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市场调查报告书
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1730052

共封装光学元件 (CPO) 市场报告：2031 年趋势、预测与竞争分析

Co-Packaged Optic Market Report: Trends, Forecast and Competitive Analysis to 2031
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

全球 CPO（共封装光纤）市场的未来预计将在资料中心/HPC 和通讯/网路市场中看到机会。预计全球共封装光学 (CPO) 市场从 2025 年到 2031 年的复合年增长率将达到 42.9%。该市场的主要驱动因素是频宽需求的增加、能源效率需求的增加以及 AI 工作负载的使用量的增加。

  • 根据Lucintel的预测，1.6T以下类别预计在预测期内达到最高成长。
  • 从应用类别来看，资料中心和HPC预计将出现强劲成长。
  • 按地区划分，预计亚太地区将在预测期内实现最高成长。

CPO（共封装光学元件）市场趋势

由于技术创新和对节能解决方案的需求不断增加，共封装光学（CPO）市场正在快速变化。改变市场的主要趋势是：

  • 光学和电气元件的整合最突出的趋势是将光学和电气元件整合到一个封装中。这种整合最大限度地减少了延迟，最大限度地提高了频宽效率，并降低了功耗，使其成为资料中心、云端运算和通讯的理想解决方案。
  • 越来越重视资料中心最佳化：资料中心对高速资料传输的需求正在推动共封装光学（CPO）的发展。企业越来越多地采用共封装光纤 (CPO) 技术来降低功耗并提高资料吞吐量。这是由人工智慧、机器学习和巨量资料分析的发展所推动的。
  • 5G 和新一代网路扩展：全球 5G 网路的扩展为共封装光学元件 (CPO) 的使用提供了巨大的推动力。这些网路需要共封装光学元件 (CPO) 提供的高频宽、低延迟技术。对高速互联网连接的需求正在推动对通讯基础设施中使用的光学技术的需求。
  • 下一代封装技术的演进：共封装光学（CPO）与硅光电等新一代封装技术的演变直接相关。这些技术促进了高速资料传输、高频宽和低延迟，使其非常适合包括 5G 及更高版本的下一代通讯系统。
  • 永续性和能源效率：日益增长的环境问题使得人们更加重视开发节能技术。共封装光学元件 (CPO) 被认为是一种永续的选择，因为它消耗更少的功率，并且可以处理高数据流量而不会产生过多的热量。

这些趋势反映出人们正朝着更整合、高效和高效的光学解决方案迈进，专注于满足人工智慧、5G 和云端运算等新兴技术日益增长的资料传输需求。

CPO（共封装光学元件）市场的最新趋势

过去几年，共封装光学 (CPO) 市场取得了重大发展，促进了光学技术的快速发展。以下是五个主要趋势：

  • 光学整合技术的进步：各公司正在推进将光学元件整合到半导体封装中。这项技术创新使得光学模组低耗电量，适合资料中心、高效能运算和通讯的应用。
  • 5G基础设施部署：5G正在全球部署，推动对高效能光互连的需求。共封装光纤（CPO）是满足5G高速、低延迟需求的完美解决方案，促进了全球对光学技术的投资和创新。
  • 政府和产业支持：世界各国政府，尤其是美国和中国政府，正在投资共封装光学元件 (CPO) 的开发。这项投资将用于资助依赖高速资料传输技术的 5G 和 AI 等下一代通讯基础设施。
  • 大型技术合作：英特尔、英特尔和 IBM 等产业巨头正在合作推动共封装光学 (CPO) 的发展。这些合作的重点是最大限度地减少能源使用和提高效能，加速这些技术在企业资料中心和云端运算中的应用。
  • 硅光电的出现：硅光电已成为共封装光学（CPO）的关键推动因素。硅光电能够在短时间内实现资料传输，同时消耗更少的功率，使其成为未来资料中心、IT 和通讯网路以及高效能运算的核心组成部分。

这些技术创新正在定义共封装光纤 (CPO) 市场的未来，确保其成为下一代通讯和资料基础设施的重要组成部分。

目录

第一章执行摘要

第二章全球共封装光学（CPO）市场：市场动态

  • 简介、背景和分类
  • 供应链
  • 产业驱动力与挑战

第三章 2019-2031 年市场趋势与预测分析

  • 宏观经济趋势（2019-2024）及预测（2025-2031）
  • 全球共封装光学（CPO）市场趋势（2019-2024）及预测（2025-2031）
  • 全球共封装光学（CPO）市场类型
    • 小于1.6T
    • 1.6～3.2 T
    • 3.2吨或以上
  • 全球共封装光学（CPO）市场（按应用）
    • 资料中心和 HPC
    • 通讯和网路

