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市场调查报告书
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1457077

半导体干蚀蚀系统市场 - 2024 年至 2029 年预测

Semiconductor Dry Etch Systems Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 138 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

半导体干式蚀刻系统市场预计将以 4.93% 的复合年增长率成长，从 2022 年的 157.18 亿美元增至 2029 年的 220.19 亿美元。

半导体干蚀刻系统是用来生产半导体、微处理器和其他微电子元件的工具。此製程可选择性地从晶圆上去除或蚀刻特定的材料层，留下装置功能所需的图案和结构。干式蚀刻系统利用多种技术从晶圆表面去除材料，包括电浆蚀刻、反应离子蚀刻和深度反应离子蚀刻。干式蚀刻製程是半导体製造的重要步骤，因为它可以在晶圆表面上精确图形化和形成复杂的型态。这些特征包括通道和沟槽，它们是现代半导体装置的关键组件。形成精确、均匀图案的能力对于提高装置性能、减少尺寸和增加功能是必要的。

半导体干蚀刻系统市场是由对先进半导体元件的需求不断增长以及对高分辨率图案化能力的需求所推动的。对更快的处理速度、更小的外形尺寸和更高的功能的需求增加了对更精确的图形化和蚀刻能力的需求。因此，干式蚀刻已成为半导体製造製程的关键步骤。

市场驱动力

  • 对先进半导体和电子设备的需求不断增长正在推动市场成长。

由于各行业越来越多地采用数位技术，对微处理器、储存晶片和感测器等先进半导体和电子设备以及行动装置、平板电脑和电脑等设备的需求正在迅速扩大。对更快的处理速度、更小的外形尺寸和增加的功能的需求正在推动对更精确的图形化和蚀刻能力的需求。根据美国人口普查局的数据，2020 年美国电子产品和电子产品量贩店的零售额估计为 854 亿美元。

  • 半导体製造的技术进步正在提供新的成长前景。

此外，半导体製造流程的技术进步，包括新材料、製程和设备的开发，正在推动对更先进的干蚀刻系统的需求。例如，碳化硅、氮化镓等高高功率、高频元件新材料的开发，需要更精确、均匀的蚀刻能力。此外，半导体装置对3D(3D) 结构的需求不断增长，推动了对深度反应离子蚀刻 (DRIE) 系统的需求。

  • 按类型划分，电介质蚀刻领域预计将呈现显着成长。

介电蚀刻是半导体工业中使用的一种工艺，透过干蚀刻製程选择性地从基板上去除电介质（绝缘体）。在半导体干蚀刻系统中，电介质蚀刻是使用等离子体电浆蚀刻来完成的，等离子体蚀刻使用高能量等离子体来去除电介质材料。电介质蚀刻用于製造各种半导体装置，包括电晶体、积体电路和储存晶片。它是半导体工业中的重要工艺，因为它可以在基板表面形成复杂而精确的图案，这是开发高性能半导体装置所必需的。

北美在半导体干蚀蚀系统的全球市场中占有很大份额。

从地区来看，半导体干蚀蚀系统市场分为北美、南美洲、欧洲、中东和非洲以及亚太地区。由于对消费性电子产品、资料储存设备和先进技术的需求不断增长，预计北美地区将在半导体干蚀刻系统市场中占据主要份额。应用材料公司和泛林研究公司等主要市场参与企业在该地区的存在也有助于市场成长。

主要进展

  • 2020 年 8 月：应用材料公司在其产品线中引入了先进的半导体蚀刻系统 Centris Sym3 Y。 Sym3 Y 系统使用 RF 脉衝技术形成用于 3D NAND、DRAM 和逻辑的高长宽比结构，包括 FinFET 和新型环栅架构。 Sym3 Y 的高电导室架构提供卓越的蚀刻轮廓控制，新的涂层材料可减少缺陷并提高产量比率。
  • 2020 年 6 月：RENA Technologies 宣布推出 Inception，这是一个适用于所有半导体湿式製程的新单晶圆平台，包括清洗、蚀刻、剥离和干燥。 Inception 平台旨在成为所有湿式清洗、蚀刻和剥离应用的理想平台。功能包括前端生产线 (FEoL) 和后端生产线 (BEoL) 处理应用、自动晶圆处理、双可移动喷射臂和独立的化学生产线。

