3D IC及2.5D IC封装市场:趋势，机会，竞争分析【2023-2028年】

3D IC及2.5D IC封装市场趋势与预测

到2028年，全球3D IC和2.5D IC封装市场预计将达到811亿美元，2023年至2028年的复合年增长率为11%。该市场的主要推动力是对基于物联网的小型设备的需求不断增长、5G 技术的出现以及高端计算、服务器和数据中心的激增。全球3D IC和2.5D IC封装市场前景广阔，消费电子、工业、通信、汽车、军事与航空航天、医疗器械等行业蕴藏商机。

该报告回答了下列 11个主要问题：

• Q.1. 全球3D IC及2.5D IC封装市场上的各个部门，最有前途和高增长机会的会是什么？
• Q.2. 哪些细分市场将以更快的速度增长？为什么？
• Q.3. 哪个地区的增长速度会更快？为什么？
• Q.4. 影响市场动态的关键因素有哪些？这个市场的主要挑战和商业风险是什么？
• Q.5. 这个市场的商业风险和竞争威胁是什么？
• Q.6. 这个市场的新兴趋势及其背后的原因是什么？
• Q.7. 市场上客户的需求有哪些变化？
• Q.8. 市场有哪些新发展？哪些公司正在引领这些发展？
• Q.9. 谁是这个市场的主要参与者？主要参与者正在采取哪些战略举措来实现业务增长？
• Q.10. 这个市场上有哪些竞争产品？它们对材料或产品替代造成的市场占有率损失有多大威胁？
• Q.11. 过去五年发生了哪些併购活动？其对行业有何影响？

目录

第1章 摘要整理

第2章 全球3D IC及2.5D IC封装市场:市场动态

• 简介，背景，分类
• 供应链
• 产业的推动因素与课题

第3章 从2017年到2028年的市场趋势与预测分析

• 宏观经济趋势(2017～2022年)与预测(2023～2028年)
• 全球3D IC及2.5D IC封装市场趋势(2017～2022年)及预测(2023～2028年)
• 各封装技术的全球3D IC及2.5D IC封装市场
  • 3D晶圆层级晶片- 规模包装(WLCSP)
  • 3D穿透硅通孔(TSV)
  • 2.5D
• 各应用领域的全球3D IC及2.5D IC封装市场
  • 逻辑
  • 成像和光电
  • 记忆体
  • MEMS/感测器
  • LED
  • 其他
• 各最终用途产业全球3D IC及2.5D IC封装市场
  • 家电
  • 产业用
  • 电讯
  • 汽车
  • 军事及航太
  • 医疗设备
  • 其他

第4章 从2017年到2028年的各地区的市场趋势与预测分析

• 各地区的全球3D IC及2.5D IC封装市场
• 北美的3D IC及2.5D IC封装市场
• 欧洲的3D IC及2.5D IC封装市场
• 亚太地区 3D IC及2.5D IC封装市场
• 其他地区 3D IC及2.5D IC封装市场

第5章 竞争的分析

• 产品系列分析
• 运用上的整合
• 波特的五力分析

第6章 成长机会及策略性分析

• 成长机会分析
  • 封装技术的全球3D IC及2.5D IC封装市场成长机会
  • 各应用领域的全球3D IC及2.5D IC封装市场成长机会
  • 各最终用途产业全球3D IC及2.5D IC封装市场成长机会
  • 各地区的全球3D IC及2.5D IC封装市场成长机会
• 全球3D IC及2.5D IC封装市场新的趋势
• 策略性分析
  • 新产品的开发
  • 全球3D IC及2.5D IC封装市场能力扩大
  • 全球3D IC及2.5D IC封装市场的合併，收购，合资企业
  • 认证和授权

第7章 主要企业的企业简介

• Taiwan Semiconductor Manufacturing
• Samsung Electronics
• Toshiba
• Advanced Semiconductor Engineering
• Amkor Technology

3D IC and 2.5D IC Packaging Market Trends and Forecast

The future of the global 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries. The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028 with a CAGR of 11% from 2023 to 2028. The major drivers for this market are growing demand for miniaturized IoT based devices, emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.

A more than 150-page report is developed to help in your business decisions.

3D IC and 2.5D IC Packaging Market by Segment

The study includes trends and forecast for the global 3D IC and 2.5D IC packaging market by packaging technology, application, end use industry, and region, as follows:

3D IC and 2.5D IC Packaging Market by Packaging Technology [Shipment Analysis by Value from 2017 to 2028]:

• 3D Wafer-Level Chip-Scale Packaging (WLCSP)
• 3D Through-Silicon Via (TSV)
• 2.5D

3D IC and 2.5D IC Packaging Market by Application [Shipment Analysis by Value from 2017 to 2028]:

• Logic
• Imaging & Optoelectronics
• Memory
• MEMS/Sensors
• LED
• Others

3D IC and 2.5D IC Packaging Market by End Use Industry [Shipment Analysis by Value from 2017 to 2028]:

• Consumer Electronics
• Industrial
• Telecommunications
• Automotive
• Military & Aerospace
• Medical Devices
• Others