第四章 2019 - 2031 年各地区市场趋势及预测分析

  • 全球共封装光学（CPO）市场（按地区）
  • 北美 CPO（共封装光学元件）市场
  • 欧洲CPO（共封装光学）市场
  • 亚太共同封装光学（CPO）市场
  • 其他地区的CPO（共封装光学）市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球共封装光学（CPO）市场成长机会（按类型）
    • 全球共封装光学（CPO）市场成长机会（按应用）
    • 全球共封装光学（CPO）市场成长机会（按地区）
  • 全球CPO（共封装光学元件）市场的新趋势
  • 战略分析
    • 新产品开发
    • 全球CPO（共封装光学元件）市场产能扩张
    • 全球 CPO（共封装光学）市场合併、收购及合资企业
    • 认证和许可

第七章主要企业简介

  • Broadcom
  • NVIDIA
  • Cisco
  • Ranovus
  • Intel
简介目录

The future of the global co-packaged optic market looks promising with opportunities in the data center & HPC and telecommunication & networking markets. The global co-packaged optic market is expected to grow with a CAGR of 42.9% from 2025 to 2031. The major drivers for this market are the increasing demand for bandwidth, the rising need for energy efficiency, and the growing use of AI workloads.

  • Lucintel forecasts that, within the type category, less than 1.6 T is expected to witness the highest growth over the forecast period.
  • Within the application category, data center & HPC is expected to witness higher growth.
  • In terms of region, APAC is expected to witness the highest growth over the forecast period.

Emerging Trends in the Co-Packaged Optic Market

The market for co-packaged optics is changing at a fast pace as a result of technological innovations and increasing needs for power-saving solutions. The following are the dominant trends changing the market:

  • Optical and Electrical Component Integration: The most prominent trend is the increased emphasis on integrating optical and electrical components into a single package. Integration of this type minimizes latency, maximizes bandwidth efficiency, and reduces power consumption, making it the best solution for data centers, cloud computing, and telecommunications.
  • Growing Emphasis on Data Center Optimization: The need for fast data transmission in data centers is driving the development of co-packaged optics. Organizations are increasingly using co-packaged optic technologies to save power and increase data throughput. This is being catalyzed by the growth in AI, machine learning, and big data analytics.
  • Expansion of 5G and Next-Generation Networks: Expansion of 5G networks worldwide is a major push for the usage of co-packaged optics. These networks call for high-bandwidth, low-latency technology that is offered by co-packaged optics. The demand for high-speed internet connectivity is driving demand for optical technologies used in telecom infrastructure.
  • Evolution of Next-Generation Packaging Technologies: Co-packaged optics is directly related to the evolution of novel and next-generation packaging technologies, like silicon photonics. These technologies facilitate high-speed data transmission, high bandwidth, and low latency and are well suited for next-generation communications systems, including 5G and beyond.
  • Sustainability and Energy Efficiency: With greater concern for the environment, there is an increasing focus on developing energy-efficient technology. Co-packaged optics are perceived to be a sustainable option because they consume less power and can process high data traffic without producing excess heat.

These trends reflect the move towards more integrated, high-performance, and efficient optical solutions, with the focus on fulfilling the increasing needs for data transmission in emerging technologies such as AI, 5G, and cloud computing.

Recent Developments in the Co-Packaged Optic Market

The co-packaged optic market has witnessed great developments over the past few years, each making a contribution to the fast evolution of optical technologies. The following are five major developments:

  • Optical Integration Technology Advancements: Optical components are increasingly being integrated in semiconductor packages by companies. The technological change has resulted in size, cost, and power reduction in optical modules, making them more fit for application in data centers, high-performance computing, as well as telecommunications.
  • Rollout of 5G Infrastructure: With 5G deployments taking place across the globe, there is growing demand for optical interconnects with high performance. Co-packaged optics present a perfect solution to accommodate the high-speed and low-latency needs of 5G, fueling investment and innovation in optical technology around the world.
  • Government and Industry Support: Governments from different countries, particularly the U.S. and China, are investing in co-packaged optics development. The investments are being made to fund next-generation communication infrastructures, including 5G and AI, which rely on high-speed data transmission technology.
  • Tech Giants' Collaboration: Industry leaders such as Intel, Cisco, and IBM are coming together to propel the evolution of co-packaged optics. These collaborations are hastening the implementation of these technologies in data centers of enterprises and cloud computing with an emphasis on minimizing energy usage and improving performance.
  • Silicon Photonics Emergence: Silicon photonics has become a central enabler for co-packaged optics. Silicon photonics enables transmitting data in a short time while consuming less power, making it a central building block of the future data centers, telecommunication networks, and high-performance computing.

These innovations are defining the future of the co-packaged optic market, ensuring that it becomes an essential element of next-generation communication and data infrastructure.

Strategic Growth Opportunities in the Co-Packaged Optic Market

The co-packaged optic industry offers several growth prospects in various applications. Five major prospects are as follows:

  • Data Centers: As the need for cloud computing and big data analysis rises, data centers are emerging as a key application for co-packaged optics. Such technologies provide better performance and less power consumption, saving substantial costs for operators and providing accelerated data processing.
  • Telecommunications: Co-packaged optics are ideal for the growth of 5G and future-generation telecom networks. They offer the high-speed, low-latency connections needed for 5G infrastructure, and therefore are essential for telecom operators looking to increase network capacity and efficiency.
  • High-Performance Computing (HPC): In high-performance computing, the need for higher data throughput and lower power consumption is growing. Co-packaged optics address these requirements by providing faster, more efficient interconnect solutions, and thus they are a central element in supercomputing and AI-based research applications.
  • Machine Learning and AI: The increasing requirement for machine learning and AI solutions fuels the demand for cutting-edge data processing technology. Co-packaged optics is important to make data transmission and processing faster, which is critical for AI-powered systems to perform optimally at scale.
  • Automotive and IoT: Co-packaged optics find use in the automotive sector, particularly in autonomous vehicles that need high-speed data exchange between processors and sensors. In the same vein, IoT devices that must communicate across large networks can use the energy-efficient and high-bandwidth aspect of co-packaged optics.

These opportunities for growth bring to light the potential of co-packaged optics to revolutionize industries from telecommunications to AI and IoT, pushing technological development and market growth.

Co-Packaged Optic Market Driver and Challenges

The market for co-packaged optics is influenced by drivers and challenges. An understanding of these factors is essential for market stakeholders to play the market effectively.

The factors responsible for driving the co-packaged optic market include:

1. Technological Advancements: Technological developments like silicon photonics and integration technologies are principal forces behind the co-packaged optic market. They allow higher data rates, lower power requirements, and greater performance, all of which are crucial for data centers and telecommunications networks today.

2. 5G Deployment: The worldwide deployment of 5G networks necessitates high-end optical solutions that can fulfill the requirements of high-speed, low-latency 5G infrastructure. Co-packaged optics are vital to ensuring the efficiency and performance of future telecom networks.

3. Energy Efficiency: There is increasing recognition of energy use and environmental stewardship that is leading to the adoption of co-packaged optics, which minimize power usage as compared to traditional electrical interconnects. Such energy efficiency is particularly important for large data centers and telecom networks.

4. Cloud Computing Growth: The increasing adoption of cloud computing services demands faster and more efficient data transmission technologies. Co-packaged optics provide the high-performance and low-latency interconnects necessary for cloud services to scale.

5. AI and Big Data: Growth in AI and big data analytics is another significant reason for co-packaged optics since these technologies require greater bandwidth and quicker data processing. Co-packaged optics offer the required infrastructure to handle these data-hungry technologies.

Challenges in the co-packaged optic market are:

1. Significant Development Cost: Co-packaged optics require high R&D investment in development and integration. The cost of manufacturing these high-tech components can prove to be a limitation to adoption, especially for medium and small businesses.

2. Integration Challenges: Although co-packaged optics have several benefits, it is technically challenging to integrate optical devices with electronic systems and entails addressing compatibility, packaging, and scalability concerns.

3. Regulatory Barriers: The market for co-packaged optics is faced with several regulatory barriers, particularly intellectual property rights, global trade policies, and standards compliance. These barriers may hinder market growth and bring about uncertainties among manufacturers.

The market for co-packaged optics is fueled by advancements in technology, the need for energy-efficient solutions, and increasing demand for high-speed data transfer across all industries. The drivers are however still hindered by challenges including high development expenditure, integration difficulties, and compliance challenges that affect market growth. Careful consideration of these drivers and challenges must be taken in order to unlock the full value of co-packaged optics.

List of Co-Packaged Optic Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies co-packaged optic companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the co-packaged optic companies profiled in this report include-

  • Broadcom
  • NVIDIA
  • Cisco
  • Ranovus
  • Intel

Co-Packaged Optic Market by Segment

The study includes a forecast for the global co-packaged optic market by type, application, and region.