目录

第一章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章半导体干蚀刻系统市场：依类型

  • 介绍
  • 介电蚀刻
  • 导体蚀刻

第六章半导体干蚀蚀系统市场：依应用分类

  • 介绍
  • 逻辑和晶圆代工厂
  • 微机电系统
  • 感应器
  • 功率元件
  • 其他的

第七章半导体干蚀刻系统市场：依地区

  • 介绍
  • 北美洲
  • 南美洲
  • 欧洲
  • 中东/非洲
  • 亚太地区

第八章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第九章 公司简介

  • Toppan Inc.
  • Applied Materials Inc.
  • Hitachi High Technologies America, Inc.
  • Lam Research Corporation
  • Tokyo Electron Limited
  • Plasma-Therm LLC
  • CVD Equipment Corporation
  • SPTS Technologies Ltd.
  • Panasonic Industry Co., Ltd.
  • DISCO Corporation
简介目录
Product Code: KSI061615184

The semiconductor dry etch systems market is projected to grow at a CAGR of 4.93% to reach US$22.019 billion in 2029 from US$15.718 billion in 2022.

Semiconductor dry etch systems are tools used in the manufacturing of semiconductors, microprocessors, and other microelectronic devices. The process involves selectively removing or etching certain layers of materials from a wafer, leaving behind patterns and structures necessary for the device's functionality. Dry etching systems utilize a range of techniques, such as plasma etching, reactive ion etching, and deep reactive ion etching, to remove the material from the wafer surface. The dry etching process is an essential step in semiconductor fabrication, as it allows for the precise patterning and formation of intricate features on the surface of the wafer. These features can include channels and trenches, which are critical components of modern semiconductor devices. The ability to produce precise and uniform patterns is necessary to improve the device's performance, reduce its size, and increase its functionality.

The semiconductor dry etch systems market is driven by the increasing demand for advanced semiconductor devices and the need for high-resolution patterning capabilities. With the demand for higher processing speeds, smaller form factors, and increased functionality, the need for more precise patterning and etching capabilities is growing. As a result, dry etching has become a critical step in the semiconductor manufacturing process.

Market Drivers

  • The increasing demand for advanced semiconductor and electronic devices is driving the market growth.

The demand for advanced semiconductor and electronic devices, such as microprocessors, memory chips, and sensors as well as devices like mobile devices, tablets, and computers, is growing rapidly due to the increasing adoption of digital technologies in various industries. The need for higher processing speeds, smaller form factors, and increased functionality is driving the demand for more precise patterning and etching capabilities. According to the US Census Bureau, the estimated retail sales of electronic and appliance stores in the United States for 2020 was US$85.4 billion.

  • Technological advancement in semiconductor fabrication has provided new growth prospects.

Further, the technological advancements in the semiconductor fabrication process, such as the development of new materials, processes, and devices, are driving the demand for more advanced dry etch systems. For instance, the development of new materials, such as silicon carbide and gallium nitride, for high-power and high-frequency devices, requires more precise and uniform etching capabilities. Additionally, the increasing demand for three-dimensional (3D) structures in semiconductor devices is driving the need for deep reactive ion etching (DRIE) systems.

  • Based on type, the dielectric etching segment is expected to show significant growth

Dielectric etching is a process used in the semiconductor industry to selectively remove dielectric materials (insulators) from a substrate using a dry etch process. In semiconductor dry etch systems, dielectric etching is achieved using plasma etching, which involves using high-energy plasma to remove the dielectric material. Dielectric etching is used in the fabrication of various semiconductor devices such as transistors, integrated circuits, and memory chips. It is an important process in the semiconductor industry as it allows for the creation of complex and precise patterns on the surface of a substrate, which is necessary for the development of high-performance semiconductor devices.

North America accounted for a significant share of the global semiconductor dry etch systems market.

Based on geography, the semiconductor dry etch systems market is segmented into North America, South America, Europe, the Middle East and Africa, and Asia Pacific. The North American region is expected to have a significant market share in the semiconductor dry etch systems market due to the increasing demand for consumer electronics, data storage devices, and advanced technologies in the region. The presence of major market players such as Applied Materials and Lam Research in the region is also contributing to the growth of the market.

Key developments.

