到 2028 年的 3D IC 和 2.5D IC 封装市场预测 - 按封装技术（3D 硅通孔 (TSV)、3D 晶圆级芯片级封装 (WLCSP)、2.5D）、按应用、按最终用户、按地区进行全球分析

根据Stratistics MRC，2022年全球3D IC & 2.5D IC封装市场规模将达到493亿美元，预计2028年将达到1010亿美元，预测期以復合年增长率增长期间的 12.7%

2.5D/3D 封装是一种将许多集成电路 (IC) 封装到同一封装中的方法。 对于 2.5D，两个或多个有源半导体芯片并排放置在硅中介层的顶部，以实现非常高的芯片到芯片连接密度。 有源芯片的三维结构与芯片堆迭集成在一起，以实现最短的连接和最小的封装尺寸。 2.5D 和 3D 凭藉极高的封装密度和出色的能效等优势，近年来成为合适的 chiplet 集成平台。

根据 WSTS 的数据，由于传感器和 MEMS 中先进晶圆级封装技术的使用激增，半导体 IC 市场的收入将在 2021 年达到 4630 亿美元，到 2022 年将增长 10% 以上，达到 5109 亿美元。预计将达到 6000 万美元，相信在预测期内将为 3D IC 封装市场提供增长前景。

市场动态：

驱动程序：

消费电子产品和游戏机越来越受欢迎

由于最近的技术进步，许多新产品进入市场，例如电子书阅读器、游戏设备、平板电脑、3D 智能眼镜、增强现实和虚拟现实产品，这些产品具有高性能。电子元件是必要的。 3D IC 封装技术通过缩短关键路径和减少延迟来帮助克服处理器和内存之间的性能差距。 通过将重点从器件级缩放转移到电路和系统级缩放，缩放可以以有效的方式继续进行。

抑制：

与高集成相关的散热问题

3D IC 的单位面积集成度非常高。 虽然这对于许多关注小型化的应用很有吸引力，但它也带来了热管理挑战，因为更高的集成度会导致更高的片上温度。 由于集成度的提高导致芯片内部温度升高，因此3D IC存在必须解决的难题，例如更大的外形尺寸、更大的硅中介层和更长的设计週期。 在使用 TSV 製造 3D IC 时观察到过热现象。 温度升高导致阈值电压下降和迁移率下降。

机会

智能基础设施和智能城市计划正在蓄势待发

3D IC 封装可以在智慧城市技术的开发和部署中发挥重要作用。 智慧城市使用各种电子设备、传感器和系统来实时收集和分析数据，以实现更好的决策制定和资源管理。 通过利用 3D IC 封装，这些设备和系统可以做得更小、功能更强大且更节能。 这可以降低智慧城市基础设施的总成本和规模，同时提高性能和可靠性。

威胁

3D IC 封装可靠性挑战

信息化、云、可访问性和物联网 (IoT) 应用正在推动半导体行业的业务发展。 为了满足现代信息和通信技术 (ICT) 系统的需求，随着集成电路 (IC) 技术的缩小，需要改进封装技术。 封装开发和设计必须同时满足价格、效率、外形尺寸和可靠性的目标。 在布局操作方面，给定封装的功率密度高于典型的 2D 芯片。 然而，解决可靠性问题非常重要，也是阻碍市场增长的一个因素。

COVID-19 的影响：

COVID-19 大流行对各种业务产生了重大影响，并推动了全球新医疗设备和小工具的开发。 自大流行爆发以来，多家医疗设备製造商宣布增加几种新仪器和设备的产量。 由于 3D IC 封装在医疗和保健行业有许多应用，製造工作的增加预计将增加对 3D IC 和 2.5D IC 封装的需求。

预计 3D 晶圆级芯片尺寸封装 (WLCSP) 细分市场将成为预测期内最大的细分市场。

3D 晶圆级芯片级封装 (WLCSP) 细分市场是要求最苛刻的封装类型之一，并且由于它提供了增强的印刷电路板功能和改进的热稳定性，因此将实现有利可图的增长。预计 3D WLCSP 是一种用于製造 3D IC 的更简单的工艺架构，采用能够承受高温的聚合物并解决了市场最大的挑战：热稳定性。 3D WLCSP 在空间受限的消费电子产品、其他便携式设备和工业产品中越来越受欢迎，以提供经济、紧凑、轻便和高性能的半导体解决方案。

