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封面
市场调查报告书
商品编码
1417286

封装天线技术市场报告：趋势、预测、竞争分析

Antenna-in-Package Technology Market Report: Trends, Forecast and Competitive Analysis
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

封装天线技术的市场趋势与预测

预计到 2030 年，全球封装天线技术市场将达到 3.311 亿美元，2024 年至 2030 年复合年增长率为 29.0%。该市场的主要驱动力是5G网路和物联网的不断部署、紧凑型高效能行动装置的日益普及，以及视讯串流和线上游戏对高速连接的需求不断增长。全球封装天线技术市场前景广阔，行动通讯、人工智慧、汽车电子和物联网市场充满机会。

洞察封装天线技术市场

Lucintel 预测，双面封装在预测期内将出现更高的成长，因为它可以提高讯号强度和频率范围。

由于自动驾驶汽车的普及，汽车电子将继续成为该市场的最大细分市场。

由于对小型电子设备的需求不断增长以及该地区领先公司的存在，亚太地区在整个预测期内仍将是最大的地区。

常问问题

Q.1 封装天线技术的市场规模有多大？

A1. 到 2030 年，全球封装天线技术市场预计将达到 3.311 亿美元。

Q.2 封装天线技术市场的成长预测为何：

A2. 2024年至2030年，全球封装天线技术市场预计将以29.0%的复合年增长率成长。

Q.3 影响封装天线技术市场成长的关键因素有哪些：

A3. 该市场的主要驱动力是 5G 网路和物联网的不断扩大部署、紧凑型高效能行动装置的日益普及，以及视讯串流和线上游戏对高速连接的需求不断增长。

Q4.市场的主要细分市场是：

A4. 封装天线技术市场前景广阔，行动通讯、人工智慧、汽车电子、物联网市场蕴藏机会。

Q5.市场的主要企业是：

A5. 一些主要的封装天线技术公司是：

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics

Q6.未来最大的细分市场是什么？

A6.Lucintel 预测，双面封装在预测期内将出现更高的成长，因为它可以提高讯号强度和频率范围。

Q7. 未来五年预计哪些地区的市场成长最大？

A7.由于小型电子产品的需求不断增长以及该地区领先公司的存在，亚太地区在整个预测期内仍将是最大的地区。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球封装天线技术市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球封装天线技术市场趋势（2018-2023）与预测（2024-2030）
  • 按产品类型分類的全球封装天线技术市场
    • 双面封装
    • 嵌入式裸晶片封装
    • 其他的
  • 全球封装天线技术市场（依应用）
    • 行动通讯
    • AI
    • 汽车电子产品
    • IoT
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球封装天线技术市场区域分布
  • 北美封装天线技术市场
  • 欧洲封装天线技术市场
  • 亚太地区封装天线技术市场
  • 其他地区封装天线技术市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按产品类型分類的全球封装天线技术市场成长机会
    • 全球封装天线技术市场成长机会（按应用）
    • 全球封装天线技术市场的区域成长机会
  • 全球封装天线技术市场新趋势
  • 战略分析
    • 新产品开发
    • 全球封装天线技术市场产能扩张
    • 全球封装天线技术市场的合併、收购与合资企业
    • 认证和许可

第七章主要企业概况

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics
简介目录

Antenna-in-Package Technology Market Trends and Forecast

The future of the global antenna-in-package technology market looks promising with opportunities in the mobile communication, AI, automotive electronic, and IOT markets. The global antenna-in-package technology market is expected to reach an estimated $331.1 million by 2030 with a CAGR of 29.0% from 2024 to 2030. The major drivers for this market are growing deployment of 5G networks and IOT, increasing adoption of compact and high-performance mobile devices ,and rising demand for high-speed connectivity for video streaming and online gaming.

A more than 150-page report is developed to help in your business decisions.

Antenna-in-Package Technology Market by Segment

The study includes a forecast for the global antenna-in-package technology market by product type, application, and region

Antenna-in-Package Technology Market by Product Type [Shipment Analysis by Value from 2018 to 2030]:

  • Double-sided Package
  • Embedded Bare-chip Package
  • Others

Antenna-in-Package Technology Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Mobile Communication
  • AI
  • Automotive Electronics
  • IoT
  • Others

Antenna-in-Package Technology Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Antenna-in-Package Technology Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies antenna-in-package technology companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the antenna-in-package technology companies profiled in this report include-

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics
  • Taiwan Semiconductor Manufacturing Company

Antenna-in-Package Technology Market Insights

Lucintel forecasts that double-sided package is expected to witness higher growth over the forecast period as it enables increased signal strength and frequency range.

