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市场调查报告书
商品编码
1457081

硅晶圆市场 - 2024 年至 2029 年预测

Silicon Wafers Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 124 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

2022年硅晶圆市场价值为81.76亿美元，将以5.52%的复合年增长率成长，到2029年市场规模将达到134.9亿美元。

硅晶圆用于各种电子设备和组件。该技术用于积体电路和微电子产品的生产。在微加工过程中，硅晶圆充当微电子元件之间的基板，并且还经历许多其他微加工工艺，例如掺杂、离子布植和蚀刻。对更紧凑的电子设备的需求导致了先进的小型化。除了全球消费者期望不断提高之外，智慧型手机、智慧型穿戴装置、个人电脑、智慧家居设备和其他智慧小工具等先进科技设备正在为消费性电子产品创造一个重要的市场。新兴国家可支配收入的增加以及这些设备的接受度将显着增加发展中国家对硅晶圆的需求。美国政府对半导体产业的投资预计将显着提振该地区的前景。美国参议院于 2021 年 5 月宣布，将投资 520 亿美元加强国内半导体生产，作为对抗中国的更广泛努力的一部分。此外，越来越多的居民现在能够购买汽车和其他车辆，从而导致对半导体的需求增加，这证明了汽车在亚太地区的日益普及。由于该地区对半导体的需求，硅晶圆市场的收益正在增加。

亚太地区的家用电子电器和汽车领域正在崛起。由于中国、印度、日本、印尼和菲律宾等国家的经济成长，对行动电话、电视和数位相机等家用电器的需求正在迅速增长。例如，亚洲的GDP预计将在2020年超过世界其他地区。如果该地区继续以目前的速度成长，到 2030 年全球成长预计将达到 60%。 （图片来源：weforum.org）

市场驱动因素：

  • 汽车需求的成长预计将推动市场发展。

推动全球硅晶圆市场的关键因素是汽车需求的增加和製造业活动的活性化。向混合动力汽车和电动车的转变是由于汽车需求和製造的增加。汽车领域新技术的开发和引入也是促进该行业发展的其他因素。汽车产业正在不断发展，并推出了配备防煞车系统的车辆。诸如此类的技术创新是硅晶圆背后的驱动力。因此，未来市场的成长将受到这些因素的支持。预计到2030年，上路的电动小客车量将超过2亿辆，比2016年增加略多于200万辆。到 2030 年，道路上行驶的两轮、三轮和四轮电动车将达到 9 亿辆，超过四轮汽车的数量。这种成长为硅晶圆供应商提供了许多机会，并促进了市场成长。

  • 半导体需求成长

硅晶圆市场直接且显着地受到半导体需求成长的影响。随着以半导体为主要零件的电子设备和技术的普及，对作为半导体製造的重要基板的硅晶圆的需求不断增加。生产商努力满足半导体产业不断扩大的需求，这种激增反映在硅晶圆产量的增加上。半导体技术的进步，例如向较低奈米製程的发展，凸显了这些领域之间的复杂联繫，并产生了对更高精度和更宽宽度硅晶圆的需求。

市场限制因素：

  • 高成本和维护：

硅晶圆供应商面临的主要挑战是初始投资高且回报率低。此外，用于半导体製造的薄硅晶圆难以处理，并且需要外部机械支撑，这使得处理器处理 450 mm 硅晶圆变得更加困难。这需要使用刚性载体晶圆、专门设计的卡盘和切割胶带，这将超出预算。此外，最终产品的繁琐包装也阻碍了市场的发展。

预计北美将成为主要区域市场。

该地区的技术突破和蓬勃发展的半导体产业正在推动北美硅晶圆市场的发展。北美主要半导体製造商和技术主导公司高度集中，因此对半导体製造重要组成部分硅晶圆的需求稳定。正在进行的扩大半导体技术前沿的计划进一步激发了该地区的研发热情。

主要进展：

  • 2023年12月，东京电子发表了可支援300片晶圆的晶圆减薄系统「UlucusTM G」。半导体製造的先进图形化需要提高硅晶圆的平整度。
  • 2023年8月，三菱电机公司宣布，该公司第一条12吋硅晶圆加工线已在其福山工厂完工，该厂生产用于功率元件的功率半导体。此外，样品製造和测试已证实同线生产的功率半导体晶片符合所需的性能标准。

