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市场调查报告书
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1698484

半导体组装和测试服务 (OSAT) 市场：2025-2030 年预测

Outsourced Semiconductor Assembly And Test Services (OSAT) Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2个工作天内

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简介目录

OSAT 市场预计将从 2025 年的 46,217,376,000 美元增长到 2030 年的 79,913,859,000 美元，复合年增长率为 11.57%。

外包装组装和测试服务 (OSAT) 是一个行业术语，指向半导体企业提供专门的製造和测试服务。半导体製造商聘请 OSAT 公司来组装、封装和测试积体电路 (IC) 和其他设备。各个领域对尖端电子设备的需求不断增长，推动了 OSAT 市场的发展。 OSAT 供应商为半导体企业进行组装和测试，以降低成本并加快交货速度。此外，这些专业服务的需求是由复杂的半导体组件（例如 SoC 设计和改进的封装方法）所驱动的。

OSAT是指将半导体封装、组装、测试外包给IDM（整合设备製造商）和无厂半导体公司的第三方机构。 OSAT 执行关键的后製造步骤，以确保晶片具有所需的性能、可靠性和品质。随着对先进封装（例如 2.5D/3D IC、扇出型）的需求不断增长，OSAT 将促进 AI、5G 和汽车电子市场的成本节约扩展。

市场趋势：

  • 小型化需求不断增加：对更小、更紧凑技术的需求正在激发持续的研究和创新，从而产生推动产业成长的新产品、製造技术和半导体设计。例如，2023年9月，美国国家科学基金会宣布将向24项研究和教育倡议投资4,560万美元，部分资金由2022年《晶片与科学法案》支持。这些计划重点关注半导体技术的进步、生产和劳动力发展。
  • 政府力度不断加大：世界各国政府正采取大胆措施促进国内半导体生产。 2024年3月，印度政府推出了三个总价值约12.5兆浮吨的半导体计划，旨在使印度成为半导体设计、製造和技术的全球领导者。这包括在古吉拉突邦Dholera 特别投资区（DSIR）建立半导体製造工厂；在阿萨姆邦莫里加奥恩建立外包半导体组装和委託(OSAT) 设施；并在古吉拉突邦南德设立 OSAT 工厂。
  • 亚太地区：中国大陆、台湾和韩国正成为半导体组装和製造的重要中心。该地区的 OSAT 供应商提供组装、封装和测试方面的专业技能，提高效率，有助于加快产品推出并缩短上市时间。

本报告涉及的主要企业包括日月光集团、安靠科技、力成科技、南茂科技、京元电子、江苏长电科技、联合科技、菱森精密工业和通富微电子。

本报告的主要优点

  • 深刻分析：获得涵盖主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他子区隔。
  • 竞争格局：了解全球主要企业采取的策略策略，并了解正确策略的市场渗透潜力。
  • 市场趋势和驱动因素：探索动态因素和关键市场趋势以及它们将如何影响市场的未来发展。
  • 可行的建议：利用洞察力进行策略决策，在动态环境中开闢新的业务流和收益。
  • 适用范围广：对于新兴企业、研究机构、顾问公司、中小企业和大型企业来说，它都是实用且具有成本效益的。

它有什么用途？

产业与市场洞察、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、监管影响、新产品开发、竞争情报

研究范围

  • 2022 年至 2024 年的历史数据和 2025 年至 2030 年的预测数据
  • 成长机会、挑战、供应链前景、法律规范与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 收益成长和预测包括国家在内的细分市场和地区分析
  • 公司概况（策略、产品、财务资讯、主要趋势等）

目录

第一章执行摘要

第二章市场概述

  • 市场概览
  • 市场定义
  • 研究范围
  • 市场区隔

第三章 商业景气

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策法规
  • 策略建议

第四章 技术展望

第五章 OSAT 市场（依服务类型）

  • 介绍
  • 包裹
  • 测试
  • 其他的

第六章 OSAT 市场（依封装类型）

  • 介绍
  • 球栅阵列 (BGA) 封装
  • 晶片级封装（CSP）
  • 堆迭晶片封装
  • 多晶片封装
  • 四方扁平和双列直插式封装

第 7 章 OSAT 市场（依设备类型）

  • 介绍
  • 逻辑装置
  • 储存装置
  • 类比和混合讯号设备
  • 其他的

第八章 OSAT 市场应用

  • 介绍
  • 沟通
  • 消费性电子产品
  • 车
  • 运算和网路
  • 产业
  • 其他的

第九章 OSAT 市场：按地区

  • 介绍
  • 美洲
    • 美国
  • 欧洲、中东和非洲
    • 德国
    • 荷兰
    • 其他的
  • 亚太地区
    • 中国
    • 日本
    • 台湾
    • 韩国
    • 其他的

第十章竞争格局及分析

  • 主要企业和策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争仪錶板

第十一章 公司简介

  • ASE Group（ASE Technology Holdings）
  • Amkor Technology Inc.
  • Powertech Technology Inc.
  • ChipMOS Technologies Inc.
  • King Yuan Electronics Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • UTAC Holdings Ltd.
  • Lingsen Precision Industries Ltd.
  • Tongfu Microelectronics Co.

第十二章 附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益
  • 调查方法
  • 简称
简介目录
Product Code: KSI061615732

The OSAT Market, valued at US$ 79,913.859 million in 2030 from US$ 46,217.376 million in 2025, is projected to grow at a CAGR of 11.57%.