Co-Packaged Optic Market by Type [Value from 2019 to 2031]:

  • Less Than 1.6 T
  • 1.6 To 3.2 T
  • More Than 3.2 T

Co-Packaged Optic Market by Application [Value from 2019 to 2031]:

  • Data Center & HPC
  • Telecommunication & Networking

Co-Packaged Optic Market by Region [Value from 2019 to 2031]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Co-Packaged Optic Market

The co-packaged optic (CPO) industry is on a high growth trajectory, fueled by escalating demand for high-speed data transmission and power-efficient technologies. CPO is a technology of integrating the optical and electrical components into a single package, resulting in high power savings and enhanced performance for high-bandwidth applications. The United States, China, Germany, India, and Japan are the main contributors to this market, with numerous technological, economic, and regulatory forces driving the growth of this industry in each of these countries. This study identifies the current trends, advancements, and strategic growth prospects of the co-packaged optic market in these countries.

  • United States: The United States is still the leader in innovation within the co-packaged optic market, with some of the major developments coming in data center technologies. Large firms like Intel and Cisco are heavily investing in co-packaged optics as a way to make data centers more efficient and conserve energy. The efforts by the U.S. government to accelerate technological innovation in 5G and AI also help in the growth of this industry.
  • China: China has established a strong leap forward in the co-packaged optics, particularly in its communication infrastructure. Its intense focus on the rollout of 5G infrastructure and artificial intelligence technologies is pushing the call for high-speed and energy-saving data transmission. China's supportive government policies backing the development of semiconductor and fiber-optic technologies are essential in fueling the expansion.
  • Germany: Germany's co-packaged optic market has expanded because of its industrial prowess in semiconductor production and focus on high-tech innovation. Companies like Siemens and Bosch are incorporating co-packaged optics into their high-speed computing and telecommunications equipment, in line with the European Union policies promoting technological independence.
  • India: India is becoming a key player in the co-packaged optic industry, primarily fueled by rising demand for data infrastructure and 5G services. The government's Digital India push and investment in data centers are improving the country's skills in the optics and semiconductor segments.
  • Japan: Japan has been making significant strides in co-packaged optics, particularly in automotive and telecommunications applications. Japan's global leadership in robotics and AI is shaping the demand for energy-saving, high-speed data solutions. NEC and Fujitsu are some of the companies venturing into co-packaged optic technologies to expand their product lines.

Features of the Global Co-Packaged Optic Market

Market Size Estimates: Co-packaged optic market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.

Segmentation Analysis: Co-packaged optic market size by type, application, and region in terms of value ($B).

Regional Analysis: Co-packaged optic market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the co-packaged optic market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the co-packaged optic market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the co-packaged optic market by type (less than 1.6 T, 1.6 to 3.2 T, and more than 3.2 T), application (data center & HPC and telecommunication & networking), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Co-Packaged Optic Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2019 to 2031

  • 3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
  • 3.2. Global Co-Packaged Optic Market Trends (2019-2024) and Forecast (2025-2031)
  • 3.3: Global Co-Packaged Optic Market by Type
    • 3.3.1: Less than 1.6 T
    • 3.3.2: 1.6 to 3.2 T
    • 3.3.3: More than 3.2 T
  • 3.4: Global Co-Packaged Optic Market by Application
    • 3.4.1: Data Center & HPC
    • 3.4.2: Telecommunication & Networking

4. Market Trends and Forecast Analysis by Region from 2019 to 2031

  • 4.1: Global Co-Packaged Optic Market by Region
  • 4.2: North American Co-Packaged Optic Market
    • 4.2.1: North American Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
    • 4.2.2: North American Market by Application: Data Center & HPC and Telecommunication & Networking
  • 4.3: European Co-Packaged Optic Market
    • 4.3.1: European Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
    • 4.3.2: European Market by Application: Data Center & HPC and Telecommunication & Networking
  • 4.4: APAC Co-Packaged Optic Market
    • 4.4.1: APAC Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
    • 4.4.2: APAC Market by Application: Data Center & HPC and Telecommunication & Networking
  • 4.5: ROW Co-Packaged Optic Market
    • 4.5.1: ROW Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
    • 4.5.2: ROW Market by Application: Data Center & HPC and Telecommunication & Networking

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Co-Packaged Optic Market by Type
    • 6.1.2: Growth Opportunities for the Global Co-Packaged Optic Market by Application
    • 6.1.3: Growth Opportunities for the Global Co-Packaged Optic Market by Region
  • 6.2: Emerging Trends in the Global Co-Packaged Optic Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Co-Packaged Optic Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Co-Packaged Optic Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Broadcom
  • 7.2: NVIDIA
  • 7.3: Cisco
  • 7.4: Ranovus
  • 7.5: Intel