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市场调查报告书
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1479880

绝缘体上硅 (SOI) 市场 - 2024 年至 2029 年预测

Silicon-on-Insulator (SOI) Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

2022年绝缘体上硅（SOI）市值为1,353,442,000美元，预计复合年增长率为19.80%，到2029年市场规模将达到4,595,902,000美元。

称为绝缘体上硅 (SOI) 技术的新型半导体製造流程提高了积体电路 (IC) 的性能和效率。在氧化硅 (SiO2) 或蓝宝石技术中，在绝缘基板的顶部形成一层薄薄的硅（称为主动层）。在这种「三明治」结构中，绝缘层将主动硅层与基板电隔离。与传统的体硅基基板相比，这种隔离减少了寄生电容，提高了 IC 速度、功率效率和抗噪能力。

此外，绝缘基板提供的隔离提高了基于SOI的IC的抗辐射性和抗噪性，使其适合在汽车和飞机等恶劣环境中使用。

市场趋势：

推动硅晶绝缘体市场成长的关键因素是5G技术的日益普及，特别是在新兴经济体。不断增长的互联网普及是 5G 技术投资兴起的关键因素，预计将进一步增加对新介面和组件技术的需求，并对绝缘体上硅 (SOI) 需求产生积极影响。

新兴经济体尤其正在投资家庭自动化，并越来越多地采用智慧和连接型家电，进一步扩大市场成长机会。然而，替代技术的可用性预计将阻碍未来几年的市场成长。

市场驱动因素：

  • 5G 技术的更多采用预计将推动市场成长。

网路普及的提高加上无线技术的快速进步预计将在预测期内推动市场成长。全球网路用户数量的增加导致服务供应商增加投资以开发更快、更先进的服务，以便透过提供更好的服务并获得相对于其他供应商的优势来满足使用者需求。

预计 5G 技术的出现将在预测期内进一步推动市场成长。此外，5G 预计将以更高的频率运行，从而能够采用新的介面和组件技术。

  • 主要市场参与企业的进入预计将提振市场。

主要市场参与企业以研发投资、产品发布、联盟和扩张投资等形式进入进一步表明了未来几年的市场成长潜力。例如，2021年11月，Soitec收购了先进技术公司NOVASiC，以强化其SiC晶圆技术。此外，2022 年 7 月，义法半导体和 GlobalFoundries 宣布签署谅解备忘录，在法国克罗尔建立 300 毫米製造工厂，用于 FD-SOI 製造。

  • RF-SOI市场预计将快速成长

绝缘体硅市场依产品分为 RF-SOI、PD-SOI、FD-SOI、Power SOI 等。由于家用电子电器领域和网路应用的需求不断增长，特别是提高毫米波和 5G 等技术的能力，预计 RF-SOI 市场将在预测期内成长。

部分耗尽 (PD-SOI) 硅晶圆支援微处理器的製造和开发，由于其在各种电子和半导体应用中的使用不断增加，其使用量也不断增加。

此外，FD-SOI 领域正在见证各种最终用户产业对先进和强化装置的需求，以满足各种超低功耗应用，例如支援电子产业发展的 FDSOI MOSFET 和多闸极 MOSFET。重要份额。

预计亚太地区将占据市场主要份额

依地区划分，硅晶绝缘体市场分为北美、南美、欧洲、中东和非洲、亚太地区。亚太地区在基线估计中占很大份额，由于该地区智慧型手机和通讯製造投资增加，预计该地区将快速成长。同时，美国政府对促进国内製造业的日益重视预计将推动该国市场的成长，而欧洲市场预计将在预测期内稳步增长。

随着主要智慧型手机製造商开始实施 5G 技术，亚太地区 RF-SOI 市场预计将快速成长。 2020 年 2 月，东芝电子元件及储存装置公司推出了 TaRF11，这是最新一代 RF-SOI，专门针对 5G 行动装置中的射频开关和低噪音放大器进行了最佳化。

