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市场调查报告书
商品编码
1873426
共封装光模组(CPO)-全球市场占有率和排名、总收入和需求预测(2025-2031年)Co-Packaged Optics Module (CPO) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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2024 年全球共封装光学模组(CPO) 市场规模预计为 4,460 万美元,预计到 2031 年将达到 12.36 亿美元,在预测期(2025-2031 年)内复合年增长率为 49.0%。
共封装光学元件 (CPO) 是一种将光元件和硅晶片高度异质整合到单一构装基板上的技术,旨在应对下一代频宽和功耗方面的挑战。 CPO 融合了光纤、数位讯号处理 (DSP)、交换器专用积体电路 (ASIC) 以及尖端封装和测试方面的丰富专业知识,为资料中心和云端基础设施带来创新的系统价值。通常,CPO 透过以下几种方式实现节能:
消除损耗较大的铜缆:与可插拔光学模组不同,CPO 设计无需讯号透过基板耗能的铜缆链路从 ASIC 晶片传输到前面板。相反,CPO 设计将光纤直接连接到交换机,从而实现晶片和光引擎之间的短距离、低损耗通讯。
数位讯号处理器 (DSP) 的减少:在目前支援 25G/通道以上速度的架构中,基于 DSP 的重定时器是插入式光模组的必要组件,用于主动分析和校正讯号劣化、失真和时序问题。 DSP 会使系统总功耗增加 25-30%。然而,透过消除 ASIC 和光组件之间片外损耗的铜互连,CPO 允许设计人员安全地减少一级 DSP,从而节省功耗和成本。
整合雷射:关于雷射光源的定位,目前有两种主要思路。主流方法是使用外部雷射器,这需要将光通过光纤传输并耦合到晶片上,通常会导致 30-50% 的光功率损耗。另一种方法是将雷射直接整合到晶片上,如果能够确保温度控管和雷射可靠性,这种方法可以实现比外部雷射更高的光耦合效率。
更高的频宽和更低的延迟:CPO 透过减少 DSP 和消除长铜线,实现了更高的频宽和更低的延迟。 DSP 等额外模组以及铜线中的寄生效应都会造成延迟,但在 CPO 解决方案中,讯号不会受到这些延迟的影响。
人工智慧革命是一个跨产业的趋势,预计到 2030 年,人工智慧产业规模将达到 2,800 亿美元。将光学引擎与运算晶片(例如 AI/ML 加速器)整合的 CPO 技术,有望受益于人工智慧驱动的资料中心和高效能运算丛集中对高速、低延迟资料传输的需求。
Google、亚马逊、微软和 Meta 等科技巨头正在探索使用 CPO 来提高电源效率和资料传输速度,预计 CPO 将在 2026 年至 2028 年间取代资料中心交换器中的传统可插拔光学模组。
传统可插拔光学模组的功耗比CPO高出50-60%。 CPO能够实现节能资料传输,并有助于降低资料中心的冷却成本。人们对绿色资料中心和减少碳足迹的日益关注正在加速CPO的普及应用。
光互联论坛 (OIF) 和开放运算专案 (OCP) 等行业组织正在製定 CPO 规范,思科、英特尔和博通等公司正在合作开发用于商业部署的标准化 CPO 模组。
本报告旨在按地区/国家、类型和应用对全球共封装光学模组(CPO) 市场进行全面分析,重点关注总收入、市场份额和主要企业的排名。
本报告基于 2020 年至 2031 年的历史数据和预测数据(以 2024 年为基准年),对共封装光模组 (CPO) 市场规模的销售收入进行了估算和预测。报告采用定量和定性分析相结合的方法,帮助读者制定业务和成长策略,评估市场竞争,分析自身在当前市场中的地位,并就共封装光模组 (CPO) 做出明智的商业决策。
市场区隔
公司
按类型分類的细分市场
应用领域
按地区
The global market for Co-Packaged Optics Module (CPO) was estimated to be worth US$ 44.6 million in 2024 and is forecast to a readjusted size of US$ 1236 million by 2031 with a CAGR of 49.0% during the forecast period 2025-2031.
Co-Packaged Optics (CPO) is an advanced heterogeneous integration of optics and silicon on a single packaged substrate aimed at addressing next generation bandwidth and power challenges. CPO brings together a wide range of expertise in fiber optics, digital signal processing (DSP), switch ASICs, and state-of-the-art packaging & test to provide disruptive system value for the data center and cloud infrastructure. Generally, CPOs offer power saving in several different ways.
No lossy copper traces: Unlike pluggable optics, CPO design eliminates the need for signals to traverse from the application-specific integrated circuit (ASIC) chip over energy-sapping copper links across the board up to the front panel. Instead, CPO design brings the fiber directly to the switch enabling short, low-loss communication between the chip and the optical engine.
Fewer digital signal processors (DSPs): In current architectures for speeds higher than 25G/lane, DSP-based retimers have become necessary components in pluggable optics to actively analyze and compensate for signal degradation, distortions, and timing issues. The DSP contributes to driving up the overall system power by as much as 25-30%. However, given that CPOs eliminate the off-chip lossy copper traces between the ASIC and the optics, designers can safely eliminate one DSP level to save power and reduce costs.
Integrated lasers: There are two schools of thought regarding laser source placement. The prevalent approach involves an external laser, necessitating the transmission of light through a fiber and coupling it into the CPO and typically incurring an optical power loss of 30-50%. The alternative approach integrates the laser directly onto the chip, offering a notably higher optical coupling compared to the latter approach, provided that thermal management and laser reliability are viable.
High bandwidth and low latency: CPOs can enable higher bandwidth and lower latency, mainly because of fewer DSPs and the removal of long copper traces. Additional blocks like DSPs as well as the parasitics in copper traces all introduce delays that signals won't see in a CPO solution.
The AI revolution is a recurring theme across industries, with projections of the AI sector reaching $280 billion by 2030. CPO technology, which integrates optical engines with compute chips (e.g., AI/ML accelerators), could benefit from AI-driven demand for high-speed, low-latency data transmission in data centers and HPC clusters.
Tech giants like Google, Amazon, Microsoft, and Meta are exploring CPO to enhance power efficiency and data transmission speeds. CPO is expected to replace traditional pluggable optics in data center switches by 2026-2028.
Traditional pluggable optics consume 50-60% more power than CPO. CPO enables energy-efficient data transmission, reducing cooling costs in data centers. Growing focus on green data centers and carbon footprint reduction is accelerating CPO deployment.
Industry alliances like OIF (Optical Internetworking Forum) and Open Compute Project (OCP) are working on CPO specifications. Companies like Cisco, Intel, Broadcom, etc. are collaborating to develop standardized CPO modules for commercial deployment.
This report aims to provide a comprehensive presentation of the global market for Co-Packaged Optics Module (CPO), focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Co-Packaged Optics Module (CPO) by region & country, by Type, and by Application.
The Co-Packaged Optics Module (CPO) market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Co-Packaged Optics Module (CPO).
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Co-Packaged Optics Module (CPO) company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Co-Packaged Optics Module (CPO) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Co-Packaged Optics Module (CPO) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.