扇出封装报告：2030 年趋势、预测与竞争分析

扇出封装趋势和预测

预计到 2030 年，全球扇出封装市场将达到 68 亿美元，2024 年至 2030 年复合年增长率为 15.7%。该市场的主要驱动力包括由于高性能、高能源效率、薄型和小尺寸等外形封装要求，在智慧型手机等占地面积敏感设备中的应用不断增长。全球扇出封装市场未来性广阔，OSAT、晶圆代工厂和IDM市场蕴含机会。

扇出封装市场洞察

Lucintel 正在利用其晶圆级加工製造能力以及使用穿模互连开发 3D 结构的能力，包括高铜 (Cu) 柱、封装通孔 (TPVS) 和先进的覆晶封装技术。我们预计高密度扇出将继续成为整个预测期内最大的部分，因为它有助于满足要求。

晶圆代工厂将继续成为该市场中最大的部分。

由于主要半导体製造商在该地区的存在，预计亚太地区在预测期内将出现最高的成长。

常问问题

Q.1 扇出封装的市场规模有多大？

A1. 到 2030 年，全球扇出封装市场预计将达到 68 亿美元。

Q.2 扇出封装市场的成长预测为何？

A2. 2024年至2030年，全球扇出封装市场预计将以15.7%的复合年增长率成长。

Q.3 影响扇出封装市场成长的关键因素有哪些？

A3. 该市场的主要驱动力是由于高性能、高能源效率、薄型和小尺寸等封装要求，在智慧型手机等占地面积敏感设备中的应用不断增长。例如，

Q4.市场的主要细分市场是什么？

A4. 扇出封装市场未来性广阔，OSAT、晶圆代工厂、IDM 领域都存在市场机会。

Q5. 市场上主要企业有哪些？

A5. 一些主要的扇出封装公司如下：

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Q6.未来最大的细分市场是什么？

A6.Lucintel 规模较小，这要归功于其晶圆级加工製造能力以及使用穿模互连开发 3D 结构的能力，例如高铜 (Cu) 柱、封装通孔 (TPVS) 和先进的覆晶封装技术。我们预测，高密度扇出将继续成为整个预测期内最大的细分市场，因为它有助于满足成长要求。

Q7. 未来五年预计哪个地区将成为最大的市场？

A7. 由于主要半导体製造商在该地区的存在，预计亚太地区在预测期内将出现最高增长。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球扇出封装市场：市场动态

• 简介、背景、分类
• 供应链
• 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

• 宏观经济趋势（2018-2023）与预测（2024-2030）
• 全球扇出封装市场趋势（2018-2023）与预测（2024-2030）
• 按类型分類的全球扇出封装市场
  • 核心扇出
  • 高密度扇出
  • 超密集扇出
• 按运营商类型分類的全球扇出封装市场
  • 200mm
  • 300mm
  • 控制板
• 以经营模式分類的全球扇出封装市场
  • OSAT
  • 晶圆代工厂
  • IDM

第四章 2018-2030年区域市场趋势及预测分析

• 全球扇出封装市场（按地区）
• 北美扇出型封装市场
• 欧洲扇出型封装市场
• 亚太扇出封装市场
• 世界其他地区 (ROW) 扇出封装市场

第五章 竞争分析

• 产品系列分析
• 营运整合
• 波特五力分析

第六章 成长机会与策略分析

• 成长机会分析
  • 按类型分類的全球扇出封装市场成长机会
  • 按载体类型分類的全球扇出封装市场成长机会
  • 以经营模式分類的全球扇出型封装市场成长机会
  • 全球扇出封装市场的区域成长机会
• 全球扇出封装市场的新兴趋势
• 战略分析
  • 新产品开发
  • 扩大全球扇出封装市场产能
  • 全球扇出封装市场的合併、收购与合资企业
  • 认证和许可

第七章主要企业概况

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Fan Out Packaging Trends and Forecast

The future of the global fan out packaging market looks promising with opportunities in the OSAT, foundary, and IDM markets. The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030 with a CAGR of 15.7% from 2024 to 2030. The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

A more than 150-page report is developed to help in your business decisions.

