外包半导体组装及检验市场:各流程，各包装类型，各用途，各地区，2024年～2031年

外包半导体组装与检测市场评估，2024-2031

外包半导体组装和测试（OSAT）未来可能会进一步成长，因为它是整个半导体产业的关键组成部分。对更快、更强大的设备（例如智慧型手机和人工智慧）的需求正在推动更复杂的处理器的开发。此外，製造这些先进电路需要高度专业化的设备和经验，促使晶片设计人员将组装和测试外包。这一趋势，加上电子产业的整体成长，正在推动 OSAT 市场的扩张。对经济高效的外包半导体封装和测试的需求不断增长，将推动市场从2024年到2031年以4.65%的复合年增长率增长，到2023年将超过321.0557亿美元，使其估值达到46184.29百万美元。

半导体封装与测试外包市场定义/概述

外包半导体组装和测试（OSAT）是将半导体晶片组装、测试和封装外包给专门从事这些任务的第三方组织。 OSAT 公司在半导体产业的製造供应链中发挥关键作用，提供从晶圆探测和封装到最终测试以及向消费者分销积体电路 (IC) 的广泛服务。

这种外包方式可以让半导体公司专注于自己的核心优势，例如晶片设计和製造，同时利用OSAT供应商的经验和资源进行组装和测试，提高效率并可以实现成本降低。

OSAT 公司通常使用配备专业设备的现代化设施，将半导体晶片组装到基板上，将其封装在保护性封装中，并进行严格的测试以确保品质和性能。这些公司采用引线键合、倒装晶片和硅通孔（TSV）封装等各种封装技术来满足各种半导体应用的多样化需求。

此外，OSAT 供应商通常提供供应链管理、库存管理和物流等增值服务，使半导体公司能够优化营运并更快地将产品推向市场。总体而言，将组装和测试业务外包给 OSAT 营运商已成为半导体产业生产生态系统的重要组成部分，从而促进各种电子设备和系统的创新并推动技术改进。

5G网路部署会推动外包半导体组装和侦测市场吗？

在外包半导体组装和测试 (OSAT) 市场中，5G 网路的引入正在推动对高效能半导体的需求不断增长。由于 5G 技术承诺更高的数据传输速度和更低的延迟，半导体製造商面临着生产满足这些高性能标准的晶片的压力。因此，随着半导体製造商寻求建造和测试这些先进晶片的专业知识，OSAT 服务的需求量很大。

随着 5G 网路成为下一代连接的基础，对尖端半导体解决方案的需求从未如此之大。 OSAT 供应商透过提供针对 5G 晶片特定要求客製化的增强组装和测试能力，在满足这一需求方面发挥关键作用。无论是将复杂的元件整合到微型封装中，还是透过严格的测试流程确保最佳效能，OSAT 公司都处于推动 5G 革命的最前线。

此外，电信、汽车和物联网等各行业支援 5G 的设备的发展显示了 OSAT 服务的长期成长潜力。随着公司利用 5G 技术的革命性力量来推动创新和连接，OSAT 供应商已做好充分准备，透过提供可扩展且高效的半导体组装和检测解决方案来从这一趋势中受益。综上所述，5G网路的部署将成为半导体组装和检测外包市场成长和演变的强大催化剂。

技术复杂性会阻碍半导体封装和测试外包市场的成长吗？

由于半导体封装技术，特别是系统级封装 (SiP) 和 3D 整合的复杂性日益增加，外包半导体组装和测试 (OSAT) 市场正在面临巨大的挑战。这些新的封装技术需要对专用设备和基础设施进行大量投资，从而使 OSAT 公司的资源紧张。

此外，为这些精緻的包装技术开发製造程序需要对细节的一丝不苟和不断改进，从而增加了操作的复杂性。此外，缺乏合格的工人来处理这些复杂的程序给 OSAT 组织带来了额外的挑战，需要不断的培训和人才开发工作来满足行业不断增长的需求。

