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封面
市场调查报告书
商品编码
1418090

构装基板市场报告：2030 年趋势、预测与竞争分析

Package Substrate Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

构装基板趋势与预测

预计2024年至2030年全球构装基板市场将以6.8%的复合年增长率成长。该市场的主要驱动力是电子设备小型化趋势的日益增长、先进封装技术的日益采用以及对高性能储存设备的需求不断增加。全球构装基板市场前景广阔，行动装置和汽车市场蕴藏机会。

构装基板市场洞察

Lucintel预测，由于覆晶尺寸封装的导热性提高和製造成本降低，预计在预测期内将实现最高成长。

由于通讯控制和资料处理应用的使用增加，汽车市场预计将出现高速成长。

由于主要半导体製造和电子生产中心的存在，预计亚太地区在预测期内将出现最高增长。

常问问题

Q1.市场成长预测如何？

A1. 2024年至2030年，全球构装基板市场预计将以6.8%的复合年增长率成长。

Q2.影响市场成长的主要驱动因素有哪些？

A2. 该市场的主要驱动因素是电子设备小型化的趋势日益明显、先进封装技术的采用不断增加以及对高性能储存设备的需求不断增加。

Q3.市场的主要细分市场有哪些？

A3.全球构装基板市场未来性广阔，行动装置市场和汽车市场都有机会。

Q4.市场上主要企业有哪些？

A4.构装基板主要企业如下。

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck

Q5.未来最大的细分市场是什么？

A5.Lucintel 预测，由于导热率的提高和製造成本的降低，覆晶级封装预计将在预测期内出现最高的增长。

Q6. 未来五年预计哪个地区将成为最大的市场？

A6.由于主要半导体製造和电子生产中心的存在，预计亚太地区在预测期内将出现最高增长。

Q7. 可以客製化报告吗？

A7. 是的，Lucintel 提供 10% 的客製化服务，无需额外费用。

目录

第一章执行摘要

第二章 全球构装基板市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球构装基板市场趋势（2018-2023）与预测（2024-2030）
  • 按类型分類的全球构装基板市场
    • 覆晶
    • 焊线
    • 球超过尖端
    • 系统级封装
    • 覆晶球栅阵列
  • 全球构装基板市场（按应用）
    • 行动装置
    • 汽车产业
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球构装基板市场（按地区）
  • 北美构装基板市场
  • 欧洲构装基板市场
  • 亚太地区构装基板市场
  • 其他地区构装基板市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按类型分類的全球构装基板市场成长机会
    • 全球构装基板市场成长机会（按应用）
    • 按地区分類的全球构装基板市场成长机会
  • 全球构装基板市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球构装基板市场产能
    • 全球构装基板市场的合併、收购与合资
    • 认证和许可

第七章主要企业概况

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck
简介目录

Package Substrate Trends and Forecast

The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets. The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030. The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.

A more than 150-page report is developed to help in your business decisions.

Package Substrate by Segment

The study includes a forecast for the global package substrate by type, application, and region.

Package Substrate Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Flip Chip Chip Scale Package
  • Wire Bonding Chip Scale Package
  • Ball Over Chip
  • System In Package
  • Flip Chip-Ball Grid Array

Package Substrate Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Mobile Devices
  • Automotive Industry
  • Others

Package Substrate Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Package Substrate Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies package substrate companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the package substrate companies profiled in this report include-

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck

Package Substrate Market Insights

Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.

Within this market, automotive is expected to witness the higher growth due to increasing usage in communication control and data processing applications.

APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.

Features of the Global Package Substrate Market

Market Size Estimates: Package substrate market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Package substrate market size by type, application, and region in terms of value ($B).

Regional Analysis: Package substrate market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the package substrate market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the package substrate market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for package substrate market?

Answer: The global package substrate market is expected to grow with a CAGR of 6.8% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the package substrate market?

Answer: The major drivers for this market are rising trend of miniaturization of electronic devices, growing adoption of advanced packaging technologies, and increasing demand for high-performance memory devices.

Q3. What are the major segments for package substrate market?

Answer: The future of the global package substrate market looks promising with opportunities in the mobile device and automotive markets.

Q4. Who are the key package substrate market companies?

Answer: Some of the key package substrate companies are as follows.

  • Ibiden
  • Shinko Electric Industries
  • Kyocera
  • Samsung Electro-Mechanics
  • Fujitsu
  • Hitachi
  • Eastern
  • LG Innotek
  • Simmtech
  • Daeduck

Q5. Which package substrate market segment will be the largest in future?

Answer: Lucintel forecasts that flip chip chip scale package is expected to witness the highest growth over the forecast period due to its improved thermal conductivity and low manufacturing cost.

Q6. In package substrate market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to presence of major semiconductor manufacturing and electronics production hubs in the region.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the package substrate market by type (flip chip chip scale package, wire bonding chip scale package, ball over chip, system in package, and flip chip-ball grid array), application (mobile devices, automotive industry, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Package Substrate Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Package Substrate Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Package Substrate Market by Type
    • 3.3.1: Flip Chip Chip Scale Package
    • 3.3.2: Wire Bonding Chip Scale Package
    • 3.3.3: Ball Over Chip
    • 3.3.4: System In Package
    • 3.3.5: Flip Chip-Ball Grid Array
  • 3.4: Global Package Substrate Market by Application
    • 3.4.1: Mobile Devices
    • 3.4.2: Automotive Industry
    • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Package Substrate Market by Region
  • 4.2: North American Package Substrate Market
    • 4.2.2: North American Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others
  • 4.3: European Package Substrate Market
    • 4.3.1: European Package Substrate Market by Type: Flip Chip Chip Scale Package, Wire Bonding Chip Scale Package, Ball Over Chip, System In Package, and Flip Chip-Ball Grid Array
    • 4.3.2: European Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others
  • 4.4: APAC Package Substrate Market
    • 4.4.1: APAC Package Substrate Market by Type: Flip Chip Chip Scale Package, Wire Bonding Chip Scale Package, Ball Over Chip, System In Package, and Flip Chip-Ball Grid Array
    • 4.4.2: APAC Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others
  • 4.5: ROW Package Substrate Market
    • 4.5.1: ROW Package Substrate Market by Type: Flip Chip Chip Scale Package, Wire Bonding Chip Scale Package, Ball Over Chip, System In Package, and Flip Chip-Ball Grid Array
    • 4.5.2: ROW Package Substrate Market by Application: Mobile Devices, Automotive Industry, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Package Substrate Market by Type
    • 6.1.2: Growth Opportunities for the Global Package Substrate Market by Application
    • 6.1.3: Growth Opportunities for the Global Package Substrate Market by Region
  • 6.2: Emerging Trends in the Global Package Substrate Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Package Substrate Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Package Substrate Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Ibiden
  • 7.2: Shinko Electric Industries
  • 7.3: Kyocera
  • 7.4: Samsung Electro-Mechanics
  • 7.5: Fujitsu
  • 7.6: Hitachi
  • 7.7: Eastern
  • 7.8: LG Innotek
  • 7.9: Simmtech
  • 7.10: Daeduck