主要进展：

  • 2023 年 3 月，为 MEMS、感测器、射频和功率装置製造提供先进硅晶圆的行业领导者 Okmetic 宣布推出具有无平台 SOI 功能的 200 毫米键合绝缘体上硅 BSOI 和 E-SOI(R) 晶圆宣布可用性。
  • 2022 年 9 月，Guerrilla RF, Inc. 推出了新型 GRF6402 数位步进衰减器 (DSA)。在收到样品准备和策略客户群的积极检验后，该公司准备推进其首款绝缘体上硅 (SOI) 产品的批量生产。这对 Guerrilla RF, Inc. (GRF) 来说是一个重要的里程碑，扩大了该公司目前的产品组合，将来自业界领先的半导体晶圆代工厂的尖端硅纳入其中。

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关利益者的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章绝缘体上硅 (SOI) 市场：以晶圆尺寸分类

  • 介绍
  • 200mm以下
  • 200mm
  • 300mm

第六章绝缘体上硅 (SOI) 市场：依技术分类

  • 介绍
  • 智慧剪切
  • 黏合
  • 层转移

第 7 章绝缘体上硅 (SOI) 市场：依产品

  • 介绍
  • RF-SOI
  • PD-SOI
  • FD-SOI
  • Power-SOI
  • 其他的

第 8 章绝缘体上硅 (SOI) 市场：依最终用户产业划分

  • 介绍
  • 家用电器
  • 车
  • 通讯
  • 军事和国防
  • 其他的

第九章绝缘体上硅（SOI）市场：依地区

  • 介绍
  • 北美洲
    • 按晶圆尺寸
    • 依技术
    • 副产品
    • 按最终用户产业
    • 按国家/地区
  • 南美洲
    • 按晶圆尺寸
    • 依技术
    • 副产品
    • 按最终用户产业
    • 按国家/地区
  • 欧洲
    • 按晶圆尺寸
    • 依技术
    • 副产品
    • 按最终用户产业
    • 按国家/地区
  • 中东/非洲
    • 按晶圆尺寸
    • 依技术
    • 副产品
    • 按最终用户产业
    • 按国家/地区
  • 亚太地区
    • 按晶圆尺寸
    • 依技术
    • 副产品
    • 按最终用户产业
    • 按国家/地区

第十章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第十一章 公司简介

  • SOITEC
  • Sumco Corporation
  • GlobalFoundries
  • STMicroelectronics
  • NXP Semiconductor
  • Shin-Etsu Chemical Co., Ltd.
  • Qorvo, Inc.
  • Shanghai Simgui Technology Co., Ltd.
简介目录
Product Code: KSI061611941

The silicon-on-insulator (SOI) market is evaluated at US$1,353.442 million for the year 2022 and is projected to grow at a CAGR of 19.80% to reach a market size of US$4,595.902 million by the year 2029.

Integrated circuit (IC) performance and efficiency are improved by the novel semiconductor fabrication process known as silicon-on-insulator (SOI) technology. A thin layer of silicon, known as the active layer, is formed on top of an insulating substrate in silicon oxide (SiO2) or sapphire technology. The insulating layer separates the active silicon layer from the substrate electrically in this "sandwich" structure created via fabrication. Compared to conventional bulk silicon substrates, this separation lowers parasitic capacitance and enhances IC speed, power efficiency, and noise immunity.

Additionally, SOI-based ICs' radiation hardness and noise immunity are improved by the isolation offered by the insulating substrate, which qualifies them for use in hostile environments like those found in automobiles and aircraft.

MARKET TRENDS:

The major factors driving the silicon on insulator market growth include the rising incorporation of 5G technology, majorly in the developing economies of the globe. The growing internet penetration has been a major factor in the budding investments in 5G technology, which is anticipated to further augment the demand for new interface and component technologies, thereby positively impacting the demand for silicon-on-insulators (SOI).

The expanding adoption of SOI wafers across the consumer electronics industry is also projected to be one of the important factors driving the market growth, as the adoption of smart appliances and connected appliances, along with investments in home automation, especially in the developed economies, is further widening the opportunities for the market growth. However, the availability of substitute technology is anticipated to hamper the market's growth in the coming years.