3D IC and 2.5D IC Packaging Market by Region [Shipment Analysis by Value from 2017 to 2028]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of 3D IC and 2.5D IC Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, 3D IC and 2.5D IC packaging companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 3D IC and 2.5D IC packaging companies profiled in this report include:

• Taiwan Semiconductor Manufacturing
• Samsung Electronics
• Toshiba
• Advanced Semiconductor Engineering
• Amkor Technology

3D IC and 2.5D IC Packaging Market Insights

• Lucintel forecasts that the MEMS/sensor segment is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
• Consumer electronics is expected to remain the largest segment due to the increasing adoption of 3D IC and 2.5D IC packaging based innovative memories, such as double-data-rate (DDR) DRAM and flash memory in the electronic devices, like smartphones and tablets.
• APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs from the telecommunication and automotive industries, and the presence of key manufacturers in the region.

Features of the 3D IC and 2.5D IC Packaging Market

• Market Size Estimates: 3D IC and 2.5D IC packaging market size estimation in terms of value ($B)
• Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
• Segmentation Analysis: 3D IC and 2.5D IC packaging market size by various segments, such as by packaging technology, application, end use industry, and region
• Regional Analysis: 3D IC and 2.5D IC packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis on growth opportunities in different packaging technologies, applications, end use industries, and regions for the 3D IC and 2.5D IC packaging market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape for the 3D IC and 2.5D IC packaging market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

• Q1. What is the 3D IC and 2.5D IC packaging market size?
• Answer: The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028.
• Q2. What is the growth forecast for 3D IC and 2.5D IC packaging market?
• Answer: The global 3D IC and 2.5D IC packaging market is expected to grow with a CAGR of 11% from 2023 to 2028.
• Q3. What are the major drivers influencing the growth of the 3D IC and 2.5D IC packaging market?
• Answer: The major drivers for this market are growing demand for miniaturized IoT based devices, the emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
• Q4. What are the major segments for 3D IC and 2.5D IC packaging market?
• Answer: The future of the 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries.
• Q5. Who are the key 3D IC and 2.5D IC packaging companies?
• Answer: Some of the key 3D IC and 2.5D IC packaging companies are as follows:
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • Toshiba
  • Advanced Semiconductor Engineering
  • Amkor Technology
• Q6. Which 3D IC and 2.5D IC packaging segment will be the largest in future?
• Answer:Lucintel forecasts that MEMS/sensor is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
• Q7. In 3D IC and 2.5D IC packaging market, which region is expected to be the largest in next 5 years?
• Answer: APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs in the telecommunication and automotive industries, and presence of key manufacturers in the region.
• Q8. Do we receive customization in this report?
• Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

• Q.1. What are some of the most promising, high-growth opportunities for the global 3D IC and 2.5D IC packaging market by packaging technology (3D wafer-level chip-scale packaging (WLCSP), 3D through-silicon via (TSV), and 2.5D), application (logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and others), end use industry (consumer electronics, industrial, telecommunications, automotive, military & aerospace, medical devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global 3D IC and 2.5D IC Packaging Market: Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

• 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
• 3.2: Global 3D IC and 2.5D IC Packaging Market Trends (2017-2022) and Forecast (2023-2028)
• 3.3: Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
  • 3.3.1: 3D Wafer-Level Chip-Scale Packaging (WLCSP)
  • 3.3.2: 3D Through-Silicon Via (TSV)
  • 3.3.3: 2.5D
• 3.4: Global 3D IC and 2.5D IC Packaging Market by Application
  • 3.4.1: Logic
  • 3.4.2: Imaging & Optoelectronics
  • 3.4.3: Memory
  • 3.4.4: MEMS/Sensors
  • 3.4.5: LED
  • 3.4.6: Others
• 3.5: Global 3D IC and 2.5D IC Packaging Market by End Use Industry
  • 3.5.1: Consumer Electronics
  • 3.5.2: Industrial
  • 3.5.3: Telecommunications
  • 3.5.4: Automotive
  • 3.5.5: Military & Aerospace
  • 3.5.6: Medical Devices
  • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

• 4.1: Global 3D IC and 2.5D IC Packaging Market by Region
• 4.2: North American 3D IC and 2.5D IC Packaging Market
  • 4.2.1: North American 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.2.2: North American 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
• 4.3: European 3D IC and 2.5D IC Packaging Market
  • 4.3.1: European 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.3.2: European 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
• 4.4: APAC 3D IC and 2.5D IC Packaging Market
  • 4.4.1: APAC 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.4.2: APAC 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
• 4.5: ROW 3D IC and 2.5D IC Packaging Market
  • 4.5.1: ROW 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
  • 4.5.2: ROW 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
  • 6.1.2: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Application
  • 6.1.3: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by End Use Industry
  • 6.1.4: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Region
• 6.2: Emerging Trends in the Global 3D IC and 2.5D IC Packaging Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global 3D IC and 2.5D IC Packaging Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 3D IC and 2.5D IC Packaging Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Taiwan Semiconductor Manufacturing
• 7.2: Samsung Electronics
• 7.3: Toshiba
• 7.4: Advanced Semiconductor Engineering
• 7.5: Amkor Technology