 and DDR4 memory. Additionally, the new product offers more bandwidth and memory per core and reduces the Total Cost of Ownership (TCO) in the data centre through optimization of application workloads.
Acquisition and Mergers:
Mar-2021: Honeywell International, Inc. completed the acquisition of Fiplex Communications, Inc., a worldwide manufacturer of telecommunication products. Through this acquisition, Honeywell enhanced its communications and building connectivity products.
Dec-2020: Honeywell International, Inc. completed the acquisition of Sparta Systems, a company providing enterprise quality management software (QMS). Through this acquisition, Honeywell solidified its position in the industrial automation and enterprise performance management software markets.
Oct-2020: Microchip Technology Inc. completed the acquisition of Tekron International Limited, a company producing high-precision atomic and GPS clocks. Through this acquisition, Microchip enhanced its product offering and established its position in the smart energy and industrial markets.
Geographical Expansions:
May-2023: Micron Technology, Inc. expanded its geographical footprints in Japan through the introduction of ultraviolet (EUV) technology. Through this geographical expansion, sophisticated patterning technology was used in order to develop the 1-gamma (1γ) node, the next generation of DRAM.
Market Segments covered in the Report:
By Technology
By Wafer Size
By Vertical
By Geography
Companies Profiled
Unique Offerings from KBV Research