目录

第一章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • CXO观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章硅晶圆市场：依晶圆尺寸

  • 介绍
  • 0～100mm
  • 100～200mm
  • 200～300mm
  • 300mm以上

第六章硅片市场：依製造方法分类

  • 介绍
  • 提拉法 (Cz)
  • 布里奇曼法
  • Float-Zone
  • 其他的

第七章硅片市场：依行业分类

  • 介绍
  • 家用电器
  • 车
  • 製造业
  • 通讯
  • 其他的

第八章硅片市场：依地区

  • 介绍
  • 北美洲
  • 南美洲
  • 欧洲
  • 中东/非洲
  • 亚太地区

第九章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第十章 公司简介

  • Siltronic
  • Sumco Corporation
  • Shin-Etsu Chemical Co., Ltd.
  • Okmetic
  • GlobalWafers（Sino-American Silicon）
  • Silicon Materials, Inc
  • Wafer Works Corporation
  • Wafer World
  • Virginia Semiconductor, Inc.
简介目录
Product Code: KSI061611682

The silicon wafers market is evaluated at US$8.176 billion for the year 2022 growing at a CAGR of 5.52% reaching the market size of US$13.49 billion by the year 2029.

All types of electronic devices and components contain silicon wafers. The technology is used to fabricate integrated circuits and microelectronics. During microfabrication, silicon wafers function as substrates between microelectronic components as well as perform many other microfabrication processes such as doping, ion implantation, and etching. A high degree of miniaturization has resulted from the demand for more compact electronics. In addition to consumer expectations growing worldwide, a significant market for consumer electronics will continue to be driven by advanced technological devices such as smartphones, smart wearables, PCs, smart home devices, and other intelligent gadgets. Increasing disposable incomes and the acceptance of these devices will increase silicon wafer demand substantially in developing countries. US government investments in the semiconductor industry will significantly boost regional prospects. The U.S. Senate announced it would invest USD 52 billion in strengthening domestic semiconductor production as part of a broader effort to compete against China in May 2021. Furthermore, the growing popularity of automobiles in APAC is evident in the fact that more residents can now afford cars and other automobiles, resulting in a demand for semiconductors. There has been an increase in revenues generated by the silicon wafer market due to the demand for semiconductors in the region.

APAC is on the rise in the consumer electronics and automotive sectors. Consumer electronics like mobile phones, TVs, digital cameras, and many others are experiencing a surge in demand due to economic growth in countries like China, India, Japan, Indonesia, and the Philippines. For instance, the GDP of Asia will surpass the GDP of the rest of the world combined in 2020. Global growth is expected to reach 60% by 2030 if the region continues to grow at its current pace. (Source: weforum.org)

MARKET DRIVERS:

  • A rise in demand for automobiles is anticipated to propel the market.

Among the key factors driving the global silicon wafer market are increasing vehicle demand and an increase in manufacturing activity. The move towards hybrid and electric vehicles is due to higher vehicle demands and manufacturing. Developing and introducing new technologies into the automotive sector were other factors contributing to the development of the industry. The automotive industry offers vehicles with an anti-braking system when it grows. Innovations such as these support the drive for silicon wafers. The market's growth is therefore supported by these factors going forward into the future. Over 200 million electric passenger cars are predicted to be on the road by 2030, a rapid increase of just over 2 million vehicles in 2016. By 2030, there could be 900 million electric two-, three---, and four-wheeled vehicles on the road, which is more than the number of four-wheeled cars. (Source: irena.org). These augmentations will consequently offer numerous opportunities to silicon wafer suppliers thus, boosting their market growth.

  • Growth in demand for semiconductors.

The silicon wafers market is directly and significantly impacted by the growing need for semiconductors. The requirement for silicon wafers, the essential substrate for semiconductor manufacture, rises in tandem with the proliferation of electronic gadgets and technologies that rely on semiconductors as their key components. As producers work to satisfy the expanding demands of the semiconductor industry, this surge is reflected in higher silicon wafer manufacturing quantities. Improvements in semiconductor technology, such as the shift to lower nanometer processes, highlight the complex link between these sectors and create a need for silicon wafers with greater accuracy and wider widths.

