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市场调查报告书
商品编码
1615838
下一代记忆体市场:各类型,各用途,各技术,各地区,2024年~2031年Next-Generation Memory Market By Type (Mass Storage, Embedded Storage), Application (Consumer Electronics, Enterprise Storage, Manufacturing), Technology (Volatile, Hybrid Memory Cube (HMC), DRAM), & Region for 2024-2031 |
人工智慧 (AI)、机器学习 (ML) 和物联网 (IoT) 等许多领域的资料驱动应用迅速崛起,正在推动下一代记忆体市场的需求成长。随着企业渴望利用大数据来实现更好的决策、营运效率和客户体验,大容量、高速记忆体解决方案变得越来越重要,预计到2031 年将超过销售额并达到约304.1 亿美元的估值。
云端运算和行动装置的激增正在推动对下一代记忆体解决方案的需求。随着越来越多的企业迁移到云端平台,对能够处理巨大工作负载并提供快速资料检索的弹性记忆体架构的需求将变得非常重要,从2024年到2031年,复合年增长率将达到27.03 %。
下一代记忆体市场定义/概述
下一代记忆体 (NGM) 是指改进的记忆体技术,可解决 DRAM 和 NAND 快闪记忆体等传统记忆体系统的限制。这些新型记忆体旨在提高速度、效率和可扩展性,以满足当今人工智慧 (AI)、机器学习、大数据分析和物联网 (IoT) 等应用程式不断增长的需求。
该技术正逐渐整合到各种应用中,以提高各行业的性能和效率。高效能运算 (HPC) 是一项重要的应用,它需要更快的资料处理速度。超级电脑和资料中心利用 3D NAND 和扩展 DRAM 等技术来实现即时分析和高速资料存取。
下一代记忆体(NGM)技术的未来应用预计将改变各行业的资料储存和处理能力。人工智慧 (AI) 和机器学习是一项值得注意的应用,NGM 可加速资料存取和处理。
对高效能资料处理的需求不断增长是下一代记忆体市场的主要驱动力。这一趋势的推动因素包括数据输出的指数级增长、数据密集型应用的激增以及人工智慧 (AI)、机器学习 (ML) 和物联网 (IoT) 等新兴技术的日益接受度。根据国际数据公司 (IDC) 的数据,全球数据圈预计将从 2018 年的 33 泽字节成长到 2025 年的 175 泽字节,复合年增长率为 61%。
此外,根据美国能源部的数据,资料中心目前使用的电力约占美国总电力的 2%,预计到 2030 年这一数字将上升至 8%。这凸显了对更节能的记忆体解决方案的需求,以满足不断增长的资料处理需求。 2020年至2022年,美国国家科学基金会(NSF)为人工智慧研发活动提供了超过5亿美元的资助。此外,美国政府于2019年宣布的美国人工智慧计画旨在刺激人工智慧创新,推动对高效能记忆体解决方案的需求。
製造成本飙升可能会严重阻碍下一代记忆体市场的成长。随着製造商采用先进技术和新颖工艺来提供高效能记忆体解决方案,研发、设备和设施所需的初始资本可能会很大。尤其是 3D NAND 和即将推出的非挥发性记忆体等尖端技术,製造的复杂性和精度推高了生产价格。这些不断上升的製造成本可能会提高消费者和企业的价格,抑制采用并限制市场扩张。
原物料价格波动和供应链中断将推高下一代记忆体领域的製造成本。
半导体产业极易受到硅、稀土元素和特种化学品等基本资源的可用性和成本波动的影响。此外,地缘政治衝突和全球供应链问题(例如复杂的 COVID-19 局势)可能会导致製造延误并增加成本。如果无法解决这些生产问题,可能会阻碍研发投资,并最终限制记忆体技术的改进。
The fast rise of data-driven applications in many sectors such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT) is driving the expanding demand for the next-generation memory market. As enterprises aspire to use big data for better decision-making, operational efficiency, and customer experiences, high-capacity, high-speed memory solutions have become increasingly important by enabling the market to surpass a revenue of USD 4.49 Billion in 2024 and reach a valuation of aroundUSD 30.41 Billion by 2031.