目录

第1章 全球外包半导体组装及检验(OSAT)市场:简介

• 市场定义
• 市场区隔
• 调查计划
• 前提条件
• 限制事项

第2章 VERIFIED MARKET RESEARCH的调查手法

• 资料探勘
• 资料的三角测量
• Bottom-Up(由下而上)方法
• Top-Down(由上而下)方法
• 调查的流程
• 产业专家的主要洞察
• 资料来源

第3章 摘要整理

• 市场概要
• 生态学的製图
• 绝对的商机
• 市场魅力
• 外包半导体组装及检验(OSAT)的全球市场:各地区分析
• 外包半导体组装及检验(OSAT)的全球市场:各类型
• 外包半导体组装及检验(OSAT)的全球市场:各用途
• 今后的市场机会
• 全球市场明细
• 产品life line

第4章 外包半导体组装及检验(OSAT)的全球市场展望

• 外包半导体组装及检验(OSAT)的世界展开
• 促进因素
• 阻碍因素
• 机会
• 波特的五力分析
• 价值链分析
• 价格分析
• 宏观经济分析

第5章 外包半导体组装及检验(OSAT)的全球市场:各类型

• 概要
• 组装
• 试验
• sewing
• sorting

第6章 外包半导体组装及检验(OSAT)的全球市场:各用途

• 概要
• 通讯
• 消费者·电子产品
• 汽车
• 产业用
• 航太·防卫
• 医疗·医疗保健
• 物流·运输

第7章 外包半导体组装及检验(OSAT)的全球市场:各地区

• 概要
• 北美
• 欧洲
• 亚太地区
• 南美
• 中东·非洲

第8章 外包半导体组装及检验(OSAT)的全球市场:竞争情形

• 概要
• 各公司的市场排行榜
• 主要的发展
• 企业的各地区足迹
• 企业的产业足迹
• ACE矩阵

第9章 企业简介

• ASE Technology Holding Co., Ltd
• UNISEM GROUP
• Powertech Technology
• Sigurd Microelectronics Corporation
• Global Unichip Corp.
• Siliconware Precision Industries Co., Ltd.
• King Yuan ELECTRONICS CO., LTD
• Hana Micron
• East China Technology Co., Ltd.
• Signetics

第10章 VERIFIED MARKET INTELLIGENCE

• VERIFIED MARKET 关于INTELLIGENCE
• 动态的资料的视觉化

Outsourced Semiconductor Assembly And Test Market Valuation - 2024-2031

As outsourced semiconductor assembly and test (OSAT) is a substantial element of the entire semiconductor industry, it is likely to grow further. The demand for more rapid and powerful devices, such as smartphones and artificial intelligence, is driving the development of progressively more complicated processors. Also, the making of these advanced circuits needs highly specialized facilities and experience, thereby encouraging the chip designers in outsourcing assembly and testing. This tendency, combined with the overall growth of the electronics industry, is driving the expansion of the OSAT market. The rising demand for cost-effective and efficient outsourced semiconductor assembly and test is enabling the market grow at a CAGR of 4.65% from 2024 to 2031,as well as enabling the revenue surpass USD 32105.57 Million valued in 2023 to reach a valuation of aroundUSD 46184.29 Million by 2031.

Outsourced Semiconductor Assembly And Test Market: Definition/ Overview

Outsourced Semiconductor Assembly and Test (OSAT) is the process of outsourcing the assembly, testing, and packaging of semiconductor chips to third-party organizations that specialize in these activities. OSAT firms play an important role in the semiconductor industry's manufacturing supply chain, providing services ranging from wafer probing and packaging to final testing and distribution of integrated circuits (ICs) to consumers.

This outsourcing approach enables semiconductor businesses to concentrate on their core strengths, such as chip design and manufacturing, while leveraging the experience and resources of OSAT providers for assembly and testing, resulting in increased efficiency and lower costs.

OSAT companies often operate modern facilities that are outfitted with specialized equipment for assembling semiconductor chips onto substrates, enclosing them in protective packages, and undergoing rigorous testing to assure quality and performance. These firms use a variety of packaging technologies, such as wire bonding, flip-chip, and through-silicon via (TSV) packaging, to fulfill the varying needs of various semiconductor applications.