MARKET RESTRAINTS:

  • High cost and maintenance:

A high initial investment coupled with a questionable lack of returns is a major challenge facing silicon wafer vendors. Furthermore, thin silicon wafers for semiconductor fabrication are difficult to handle and must be supported mechanically outside, which makes it even more difficult for processors to handle 450 mm silicon wafers. This means it becomes necessary to use rigid career wafers, specially designed chucks, and dicing tape, thus exceeding budget expectations. Furthermore, the final product packaging is cumbersome hampering the market.

North America is anticipated to be the major regional market.

The region's technical breakthroughs and booming semiconductor sector drive the North American silicon wafers market. North America has a concentration of large semiconductor manufacturers and technology-driven businesses, which means that there is a steady need for silicon wafers, which are essential components in the creation of semiconductors. The market is further stimulated by the region's dedication to research and development, as continuous projects concentrate on expanding the frontiers of semiconductor technology.

Key Developments:

  • In December 2023, Tokyo Electron announced the release of UlucusTM G, a wafer-thinning system for 300-wafer production. Greater flatness in silicon wafers is necessary for advanced patterning in semiconductor fabrication. Integrated wafer manufacturing equipment that can execute various operations automatically and continuously is preferred due to the worldwide labor shortage trend.
  • In August 2023, Mitsubishi Electric Corporation announced that the construction of its first 12-inch silicon wafer processing line at its Fukuyama Factory, which produces power semiconductors for Power Device Works, has been completed. Furthermore, it has been confirmed by sample manufacturing and testing that the power semiconductor chips produced on this line of production meet the necessary performance standards.

Segmentation:

By Wafer Size

  • 0- 100 mm
  • 100 - 200 mm
  • 200 - 300 mm
  • More than 300 mm

By Fabrication Method

  • Czochralski Technique (Cz)
  • Bridgeman Method
  • Float-Zone
  • Others

By Industry Vertical

  • Consumer Electronics
  • Automotive
  • Manufacturing
  • Telecommunications
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • Others
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • France
  • Germany
  • UK
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Japan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. CXO Perspective

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SILICON WAFERS MARKET, BY WAFER SIZE

  • 5.1. Introduction
  • 5.2. 0-100 mm
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. 100-200 mm
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. 200-300 mm
    • 5.4.1. Market Trends and Opportunities
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness
  • 5.5. More than 300 mm
    • 5.5.1. Market Trends and Opportunities
    • 5.5.2. Growth Prospects
    • 5.5.3. Geographic Lucrativeness

6. SILICON WAFERS MARKET, BY FABRICATION METHOD

  • 6.1. Introduction
  • 6.2. Czochralski Technique (Cz)
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Bridgeman Method
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Float-Zone
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness
  • 6.5. Others
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness

7. SILICON WAFERS MARKET, BY INDUSTRY VERTICAL

  • 7.1. Introduction
  • 7.2. Consumer Electronics
    • 7.2.1. Market Trends and Opportunities
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. Automotive
    • 7.3.1. Market Trends and Opportunities
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. Manufacturing
    • 7.4.1. Market Trends and Opportunities
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Telecommunications
    • 7.5.1. Market Trends and Opportunities
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness
  • 7.6. Others
    • 7.6.1. Market Trends and Opportunities
    • 7.6.2. Growth Prospects
    • 7.6.3. Geographic Lucrativeness