Cloud computing and the proliferation of mobile devices are driving up demand for next-generation memory solutions. As more businesses migrate to cloud platforms, the demand for resilient memory architectures that can handle huge workloads and deliver fast data retrieval becomes critical by enabling the market to grow at aCAGR of 27.03% from 2024 to 2031.
Next-Generation Memory Market: Definition/ Overview
Next Generation Memory (NGM) refers to improved memory technologies that address the constraints of traditional memory systems such as DRAM and NAND flash. These novel memory types are intended to improve speed, efficiency, and scalability meeting the expanding demands of current applications such as artificial intelligence (AI), machine learning, big data analytics, and the Internet of Things (IoT).
The technologies are progressively being integrated into a wide range of applications improving performance and efficiency across industries. One significant use is high-performance computing (HPC) where the need for faster data processing is critical. Supercomputers and data centers leverage technologies like 3D NAND and enhanced DRAM to provide real-time analytics and fast data access.
The future application of next generation memory (NGM) technologies is expected to alter data storage and processing capacities across a variety of industries. One notable application is in artificial intelligence (AI) and machine learning where NGM will speed up data access and processing.
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The increasing demand for high-performance data processing is a major driver of the next-generation memory market. This trend is being driven by the exponential increase in data output, the proliferation of data-intensive applications, and the growing acceptance of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). According to the International Data Corporation (IDC), the global datasphere is expected to increase from 33 zettabytes in 2018 to 175 zettabytes by 2025 indicating a 61% compound annual growth rate (CAGR).
Furthermore, the US Department of Energy says that data centers currently utilize around 2% of all electricity in the United States with this figure anticipated to rise to 8% by 2030. This emphasizes the need for more energy-efficient memory solutions to meet the increasing need for data processing. Between 2020 and 2022, the National Science Foundation (NSF) funded more than $500 million in AI research and development activities. Furthermore, the US government's American AI Initiative which was announced in 2019 aims to stimulate AI innovation, increasing demand for high-performance memory solutions.
High production costs may severely impede the growth of the next-generation memory market. As manufacturers engage in sophisticated technologies and novel processes to provide high-performance memory solutions, the initial capital required for research and development, equipment, and facilities can be significant. This is especially true for cutting-edge technologies like 3D NAND and upcoming non-volatile memory types where fabrication complexity and precision requirements drive up production prices. These high manufacturing costs can raise prices for consumers and businesses, discouraging widespread adoption and limiting market expansion.
Fluctuating raw material prices and supply chain interruptions drive increased manufacturing costs in the next-generation memory sector.
The semiconductor industry is extremely vulnerable to changes in the availability and cost of essential resources including silicon, rare earth elements, and specialty chemicals. Furthermore, geopolitical conflicts and global supply chain concerns as shown by incidents such as the COVID-19 epidemic can cause delays and increased costs complicating the landscape. If these production issues are not addressed, they may impede investment in R&D, ultimately limiting memory technology improvements.
The non-volatile memory sector is expected to dominate the memory market due to the exponential development of data generation across numerous industries. With the introduction of big data analytics, Internet of Things (IoT) devices, and cloud computing, enterprises are dealing with an unprecedented volume of data necessitating high-performance and cost-effective memory solutions. Non-volatile memory technologies such as NAND flash and developing alternatives like 3D XPoint are increasingly valued for their ability to maintain data even when power is lost.
The growing popularity of wearables, high-performance computing (HPC), and other consumer gadgets increases the demand for sophisticated non-volatile memory solutions. Wearables, for example, require compact, energy-efficient storage capable of processing health data and user interactions. Similarly, HPC applications demand memory that can handle sophisticated computations and enormous datasets which makes non-volatile systems more appealing.