Furthermore, OSAT providers frequently provide value-added services such as supply chain management, inventory management, and logistics, allowing semiconductor companies to optimize their operations and get goods to market quickly. Overall, outsourcing assembly and test operations to OSAT businesses has become an essential component of the semiconductor industry's production ecosystem, enabling innovation and pushing technological improvements across a wide range of electronic devices and systems.

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Will 5G Networks Deployments Drive the Outsourced Semiconductor Assembly And Test Market?

In the Outsourced Semiconductor Assembly and Testing (OSAT) market, the implementation of 5G networks is driving an increase in demand for high-performance semiconductors. As 5G technology promises higher data rates and low latency, semiconductor makers are under pressure to build chips that match these high-performance standards. As a result, OSAT services are in high demand as semiconductor companies seek specialized knowledge in building and testing these advanced chips.

With 5G networks becoming the foundation of next-generation connectivity, the demand for cutting-edge semiconductor solutions is greater than ever. OSAT suppliers play a critical role in meeting this demand by providing enhanced assembly and testing capabilities that are tailored to the specific requirements of 5G-compatible chips. Whether it's integrating complex components into small packaging or assuring optimal performance through rigorous testing processes, OSAT companies are at the forefront of enabling the 5G revolution.

Furthermore, the development of 5G-enabled devices in a variety of industries, including telecoms, automotive, and IoT, indicates the long-term growth potential for OSAT services. As businesses harness the revolutionary power of 5G technology to drive innovation and connectivity, OSAT suppliers are well-positioned to benefit from this trend by providing scalable and efficient semiconductor assembly and testing solutions. In summary, the deployment of 5G networks acts as a potent catalyst for the growth and evolution of the Outsourced Semiconductor Assembly and Testing market.

Will Technological Complexity Hamper the Growth of Outsourced Semiconductor Assembly And Test Market?

The outsourced semiconductor assembly and test (OSAT) market is a considerable challenge due to the increasing complexity of semiconductor packaging technologies, particularly System-in-Package (SiP) and 3D integration. These new packaging technologies demand significant investments in specialized equipment and infrastructure, which put pressure on OSAT firms' resources.

Furthermore, developing manufacturing procedures for these delicate packaging technologies requires extreme care for detail and constant refinement, adding complexity to operations. Furthermore, the lack of qualified workers capable of handling these complicated procedures creates an additional challenge for OSAT organizations, demanding constant training and talent development activities to meet the industry's increasing demands.

Category-Wise Acumens

How wWill Assembly Segment Drive the Demand in the Growth of Outsourced Semiconductor Assembly And Test Market?

In the outsourced semiconductor assembly and test (OSAT) market, the assembly segment is the key revenue generator owing to the constant development in demand for consumer electronics and telecommunications infrastructure. The global demand for smartphones, laptops, and advanced networking equipment has risen dramatically, as has the demand for efficient chip assembly.

OSAT businesses are at the forefront of satisfying this demand by precisely attaching chips to protective packages that allow for smooth interaction with other components on circuit boards. This crucial position ensures the proper operation of electronic equipment required for modern lives and commercial activities.

As consumer demands for quicker, smaller, and more feature-rich devices grow, the role of OSAT firms in the semiconductor supply chain becomes increasingly important. These companies not only handle intricate assembly procedures, but they also help to innovate packaging methods to satisfy changing market demands. By delivering efficient and dependable assembly services, OSAT companies let semiconductor manufacturers concentrate on key capabilities such as design and innovation, driving overall industry growth. The beneficial interaction between OSAT providers and the booming consumer electronics and telecommunications sectors highlights their critical role in defining the future of semiconductor technology.

Will Increasing Demand for Electrical Device Propel the Outsourced Semiconductor Assembly And Test Market?

Consumer electronics is a competitive area of the outsourced semiconductor assembly and test (OSAT) market, driven by the constant spike in demand for smartphones, laptops, tablets, and other electronic devices. These devices require significantly complicated miniaturized chips, for which OSAT businesses provide essential assembly and testing services. By methodically assembling and testing these chips, OSAT companies ensure the seamless performance of the electronic components that power our everyday electronics, hence improving the user experience.

