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封面
市场调查报告书
商品编码
1417978

宽频通讯晶片组市场报告：2030 年趋势、预测与竞争分析

Broadband Power Line Communication Chipset Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

宽频通讯晶片组趋势与预测

预计到 2030 年，全球宽频通讯晶片组市场将达到 85 亿美元，2024 年至 2030 年复合年增长率为 14.6%。该市场的主要驱动力是智慧电网技术的不断使用和对高速互联网的需求不断增长、政府活性化推动智慧城市市场的开拓以及对能源效率的日益关注。全球宽频电力线通讯晶片组市场的未来前景广阔，智慧电网、网路、照明、安全与监控、远距以及机器对机器 (M2M) 市场充满机会。

宽频通讯晶片组市场洞察

Lucintel 表示，在预测期内，独立式将继续成为最大的细分市场，因为独立式 PLC 晶片组只需要连接到电网，使其易于安装，是维修现有住宅和建筑物的理想选择。我预测这种情况将持续下去。

由于对网路存取的强劲需求，预计亚太地区在预测期内仍将是最大的地区。

常问问题

Q1.市场规模有多大？

A1. 到 2030 年，全球宽频通讯晶片组市场预计将达到 85 亿美元。

Q2.市场成长预测如何？

A2. 2024年至2030年，全球宽频通讯晶片组市场预计将以14.6%的复合年增长率成长。

Q3.影响市场成长的主要驱动因素有哪些？

A3. 该市场的主要驱动力是智慧电网技术的使用和对高速网路需求的增加、政府加强开拓智慧城市以及对能源效率的日益关注。

Q4.市场的主要细分市场是什么？

A4. 全球宽频通讯晶片组市场的未来在智慧电网、网路、照明、安全与监控、远距以及M2M（机器对机器）市场方面前景广阔。

Q5.市场上主要企业有哪些？

A5. 宽频通讯晶片组的主要企业如下。

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Q6.未来最大的细分市场是什么？

A6.Lucintel 认为，在预测期内，独立式 PLC 晶片组仍将是最大的细分市场，因为独立式 PLC 晶片组易于安装，因为它们只需要连接到电网，并且是维修现有住宅和建筑物的理想选择。我预测是这样的。

Q7. 未来五年预计哪个地区将成为最大的市场？

A7.由于对网路接取的强劲需求，亚太地区在预测期内仍将是最大的地区。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球宽​​频通讯晶片组市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球宽频通讯晶片组市场趋势（2018-2023）与预测（2024-2030）
  • 按标准分類的全球宽频通讯组市场
    • 家用插头AV
    • 家用插头 AV1
    • 家用插头 AV2
    • IEEE1901
    • IEEE 1905.1
    • G.Hn
    • 首页 PNA
    • 其他的
  • 按技术分類的全球宽频通讯组市场
    • 独立的
    • 混合
    • Wi-Fi
    • 紫蜂
    • 乙太网路
    • 其他的
  • 全球宽频通讯晶片组市场（按应用）
    • 智慧电网
    • 联网
    • 点亮
    • 安全和监视
    • 远距
    • 机器对机器
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球宽频通讯晶片组市场（按地区）
  • 北美宽频通讯晶片组市场
  • 欧洲宽频通讯晶片组市场
  • 亚太宽频宽频通讯晶片组市场
  • 其他地区宽频电力线通讯晶片组市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按标准分類的全球宽频通讯晶片组市场成长机会
    • 全球宽频通讯晶片组市场成长机会（按技术）
    • 全球宽频通讯晶片组市场成长机会（按应用）
    • 全球宽频通讯晶片组市场成长机会（按地区）
  • 全球宽频电力线通讯晶片组市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 全球宽频通讯晶片组市场产能扩张
    • 全球宽频通讯组市场的併购和合资企业
    • 认证和许可

第七章主要企业概况

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies
简介目录

Broadband Power Line Communication Chipset Trends and Forecast

The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets. The global broadband power line communication chipset market is expected to reach an estimated $8.5 billion by 2030 with a CAGR of 14.6% from 2024 to 2030. The major drivers for this market are rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

A more than 150-page report is developed to help in your business decisions.

Broadband Power Line Communication Chipset by Segment

The study includes a forecast for the global broadband power line communication chipset by standards, technology, application, and region.

Broadband Power Line Communication Chipset Market by Standards [Shipment Analysis by Value from 2018 to 2030]:

  • Homeplug AV
  • Homeplug AV1
  • Homeplug AV2
  • IEEE 1901
  • IEEE 1905.1
  • G.Hn
  • HomePNA
  • Others

Broadband Power Line Communication Chipset Market by Technology [Shipment Analysis by Value from 2018 to 2030]:

  • Standalone
  • Hybrid
  • Wi-Fi
  • Zigbee
  • Ethernet
  • Others

Broadband Power Line Communication Chipset Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Smart Grids
  • Networking
  • Lighting
  • Security & Surveillance
  • Long Haul
  • Machine To Machine
  • Others

Broadband Power Line Communication Chipset Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Broadband Power Line Communication Chipset Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies broadband power line communication chipset companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the broadband power line communication chipset companies profiled in this report include-

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Broadband Power Line Communication Chipset Market Insights

Lucintel forecasts that standalone will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.

APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

Features of the Global Broadband Power Line Communication Chipset Market

Market Size Estimates: Broadband power line communication chipset market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Broadband power line communication chipset market size by various segments, such as by standards, technology, application, and region in terms of value ($B).

Regional Analysis: Broadband power line communication chipset market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different standards, technology, application, and regions for the broadband power line communication chipset market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the broadband power line communication chipset market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the broadband power line communication chipset market size?

Answer: The global broadband power line communication chipset market is expected to reach an estimated $8.5 billion by 2030.

Q2. What is the growth forecast for broadband power line communication chipset market?

Answer: The global broadband power line communication chipset market is expected to grow with a CAGR of 14.6% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the broadband power line communication chipset market?

Answer: The major drivers for this market are rising use of smart grid technologies and rising demand for high-speed internet, growing government efforts to promote the development of smart cities, as well as, an increased emphasis on energy efficiency.

Q4. What are the major segments for broadband power line communication chipset market?

Answer: The future of the global broadband power line communication chipset market looks promising with opportunities in the smart grids, networking, lighting, security & surveillance, long haul, and machine to machine markets.

Q5. Who are the key broadband power line communication chipset market companies?

Answer: Some of the key broadband power line communication chipset companies are as follows.

  • Broadcom
  • Intel
  • Marvell Technology
  • Maxim Integrated
  • Megachips
  • Qualcomm
  • Semtech
  • ST Microelectronics
  • Vango Technologies
  • Yitran Technologies

Q6. Which broadband power line communication chipset market segment will be the largest in future?

Answer: Lucintel forecasts that standalone will remain the largest segment over the forecast period because the standalone PLC chipsets only require a connection to the electrical grid, making them easy to install and ideal for retrofitting existing homes and buildings.

Q7. In broadband power line communication chipset market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to strong demand for internet access in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the broadband power line communication chipset market by standards (homeplug AV, homeplug AV1, homeplug AV2, IEEE 1901, IEEE 1905.1, G.Hn, homePNA, and others), technology (standalone, hybrid, Wi-Fi, zigbee, ethernet, and others), application (smart grids, networking, lighting, security & surveillance, long haul, machine to machine, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Broadband Power Line Communication Chipset Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Broadband Power Line Communication Chipset Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Broadband Power Line Communication Chipset Market by Standards
    • 3.3.1: Homeplug AV
    • 3.3.2: HomePlug AV1
    • 3.3.3: HomePlug AV2
    • 3.3.4: IEEE 1901
    • 3.3.5: IEEE 1905.1
    • 3.3.6: G.Hn
    • 3.3.7: HomePNA
    • 3.3.8: Others
  • 3.4: Global Broadband Power Line Communication Chipset Market by Technology
    • 3.4.1: Standalone
    • 3.4.2: Hybrid
    • 3.4.3: Wi-Fi
    • 3.4.4: Zigbee
    • 3.4.5: Ethernet
    • 3.4.6: Others
  • 3.5: Global Broadband Power Line Communication Chipset Market by Application
    • 3.5.1: Smart Grids
    • 3.5.2: Networking
    • 3.5.3: Lighting
    • 3.5.4: Security & Surveillance
    • 3.5.5: Long Haul
    • 3.5.6: Machine to Machine
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Broadband Power Line Communication Chipset Market by Region
  • 4.2: North American Broadband Power Line Communication Chipset Market
    • 4.2.1: North American Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.2.2: North American Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.3: European Broadband Power Line Communication Chipset Market
    • 4.3.1: European Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.3.2: European Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.4: APAC Broadband Power Line Communication Chipset Market
    • 4.4.1: APAC Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.4.2: APAC Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others
  • 4.5: ROW Broadband Power Line Communication Chipset Market
    • 4.5.1: ROW Broadband Power Line Communication Chipset Market by Technology: Standalone, Hybrid, Wi-Fi, Zigbee, Ethernet, and Others
    • 4.5.2: ROW Broadband Power Line Communication Chipset Market by Application: Smart Grids, Networking, Lighting, Security & Surveillance, Long Haul, Machine to Machine, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Standards
    • 6.1.2: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Technology
    • 6.1.3: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Application
    • 6.1.4: Growth Opportunities for the Global Broadband Power Line Communication Chipset Market by Region
  • 6.2: Emerging Trends in the Global Broadband Power Line Communication Chipset Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Broadband Power Line Communication Chipset Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Broadband Power Line Communication Chipset Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Broadcom
  • 7.2: Intel
  • 7.3: Marvell Technology
  • 7.4: Maxim Integrated
  • 7.5: Megachips
  • 7.6: Qualcomm
  • 7.7: Semtech
  • 7.8: ST Microelectronics
  • 7.9: Vango Technologies
  • 7.10: Yitran Technologies