预计 MEMS/传感器领域在预测期内的复合年增长率最高

在预测期内，MEMS/传感器领域预计将以最高复合年增长率增长。 MEMS 功能组件包括微传感器、微执行器和微电子器件。 先进的 MEMS 器件包括加速度计、陀螺仪、数字罗盘、惯性模块、压力传感器、湿度传感器、麦克风和智能传感器。 在所有这些组件和传感器中，基本要求是小型化结构。 因此，很多传感器都采用了3D IC和2.5D IC封装。

市场份额最高的地区

由于在许多消费电子产品（包括智能手机和平板电脑设备）中的广泛使用，预计亚太地区在预测期内将占据最高的市场份额。 这是由于该地区人口密度高，使其成为四大区域中3D IC和2.5D IC封装潜在市场最大的区域。

复合年增长率最高的地区：

预计在预测期内，北美的复合年增长率最高。 这是由于对电子产品的需求增加、远程工作和操作模式的增加以及数字化的增加，所有这些都增加了美国对尖端半导体设备的需求。 随着对半导体设备的需求不断增长，最新的封装技术提供了当今数字世界所需的处理能力和外形规格。 预计这些因素将推动 3D IC 和 2.5D IC 在美国的销售。

主要发展：

2023 年 4 月，三星将在伦敦和纽约的微软体验中心推出与 Xbox 合作的免费游戏专区。使用 Game Pass Ultimate，您可以通过 Xbox 串流 100 多款高品质游戏应用程序。

2023 年 4 月，三星和 TOILETPAPER 将合作为 Bespoke Appliances 引入前卫的标誌性设计。 我们与创意合作伙伴 TOILETPAPER 一起推出了一款全新的限量版 Bespoke 面板，可在厨房中最大限度地展现大胆的自我表达和个性化。

2023 年 3 月，Amkor 扩展了汽车电气化的电源解决方案。 随着对电气化、可再生能源和高效电源的需求增加，Amkor 正在加紧在碳化硅方面的努力。

我们的报告提供了什么

• 区域和国家级细分市场的市场份额评估
• 向新进入者提出战略建议
• 2020、2021、2022、2025 和 2028 年的综合市场数据
• 市场趋势（驱动因素、制约因素、机会、威胁、挑战、投资机会、建议）
• 根据市场预测在关键业务领域提出战略建议
• 竞争格局映射关键共同趋势。
• 公司简介，包括详细的战略、财务状况和近期发展
• 映射最新技术进步的供应链趋势

免费定制优惠：

购买此报告的客户将获得以下免费定制选项之一：

• 公司简介
  • 其他市场参与者的综合概况（最多 3 家公司）
  • 主要参与者的 SWOT 分析（最多 3 家公司）
• 区域细分
  • 根据客户的要求对主要国家/地区的市场估计/预测/复合年增长率（注意：基于可行性检查）。
• 竞争基准
  • 根据产品组合、区域影响力和战略联盟对主要参与者进行基准测试

内容

第 1 章执行摘要

第二章前言

• 概览
• 利益相关者
• 调查范围
• 调查方法
  • 数据挖掘
  • 数据分析
  • 数据验证
  • 研究方法
• 调查来源
  • 主要研究来源
  • 二级研究来源
  • 假设

第三章市场趋势分析

• 司机
• 约束因素
• 机会
• 威胁
• 应用分析
• 最终用户分析
• 新兴市场
• COVID-19 的影响

第 4 章波特五力分析

• 供应商的议价能力
• 买家的议价能力
• 替代品的威胁
• 新进入者的威胁
• 竞争公司之间的敌对关係

第 5 章全球 3D IC 和 2.5D IC 封装市场：按封装技术分类

• 3D 硅通孔 (TSV)
• 3D 晶圆级芯片尺寸封装 (WLCSP)
• 2.5D

第 6 章全球 3D IC 和 2.5D IC 封装市场：按应用分类

• 成像和光电
• 内存
• 逻辑
• MEMS/传感器
• LED
• 其他应用

第 7 章全球 3D IC 和 2.5D IC 封装市场：按最终用户分类

• 行业
• 电信
• 消费类电子产品
• 军事和航空航天
• 医疗设备
• 汽车

第 8 章全球 3D IC 和 2.5D IC 封装市场：按地区

• 北美
  • 美国
  • 加拿大
  • 墨西哥
• 欧洲
  • 德国
  • 英国
  • 意大利
  • 法国
  • 西班牙
  • 其他欧洲
• 亚太地区
  • 日本
  • 中国
  • 印度
  • 澳大利亚
  • 新西兰
  • 韩国
  • 其他亚太地区
• 南美洲
  • 阿根廷
  • 巴西
  • 智利
  • 其他南美洲
• 中东和非洲
  • 沙特阿拉伯
  • 阿拉伯联合酋长国
  • 卡塔尔
  • 南非
  • 其他中东和非洲地区

