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全球多模式晶片组市场研究报告 - 2024 年至 2032 年产业分析、规模、份额、成长、趋势与预测

Global Multi-Mode Chipset Market Research Report - Industry Analysis, Size, Share, Growth, Trends and Forecast 2024 to 2032

出版日期: 2024年03月01日 | 出版商:

Value Market Research | 英文 112 Pages | 商品交期: 最快1-2个工作天内

价格

简介目录图表

全球多模晶片组市场需求预计将从 2023 年的 67.4 亿美元增至 2032 年的近 224.6 亿美元，2024-2032 年研究期间CAGR为 14.3%。

多模式晶片组是指在电子设备内支援和启用多种通讯模式的积体电路。这些晶片组通常包含各种无线技术的功能，例如 Wi-Fi、蓝牙和蜂窝连接。透过将多种模式整合到单一晶片组中，製造商可以创建具有增强连接选项的多功能紧凑型设备，从而提高智慧型手机、平板电脑和物联网设备等各种电子产品的效率和功能。

市场动态

由于对高速可靠通讯网路的需求不断增长、连接设备的激增以及无线通讯技术的进步，多模晶片组市场经历了成长。多模晶片组使设备能够支援多种无线通讯标准，包括 3G、4G 和 5G，从而在不同的网路环境中提供灵活性和相容性。智慧型手机、智慧家庭设备和物联网 (IoT) 设备的日益普及促进了市场成长。此外，5G 网路的全球扩张以及跨不同代无线技术无缝连接的需求推动了市场成长。更高资料速率、低延迟通讯和智慧基础设施发展的趋势进一步刺激了市场成长。包括整合天线和节能设计在内的技术创新有助于提高多模晶片组的性能和效率，支援其整合到各种无线设备和网路设备中。

研究报告涵盖波特五力模型、市场吸引力分析和价值链分析。这些工具有助于清晰地了解行业结构并评估全球范围内的竞争吸引力。此外，这些工具也对全球多模晶片组市场的各个细分市场进行了包容性评估。多模晶片组产业的成长和趋势为本研究提供了整体方法。

市场区隔

多模晶片组市场报告的这一部分提供了国家和地区级别细分市场的详细资料，从而帮助战略家确定相应产品或服务的目标人群以及即将到来的机会。

按申请

智慧型手机
平板电脑
穿戴式装置
其他的

区域分析

本节涵盖区域前景，重点介绍北美、欧洲、亚太地区、拉丁美洲以及中东和非洲多模晶片组市场当前和未来的需求。此外，该报告重点关注所有主要地区各个应用领域的需求、估计和预测。

全球多模式晶片组市场份额（按地区）（代表性图）
全球多模晶片组市场份额

该研究报告还涵盖了市场主要参与者的全面概况以及对全球竞争格局的深入了解。多模晶片组市场的主要参与者包括海思半导体、英特尔公司、高通技术公司、三星集团、联发科、展讯通讯、Marvell 科技集团、Altair Semiconductor, Inc.、博通公司、GCT Semiconductor Inc.。对竞争格局的整体看法，包括各种策略发展，例如关键併购、未来能力、合作伙伴关係、财务概况、合作、新产品开发、新产品发布和其他发展。