Fan Out Packaging by Segment

The study includes a forecast for the global fan out packaging by type, carrier ttype, business model, and region

Fan Out Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Core Fan-Out
• High-Density Fan-Out
• Ultra High-density Fan Out

Fan Out Packaging Market by Carrier Type [Shipment Analysis by Value from 2018 to 2030]:

• 200 mm
• 300 mm
• Panel

Fan Out Packaging Market by Business Model [Shipment Analysis by Value from 2018 to 2030]:

• OSAT
• Foundary
• IDM

Fan Out Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Fan Out Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies fan out packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the fan out packaging companies profiled in this report include-

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Fan Out Packaging Market Insights

Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Within this market, foundary will remain the largest segment.

APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Features of the Global Fan Out Packaging Market

Market Size Estimates: Fan out packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Fan out packaging market size by type, carrier type, business model, and region in terms of value ($B).

Regional Analysis: Fan out packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, carrier types, business models, and regions for the fan out packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the fan out packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the fan out packaging market size?

Answer: The global fan out packaging market is expected to reach an estimated $6.8 billion by 2030.

Q.2 What is the growth forecast for fan out packaging market?

Answer: The global fan out packaging market is expected to grow with a CAGR of 15.7% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the fan out packaging market?

Answer: The major drivers for this market are growing applications in footprint sensitive devices like smartphones, owing to requirement of high performing, energy efficient, thin, and small form factor packages.

Q4. What are the major segments for fan out packaging market?

Answer: The future of the fan out packaging market looks promising with opportunities in the OSAT, foundary, IDM markets.

Q5. Who are the key fan out packaging market companies?

Answer: Some of the key fan out packaging companies are as follows:

• Taiwan Semiconductor
• Jiangsu Changjiang Electronics
• Samsung Electro-Mechanics
• Powertech Technology
• Amkor Technology
• Advanced Semiconductor
• Nepes Corporation

Q6. Which fan out packaging market segment will be the largest in future?

Answer: Lucintel forecast that high-density fan out will remain the largest segment over the forecast period as it helps in meeting the requirement of miniaturization by fabrication capabilities of wafer-level processing along with its ability to develop 3D structures utilizing through-mold interconnects, such as tall copper (CU) pillars and through package vias (TPVS) and advanced flip chip packaging technologies.

Q7. In fan out packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturers in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the fan out packaging market by type (core fan-out, high-density fan-out, and ultra high-density fan out), carrier type (200 mm, 300 mm, and panel), business model (OSAT, foundary, and IDM), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Fan Out Packaging Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global Fan Out Packaging Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global Fan Out Packaging Market by Type
  • 3.3.1: Core Fan-Out
  • 3.3.2: High-Density Fan-Out
  • 3.3.3: Ultra High-density Fan Out
• 3.4: Global Fan Out Packaging Market by Carrier Type
  • 3.4.1: 200 mm
  • 3.4.2: 300 mm
  • 3.4.3: Panel
• 3.5: Global Fan Out Packaging Market by Business Model
  • 3.5.1: OSAT
  • 3.5.2: Foundary
  • 3.5.3: IDM

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global Fan Out Packaging Market by Region
• 4.2: North American Fan Out Packaging Market
  • 4.2.1: North American Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.2.2: North American Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
• 4.3: European Fan Out Packaging Market
  • 4.3.1: European Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.3.2: European Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
• 4.4: APAC Fan Out Packaging Market
  • 4.4.1: APAC Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.4.2: APAC Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM
• 4.5: ROW Fan Out Packaging Market
  • 4.5.1: ROW Fan Out Packaging Market by Type: Core Fan-Out, High-Density Fan-Out, and Ultra High-density Fan Out
  • 4.5.2: ROW Fan Out Packaging Market by Business Model: OSAT, Foundary, and IDM

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Fan Out Packaging Market by Type
  • 6.1.2: Growth Opportunities for the Global Fan Out Packaging Market by Carrier Type
  • 6.1.3: Growth Opportunities for the Global Fan Out Packaging Market by Business Model
  • 6.1.4: Growth Opportunities for the Global Fan Out Packaging Market Region
• 6.2: Emerging Trends in the Global Fan Out Packaging Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Fan Out Packaging Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Fan Out Packaging Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Taiwan Semiconductor
• 7.2: Jiangsu Changjiang Electronics
• 7.3: Samsung Electro-Mechanics
• 7.4: Powertech Technology
• 7.5: Amkor Technology
• 7.6: Advanced Semiconductor
• 7.7: Nepes Corporation