The dynamic environment of consumer electronics, marked by ongoing innovation and refresh cycles, increases the need for efficient and high-volume OSAT services. As consumers desire more advanced features, improved performance, and sleeker designs in their electronic products, semiconductor makers must keep up with these changing expectations. OSAT firms play an essential role in this ecosystem by providing flexible and scalable assembly and testing solutions, allowing semiconductor makers to quickly react to changing market trends and deliver cutting-edge products to consumers throughout the world.

Country/Region Wise Acumens

Will the Asia Pacific Region Emerge the Outsourced Semiconductor Assembly And Test Market?

Asia Pacific emerges as the market leader in Outsourced Semiconductor Assembly and Test (OSAT) services, accounting for a significant 60.2% of total revenue in 2022. This supremacy is partly due to the region's strong presence of leading companies and significant innovators, like ASE Technology Holding Co., ChipMOS Technologies Inc., and HANA Micron Inc. Furthermore, the fast adoption of robotic processes in different industries, particularly automotive and consumer electronics, in nations such as Japan, South Korea, India, and China boosted the growth trajectory.

Notably, China, India, and Taiwan are key regions in Asia Pacific, with exponential growth in the semiconductor market. These regions are expected to dramatically increase their market share in the coming years, encouraged by favorable government initiatives and rising demand for semiconductor-related services.

In an effort to strengthen its semiconductor ecosystem, the Indian government announced a change to its current strategy for creating semiconductor-related facilities. Under the revamped policy, qualifying applicants would get a significant increase in financial aid, with the government agreeing to cover 50% of capital expenditure (CAPEX), up from 30% previously.

Similarly, Taiwan made significant steps to strengthen its semiconductor industry, announcing a detailed five-year plan in 2020. Taiwan plans to invest USD 54.15 million in the semiconductor business to build a qualified workforce for research and development. These strategic initiatives highlight governments' collaborative efforts in Asia Pacific to nurture and accelerate the expansion of the semiconductor sector, consequently increasing demand for outsourced assembly and testing services in the area.

How Will Increasing Adoption of the Smart Device Drive Growth in North America for the Outsourced Semiconductor Assembly And Test Market?

North America is expected to develop at the quickest CAGR of 8.5% over the forecast period. Increased adoption of the Internet of Things (IoT), artificial intelligence, and smart devices in industries such as healthcare, transportation, and manufacturing is one of the factors driving growth. For example, during and after the COVID-19 pandemic, there was an increase in demand for semiconductors, which drove demand for OSAT services.

In 2021, the United States overtook the North American OSAT market, accounting for more than 78%. Leading businesses, including Amkor Technology Inc. and Aehr Test Systems, account for the majority of revenue in the United States. Increased demand for OSAT services from end users, including EV, defense, and aerospace industries including Tesla, Rivian, Boeing, Lockheed Martin, and GE Aviation, is driving market expansion. Furthermore, the growing demand for semiconductor testing services across computer and data storage devices in the United States and Canada is helping to drive growth.

Competitive Landscape

The outsourced semiconductor assembly and test market is a dynamic and competitive space, characterized by a diverse range of players vying for market share. These players are on the run for solidifying their presence through the adoption of strategic plans such as collaborations, mergers, acquisitions, and political support.

The organizations are focusing on innovating their product line to serve the vast population in diverse regions. Some of the prominent players operating in the outsourced semiconductor assembly and test market include:

• Amkor Technology, ASE Technology, SPIL, TSMC, Advanced Semiconductor Engineering, Huamao Microelectronics, Jiangsu Changjiang Electronics Technology, Powertech Technology, Sigurd Microelectronics, Global Unichip Corporation, Greate Wall Technology, Tessera Technology, Teradyne, Advantest, Cohu, ASE Hong Kong, Foxconn Interconnect Technology.

