记忆体 IC 市场规模、份额、成长分析（按类型、最终用户产业和地区）- 产业预测（2025 年至 2032 年）

Memory IC Market Size, Share, and Growth Analysis, By Type (DRAM, Flash), By End-user Industry (Consumer Electronics, Automotive), By Region - Industry Forecast 2025-2032

出版日期: 2025年07月10日 | 出版商:

SkyQuest | 英文 179 Pages | 商品交期: 3-5个工作天内

价格

简介目录

全球记忆体IC市场预计在2023年达到31亿美元，从2024年的33.4亿美元成长到2032年的60.4亿美元，预测期间（2025-2032年）的复合年增长率为7.7%。

全球记忆体IC市场日益受到各垂直领域对高效能运算日益增长的需求的影响。随着资料中心和边缘运算领域先进应用的涌现，对快速资料处理的需求变得至关重要，这促使製造商采用尖端架构在记忆体解决方案方面进行创新。这种对效率的追求也渗透到行动装置和网路基础设施中，从而带来了对低延迟和高频宽的需求。诸如3D堆迭和MRAM等能够提升效能并降低能耗的新型记忆体也不断涌现。此外，设计工具的进步和行业内的协同努力正在推动记忆体密度的提高和功耗的降低，从而在未来记忆体技术中平衡速度、容量和能源效率，同时解决永续性问题。

北美洲
- 美国
- 加拿大
欧洲
- 德国
- 西班牙
- 法国
- 英国
- 义大利
- 其他欧洲国家地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 其他亚太地区
拉丁美洲
- 巴西
- 其他拉丁美洲
中东和非洲
- 海湾合作委员会国家
- 南非
- 其他中东和非洲地区

竞争资讯

前五大公司对比
主要企业市场定位（2024年）
主要市场参与者所采取的策略
近期市场趋势
公司市场占有率分析（2024年）
主要企业简介
- 公司详情
- 产品系列分析
- 公司分部份额分析
- 收益同比对比（2022-2024 年）

主要企业简介

Samsung Electronics（South Korea）
SK Hynix（South Korea）
Micron Technology（United States）
Western Digital（United States）
Intel Corporation（United States）
Texas Instruments（United States）
Kingston Technology（United States）
Broadcom Inc.（United States）
Infineon Technologies（Germany）
STMicroelectronics（Switzerland）
Microchip Technology（United States）
Renesas Electronics（Japan）
Nanya Technology（Taiwan）
Winbond Electronics（Taiwan）

结论和建议

简介目录

Product Code: SQMIG45I2296

Global Memory IC Market size was valued at USD 3.1 billion in 2023 and is poised to grow from USD 3.34 billion in 2024 to USD 6.04 billion by 2032, growing at a CAGR of 7.7% during the forecast period (2025-2032).

The global memory IC market is increasingly influenced by the growing demand for high-performance computing across various sectors. As advanced applications in data centers and edge computing arise, the necessity for rapid data processing becomes paramount, prompting manufacturers to innovate memory solutions with cutting-edge architectures. This drive for efficiency permeates mobile devices and network infrastructure, leading to lower latency and higher bandwidth requirements. The market also sees a rise in novel memory types, such as 3D stacking and MRAM, which improve performance and energy use. Additionally, advancements in design tools and collaborative efforts within the industry aim to enhance memory integration and reduce power consumption, all while addressing sustainability concerns and balancing speed, capacity, and energy efficiency in future memory technologies.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Memory IC market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Memory IC Market Segments Analysis

Global Memory IC Market is segmented by Type, End-user Industry and region. Based on Type, the market is segmented into DRAM, Flash and Other Types. Based on End-user Industry, the market is segmented into Consumer Electronics, Automotive, IT & Telecommunication, Healthcare and Other End-user Industries. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Memory IC Market

The surge in data-intensive applications, especially in areas like artificial intelligence, machine learning, cloud computing, and the Internet of Things, has significantly heightened the need for high-performance memory integrated circuits (ICs). These applications demand rapid and high-capacity memory solutions to enable real-time data processing and storage capabilities. As a result, device manufacturers and infrastructure providers are increasingly investing in advanced memory technologies, including High Bandwidth Memory (HBM) and DDR5, alongside ongoing innovations in memory ICs. This investment trend is driving continuous growth in the global memory IC market across its entire value chain, reflecting a robust demand for enhanced memory solutions.

Restraints in the Global Memory IC Market

The Global Memory IC market faces notable constraints due to the substantial initial investment and technical know-how required for developing and producing advanced memory integrated circuits. The manufacturing facilities necessitate the use of highly specialized equipment, and the production process demands exceptional precision. Consequently, these factors establish high barriers to entry that restrict market participation primarily to a handful of dominant companies, thereby limiting overall competitiveness. This oligopolistic environment hampers the ability of smaller firms to innovate and share advancements, ultimately stifling the proliferation of new technologies and solutions within the industry.

Market Trends of the Global Memory IC Market

The Global Memory IC market is witnessing a transformative trend driven by the burgeoning demand for AI and machine learning applications. As industries increasingly adopt AI technologies, memory architectures are evolving to meet the requisite high-bandwidth and low-latency needs. Advanced options such as High Bandwidth Memory (HBM), GDDR6X, and Processing-In-Memory (PIM) are gaining momentum, particularly in AI accelerators and data centers. Memory IC manufacturers are collaborating with processor designers to create co-packaged modules that reduce energy consumption and enhance real-time inferencing capabilities by minimizing data transfer bottlenecks. This evolution reflects a shift towards more efficient and specialized memory solutions tailored for AI-driven workloads.

Introduction

Objectives of the Study
Scope of the Report
Definitions

Research Methodology

Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Overview
Market Size
Market Dynamics
- Drivers & Opportunities
- Restraints & Challenges
Porters Analysis
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers

Key Market Insights

Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2024
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Technology Analysis
Case Studies
Customer Buying Behavior Analysis

Global Memory IC Market Size by Type & CAGR (2025-2032)

Market Overview
DRAM
Flash
- NOR
- NAND
Other Types

Global Memory IC Market Size by End-user Industry & CAGR (2025-2032)

Market Overview
Consumer Electronics
Automotive
IT & Telecommunication
Healthcare
Other End-user Industries

Global Memory IC Market Size & CAGR (2025-2032)

North America (Type, End-user Industry)
- US
- Canada
Europe (Type, End-user Industry)
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific (Type, End-user Industry)
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America (Type, End-user Industry)
- Brazil
- Rest of Latin America
Middle East & Africa (Type, End-user Industry)
- GCC Countries
- South Africa
- Rest of Middle East & Africa

Competitive Intelligence

Top 5 Player Comparison
Market Positioning of Key Players, 2024
Strategies Adopted by Key Market Players
Recent Developments in the Market
Company Market Share Analysis, 2024
Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

Samsung Electronics (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SK Hynix (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Micron Technology (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Western Digital (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Intel Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Texas Instruments (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Kingston Technology (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Broadcom Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Infineon Technologies (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STMicroelectronics (Switzerland)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Microchip Technology (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Renesas Electronics (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nanya Technology (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Winbond Electronics (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments