查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1602287

3D IC 和 2.5D IC封装市场：按技术、最终用户、应用划分 - 2025-2030 年全球预测

3D IC & 2.5D IC Packaging Market by Technology (2.5D, 3D TSV, 3D Wafer-Level Chip-Scale Packaging), End User (Automotive, Consumer Electronics, Industrial Sector), Application - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 189 Pages | 商品交期: 最快1-2个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

2023年3D IC和2.5D IC封装市场规模预计为923.6亿美元，预计2024年将达到1181.9亿美元，复合年增长率为28.05%，2030年将达到5214亿美元。

3D IC 和 2.5D IC封装产业代表了半导体设计的重大发展，允许晶片垂直堆迭（3D IC）或使用内插器并排堆迭（2.5D IC）。该市场的驱动因素是克服摩尔定律的物理限制，满足对高效能运算、人工智慧以及智慧型手机和穿戴式装置等先进消费性电子产品日益增长的需求。应用涵盖资料中心、汽车电子、医疗保健设备和物联网，最终用户包括希望提高产品效率并减少延迟的技术公司、汽车公司和医疗保健提供者。关键的市场成长要素包括人工智慧工作负载的快速发展、连网型设备的激增以及对紧凑型和节能技术的需求。商机在于人工智慧驱动产业的扩张、智慧城市基础设施的持续发展，以及VR和AR技术的日益使用，其中先进的IC封装是关键。公司可以透过投资适应性设计方法并与专注于人工智慧和物联网的行业建立伙伴关係来获得资本。然而，其限制包括製造成本高、技术复杂性和供应链挑战。在设计和组装这些先进封装方面也存在显着的技能差距。创新可以集中在利用新兴材料降低製造成本、利用机器学习来增强设计流程以及开发永续和可回收材料。小晶片架构和异构整合等研究领域有可能进一步突破界限。该市场仍处于动态状态，其特点是半导体和电子领域主要参与者之间的积极研发和竞争性合作。儘管面临挑战，这些IC封装解决方案的创新潜力仍然巨大，随着产业寻求满足不断发展的技术和消费者需求，预计将出现稳定的发展轨迹。

主要市场统计
基准年[2023] 923.6亿美元
预测年份 [2024] 1181.9亿美元
预测年份 [2030] 5214.9亿美元
复合年增长率（%） 28.05%

市场动态：针对快速发展的 3D IC 和 2.5D IC封装市场所揭示的关键市场见解

3D IC 和 2.5D IC封装市场正因供需的动态交互作用而转变。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，并了解消费行为及其对製造成本的影响，并更清楚地了解对采购趋势的影响。

  • 市场驱动因素
    • 电子产品先进设计需求
    • 电子设备小型化趋势日益明显
    • 游戏设备和平板智慧型手机的增加
  • 市场限制因素
    • 高集成度导致的散热问题
  • 市场机会
    • 对高阶运算、资料中心和伺服器的需求增加
    • 引进製造商的创新产品与先进包装
  • 市场挑战
    • 3D IC和2.5D IC的单位成本高

波特五力：驾驭 3D IC 与 2.5D IC封装市场的策略工具

波特的五力框架是了解市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势、解决弱点并避免潜在的挑战，以确保更强大的市场地位。

PESTLE分析：了解3D IC和2.5D IC封装市场的外部影响

外部宏观环境因素在塑造3D IC和2.5D IC封装市场的表现动态方面发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并帮助他们做出积极主动的决策。

市场占有率分析 了解3D IC和2.5D IC封装市场的竞争格局

对 3D IC 和 2.5D IC封装市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵3D IC和2.5D IC封装市场厂商表现评估

FPNV定位矩阵是评估3D IC和2.5D IC封装市场供应商的重要工具。此矩阵允许业务组织根据商务策略和产品满意度评估供应商，从而做出与其目标相符的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析和建议描绘了 3D IC 和 2.5D IC封装市场的成功之路

对 3D IC 和 2.5D IC封装市场进行策略分析对于旨在加强其在全球市场的影响力的公司至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：详细检视当前市场环境、主要企业的广泛资料、评估其在市场中的影响力和整体影响力。

2. 市场开拓：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，以帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 电子产品先进设计需求
      • 电子设备小型化趋势日益明显
      • 游戏机和平板智慧型手机的扩展
    • 抑制因素
      • 更高水准的整合会产生散热问题
    • 机会
      • 对高阶运算、资料中心和伺服器的需求增加
      • 引进製造商的创新产品与先进包装
    • 任务
      • 3D IC和2.5D IC的单位成本高
  • 市场区隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章 3D IC 和 2.5D IC封装市场：依技术分类

  • 2.5D
  • 3D TSV
  • 3D晶圆级构装

第 7 章 3D IC 与 2.5D IC封装市场：依最终使用者划分

  • 车
  • 家电
  • 工业部门
  • 医疗设备
  • 军事/航太
  • 智慧科技
  • 通讯

第 8 章 3D IC 和 2.5D IC封装市场：依应用分类

  • 成像和光电
  • 引导的
  • 逻辑
  • 记忆
  • MEMS/感测器
  • 光电
  • 无线电频率

第九章美洲3D IC和2.5D IC封装市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第十章亚太地区3D IC和2.5D IC封装市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十一章 欧洲、中东和非洲3D IC和2.5D IC封装市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十二章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
  • 战略分析和建议

