中介层的全球市场:趋势，机会，竞争分析

全球中介层的市场规模在2021年～2027年间预计将以17.4％的年复合成长率增长，到2027年将达到7亿2,870万美元。市场成长的主要促进因素有对2.5D 和3D IC 封装的需求不断增长以及电子设备的小型化。

本报告提供全球中介层市场的相关调查，提供市场趋势，预测分析，竞争分析，企业简介等全面性资讯。

目录

第1章 摘要整理

第2章 全球中介层市场背景与分类

• 简介，背景，及分类
• 供应链
• 中介层市场主要趋势
• 产业的原动力与课题

第3章 市场趋势与预测分析(2016年～2027年)

• 宏观经济的趋势与预测
• 全球中介层市场趋势与预测
• 全球中介层市场:各产品类型
  • 2D中介层
  • 2.5D中介层
  • 3D中介层
• 全球中介层市场:各用途
  • CIS
  • CPU/GPU
  • MEMS 3D 封盖中介层
  • RF设备
  • LogicSoC
  • ASIC/FPGA
  • 其他

第4章 市场趋势与预测分析:各地区

• 全球中介层市场:各地区
• 北美的中介层市场趋势与预测
• 欧洲的中介层市场趋势与预测
• 亚太地区的中介层市场趋势与预测
• 其他的中介层市场趋势与预测

第5章 竞争的分析

• 产品系列分析
• 运用整合
• 地理范围
• 波特的五力分析

第6章 成长机会及策略分析

• 成长机会分析
  • 全球中介层市场成长机会:各产品类型
  • 全球中介层市场成长机会:各用途
  • 全球中介层市场成长机会:各地区
• 全球中介层市场新的趋势
• 策略分析
  • 新产品的开发
  • 全球中介层市场的合併，收购，合资企业
  • 全球中介层市场上技术开发

第7章 主要企业的企业简介

• Murata Manufacturing Company, Ltd
• Amkor Technology
• AGC
• Atomica
• TSMC
• Tezzaron
• Plan Optik AG
• Xilinx
• ALLVIA
• UMC(United Microelectronics Corporation)

Interposer Market Trends and Forecast

The future of the interposer market looks promising with opportunities in the CIS, CPU/GPU, MEMS 3D capping interposer, RF devices, logic SoC, and ASIC/FPGA markets. The global interposer market is expected to reach an estimated $728.7 million by 2027 with a CAGR of 17.4% from 2021 to 2027. The major drivers for this market are growing demand for 2.5D and 3D IC packaging and the miniaturization of electronic devices.

Emerging Trends in the Interposer Market

Emerging trends, which have a direct impact on the dynamics of the interposer industry, include increasing reticle size of interposer and growing adoption of RDL interposer technology for heterogeneous integration.

A total of 107 figures / charts and 68 tables are provided in this 205-page report to help in your business decisions. Learn the scope of benefits, companies researched, and other details of the interposer market report.

Interposer Market by Segment

The study includes trends and forecast for the global interposer market by product type, application, and region as follows:

Interposer Market by Product Type [$M shipment analysis for 2016 - 2027]:

• 2D Interposer
• 2.5D Interposer
• 3D Interposer

Interposer Market by Application [$M shipment analysis for 2016 - 2027]:

• CIS
• CPU/GPU
• MEMS 3D Capping Interposer
• RF Devices
• Logic SoC
• ASIC/FPGA
• Others

Interposer Market by Region [$M shipment analysis for 2016 - 2027]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Interposer Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies interposer companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the interposer companies profiled in this report includes.

• Murata
• Amkor
• AGC
• Atomica
• TSMC

Interposer Market Insight

• Lucintel forecasts that ASIC/FPGA will remain the largest application during the forecast period due to growing demand of artificial intelligence, autonomous car, and machine learning.
• 2.5D interposer will remain the largest segment due to better speed, power, heterogeneous integration, and simplified integration properties.
• Asia Pacific will remain the largest region over the forecast period due to the presence of large foundries and manufacturing hub for electronic devices. Economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as 5G, Internet of things (IoT), and artificial intelligence (AI) driving the demand for semiconductor and advance IC packaging in this region, thereby demand for interposer will also grow.

