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半导体代工全球市场规模、份额、产业趋势分析报告:按节点规模、应用、地区分類的展望与预测,2023-2030年Global Semiconductor Foundry Market Size, Share & Industry Trends Analysis Report By Node Size (7/5nm, 130nm, 5nm, 65nm, 45/40nm, 32/28nm, 180nm, 10/7nm, 16/14nm and Others), By Application, By Regional Outlook and Forecast, 2023 - 2030 |
预计到 2030 年,半导体代工市场规模将达到 1,838 亿美元,预测期内CAGR为 7.4%。
然而,正如 COVID-19大流行所表明的那样,半导体产业依赖全球供应链,因此容易受到供应中断的影响。供应链问题可能会导致交货时间延长和零件短缺。自然灾害、地缘政治紧张局势和公共卫生危机扰乱了全球供应链,并导致半导体製造短缺和延误。半导体产业通常依靠及时库存管理来最大限度地减少库存过剩。虽然这种方法具有成本效益,但也容易造成供应链中断。全面了解半导体供应链是一项挑战。公司缺乏来自下层供应商的透明度,因此难以评估风险。供应链脆弱性是市场面临的主要挑战。
节点规模展望
依节点尺寸分为180nm、130nm、65nm、45/40nm、32/28nm、16/14nm、10/7nm、7/5nm、5nm等。 16/14nm 细分市场将在 2022 年获得显着的市场收益占有率。 16/14nm 的主要优势之一是成本效益。为各种半导体应用提供经济高效的解决方案。该技术通常用于中阶和廉价智慧型手机,使其价格实惠,同时又不牺牲基本性能。
应用前景
根据应用,它们分为通讯、国防/军事、工业、消费性电子、汽车等。在2022年的市场中,消费性电子领域将占据最大的收益占有率。消费性电子产品,特别是智慧型手机,正在推动对先进半导体零件的需求。这些设备需要半导体代工厂製造的强大的应用处理器、数据机、感测器和储存晶片。此外,该代工厂也为5G技术的发展做出贡献,该技术支援更快、更有效率的行动连接。
区域展望
从区域来看,我们对北美、欧洲、亚太地区和拉丁美洲地区的市场进行了分析。 2022年,北美地区以最高的收益占有率引领市场。北美拥有多家知名半导体代工厂,提供包括尖端製程技术和自订解决方案在内的各种服务。北美的铸造厂通常专注于提供自订製造和专业製造服务。这使得它能够用于各种应用,包括航太、国防、汽车和工业领域。
The Global Semiconductor Foundry Market size is expected to reach $183.8 billion by 2030, rising at a market growth of 7.4% CAGR during the forecast period.
The 130nm technology node represents a well-established and mature semiconductor manufacturing process. It is often used for applications where more advanced nodes are not required due to cost considerations. Thus, the 130nm segment registered $6,526.9 million revenue in the market in 2022. This includes applications like RF transceivers, Bluetooth, Wi-Fi connectivity chips, and other wireless communication standards. The automotive industry relies on 130nm technology for various components, such as microcontrollers, sensor interfaces, and control systems, especially in older vehicles and legacy automotive systems. Some of the factors impacting the market are Cost-effective manufacturing of semiconductors, Proliferation of IoT and edge devices, and Supply chain vulnerabilities.
The economic advantage of semiconductor manufacturing is achieved through the consolidation of semiconductor fabrication within specialized foundries, rather than individual companies establishing costly in-house facilities. Cost-effective manufacturing facilitates increased market participation, enabling a broader array of semiconductor companies, including fabless designers and smaller enterprises, to develop and bring innovative semiconductor products to market. Cost-effective semiconductor manufacturing also promotes global market diversification, reducing dependency on a few dominant players. This diversification is particularly important in mitigating supply chain risks and ensuring the stability of semiconductor production. Moreover, the proliferation of IoT and edge devices, which require low-power, compact, and specialized semiconductor components, has increased foundry services for these applications. IoT devices require various connectivity options, including Wi-Fi, Bluetooth, LoRa, NB-IoT, and more. Semiconductor foundries are essential for providing customized, low-power, and efficient solutions that enable the widespread deployment of IoT and edge devices across various industries and applications. As these technologies continue to evolve and increase, the role of semiconductor foundries in supporting their development becomes even more critical. The growth of the Internet of Things (IoT) and edge computing significantly impacts the market.