公司名单

  • 3M Company
  • Amkor Technology, Inc.
  • ASE Technology Holding Co, Ltd.
  • Broadcom Inc.
  • Fujitsu Limited
  • Intel Corporation
  • International Business Machines Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • MonolithIC 3D Inc.
  • Samsung Electronics Co. Ltd
  • STMicroelectronics NV
  • Texas Instruments Incorporated
  • Tezzaron Semiconductor Corporation
  • Toshiba Electronic Devices & Storage Corporation
  • United Microelectronics Corporation
  • Xilinx Inc.
Product Code: MRR-4369010656CE

The 3D IC & 2.5D IC Packaging Market was valued at USD 92.36 billion in 2023, expected to reach USD 118.19 billion in 2024, and is projected to grow at a CAGR of 28.05%, to USD 521.49 billion by 2030.

The 3D IC and 2.5D IC packaging industry represents a crucial evolution in semiconductor design, characterized by vertically stacking chips (3D IC) or placing chips side-by-side with an interposer (2.5D IC) to improve performance and reduce power consumption. This market is driven by the necessity to overcome the physical limitations of Moore's Law and cater to the increasing demand for high-performance computing, artificial intelligence, and advanced consumer electronics, such as smartphones and wearables. With applications spanning data centers, automotive electronics, healthcare devices, and IoT, end-users include technology firms, automotive companies, and healthcare providers seeking enhanced efficiency and reduced latency in their products. Key market growth factors include the rapid advancement in AI workloads, the proliferation of connected devices, and the need for compact, energy-efficient technology. Opportunities lie in expanding AI-driven sectors, the ongoing development of smart city infrastructures, and the growing use of VR and AR technologies, where sophisticated IC packaging is critical. Businesses can capitalize by investing in adaptable design methodologies and establishing partnerships with AI and IoT-focused industries. However, limitations include high manufacturing costs, technological complexity, and supply chain challenges. There is also a notable skills gap in designing and assembling these advanced packages. Innovations could focus on reducing manufacturing costs using emerging materials, leveraging machine learning for enhanced design processes, and developing sustainable, recyclable materials. Research areas such as chiplet architecture and heterogeneous integration could further push the envelope. The market remains in a dynamic state, characterized by intense R&D and competitive collaboration between key players in semiconductors and electronics. Despite challenges, the potential for technology revolution driven by these IC packaging solutions is significant, with a robust trajectory likely as industries look to meet evolving technical and consumer demands.

KEY MARKET STATISTICS
Base Year [2023] USD 92.36 billion
Estimated Year [2024] USD 118.19 billion
Forecast Year [2030] USD 521.49 billion
CAGR (%) 28.05%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving 3D IC & 2.5D IC Packaging Market

The 3D IC & 2.5D IC Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Demand for advanced design in electronic products
    • Increasing inclination to miniaturization of electronic devices
    • Augment of gaming devices and tablet smartphones
  • Market Restraints
    • Greater levels of integration causes thermal issues
  • Market Opportunities
    • Rising demand for high-end computing, data centers, and servers
    • Advent of innovative products from manufacturers and advanced packaging
  • Market Challenges
    • High cost per unit of 3D IC and 2.5D IC

Porter's Five Forces: A Strategic Tool for Navigating the 3D IC & 2.5D IC Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the 3D IC & 2.5D IC Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the 3D IC & 2.5D IC Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the 3D IC & 2.5D IC Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the 3D IC & 2.5D IC Packaging Market

A detailed market share analysis in the 3D IC & 2.5D IC Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the 3D IC & 2.5D IC Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the 3D IC & 2.5D IC Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the 3D IC & 2.5D IC Packaging Market

A strategic analysis of the 3D IC & 2.5D IC Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the 3D IC & 2.5D IC Packaging Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Amkor Technology, Inc., ASE Technology Holding Co, Ltd., Broadcom Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., MonolithIC 3D Inc., Samsung Electronics Co. Ltd, STMicroelectronics NV, Texas Instruments Incorporated, Tezzaron Semiconductor Corporation, Toshiba Electronic Devices & Storage Corporation, United Microelectronics Corporation, and Xilinx Inc..