第九章主要进展

• 合同、伙伴关係、协作和合资企业
• 收购与合併
• 新产品发布
• 业务扩展
• 其他关键策略

第10章公司简介

• Samsung
• ASE Technology Holding Co., Ltd.
• Amkor Technology
• Broadcom
• United Microelectronics Corporation
• Texas Instruments Inc
• Powertech Technology Inc.
• JCET Group Co., Ltd.
• Taiwan Semiconductor Manufacturing Company, Ltd.
• Intel Corporation
• Toshiba Corporation
• Invensas
• GlobalFoundries
• Siliconware Precision Industries Co. Ltd（SPIL）
• Jiangsu Changjiang Electronics Technology Co., Ltd.

According to Stratistics MRC, the Global 3D IC and 2.5D IC Packaging Market is accounted for $49.3 billion in 2022 and is expected to reach $101.0 billion by 2028 growing at a CAGR of 12.7% during the forecast period. 2.5D / 3D packaging is a way of putting numerous integrated circuits (IC) into the same package. Two or more active semiconductor chips are put side by side atop a silicon interposer in a 2.5D arrangement to achieve extraordinarily high die-to-die connection density. Active chips in 3D structures are integrated via die stacking for the shortest connectivity and lowest package footprint. Because of their advantages in obtaining exceptionally high package density and great energy efficiency, 2.5D and 3D have gained traction as an appropriate chiplet integration platform in recent years.

According to WSTS, the IC market for semiconductors reached USD 463 billion in revenue in 2021 and is expected to grow by over 10% to USD 510.96 billion in 2022 due to the surging usage of advanced wafer-level packaging technologies in sensors and MEMS, is expected to provide growth prospects for the 3D IC packaging market during the forecast period.

Market Dynamics:

Driver:

Consumer gadgets and gaming devices are becoming increasingly popular

Many new gadgets are entering the market as a result of recent technological advancements, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products, all of which require high-performance electronic components. By shortening the critical route and lowering latency, 3D IC packaging technology has helped overcome the processor memory performance gap. It also enables scaling to continue in an effective manner by shifting the emphasis from device-level scaling to circuit- and system-level scaling.

Restraint:

Thermal difficulties caused by a higher level of integration

3D integrated circuits provide extremely dense multi-level integration per unit footprint. Though this is appealing for many applications where miniaturisation is a concern, it also poses thermal management challenges; increased integration leads to high on-chip temperatures. A bigger form factor, the need for a larger silicon interposer, and lengthier design cycles are all difficulties that must be addressed with 3D ICs. During the production of 3D ICs with TSVs, overheating has been observed. Elevated temperatures cause a decrease in threshold voltage and mobility deterioration.

Opportunity:

A growing number of smart infrastructure and smart city initiatives are being developed

3D IC packaging has the potential to play an important role in the development and deployment of smart city technologies. Smart cities use a range of electronic devices, sensors, and systems to gather and analyse data in real time, allowing for better decision-making and resource management. These devices and systems can be made smaller, more powerful, and energy efficient by utilising 3D IC packaging. This contributes to lowering the total cost and size of smart city infrastructure while enhancing performance and dependability.

Threat:

3D IC packaging reliability challenges

Applications like as information centred, cloud, accessibility, and the Internet of Things (IoT) drive the semiconductor sector business. To meet the needs of modern information and communication technology (ICT) systems, packaging technology must improve in tandem with the scaling of integrated circuit (IC) technology. Package development and design must fulfil price, efficiency, form factor, and dependability goals all at the same time. When it comes to operating the layout, the power density for a given footprint is higher than for typical 2D chips. However, addressing issues of dependability will be critical which hampers the growth of the market.

COVID-19 Impact:

The COVID-19 pandemic has had a huge influence on different businesses while also propelling the development of new medical equipment and gadgets throughout the world. Following the pandemic outbreak, several medical equipment manufacturing companies announced an increase in the production of several new equipment and devices. Because 3D IC packaging has numerous applications in the medical and healthcare industries, increased manufacturing initiatives are expected to increase demand for 3D IC and 2.5D IC packaging.