However, As evidenced by the COVID-19 pandemic, the semiconductor industry relies on a global supply chain, making it susceptible to supply disruptions. Supply chain problems can cause lead times to increase and component shortages. Natural disasters, geopolitical tensions, and public health crises disrupt the global supply chain, causing semiconductor manufacturing shortages and delays. The semiconductor industry often relies on just-in-time inventory management, which minimizes excess stock. While this approach can be cost-effective, it also makes the supply chain susceptible to disruptions. Achieving full visibility into the semiconductor supply chain can be challenging. Companies lack transparency into sub-tier suppliers, making it difficult to assess risk. Supply chain vulnerabilities are a critical challenge for the market.
Node size Outlook
By node size, the market is categorized into 180nm, 130nm, 65nm, 45/40nm, 32/28nm, 16/14nm, 10/7nm, 7/5nm, 5nm, and others. The 16/14nm segment procured a remarkable revenue share in the market in 2022. One of its primary advantages is cost-effectiveness. It provides a cost-efficient solution for various semiconductor applications. This technology is commonly used in mid-range and budget smartphones, where the emphasis is on affordability without compromising essential performance.
Application Outlook
Based on application, the market is classified into telecommunication, defense & military, industrial, consumer electronics, automotive, and others. The consumer electronics segment witnessed the largest revenue share in the market in 2022. Consumer electronics, particularly smartphones, have driven the demand for advanced semiconductor components. These devices require powerful application processors, modems, sensors, and memory chips produced by semiconductor foundries. Additionally, foundries have contributed to developing 5G technology to support faster and more efficient mobile connectivity.
Regional Outlook
Region-wise, the market is analysed across North America, Europe, Asia Pacific, and LAMEA. In 2022, the North America region led the market by generating the highest revenue share. North America has several prominent semiconductor foundries, which offer various services, including leading-edge process technology and custom solutions. North American foundries often focus on providing custom and specialty manufacturing services. This allows them to cater to various applications, including aerospace, defense, automotive, and industrial sectors.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Intel Corporation, Texas Instruments, Inc., GLOBALFOUNDRIES Inc., Samsung Electronics Co. Ltd, Hua Hong Semiconductor Limited, Taiwan Semiconductor Manufacturing Company Limited, United Microelectronics Corporation, Semiconductor Manufacturing International Corporation, Micron Technology, Inc., and X-FAB Silicon Foundries SE
Strategies Deployed in Semiconductor Foundry Market
Partnerships, Collaborations and Agreements
Sep-2023: Intel Foundry Services (IFS), a division of Intel Corporation, has officially entered into a collaborative agreement with Tower Semiconductor Ltd., a prominent analog semiconductor solutions foundry. In this strategic partnership, Intel will extend its foundry services and offer access to its 300mm manufacturing capabilities to assist Tower in catering to a global clientele. As part of this collaboration, Tower is set to leverage Intel's cutting-edge manufacturing facility located in New Mexico.
Aug-2023: Intel Corporation has solidified a definitive agreement with Synopsys, Inc., an American electronic design automation firm. Through this agreement, Intel seeks to enhance their enduring strategic partnership in intellectual property (IP) and electronic design automation (EDA). This expansion aims to create an IP portfolio on Intel 3 and Intel 18A for Intel's foundry clients, strengthening the offering for both new and existing Intel Foundry Services (IFS) customers.