Outsourced semiconductor assembly and test services (OSAT) is the industry term for providing specialist manufacturing and testing services to semiconductor businesses. To assemble, package, and test integrated circuits (ICs) and other devices, semiconductor manufacturers employ OSAT companies. The rising demand for cutting-edge electronic gadgets across various sectors is driving the OSAT market. OSAT suppliers conduct assembly and testing for semiconductor businesses to save money and expedite delivery. Furthermore, the need for these specialized services is driven by complex semiconductor components such as SoC designs and improved packaging methods.

OSAT refers to a third-party semiconductor package, assembly, and test outsourcing for IDMs (Integrated Device Manufacturers) and fabless companies. OSATs carry out important post-fabrication processes to guarantee chips of desired performance, reliability, and quality. With the growing need for advanced packaging (e.g., 2.5D/3D IC, fan-out), OSATs facilitate cost-saving scaling for AI, 5G, and automotive electronics markets.

Market Trends:

  • Rising Demand for Miniaturization: The push for smaller, more compact technologies has sparked continuous research and innovation, leading to new products, manufacturing techniques, and semiconductor designs that propel industry growth. For example, in September 2023, the US National Science Foundation announced a $45.6 million investment to fund 24 research and education initiatives, supported in part by the "CHIPS and Science Act of 2022." These efforts focus on advancing semiconductor technology, production, and workforce training.
  • Growing Government Initiatives: Governments worldwide are taking bold steps to bolster domestic semiconductor production. In March 2024, the Indian government launched three semiconductor projects valued at approximately Rs 1.25 lakh crore, aiming to position India as a global leader in semiconductor design, manufacturing, and technology. This includes establishing a semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, an Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam, and another OSAT facility in Sanand, Gujarat.
  • Asia Pacific: China, Taiwan, and South Korea are emerging as key hubs for semiconductor assembly and production. OSAT providers in the region enhance efficiency by offering specialized skills in assembly, packaging, and testing, helping to accelerate product launches and reduce time-to-market.

Some of the major players covered in this report include ASE Group, Amkor Technology Inc., Powertech Technology Inc., ChipMOS Technologies Inc., King Yuan Electronics Co. Ltd, Jiangsu Changjiang Electronics Technology Co. Ltd, UTAC Holdings Ltd, Lingsen Precision Industries Ltd, and Tongfu Microelectronics Co., among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

OSAT Market Segmentation:

By Service Type

  • Packaging
  • Testing
  • Other

By Packaging Type

  • Ball Grid Array (BGA) Packaging
  • Chip-scale Packaging (CSP)
  • Stacked Die Packaging
  • Multi-Chip Packaging
  • Quad Flat and Dual-inline Packaging

By Device Type

  • Logic Devices
  • Memory Devices
  • Analog and Mixed-Signal Devices
  • Others

By Application

  • Communication
  • Consumer Electronics
  • Automotive
  • Computing and Networking
  • Industrial
  • Others

By Region

  • Americas
  • USA
  • Europe, Middle East, and Africa
  • Germany
  • Netherlandss
  • Others
  • Asia Pacific
  • China
  • Japan
  • Taiwan
  • South Korea
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. OSAT MARKET BY SERVICE TYPE

  • 5.1. Introduction
  • 5.2. Packaging
  • 5.3. Testing
  • 5.4. Other

6. OSAT MARKET BY PACKAGING TYPE

  • 6.1. Introduction
  • 6.2. Ball Grid Array (BGA) Packaging
  • 6.3. Chip-scale Packaging (CSP)
  • 6.4. Stacked Die Packaging
  • 6.5. Multi-Chip Packaging
  • 6.6. Quad Flat and Dual-inline Packaging

7. OSAT MARKET BY DEVICE TYPE

  • 7.1. Introduction
  • 7.2. Logic Devices
  • 7.3. Memory Devices
  • 7.4. Analog and Mixed-Signal Devices
  • 7.5. Others

8. OSAT MARKET BY APPLICATION

  • 8.1. Introduction
  • 8.2. Communication
  • 8.3. Consumer Electronics
  • 8.4. Automotive
  • 8.5. Computing and Networking
  • 8.6. Industrial
  • 8.7. Others

9. OSAT MARKET BY GEOGRAPHY

  • 9.1. Introduction
  • 9.2. Americas
    • 9.2.1. USA
  • 9.3. Europe, Middle East, and Africa
    • 9.3.1. Germany
    • 9.3.2. Netherlandss
    • 9.3.3. Others
  • 9.4. Asia Pacific
    • 9.4.1. China
    • 9.4.2. Japan
    • 9.4.3. Taiwan
    • 9.4.4. South Korea
    • 9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. ASE Group (ASE Technology Holdings)
  • 11.2. Amkor Technology Inc.
  • 11.3. Powertech Technology Inc.
  • 11.4. ChipMOS Technologies Inc.
  • 11.5. King Yuan Electronics Co., Ltd.
  • 11.6. Jiangsu Changjiang Electronics Technology Co., Ltd.
  • 11.7. UTAC Holdings Ltd.
  • 11.8. Lingsen Precision Industries Ltd.
  • 11.9. Tongfu Microelectronics Co.

12. APPENDIX

  • 12.1. Currency
  • 12.2. Assumptions
  • 12.3. Base and Forecast Years Timeline
  • 12.4. Key benefits for the stakeholders
  • 12.5. Research Methodology
  • 12.6. Abbreviations