8. SILICON WAFERS MARKET, BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. By Wafer Size
    • 8.2.2. By Fabrication Method
    • 8.2.3. By Industry Vertical
    • 8.2.4. By Country
      • 8.2.4.1. USA
        • 8.2.4.1.1. Market Trends and Opportunities
        • 8.2.4.1.2. Growth Prospects
      • 8.2.4.2. Canada
        • 8.2.4.2.1. Market Trends and Opportunities
        • 8.2.4.2.2. Growth Prospects
      • 8.2.4.3. Mexico
        • 8.2.4.3.1. Market Trends and Opportunities
        • 8.2.4.3.2. Growth Prospects
  • 8.3. South America
    • 8.3.1. By Wafer Size
    • 8.3.2. By Fabrication Method
    • 8.3.3. By Industry Vertical
    • 8.3.4. By Country
      • 8.3.4.1. Brazil
        • 8.3.4.1.1. Market Trends and Opportunities
        • 8.3.4.1.2. Growth Prospects
      • 8.3.4.2. Argentina
        • 8.3.4.2.1. Market Trends and Opportunities
        • 8.3.4.2.2. Growth Prospects
      • 8.3.4.3. Others
        • 8.3.4.3.1. Market Trends and Opportunities
        • 8.3.4.3.2. Growth Prospects
  • 8.4. Europe
    • 8.4.1. By Wafer Size
    • 8.4.2. By Fabrication Method
    • 8.4.3. By Industry Vertical
    • 8.4.4. By Country
      • 8.4.4.1. France
        • 8.4.4.1.1. Market Trends and Opportunities
        • 8.4.4.1.2. Growth Prospects
      • 8.4.4.2. Germany
        • 8.4.4.2.1. Market Trends and Opportunities
        • 8.4.4.2.2. Growth Prospects
      • 8.4.4.3. UK
        • 8.4.4.3.1. Market Trends and Opportunities
        • 8.4.4.3.2. Growth Prospects
      • 8.4.4.4. Italy
        • 8.4.4.4.1. Market Trends and Opportunities
        • 8.4.4.4.2. Growth Prospects
      • 8.4.4.5. Others
        • 8.4.4.5.1. Market Trends and Opportunities
        • 8.4.4.5.2. Growth Prospects
  • 8.5. Middle East and Africa
    • 8.5.1. By Wafer Size
    • 8.5.2. By Fabrication Method
    • 8.5.3. By Industry Vertical
    • 8.5.4. By Country
      • 8.5.4.1. Saudi Arabia
        • 8.5.4.1.1. Market Trends and Opportunities
        • 8.5.4.1.2. Growth Prospects
      • 8.5.4.2. UAE
        • 8.5.4.2.1. Market Trends and Opportunities
        • 8.5.4.2.2. Growth Prospects
      • 8.5.4.3. Israel
        • 8.5.4.3.1. Market Trends and Opportunities
        • 8.5.4.3.2. Growth Prospects
      • 8.5.4.4. Others
        • 8.5.4.4.1. Market Trends and Opportunities
        • 8.5.4.4.2. Growth Prospects
  • 8.6. Asia Pacific
    • 8.6.1. By Wafer Size
    • 8.6.2. By Fabrication Method
    • 8.6.3. By Industry Vertical
    • 8.6.4. By Country
      • 8.6.4.1. China
        • 8.6.4.1.1. Market Trends and Opportunities
        • 8.6.4.1.2. Growth Prospects
      • 8.6.4.2. India
        • 8.6.4.2.1. Market Trends and Opportunities
        • 8.6.4.2.2. Growth Prospects
      • 8.6.4.3. South Korea
        • 8.6.4.3.1. Market Trends and Opportunities
        • 8.6.4.3.2. Growth Prospects
      • 8.6.4.4. Taiwan
        • 8.6.4.4.1. Market Trends and Opportunities
        • 8.6.4.4.2. Growth Prospects
      • 8.6.4.5. Thailand
        • 8.6.4.5.1. Market Trends and Opportunities
        • 8.6.4.5.2. Growth Prospects
      • 8.6.4.6. Indonesia
        • 8.6.4.6.1. Market Trends and Opportunities
        • 8.6.4.6.2. Growth Prospects
      • 8.6.4.7. Japan
        • 8.6.4.7.1. Market Trends and Opportunities
        • 8.6.4.7.2. Growth Prospects
      • 8.6.4.8. Others
        • 8.6.4.8.1. Market Trends and Opportunities
        • 8.6.4.8.2. Growth Prospects

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Siltronic
  • 10.2. Sumco Corporation
  • 10.3. Shin-Etsu Chemical Co., Ltd.
  • 10.4. Okmetic
  • 10.5. GlobalWafers (Sino-American Silicon)
  • 10.6. Silicon Materials, Inc
  • 10.7. Wafer Works Corporation
  • 10.8. Wafer World
  • 10.9. Virginia Semiconductor, Inc.