Features of Interposer Market

• Market Size Estimates: Interposer market size estimation in terms of value ($B)
• Trend and Forecast Analysis: Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
• Segmentation Analysis: Market size by product type and application
• Regional Analysis: Interposer market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis of growth opportunities in different product type, application, and regions for the interposer market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape for the interposer market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the interposer market size?

Answer: The global interposer market is expected to reach an estimated $728.7 million by 2027.

Q2. What is the growth forecast for interposer market?

Answer: The interposer market is expected to grow at a CAGR of 17.4% from 2021 to 2027.

Q3. What are the major drivers influencing the growth of the interposer market?

Answer: The major drivers for this market are growing demand for 2.5D and 3D IC packaging and the miniaturization of electronic devices.

Q4. What are the major applications or end use industries for interposer?

Answer: ASIC and MEMS are the major end use industries for interposer.

Q5. What are the emerging trends in interposer market?

Answer: Emerging trends, which have a direct impact on the dynamics of the interposer industry, include increasing reticle size of interposer and growing adoption of RDL interposer technology for heterogeneous integration.

Q6. Who are the key interposer companies?

Answer: Some of the key interposer companies are as follows:

• Murata
• Amkor
• AGC
• Atomica
• TSMC

Q7. Which interposer product segment will be the largest in future?

Answer: Lucintel forecasts that 2.5D interposer will remain the largest segment due to better speed, power, heterogeneous integration, and simplified integration properties.

Q8 : In interposer market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years.

Q9. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

• Q.1 What are some of the most promising potential, high growth opportunities for the global interposer market by product type (2D interposer, 2.5D interposer, and 3D interposer), application (CIS, CPU/GPU, MEMS 3D capping interposer, RF devices, logic SoC, ASIC/FPGA, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q. 2 Which segments will grow at a faster pace and why?
• Q.3 Which regions will grow at a faster pace and why?
• Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
• Q.5 What are the business risks and threats to the market?
• Q.6 What are the emerging trends in this market and the reasons behind them?
• Q.7 What are the changing demands of customers in the market?
• Q.8 What are the new developments in the market? Which companies are leading these developments?
• Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
• Q.1 0 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
• Q.1 1 What M & A activities have taken place in the last 5 years in this market?

Table of Contents

1. Executive Summary

2. Global Interposer Market Background and Classifications

• 2.1: Introduction, Background, and Classification
• 2.2: Supply Chain
• 2.3: Key Trends for the Interposer Market
• 2.4: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2016 to 2027

• 3.1: Macroeconomic Trends and Forecasts
• 3.2: Global Interposer Market Trends and Forecast
• 3.3: Global Interposer Market by Product Type
  • 3.3.1: 2D Interposers
  • 3.3.2: 2.5D Interposers
  • 3.3.3: 3D Interposers
• 3.4: Global Interposer Market by Application
  • 3.4.1: CIS
  • 3.4.2: CPU/GPU
  • 3.4.3: MEMS 3D Capping Interposers
  • 3.4.4: RF Devices
  • 3.4.5: Logic SoC
  • 3.4.6: ASIC/FPGA
  • 3.4.7: Others

4. Market Trends and Forecast Analysis from 2016 to 2027

• 4.1: Global Interposer Market by Region
• 4.2: North American Interposer Market Trends and Forecast
• 4.3: European Interposer Market Trends and Forecast
• 4.4: APAC Interposer Market Trends and Forecast
• 4.5: ROW Interposer Market Trends and Forecast

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Geographical Reach
• 5.4: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Interposer Market by Product Type
  • 6.1.2: Growth Opportunities for the Global interposer Market by Application
  • 6.1.3: Growth Opportunities for the Global Interposer Market by Region
• 6.2: Emerging Trends in the Global Interposer Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Mergers, Acquisitions, and Joint Ventures in the Global Interposer Market
  • 6.3.3: Technological Development in the Global Interposer Market

7. Company Profiles of Leading Players

• 7.1: Murata Manufacturing Company, Ltd
• 7.2: Amkor Technology
• 7.3: AGC
• 7.4: Atomica
• 7.5: TSMC
• 7.6: Tezzaron
• 7.7: Plan Optik AG
• 7.8: Xilinx
• 7.9: ALLVIA
• 7.10: UMC (United Microelectronics Corporation)