The 3D wafer-level chip-scale packaging (WLCSP) segment is expected to be the largest during the forecast period

The 3D wafer-level chip-scale packaging (WLCSP) segment is estimated to have a lucrative growth, due to its one of most tightly packaging type, offering enhanced capabilities and improved thermal stability in printed circuit boards. 3D WLCSP is a simpler process architecture for producing 3D ICs, which employs polymers that can withstand high temperatures, resolving the thermal stability issue, which is the market's biggest difficulty. Because it provides economical, small, lightweight, exceptional performance semiconductor solutions, 3D WLCSP has been gaining prominence in facility-constrained consumer's electronic applications and other portable consumer devices, as well as industrial products.

The MEMS/Sensors segment is expected to have the highest CAGR during the forecast period

The MEMS/Sensors segment is anticipated to witness the highest CAGR growth during the forecast period, because MEMS functional components include micro sensors, micro actuators, and microelectronics. MEMS advanced elements include accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The essential need in all of these parts and sensors is a miniaturised construction. As a result, many sensors are now using 3D IC and 2.5D IC packaging.

Region with highest share:

Asia Pacific is projected to hold the highest market share during the forecast period owing to its extensive reach in numerous consumer electronics applications, notably smartphone and tablets, the Asia Pacific area is one of the important markets for 3D IC and 2.5D IC packaging. This is mostly due to the region's high population density, which makes it the greatest potential market for 3D IC and 2.5D IC packaging among the four key areas.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to rising demand for electronics; growing patterns of remote work and remote operations, and boosting digitalization have all contributed to the need for cutting-edge semiconductor devices in the United States. As the demand for semiconductor devices rises, modern packaging techniques provide the processing power and form factor required for today's digital world. These factors are expected to drive 3D IC and 2.5D IC sales in the United States.

Key players in the market:

Some of the key players profiled in the 3D IC and 2.5D IC Packaging Market include Samsung, ASE Technology Holding Co., Ltd., Amkor Technology, Broadcom, United Microelectronics Corporation, Texas Instruments Inc, Powertech Technology Inc., JCET Group Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, Toshiba Corporation, Invensas, GlobalFoundries, Siliconware Precision Industries Co. Ltd (SPIL) and Jiangsu Changjiang Electronics Technology Co., Ltd.

Key Developments:

In April 2023, Samsung Opens Free-to-Play Gaming Zones in Collaboration With Xbox at Microsoft Experience Centers in London, New York, with this partnership, Samsung Gaming Hub users are now able to stream over 100 high-quality games through the Xbox App by subscribing to Xbox Game Pass Ultimate.

In April 2023, Samsung and TOILETPAPER Collaborate to Introduce Edgy, Iconic Designs for Bespoke Appliances, together with creative partner TOILETPAPER, Samsung offers new, limited-edition Bespoke panels that maximize bold self-expression and personalization in the kitchen.

In March 2023, Amkor Expands Power Solutions for Automotive Electrification, as the demand for electrification, renewable energy, and efficient power delivery continues to grow, Amkor is focusing increased effort on silicon carbide

Packaging Technologies Covered:

• 3D Through-Silicon Via (TSV)
• 3D Wafer-Level Chip-Scale Packaging (WLCSP)
• 2.5D

Applications Covered:

• Imaging & Optoelectronics
• Memory
• Logic
• MEMS/Sensors
• LED
• Other Applications

End Users Covered:

• Industrial
• Telecommunications
• Consumer Electronics
• Military & Aerospace
• Medical Devices
• Automotive

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Application Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global 3D IC and 2.5D IC Packaging Market, By Packaging Technology

• 5.1 Introduction
• 5.2 3D Through-Silicon Via (TSV)
• 5.3 3D Wafer-Level Chip-Scale Packaging (WLCSP)
• 5.4 2.5D

6 Global 3D IC and 2.5D IC Packaging Market, By Application

• 6.1 Introduction
• 6.2 Imaging & Optoelectronics
• 6.3 Memory
• 6.4 Logic
• 6.5 MEMS/Sensors
• 6.6 LED
• 6.7 Other Applications

7 Global 3D IC and 2.5D IC Packaging Market, By End User

• 7.1 Introduction
• 7.2 Industrial
• 7.3 Telecommunications
• 7.4 Consumer Electronics
• 7.5 Military & Aerospace
• 7.6 Medical Devices
• 7.7 Automotive