MARKET DRIVERS:

  • The rising incorporation of 5G technology is anticipated to drive the market's growth.

The growing internet penetration coupled with rapid advancements in wireless technology is expected to propel the market growth during the forecast period. The growing number of internet users globally is further leading to budding investments by the service providers for the development of faster and more advanced services to meet the requirements of the users by providing better services and gaining an advantage over other providers.

The emergence of 5G technology is further expected to drive the growth of the market during the projected period. Moreover, 5G is expected to operate on much higher frequencies, which is further anticipated to enable the adoption of new interface and component technologies.

  • Participation of key market players is predicted to boost the market.

The participation of key market players in the form of R&D investments, product launches, partnerships, and expansion investments further shows the potential for the market to grow in the coming years. For instance, in November 2021, Soitec acquired the advanced technology company, NOVASiC to enhance its SiC wafer technology. Further, in July 2022, STMicroelectronics and GlobalFoundries announced the signing of a memorandum of understanding according to which, the market giants would set up a 300mm manufacturing facility in Crolles, France for the production of FD-SOI.

  • The RF-SOI market is projected to grow rapidly

By product, the silicon in the insulator market is segmented as RF-SOI, PD-SOI, FD-SOI, power SOI, and others. The RF-SOI market is expected to grow during the forecast period due to rising demand from the consumer electronics sector and networking applications to improve the capabilities of technologies such as mmWave and 5G, among others.

The growing usage of silicon wafers in PD-SOI (Partially depleted) to support the fabrication and development of microprocessors, due to the rising usage in different electronics and semiconductor applications.

In addition, the FD-SOI segment is expected to hold a significant share over the forecast period owing to the burgeoning demand for advanced and enhanced devices from various end-user industries for catering to the various ultra-low-power applications such as FDSOI MOSFETS and multi-gate MOSFETS to aid in the development of the electronics industry.

Asia-Pacific is estimated to hold a significant share of the market

By geography, the silicon on insulator market is segmented into North America, South America, Europe, the Middle East and Africa, and Asia Pacific. Asia-Pacific is estimated to hold a significant share in the base year and is anticipated to grow at a rapid pace as a result of rising investment in smartphone and telecommunication manufacturing in the region. Simultaneously, the growing focus by the government of the United States to promote domestic manufacturing is anticipated to drive the market's growth in the country, while the European market is projected to grow at a steady pace during the forecast period.

The RF-SOI market in Asia-Pacific is projected to grow at a rapid rate as major smartphone manufacturers start incorporating 5G technology. Toshiba Electronic Device & Storage Corporation launched "TaRF11" in February 2020, its latest generation of RF-SOI that has been specifically optimized for RF switches and low-noise amplifiers in 5G mobile devices.

Key Developments:

  • In March 2023, for its 200 mm Bonded Silicon-On-Insulator BSOI and E-SOI(R) wafers, Okmetic, the industry leader in advanced silicon wafer supply for the production of MEMS, sensor, RF, and power devices, has announced the availability of Terrace Free SOI capabilities.
  • In September 2022, the new GRF6402 digital step attenuator (DSA) was launched by Guerrilla RF, Inc. The company is prepared to proceed the production with mass-producing its first silicon-on-insulator (SOI) product after sampling and receiving positive validation from its strategic customer base. This is a significant milestone for Guerrilla RF (GRF), as it signifies the expansion of its current portfolio to now include cutting-edge silicon from one of the top semiconductor foundries in the business.