如果您有任何客製化要求，请写信给我们。我们的研究团队可以根据您的需求提供客製化报告。

区域展望
介绍
北美销售分析
- 概览、历史与预测资料销售分析
- 北美按细分市场销售分析
- 北美按国家销售分析
- 美国销售分析
- 加拿大销售分析
- 墨西哥销售分析
欧洲销售分析
- 概览、历史与预测资料销售分析
- 欧洲按细分市场销售分析
- 欧洲按国家销售分析
- 英国销售分析
- 法国销售分析
- 德国销售分析
- 义大利销售分析
- 俄罗斯销售分析
- 欧洲其他地区销售分析
亚太地区销售分析
- 概览、历史与预测资料销售分析
- 亚太地区按细分市场销售分析
- 亚太地区国家/地区销售分析
- 中国销售分析
- 印度销售分析
- 日本销售分析
- 韩国销售分析
- 澳洲销售分析
- 东南亚销售分析
- 亚太地区其他地区销售分析
拉丁美洲销售分析
- 概览、历史与预测资料销售分析
- 拉丁美洲按细分市场销售分析
- 拉丁美洲按国家销售分析
- 巴西销售分析
- 阿根廷销售分析
- 秘鲁销售分析
- 智利销售分析
- 拉丁美洲其他地区销售分析
中东和非洲销售分析
- 概览、历史与预测资料销售分析
- 中东和非洲按细分市场销售分析
- 中东和非洲国家销售分析
- 沙乌地阿拉伯销售分析
- 阿联酋销售分析
- 以色列销售分析
- 南非销售分析
- 中东其他地区和非洲销售分析

第 7 章：多模式晶片组公司的竞争格局

多模晶片组市场竞争
伙伴关係/协作/协议
併购
新产品发布
其他发展

第 8 章：公司简介

公司股份分析
市场集中度
HiSilicon Technologies

公司简介
公司收入
产品
最近的发展

Intel Corporation

公司简介
公司收入
产品
最近的发展

Qualcomm Technologies Inc.

公司简介
公司收入
产品
最近的发展

Samsung Group

公司简介
公司收入
产品
最近的发展

MediaTek

公司简介
公司收入
产品
最近的发展

Spreadtrum Communications

公司简介
公司收入
产品
最近的发展

Marvell Technology Group

公司简介
公司收入
产品
最近的发展

Altair Semiconductor Inc.

公司简介
公司收入
产品
最近的发展

Broadcom Corporation

公司简介
公司收入
产品
最近的发展

GCT Semiconductor Inc.

公司简介
公司收入
产品
最近的发展

注意 - 在公司概况中，财务详细资讯和近期发展视情况而定，或者如果是私人公司，则可能不包括在内

简介目录图表

Product Code: VMR112113859

The global demand for Multi-Mode Chipset Market is presumed to reach the market size of nearly USD 22.46 BN by 2032 from USD 6.74 BN in 2023 with a CAGR of 14.3% under the study period 2024 - 2032.

Multi-mode chipset refers to integrated circuits that support and enable multiple communication modes within electronic devices. These chipsets often include capabilities for various wireless technologies, such as Wi-Fi, Bluetooth, and cellular connectivity. By integrating multiple modes into a single chipset, manufacturers can create versatile and compact devices with enhanced connectivity options, contributing to the efficiency and functionality of diverse electronic products like smartphones, tablets, and IoT devices.

MARKET DYNAMICS

The multi-mode chipset market experiences growth driven by the escalating demand for high-speed and reliable communication networks, the proliferation of connected devices, and advancements in wireless communication technologies. Multi-mode chipsets enable devices to support multiple wireless communication standards, including 3G, 4G, and 5G, providing flexibility and compatibility in diverse network environments. The growing adoption of smartphones, smart home devices, and Internet of Things (IoT) devices contributes to market growth. Additionally, the global expansion of 5G networks and the need for seamless connectivity across different generations of wireless technologies drive the market growth. The trend towards higher data rates, low-latency communication, and smart infrastructure development further stimulate market growth. Technological innovations, including integrated antennas and power-efficient designs, contribute to the performance and efficiency of multi-mode chipsets, supporting their integration into a wide range of wireless devices and network equipment.

The research report covers Porter's Five Forces Model, Market Attractiveness Analysis, and Value Chain analysis. These tools help to get a clear picture of the industry's structure and evaluate the competition attractiveness at a global level. Additionally, these tools also give an inclusive assessment of each segment in the global market of multi-mode chipset. The growth and trends of multi-mode chipset industry provide a holistic approach to this study.

MARKET SEGMENTATION

This section of the multi-mode chipset market report provides detailed data on the segments at country and regional level, thereby assisting the strategist in identifying the target demographics for the respective product or services with the upcoming opportunities.