Latest Developments

• In December 2023, Sahasra Electronics, a Noida-based company, announced plans to invest around INR 350 crore (USD 42.2 million) over three years. The investment will be used to create a semiconductor packaging plant and expand manufacturing operations as part of the 'Make in India' initiative. The company intends to acquire electronic assembly machines, resulting in an investment of more than INR 150 crore (USD 18.1 million) for the plant, with an additional INR 50 crore (USD 6 million) allocated to the interior of the building. Such expenditures to improve semiconductor packaging and assembly services are likely to strengthen the market's potential.
• In November 2023, JCET Automotive Electronics (Shanghai) Co. Ltd is set to receive a capital injection of RMB 4.4 billion (USD 0.61 billion), bringing the total registered capital to RMB 4.8 billion (USD 0.67 billion). This investment will accelerate the development of an advanced packaging factory for automotive chip products in Shanghai's Lingang Special Area.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET

• 1.1 Market Definition
• 1.2 Market Segmentation
• 1.3 Research Timelines
• 1.4 Assumptions
• 1.5 Limitations

2 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

• 2.1 Data Mining
• 2.2 Data Triangulation
• 2.3 Bottom-Up Approach
• 2.4 Top-Down Approach
• 2.5 Research Flow
• 2.6 Key Insights from Industry Experts
• 2.7 Data Sources

3 EXECUTIVE SUMMARY

• 3.1 Market Overview
• 3.2 Ecology Mapping
• 3.3 Absolute Market Opportunity
• 3.4 Market Attractiveness
• 3.5 Global Outsourced Semiconductor Assembly And Test (OSAT) Market Geographical Analysis (CAGR %)
• 3.6 Global Outsourced Semiconductor Assembly And Test (OSAT) Market, By Type (USD Million)
• 3.7 Global Outsourced Semiconductor Assembly And Test (OSAT) Market, By Application (USD Million)
• 3.8 Future Market Opportunities
• 3.9 Global Market Split
• 3.10 Product Life Line

4 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET OUTLOOK

• 4.1 Global Outsourced Semiconductor Assembly And Test (OSAT) Evolution
• 4.2 Drivers
  • 4.2.1 Driver 1
  • 4.2.2 Driver 2
• 4.3 Restraints
  • 4.3.1 Restraint 1
  • 4.3.2 Restraint 2
• 4.4 Opportunities
  • 4.4.1 Opportunity 1
  • 4.4.2 Opportunity 2
• 4.5 Porters Five Force Model
• 4.6 Value Chain Analysis
• 4.7 Pricing Analysis
• 4.8 Macroeconomic Analysis

5 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY TYPE

• 5.1 Overview '
• 5.2 Assembly
• 5.3 Testing
• 5.4 Sawing
• 5.5 Sorting

6 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION

• 6.1 Overview
• 6.2 Telecommunication
• 6.3 Consumer Electronics,
• 6.4 Automative
• 6.5 Industrial
• 6.6 Aerospace and Defense
• 6.7 Medical and Healthcare
• 6.8 Logistics and Transportation

7 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY GEOGRAPHY

• 7.1 Overview
• 7.2 North America
• 7.3 Europe
• 7.4 Asia Pacific
• 7.5 Latin America
• 7.6 Middle-East and Africa

8 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET COMPETITIVE LANDSCAPE

• 8.1 Overview
• 8.2 Company Market Ranking
• 8.3 Key Developments
• 8.4 Company Regional Footprint
• 8.5 Company Industry Footprint
• 8.6 ACE Matrix

9 COMPANY PROFILES

• 9.1 ASE Technology Holding Co., Ltd
  • 9.1.1 Company Overview
  • 9.1.2 Company Insights
  • 9.1.3 Product Benchmarking
  • 9.1.4 Key Developments
  • 9.1.5 Winning Imperatives
  • 9.1.6 Current Focus & Strategies
  • 9.1.7 Threat from Competition
  • 9.1.8 SWOT Analysis
• 9.2 UNISEM GROUP
• 9.3 Powertech Technology
• 9.4 Sigurd Microelectronics Corporation
• 9.5 Global Unichip Corp.
• 9.6 Siliconware Precision Industries Co., Ltd.
• 9.7 King Yuan ELECTRONICS CO., LTD
• 9.8 Hana Micron
• 9.9 East China Technology Co., Ltd.
• 9.10 Signetics

10 VERIFIED MARKET INTELLIGENCE

• 10.1 About Verified Market Intelligence
• 10.2 Dynamic Data Visualization