Segmentation:

By Wafer Size

  • Less than 200mm
  • 200mm
  • 300mm

By Technology

  • Smart Cut
  • Bonding
  • Layer Transfer

By Product

  • RF-SOI
  • PD-SOI
  • FD-SOI
  • Power-SOI
  • Others

By End-User Industry

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Military and Defense
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits for the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SILICON ON INSULATOR (SOI) MARKET, BY WAFER SIZE

  • 5.1. Introduction
  • 5.2. Less than 200mm
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. 200 mm
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. 300 mm
    • 5.4.1. Market Trends and Opportunities
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness

6. SILICON ON INSULATOR (SOI) MARKET, BY TECHNOLOGY

  • 6.1. Introduction
  • 6.2. Smart Cut
    • 6.2.1. Market Trends and Opportunities
    • 6.2.2. Growth Prospects
    • 6.2.3. Geographic Lucrativeness
  • 6.3. Bonding
    • 6.3.1. Market Trends and Opportunities
    • 6.3.2. Growth Prospects
    • 6.3.3. Geographic Lucrativeness
  • 6.4. Layer Transfer
    • 6.4.1. Market Trends and Opportunities
    • 6.4.2. Growth Prospects
    • 6.4.3. Geographic Lucrativeness

7. SILICON ON INSULATOR (SOI) MARKET, BY PRODUCT

  • 7.1. Introduction
  • 7.2. RF-SOI
    • 7.2.1. Market Trends and Opportunities
    • 7.2.2. Growth Prospects
    • 7.2.3. Geographic Lucrativeness
  • 7.3. PD-SOI
    • 7.3.1. Market Trends and Opportunities
    • 7.3.2. Growth Prospects
    • 7.3.3. Geographic Lucrativeness
  • 7.4. FD-SOI
    • 7.4.1. Market Trends and Opportunities
    • 7.4.2. Growth Prospects
    • 7.4.3. Geographic Lucrativeness
  • 7.5. Power-SOI
    • 7.5.1. Market Trends and Opportunities
    • 7.5.2. Growth Prospects
    • 7.5.3. Geographic Lucrativeness
  • 7.6. Others
    • 7.6.1. Market Trends and Opportunities
    • 7.6.2. Growth Prospects
    • 7.6.3. Geographic Lucrativeness

8. SILICON ON INSULATOR (SOI) MARKET, BY END-USER INDUSTRY

  • 8.1. Introduction
  • 8.2. Consumer Electronics
    • 8.2.1. Market Trends and Opportunities
    • 8.2.2. Growth Prospects
    • 8.2.3. Geographic Lucrativeness
  • 8.3. Automotive
    • 8.3.1. Market Trends and Opportunities
    • 8.3.2. Growth Prospects
    • 8.3.3. Geographic Lucrativeness
  • 8.4. Telecommunication
    • 8.4.1. Market Trends and Opportunities
    • 8.4.2. Growth Prospects
    • 8.4.3. Geographic Lucrativeness
  • 8.5. Military and Defense
    • 8.5.1. Market Trends and Opportunities
    • 8.5.2. Growth Prospects
    • 8.5.3. Geographic Lucrativeness
  • 8.6. Others
    • 8.6.1. Market Trends and Opportunities
    • 8.6.2. Growth Prospects
    • 8.6.3. Geographic Lucrativeness