By Application

Smartphones
Tablets
Wearable Devices
Others

REGIONAL ANALYSIS

This section covers the regional outlook, which accentuates current and future demand for the Multi-Mode Chipset market across North America, Europe, Asia-Pacific, Latin America, and Middle East & Africa. Further, the report focuses on demand, estimation, and forecast for individual application segments across all the prominent regions.

GLOBAL MULTI-MODE CHIPSET MARKET SHARE BY REGION (REPRESENTATIVE GRAPH)
Global Multi-Mode Chipset Market Share

The research report also covers the comprehensive profiles of the key players in the market and an in-depth view of the competitive landscape worldwide. The major players in the Multi-Mode Chipset market include HiSilicon Technologies, Intel Corporation, Qualcomm Technologies Inc., Samsung Group, MediaTek, Spreadtrum Communications, Marvell Technology Group, Altair Semiconductor, Inc., Broadcom Corporation, GCT Semiconductor Inc. This section consists of a holistic view of the competitive landscape that includes various strategic developments such as key mergers & acquisitions, future capacities, partnerships, financial overviews, collaborations, new product developments, new product launches, and other developments.

In case you have any custom requirements, do write to us. Our research team can offer a customized report as per your need.

1 . PREFACE

1.1. Report Description
- 1.1.1. Objective
- 1.1.2. Target Audience
- 1.1.3. Unique Selling Proposition (USP) & offerings
1.2. Research Scope
1.3. Research Methodology
- 1.3.1. Market Research Process
- 1.3.2. Market Research Methodology

2 . EXECUTIVE SUMMARY

2.1. Highlights of Market
2.2. Global Market Snapshot

3 . MULTI-MODE CHIPSET - INDUSTRY ANALYSIS

3.1. Introduction - Market Dynamics
3.2. Market Drivers
3.3. Market Restraints
3.4. Opportunities
3.5. Industry Trends
3.6. Porter's Five Force Analysis
3.7. Market Attractiveness Analysis
- 3.7.1 Market Attractiveness Analysis By Application
- 3.7.2 Market Attractiveness Analysis By Region

4 . VALUE CHAIN ANALYSIS

4.1. Value Chain Analysis
4.2. Raw Material Analysis
- 4.2.1. List of Raw Materials
- 4.2.2. Raw Material Manufactures List
- 4.2.3. Price Trend of Key Raw Materials
4.3. List of Potential Buyers
4.4. Marketing Channel
- 4.4.1. Direct Marketing
- 4.4.2. Indirect Marketing
- 4.4.3. Marketing Channel Development Trend

5 . GLOBAL MULTI-MODE CHIPSET MARKET ANALYSIS BY APPLICATION

5.1 Overview by Application
5.2 Historical and Forecast Data
5.3 Analysis by Application
5.4 Smartphones Historic and Forecast Sales by Regions
5.5 Tablets Historic and Forecast Sales by Regions
5.6 Wearable Devices Historic and Forecast Sales by Regions
5.7 Others Historic and Forecast Sales by Regions