  • In August 2020: Applied Materials introduced the Centris Sym3 Y, an advanced semiconductor etching system, to its range of products. The Sym3 Y system uses RF pulsing technology to create high-aspect-ratio structures in 3D NAND, DRAM, and logic, including FinFETs and emerging gate-all-around architectures. The high-conductance chamber architecture of Sym3 Y delivers excellent etch profile control, while a novel coating material reduces defects and boosts yields.
  • In June 2020: RENA Technologies introduced a new single-wafer platform named Inception for all wet processes of semiconductors including cleaning, etching, stripping, and drying. The Inception platform is built to provide a suitable platform for any wet cleaning, etching, or stripping application. It includes front-end-of-line (FEoL) and back-end-of-line (BEoL) processing applications, automated wafer handling, dual movable spray arms, and separate chemical lines.

Segmentation:

By Type

  • Dielectric Etching
  • Conductor Etching

By Application

  • Logic & Foundry
  • MEMS
  • Sensors
  • Power Devices
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Indonesia
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Dielectric Etching
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness Insights
  • 5.3. Conductor Etching
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness Insights

6. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. Logic & Foundry
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness Insights
  • 6.3. MEMS
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness Insights
  • 6.4. Sensors
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness Insights
  • 6.5. Power Devices
    • 6.5.1. Market Trends and Opportunities
    • 6.5.2. Growth Prospects
    • 6.5.3. Geographic Lucrativeness Insights
  • 6.6. Others
    • 6.6.1. Market Trends and Opportunities
    • 6.6.2. Growth Prospects
    • 6.6.3. Geographic Lucrativeness Insights

7. SEMICONDUCTOR DRY ETCH SYSTEMS MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
      • 7.2.3.1. USA
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Canada
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
      • 7.2.3.3. Mexico
        • 7.2.3.3.1. Market Trends and Opportunities
        • 7.2.3.3.2. Growth Prospects
  • 7.3. South America
    • 7.3.1. By Type
    • 7.3.2. By Application
    • 7.3.3. By Country
      • 7.3.3.1. Brazil
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. Argentina
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Others
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
  • 7.4. Europe
    • 7.4.1. By Type
    • 7.4.2. By Application
    • 7.4.3. By Country
      • 7.4.3.1. Germany
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. France
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. United KIngdom
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Spain
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects
  • 7.5. Middle East and Africa
    • 7.5.1. By Type
    • 7.5.2. By Application
    • 7.5.3. By Country
      • 7.5.3.1. Saudi Arabia
        • 7.5.3.1.1. Market Trends and Opportunities
        • 7.5.3.1.2. Growth Prospects
      • 7.5.3.2. UAE
        • 7.5.3.2.1. Market Trends and Opportunities
        • 7.5.3.2.2. Growth Prospects
      • 7.5.3.3. Israel
        • 7.5.3.3.1. Market Trends and Opportunities
        • 7.5.3.3.2. Growth Prospects
      • 7.5.3.4. Others
        • 7.5.3.4.1. Market Trends and Opportunities
        • 7.5.3.4.2. Growth Prospects
  • 7.6. Asia Pacific
    • 7.6.1. By Type
    • 7.6.2. By Application
    • 7.6.3. By Country
      • 7.6.3.1. China
        • 7.6.3.1.1. Market Trends and Opportunities
        • 7.6.3.1.2. Growth Prospects
      • 7.6.3.2. Japan
        • 7.6.3.2.1. Market Trends and Opportunities
        • 7.6.3.2.2. Growth Prospects
      • 7.6.3.3. India
        • 7.6.3.3.1. Market Trends and Opportunities
        • 7.6.3.3.2. Growth Prospects
      • 7.6.3.4. South Korea
        • 7.6.3.4.1. Market Trends and Opportunities
        • 7.6.3.4.2. Growth Prospects
      • 7.6.3.5. Indonesia
        • 7.6.3.5.1. Market Trends and Opportunities
        • 7.6.3.5.2. Growth Prospects
      • 7.6.3.6. Taiwan
        • 7.6.3.6.1. Market Trends and Opportunities
        • 7.6.3.6.2. Growth Prospects
      • 7.6.3.7. Others
        • 7.6.3.7.1. Market Trends and Opportunities
        • 7.6.3.7.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Toppan Inc.
  • 9.2. Applied Materials Inc.
  • 9.3. Hitachi High Technologies America, Inc.
  • 9.4. Lam Research Corporation
  • 9.5. Tokyo Electron Limited
  • 9.6. Plasma-Therm LLC
  • 9.7. CVD Equipment Corporation
  • 9.8. SPTS Technologies Ltd.
  • 9.9. Panasonic Industry Co., Ltd.
  • 9.10. DISCO Corporation