Jul-2022: Intel Corporation has established a collaborative alliance with MediaTek Inc., the fifth-largest global fabless semiconductor company. In this partnership, Intel's objective is to offer advanced process technologies through its foundry services to MediaTek. This will enable MediaTek to create a diversified and robust supply chain, facilitating the production of various chips for a wide array of smart edge devices.
Mar-2023: The Georgia Institute of Technology announced a new partnership to expand collaboration with GlobalFoundries Inc., one of the foremost semiconductor manufacturers worldwide. Through this partnership aims to further enhance their joint efforts in semiconductor research, education, talent cultivation, and workforce development. Through this initiative, GlobalFoundries seeks to extend their collaboration with Georgia Tech, capitalizing on the institution's expertise and resources to advance this critical industry and ultimately contribute to the betterment of society.
Feb-2023: General Motors Co. has forged a strategic alliance with GlobalFoundries Inc., a leading multinational company renowned for its expertise in semiconductor contract manufacturing and design. In this groundbreaking collaboration, GlobalFoundries is establishing a specialized capacity corridor solely focused on fulfilling GM's semiconductor supply needs. Through this innovative partnership, GlobalFoundries will manufacture chips for GM's critical suppliers, enabling GM to address increasing demand and introduce advanced technological enhancements and features to its clientele.
Feb-2023: Amkor Technology, entered into partnership with GlobalFoundries Inc., a leading global semiconductor manufacturer. Through this partnership Globalfoundries aims to bolster the advanced semiconductor packaging supply chain in Europe. Additionally, Amkor will expand its manufacturing capacity, enabling the introduction of new assembly and testing capabilities to better serve its European and global clientele.
Jun-2021: Synopsys Inc. has established a strategic partnership with Samsung Foundry, a division of Samsung Electronics Co. Ltd., a prominent South Korean conglomerate known for its major appliances and consumer electronics. This collaboration aims to expedite the adoption of groundbreaking 3nm GAA (Gate-All-Around) technology. Samsung's cutting-edge 3nm GAA process has significantly advanced through their close cooperation with Synopsys, and the swift readiness of the Fusion Design Platform underscores the critical value and advantages of these key alliances in realizing the full potential of the 3nm process.
Aug-2023: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED(TSMC), Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. formed a joint venture to invest in European Semiconductor Manufacturing Company (ESMC) GmbH. This joint venture signifies TSMC's dedication to meeting its customers' essential capacity and technology requirements. The envisioned fabrication facility aims to achieve a monthly production capacity of 40,000 wafers, each with a diameter of 300mm (equivalent to 12 inches). This facility will utilize TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology.
Mar-2021: X-FAB Silicon Foundries SE has established a collaborative alliance with IHP Gmbh, aiming to leverage their respective strengths. In this partnership, X-FAB seeks to unite its semiconductor manufacturing expertise with IHP's specialized knowledge in wireless communication. The primary objectives are to facilitate the exchange of insights and foster mutually advantageous engineering synergies.
Acquisition and Mergers
June-2021: Texas Instruments Incorporated has recently signed a definitive agreement to purchase the 300-mm semiconductor facility from Micron Technologies Inc., a prominent American manufacturer of computer memory and data storage products. By pursuing this acquisition, Texas Instruments seeks to expand its cost-efficiency and enhance its control over the supply chain. This strategic investment serves to further fortify their competitive edge in manufacturing and technology, aligning with their long-term capacity planning objectives.
Feb-2023: GlobalFoundries Inc. has completed the acquisition of Renesas Electronics Corporation's Conductive Bridging Random Access Memory (CBRAM) technology, a well-established Japanese semiconductor manufacturer. This strategic acquisition empowers GlobalFoundries to leverage Renesas' cutting-edge memory technology, positioning GF as a pivotal player in expediting the advancement of Non-Volatile Memory (NVM) solutions. This will enable GlobalFoundries' clients to craft the future generation of intelligent and interconnected devices.
Market Segments covered in the Report:
By Node Size
By Application
By Geography
Companies Profiled
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