Within this market, automotive electronics will remain the largest segment due to increasing adoption of autonomous vehicles.

APAC will remain the largest region over the forecast period due to growing demand for miniaturizied electronic device and presence of major players in the region..

Features of the Global Antenna-in-Package Technology Market

Market Size Estimates: Antenna-in-package technology market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Antenna-in-package technology market size by type, application, and region in terms of value ($B).

Regional Analysis: Antenna-in-package technology market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different product types, applications, and regions for the antenna-in-package technology market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the antenna-in-package technology market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the antenna-in-package technology market size?

Answer: The global antenna-in-package technology market is expected to reach an estimated $331.1 million by 2030.

Q.2 What is the growth forecast for antenna-in-package technology market?

Answer: The global antenna-in-package technology market is expected to grow with a CAGR of 29.0% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the antenna-in-package technology market?

Answer: The major drivers for this market are growing deployment of 5g networks and iot increasing adoption of compact and high-performance mobile devices rising demand for high-speed connectivity for video streaming and online gaming.

Q4. What are the major segments for antenna-in-package technology market?

Answer: The future of the antenna-in-package technology market looks promising with opportunities in the mobile communication, AI, automotive electronic, and IOT markets.

Q5. Who are the key antenna-in-package technology market companies?

Answer: some of the key antenna-in-package technology companies are as follows.

  • 3D Glass Solutions
  • Advanced Semiconductor Engineering
  • Amkor Technology
  • LitePoint
  • MediaTek
  • Metawave Corporation
  • MixComm
  • Murata Manufacturing
  • Powertech Technology
  • Samsung Electronics

Q6. Which antenna-in-package technology market segment will be the largest in future?

Answer: Lucintel forecasts that double-sided package is expected to witness higher growth over the forecast period as it enables increased signal strength and frequency range.

Q7. In antenna-in-package technology market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to growing demand for miniaturizied electronic device and presence of major players in the region..

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the antenna-in-package technology market by type (double-sided package, embedded bare-chip package, and others), application (mobile communication, AI, automotive electronics, IOT, and other), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Antenna-in-Package Technology Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Antenna-in-Package Technology Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Antenna-in-Package Technology Market by Product Type
    • 3.3.1: Double-sided Package
    • 3.3.2: Embedded Bare-chip Package
    • 3.3.3: Others
  • 3.4: Global Antenna-in-Package Technology Market by Application
    • 3.4.1: Mobile Communication
    • 3.4.2: AI
    • 3.4.3: Automotive Electronics
    • 3.4.4: IoT
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Antenna-in-Package Technology Market by Region
  • 4.2: North American Antenna-in-Package Technology Market
    • 4.2.1: North American Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.2.2: North American Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others
  • 4.3: European Antenna-in-Package Technology Market
    • 4.3.1: European Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.3.2: European Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others
  • 4.4: APAC Antenna-in-Package Technology Market
    • 4.4.1: APAC Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.4.2: APAC Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others
  • 4.5: ROW Antenna-in-Package Technology Market
    • 4.5.1: ROW Antenna-in-Package Technology Market by Product Type: Double-sided Package, Embedded Bare-chip Package, and Others
    • 4.5.2: ROW Antenna-in-Package Technology Market by Application: Mobile Communication, AI, Automotive Electronics, IoT, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Antenna-in-Package Technology Market by Product Type
    • 6.1.2: Growth Opportunities for the Global Antenna-in-Package Technology Market by Application
    • 6.1.3: Growth Opportunities for the Global Antenna-in-Package Technology Market Region
  • 6.2: Emerging Trends in the Global Antenna-in-Package Technology Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Antenna-in-Package Technology Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Antenna-in-Package Technology Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: 3D Glass Solutions
  • 7.2: Advanced Semiconductor Engineering
  • 7.3: Amkor Technology
  • 7.4: LitePoint
  • 7.5: MediaTek
  • 7.6: Metawave Corporation
  • 7.7: MixComm
  • 7.8: Murata Manufacturing
  • 7.9: Powertech Technology
  • 7.10: Samsung Electronics