9. SILICON ON INSULATOR (SOI) MARKET, BY GEOGRAPHY

  • 9.1. Introduction
  • 9.2. North America
    • 9.2.1. By Wafer Size
    • 9.2.2. By Technology
    • 9.2.3. By Product
    • 9.2.4. By End-User Industry
    • 9.2.5. By Country
      • 9.2.5.1. USA
        • 9.2.5.1.1. Market Trends and Opportunities
        • 9.2.5.1.2. Growth Prospects
      • 9.2.5.2. Canada
        • 9.2.5.2.1. Market Trends and Opportunities
        • 9.2.5.2.2. Growth Prospects
      • 9.2.5.3. Mexico
        • 9.2.5.3.1. Market Trends and Opportunities
        • 9.2.5.3.2. Growth Prospects
  • 9.3. South America
    • 9.3.1. By Wafer Size
    • 9.3.2. By Technology
    • 9.3.3. By Product
    • 9.3.4. By End-User Industry
    • 9.3.5. By Country
      • 9.3.5.1. Brazil
        • 9.3.5.1.1. Market Trends and Opportunities
        • 9.3.5.1.2. Growth Prospects
      • 9.3.5.2. Argentina
        • 9.3.5.2.1. Market Trends and Opportunities
        • 9.3.5.2.2. Growth Prospects
      • 9.3.5.3. Others
        • 9.3.5.3.1. Market Trends and Opportunities
        • 9.3.5.3.2. Growth Prospects
  • 9.4. Europe
    • 9.4.1. By Wafer Size
    • 9.4.2. By Technology
    • 9.4.3. By Product
    • 9.4.4. By End-User Industry
    • 9.4.5. By Country
      • 9.4.5.1. United Kingdom
        • 9.4.5.1.1. Market Trends and Opportunities
        • 9.4.5.1.2. Growth Prospects
      • 9.4.5.2. Germany
        • 9.4.5.2.1. Market Trends and Opportunities
        • 9.4.5.2.2. Growth Prospects
      • 9.4.5.3. France
        • 9.4.5.3.1. Market Trends and Opportunities
        • 9.4.5.3.2. Growth Prospects
      • 9.4.5.4. Spain
        • 9.4.5.4.1. Market Trends and Opportunities
        • 9.4.5.4.2. Growth Prospects
      • 9.4.5.5. Others
        • 9.4.5.5.1. Market Trends and Opportunities
        • 9.4.5.5.2. Growth Prospects
  • 9.5. Middle East and Africa
    • 9.5.1. By Wafer Size
    • 9.5.2. By Technology
    • 9.5.3. By Product
    • 9.5.4. By End-User Industry
    • 9.5.5. By Country
      • 9.5.5.1. Saudi Arabia
        • 9.5.5.1.1. Market Trends and Opportunities
        • 9.5.5.1.2. Growth Prospects
      • 9.5.5.2. UAE
        • 9.5.5.2.1. Market Trends and Opportunities
        • 9.5.5.2.2. Growth Prospects
      • 9.5.5.3. Israel
        • 9.5.5.3.1. Market Trends and Opportunities
        • 9.5.5.3.2. Growth Prospects
      • 9.5.5.4. Others
        • 9.5.5.4.1. Market Trends and Opportunities
        • 9.5.5.4.2. Growth Prospects
  • 9.6. Asia Pacific
    • 9.6.1. By Wafer Size
    • 9.6.2. By Technology
    • 9.6.3. By Product
    • 9.6.4. By End-User Industry
    • 9.6.5. By Country
      • 9.6.5.1. China
        • 9.6.5.1.1. Market Trends and Opportunities
        • 9.6.5.1.2. Growth Prospects
      • 9.6.5.2. Japan
        • 9.6.5.2.1. Market Trends and Opportunities
        • 9.6.5.2.2. Growth Prospects
      • 9.6.5.3. India
        • 9.6.5.3.1. Market Trends and Opportunities
        • 9.6.5.3.2. Growth Prospects
      • 9.6.5.4. South Korea
        • 9.6.5.4.1. Market Trends and Opportunities
        • 9.6.5.4.2. Growth Prospects
      • 9.6.5.5. Taiwan
        • 9.6.5.5.1. Market Trends and Opportunities
        • 9.6.5.5.2. Growth Prospects
      • 9.6.5.6. Thailand
        • 9.6.5.6.1. Market Trends and Opportunities
        • 9.6.5.6.2. Growth Prospects
      • 9.6.5.7. Indonesia
        • 9.6.5.7.1. Market Trends and Opportunities
        • 9.6.5.7.2. Growth Prospects
      • 9.6.5.8. Others
        • 9.6.5.8.1. Market Trends and Opportunities
        • 9.6.5.8.2. Growth Prospects

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. SOITEC
  • 11.2. Sumco Corporation
  • 11.3. GlobalFoundries
  • 11.4. STMicroelectronics
  • 11.5. NXP Semiconductor
  • 11.6. Shin- Etsu Chemical Co., Ltd.
  • 11.7. Qorvo, Inc.
  • 11.8. Shanghai Simgui Technology Co., Ltd.