8 Global 3D IC and 2.5D IC Packaging Market, By Geography

• 8.1 Introduction
• 8.2 North America
  • 8.2.1 US
  • 8.2.2 Canada
  • 8.2.3 Mexico
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 Italy
  • 8.3.4 France
  • 8.3.5 Spain
  • 8.3.6 Rest of Europe
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 Australia
  • 8.4.5 New Zealand
  • 8.4.6 South Korea
  • 8.4.7 Rest of Asia Pacific
• 8.5 South America
  • 8.5.1 Argentina
  • 8.5.2 Brazil
  • 8.5.3 Chile
  • 8.5.4 Rest of South America
• 8.6 Middle East & Africa
  • 8.6.1 Saudi Arabia
  • 8.6.2 UAE
  • 8.6.3 Qatar
  • 8.6.4 South Africa
  • 8.6.5 Rest of Middle East & Africa

9 Key Developments

• 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 9.2 Acquisitions & Mergers
• 9.3 New Product Launch
• 9.4 Expansions
• 9.5 Other Key Strategies

10 Company Profiling

• 10.1 Samsung
• 10.2 ASE Technology Holding Co., Ltd.
• 10.3 Amkor Technology
• 10.4 Broadcom
• 10.5 United Microelectronics Corporation
• 10.6 Texas Instruments Inc
• 10.7 Powertech Technology Inc.
• 10.8 JCET Group Co., Ltd.
• 10.9 Taiwan Semiconductor Manufacturing Company, Ltd.
• 10.10 Intel Corporation
• 10.11 Toshiba Corporation
• 10.12 Invensas
• 10.13 GlobalFoundries
• 10.14 Siliconware Precision Industries Co. Ltd (SPIL)
• 10.15 Jiangsu Changjiang Electronics Technology Co., Ltd.

List of Tables

• Table 1 Global 3D IC and 2.5D IC Packaging Market Outlook, By Region (2020-2028) ($MN)
• Table 2 Global 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
• Table 3 Global 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
• Table 4 Global 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
• Table 5 Global 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
• Table 6 Global 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
• Table 7 Global 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
• Table 8 Global 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
• Table 9 Global 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
• Table 10 Global 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
• Table 11 Global 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
• Table 12 Global 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
• Table 13 Global 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
• Table 14 Global 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
• Table 15 Global 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
• Table 16 Global 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 17 Global 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
• Table 18 Global 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
• Table 19 Global 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
• Table 20 North America 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
• Table 21 North America 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
• Table 22 North America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
• Table 23 North America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
• Table 24 North America 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
• Table 25 North America 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
• Table 26 North America 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
• Table 27 North America 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
• Table 28 North America 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
• Table 29 North America 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
• Table 30 North America 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
• Table 31 North America 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
• Table 32 North America 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
• Table 33 North America 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
• Table 34 North America 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
• Table 35 North America 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 36 North America 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
• Table 37 North America 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
• Table 38 North America 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
• Table 39 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
• Table 40 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
• Table 41 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
• Table 42 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
• Table 43 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
• Table 44 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
• Table 45 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
• Table 46 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
• Table 47 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
• Table 48 Europe 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
• Table 49 Europe 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
• Table 50 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
• Table 51 Europe 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
• Table 52 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
• Table 53 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
• Table 54 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 55 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
• Table 56 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
• Table 57 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
• Table 58 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
• Table 59 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
• Table 60 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
• Table 61 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
• Table 62 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
• Table 63 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
• Table 64 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
• Table 65 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
• Table 66 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
• Table 67 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
• Table 68 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
• Table 69 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
• Table 70 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
• Table 71 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
• Table 72 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
• Table 73 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 74 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
• Table 75 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
• Table 76 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
• Table 77 South America 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
• Table 78 South America 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
• Table 79 South America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
• Table 80 South America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
• Table 81 South America 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
• Table 82 South America 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
• Table 83 South America 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
• Table 84 South America 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
• Table 85 South America 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
• Table 86 South America 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
• Table 87 South America 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
• Table 88 South America 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
• Table 89 South America 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
• Table 90 South America 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
• Table 91 South America 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
• Table 92 South America 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 93 South America 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
• Table 94 South America 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
• Table 95 South America 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
• Table 96 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
• Table 97 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
• Table 98 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
• Table 99 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
• Table 100 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
• Table 101 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
• Table 102 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
• Table 103 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
• Table 104 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
• Table 105 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
• Table 106 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
• Table 107 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
• Table 108 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
• Table 109 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
• Table 110 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
• Table 111 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
• Table 112 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
• Table 113 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
• Table 114 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)