Next-generation memory technologies play a critical role in improving enterprise storage systems such as data centers, servers, and cloud storage. These advanced memory technologies such as 3D NAND and non-volatile memory express are intended to provide extraordinary speed and efficiency allowing for quick data access and low latency storage. In today's data-driven world, organizations are bombarded with massive amounts of information that must be effectively managed and retrieved.
The deployment of sophisticated memory technologies improves reliability and scalability in enterprise storage infrastructures. These technologies are designed to resist the rigors of continuous operation providing the durability and performance consistency that businesses seek. Organizations may easily extend their storage capabilities without compromising performance allowing them to react to evolving business needs and effectively manage expanding data workloads.
The Asia Pacific region dominates the next generation memory market due to its significant presence in semiconductor manufacturing and quick adoption of sophisticated technologies. This dominance is fueled by the region's tremendous expansion in mobile technology and the Internet of Things (IoT) which has created an enormous need for high-performance, energy-efficient memory solutions. Asia Pacific's mobile technology sector is growing at an unparalleled rate. The International Data Corporation (IDC) predicts that smartphone shipments in Asia Pacific will reach 878 million units by 2025, reflecting a 2.9% compound annual growth rate (CAGR) between 2020 and 2025.
According to the Global Mobile Suppliers Association (GSA), by 2023, there will be 233 commercial 5G networks in 87 countries with Asia Pacific leading in installations. As of 2022, China alone had installed approximately 1.43 million 5G base stations covering all prefecture-level cities, according to the Ministry of Industry and Information Technology. This vast 5G infrastructure is fueling the growth of edge computing and AI applications that require high-performance memory. The Korea Information Society Development Institute projects that South Korea's 5G industry will reach USD 73 Billion by 2026, reflecting a 43% CAGR from 2020 to 2026.
The Asia Pacific region is experiencing the greatest growth in the next generation memory market owing to rapid technical developments and increased data center investments. Countries such as China, Japan, and South Korea have had exceptionally rapid growth. The Asia Pacific region's next generation memory market is being driven by a growing emphasis on data security and regulatory compliance. According to International Association of Privacy Professionals (IAPP) research, 65% of Asia Pacific countries have comprehensive data protection laws in place as of 2023.
According to the Asian Development Bank, the Asia Pacific IoT market is expected to develop at a CAGR of 28.6% between 2021 and 2026, reaching USD 436.77 Billion. This rapid increase in IoT combined with severe data protection rules is driving demand for next-generation memory technologies that provide stronger security features, quicker data processing capabilities, and more energy efficiency.
The Next-Generation Memory Market is a dynamic and competitive space characterized by diverse players vying for market share. These players are on the run for solidifying their presence through the adoption of strategic plans such as collaborations, mergers, acquisitions, and political support. The organizations are focusing on innovating their product line to serve the vast population in diverse regions.
Some of the prominent players operating in the next-generation memory market include:
Samsung
Micron Technology, Inc.
Fujitsu
SK HYNIX INC
Honeywell International, Inc.
Microchip Technology, Inc
Everspin Technologies, Inc
Infineon Technologies AG
Kingston Technology Europe Co LLP
KIOXIA Singapore Pte. Ltd
In April 2024, Samsung unveiled the Evo Select and Evo Plus microSD memory cards in the United States, touting higher read speeds of up to 160 MB/s, 30 MB/s faster than the previous 2023 models. These improved memory card lines are meant to considerably improve data transfer speeds, meeting consumers' growing demand for quicker and more dependable storage options across multiple devices.
In May 2024, Micron Technology, Inc. stated that it will begin shipping a new high-performance memory for data centers. Their 128GB DDR5 RDIMM has quicker speeds and greater capacity than prior models, with a maximum transfer rate of 5,600 MT/s. This improvement will address the needs of modern data centers, which require efficient and powerful computing.