6 . GLOBAL MULTI-MODE CHIPSET MARKET ANALYSIS BY GEOGRAPHY

6.1. Regional Outlook
6.2. Introduction
6.3. North America Sales Analysis
- 6.3.1. Overview, Historic and Forecast Data Sales Analysis
- 6.3.2. North America By Segment Sales Analysis
- 6.3.3. North America By Country Sales Analysis
- 6.3.4. United State Sales Analysis
- 6.3.5. Canada Sales Analysis
- 6.3.6. Mexico Sales Analysis
6.4. Europe Sales Analysis
- 6.4.1. Overview, Historic and Forecast Data Sales Analysis
- 6.4.2. Europe by Segment Sales Analysis
- 6.4.3. Europe by Country Sales Analysis
- 6.4.4. United Kingdom Sales Analysis
- 6.4.5. France Sales Analysis
- 6.4.6. Germany Sales Analysis
- 6.4.7. Italy Sales Analysis
- 6.4.8. Russia Sales Analysis
- 6.4.9. Rest Of Europe Sales Analysis
6.5. Asia Pacific Sales Analysis
- 6.5.1. Overview, Historic and Forecast Data Sales Analysis
- 6.5.2. Asia Pacific by Segment Sales Analysis
- 6.5.3. Asia Pacific by Country Sales Analysis
- 6.5.4. China Sales Analysis
- 6.5.5. India Sales Analysis
- 6.5.6. Japan Sales Analysis
- 6.5.7. South Korea Sales Analysis
- 6.5.8. Australia Sales Analysis
- 6.5.9. South East Asia Sales Analysis
- 6.5.10. Rest Of Asia Pacific Sales Analysis
6.6. Latin America Sales Analysis
- 6.6.1. Overview, Historic and Forecast Data Sales Analysis
- 6.6.2. Latin America by Segment Sales Analysis
- 6.6.3. Latin America by Country Sales Analysis
- 6.6.4. Brazil Sales Analysis
- 6.6.5. Argentina Sales Analysis
- 6.6.6. Peru Sales Analysis
- 6.6.7. Chile Sales Analysis
- 6.6.8. Rest of Latin America Sales Analysis
6.7. Middle East & Africa Sales Analysis
- 6.7.1. Overview, Historic and Forecast Data Sales Analysis
- 6.7.2. Middle East & Africa by Segment Sales Analysis
- 6.7.3. Middle East & Africa by Country Sales Analysis
- 6.7.4. Saudi Arabia Sales Analysis
- 6.7.5. UAE Sales Analysis
- 6.7.6. Israel Sales Analysis
- 6.7.7. South Africa Sales Analysis
- 6.7.8. Rest Of Middle East And Africa Sales Analysis

7 . COMPETITIVE LANDSCAPE OF THE MULTI-MODE CHIPSET COMPANIES

7.1. Multi-Mode Chipset Market Competition
7.2. Partnership/Collaboration/Agreement
7.3. Merger And Acquisitions
7.4. New Product Launch
7.5. Other Developments

8 . COMPANY PROFILES OF MULTI-MODE CHIPSET INDUSTRY

8.1. Company Share Analysis
8.2. Market Concentration Rate
8.3. HiSilicon Technologies
- 8.3.1. Company Overview
- 8.3.2. Company Revenue
- 8.3.3. Products
- 8.3.4. Recent Developments
8.4. Intel Corporation
- 8.4.1. Company Overview
- 8.4.2. Company Revenue
- 8.4.3. Products
- 8.4.4. Recent Developments
8.5. Qualcomm Technologies Inc.
- 8.5.1. Company Overview
- 8.5.2. Company Revenue
- 8.5.3. Products
- 8.5.4. Recent Developments
8.6. Samsung Group
- 8.6.1. Company Overview
- 8.6.2. Company Revenue
- 8.6.3. Products
- 8.6.4. Recent Developments
8.7. MediaTek
- 8.7.1. Company Overview
- 8.7.2. Company Revenue
- 8.7.3. Products
- 8.7.4. Recent Developments
8.8. Spreadtrum Communications
- 8.8.1. Company Overview
- 8.8.2. Company Revenue
- 8.8.3. Products
- 8.8.4. Recent Developments
8.9. Marvell Technology Group
- 8.9.1. Company Overview
- 8.9.2. Company Revenue
- 8.9.3. Products
- 8.9.4. Recent Developments
8.10. Altair Semiconductor Inc.
- 8.10.1. Company Overview
- 8.10.2. Company Revenue
- 8.10.3. Products
- 8.10.4. Recent Developments
8.11. Broadcom Corporation
- 8.11.1. Company Overview
- 8.11.2. Company Revenue
- 8.11.3. Products
- 8.11.4. Recent Developments
8.12. GCT Semiconductor Inc.
- 8.12.1. Company Overview
- 8.12.2. Company Revenue
- 8.12.3. Products
- 8.12.4. Recent Developments