Market Segmentation & Coverage

This research report categorizes the 3D IC & 2.5D IC Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Technology, market is studied across 2.5D, 3D TSV, and 3D Wafer-Level Chip-Scale Packaging.
  • Based on End User, market is studied across Automotive, Consumer Electronics, Industrial Sector, Medical Devices, Military & Aerospace, Smart Technologies, and Telecommunication.
  • Based on Application, market is studied across Imaging & Optoelectronics, LED, Logic, Memory, MEMS/Sensors, Photonics, and RF.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Demand for advanced design in electronic products
      • 5.1.1.2. Increasing inclination to miniaturization of electronic devices
      • 5.1.1.3. Augment of gaming devices and tablet smartphones
    • 5.1.2. Restraints
      • 5.1.2.1. Greater levels of integration causes thermal issues
    • 5.1.3. Opportunities
      • 5.1.3.1. Rising demand for high-end computing, data centers, and servers
      • 5.1.3.2. Advent of innovative products from manufacturers and advanced packaging
    • 5.1.4. Challenges
      • 5.1.4.1. High cost per unit of 3D IC and 2.5D IC
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. 3D IC & 2.5D IC Packaging Market, by Technology

  • 6.1. Introduction
  • 6.2. 2.5D
  • 6.3. 3D TSV
  • 6.4. 3D Wafer-Level Chip-Scale Packaging

7. 3D IC & 2.5D IC Packaging Market, by End User

  • 7.1. Introduction
  • 7.2. Automotive
  • 7.3. Consumer Electronics
  • 7.4. Industrial Sector
  • 7.5. Medical Devices
  • 7.6. Military & Aerospace
  • 7.7. Smart Technologies
  • 7.8. Telecommunication

8. 3D IC & 2.5D IC Packaging Market, by Application

  • 8.1. Introduction
  • 8.2. Imaging & Optoelectronics
  • 8.3. LED
  • 8.4. Logic
  • 8.5. Memory
  • 8.6. MEMS/Sensors
  • 8.7. Photonics
  • 8.8. RF

9. Americas 3D IC & 2.5D IC Packaging Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific 3D IC & 2.5D IC Packaging Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa 3D IC & 2.5D IC Packaging Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. 3M Company
  • 2. Amkor Technology, Inc.
  • 3. ASE Technology Holding Co, Ltd.
  • 4. Broadcom Inc.
  • 5. Fujitsu Limited
  • 6. Intel Corporation
  • 7. International Business Machines Corporation
  • 8. Jiangsu Changjiang Electronics Technology Co., Ltd.
  • 9. MonolithIC 3D Inc.
  • 10. Samsung Electronics Co. Ltd
  • 11. STMicroelectronics NV
  • 12. Texas Instruments Incorporated
  • 13. Tezzaron Semiconductor Corporation
  • 14. Toshiba Electronic Devices & Storage Corporation
  • 15. United Microelectronics Corporation
  • 16. Xilinx Inc.

LIST OF FIGURES

  • FIGURE 1. 3D IC & 2.5D IC PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. 3D IC & 2.5D IC PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. 3D IC & 2.5D IC PACKAGING MARKET DYNAMICS
  • TABLE 7. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 2.5D, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D TSV, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY 3D WAFER-LEVEL CHIP-SCALE PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY INDUSTRIAL SECTOR, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEDICAL DEVICES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY SMART TECHNOLOGIES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY IMAGING & OPTOELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LED, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY LOGIC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 24. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY MEMS/SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 25. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY PHOTONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 26. GLOBAL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY RF, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 27. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 28. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 29. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 30. AMERICAS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 31. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 32. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 33. ARGENTINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 34. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 35. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 36. BRAZIL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 37. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 38. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 39. CANADA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 40. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 41. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 42. MEXICO 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 43. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 44. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 45. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 46. UNITED STATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 47. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 48. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 49. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 50. ASIA-PACIFIC 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 51. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 52. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 53. AUSTRALIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 55. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 56. CHINA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 57. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 58. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 59. INDIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 60. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 61. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 62. INDONESIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 63. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 64. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 65. JAPAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 66. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 67. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 68. MALAYSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 70. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 71. PHILIPPINES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 72. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 73. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 74. SINGAPORE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 75. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 76. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 77. SOUTH KOREA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 78. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 79. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 80. TAIWAN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 82. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 83. THAILAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 84. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 85. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 86. VIETNAM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 87. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 88. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 89. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 90. EUROPE, MIDDLE EAST & AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 91. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 92. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 93. DENMARK 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 94. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 95. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 96. EGYPT 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 98. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 99. FINLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 100. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 101. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 102. FRANCE 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 103. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 104. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 105. GERMANY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 106. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 107. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 108. ISRAEL 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 109. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 110. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 111. ITALY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 112. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 113. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 114. NETHERLANDS 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 115. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 116. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 117. NIGERIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 118. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 119. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 120. NORWAY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 121. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 122. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 123. POLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 124. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 125. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 126. QATAR 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 127. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 128. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 129. RUSSIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 130. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 131. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 132. SAUDI ARABIA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 133. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 134. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 135. SOUTH AFRICA 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 136. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 137. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 138. SPAIN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 139. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 140. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 141. SWEDEN 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 142. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 143. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 144. SWITZERLAND 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 145. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 146. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 147. TURKEY 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 148. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 149. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 150. UNITED ARAB EMIRATES 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 151. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 152. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY END USER, 2018-2030 (USD MILLION)
  • TABLE 153. UNITED KINGDOM 3D IC & 2.5D IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 154. 3D IC & 2.5D IC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 155. 3D IC & 2.5D IC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023