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市场调查报告书
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1855186

自动银烧结晶片贴装机市场报告：趋势、预测及竞争分析（至2031年）

Automatic Silver Sintering Die Attach Machine Market Report: Trends, Forecast and Competitive Analysis to 2031
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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由于功率半导体装置、射频功率装置和高性能LED市场的巨大机会，全球自动银烧结晶片贴装机市场前景广阔。预计2025年至2031年，该市场将以7.1%的复合年增长率成长。推动该市场成长的关键因素包括：对高功率元件的需求不断增长、先进封装技术的应用日益广泛以及对温度控管解决方案的需求不断增加。

  • Lucintel 预测，按类型划分，全自动机器在预测期内将实现高速成长。
  • 从应用领域来看，功率半导体装置、射频功率元件和高效能LED预计将达到最高成长。
  • 从区域来看，预计亚太地区在预测期内将达到最高成长。

全自动银烧结晶片黏接机的市场趋势

由于先进电子封装领域对更高效、更可靠的晶片贴装解决方案的需求，自动化银烧结晶片贴装机市场正在快速发展。几个关键趋势正在推动这一发展进程。

  • 自动化和提高产量：开发能够实现更高产量的全自动机器，以满足大规模生产的需求，尤其是在汽车和消费性电子产业。这包括缩短生产週期和整合物料输送系统。
  • 提高微型化精度：随着电子设备变得越来越小、整合度越来越高，对晶片贴装机的需求也越来越大，这些贴装机能够在微型零件的烧结过程中实现更高的贴装精度和更精细的控制。
  • 整合先进製程控制：现代机器采用精密的感测器和软体，即时监控和控制烧结过程中的压力、温度和时间，确保晶片连接始终如一的高品质。
  • 灵活支援各种基板：为了满足功率模组、LED 和射频装置等应用的各种需求，对能够处理更广泛的物料输送和尺寸的机器的需求日益增长。
  • 无压烧结能力的发展：虽然压力辅助烧结很常见，但人们对支援特定应用无压烧结的机器越来越感兴趣，并对其进行了开发，这可能会简化工艺并减少对精密模具的压力。

这些新兴趋势再形成自动化银烧结晶片贴装机市场，使其朝着更自动化、精确、灵活和可控的解决方案发展，从而在先进电子组件中实现更广泛的应用和更高的品质。

自动银烧结晶片黏接机市场的最新趋势

近年来，自动银烧结晶片贴装机市场的发展趋势主要集中在提高效率、可靠性以及扩大这些机器在半导体封装领域的应用范围。

  • 高功率烧结头的开发：新的机器设计采用了一种烧结头，可以施加更大的力并进行更精确的控制，从而提高烧结接头的结合强度并减少空隙的形成。
  • 先进的视觉系统整合：实施增强型视觉系统，以实现更精确的模具放置和对准，这对于高精度应用和处理非常小的模具至关重要。
  • 引入多头烧结机：为了提高产量，一些製造商正在开发允许多个烧结头并行运作的设备，从而显着提高生产能力。
  • 温度控制均匀性得到改善：加热系统的进步使得整个烧结区域的温度分布更加均匀，从而确保大晶粒和多晶粒封装的黏合品质一致。
  • 即时製程监控和资料登录：现代化的设备配备了先进的感测器和软体，可即时监控关键过程参数并记录数据，以实现可追溯性和品质保证。

这些发展正在影响自动化银烧结晶片贴装机市场，从而提高了产量、精度和品管，使银烧结成为更可行、更有效率的晶片贴装解决方案，适用于更广泛的电子设备。

目录

第一章执行摘要

第二章 市场概览

  • 背景和分类
  • 供应链

第三章：市场趋势与预测分析

  • 产业驱动因素与挑战
  • PESTLE分析
  • 专利分析
  • 法规环境

第四章 全球自动银烧结晶片接合机市场（按类型划分）

  • 概述
  • 按类型进行吸引力分析
  • 完全自动化：趋势与预测（2019-2031）
  • 半自治：趋势与预测（2019-2031）

5. 全球自动银烧结晶片黏接机市场（依应用领域划分）

  • 概述
  • 透过用途进行吸引力分析
  • 功率半导体装置：趋势与预测（2019-2031）
  • 射频功率元件：趋势与预测（2019-2031）
  • 高效能LED：趋势与预测（2019-2031）
  • 其他：趋势与预测（2019-2031 年）

第六章 区域分析

  • 概述
  • 全球自动银烧结晶片黏接机市场（按地区划分）

7. 北美自动银烧结晶片接合机市场

  • 概述
  • 北美自动银烧结模具贴装机市场（按类型划分）
  • 北美自动银烧结晶片贴装机市场（按应用领域划分）
  • 美国自动银烧结模具组装机市场
  • 墨西哥自动银烧结模具贴装机市场
  • 加拿大自动银烧结模具组装机市场

8. 欧洲自动银烧结晶片接合机市场

  • 概述
  • 欧洲自动银烧结模具贴装机市场按类型划分
  • 欧洲自动银烧结晶片贴装机市场（按应用领域划分）
  • 德国自动银烧结模具组装机市场
  • 法国全自动银烧结模具组装机市场
  • 西班牙全自动银烧结模具组装机市场
  • 义大利全自动银烧结模具组装机市场
  • 英国自动银烧结模具组装机市场

9. 亚太地区自动银烧结晶片接合机市场

  • 概述
  • 亚太地区自动银烧结晶片贴装机市场（按类型划分）
  • 亚太地区自动银烧结晶片贴装机市场（依应用领域划分）
  • 日本自动银烧结模具贴装机市场
  • 印度自动银烧结模具组装机市场
  • 中国全自动银烧结晶片接合机市场
  • 韩国全自动银烧结模具组装机市场
  • 印尼自动银烧结模具贴装机市场

第十章 世界其他地区自动银烧结晶片贴装机市场

  • 概述
  • 世界其他地区自动银烧结晶片贴装机市场（按类型划分）
  • 世界其他地区自动银烧结晶片贴装机市场（按应用领域划分）
  • 中东自动银烧结模焊机市场
  • 南美洲自动银烧结模具组装机市场
  • 非洲自动银烧结模具组装机市场

第十一章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析
    • 竞争对手之间的竞争
    • 买方的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 新进入者的威胁
  • 市占率分析

第十二章：机会与策略分析

  • 价值链分析
  • 成长机会分析
    • 按类型分類的成长机会
    • 透过申请获得发展机会
  • 全球自动银烧结晶片黏接机市场新兴趋势
  • 战略分析
    • 新产品开发
    • 认证和许可
    • 合併、收购、协议、合作关係和合资企业

第十三章 价值链主要企业的公司概况

  • Competitive Analysis
  • Boschman
  • ASMPT
  • AMX Automatrix
  • NIKKISO
  • PINK GmbH Thermosysteme
  • Zhuhai Silicon Cool Technology
  • Shenzhen Advanced Joining
  • Quick Intelligent Equipment
  • Chenglian Kaida Technology
  • JH Advanced Semiconductor

第十四章附录

  • 图表清单
  • 表格列表
  • 调查方法
  • 免责声明
  • 版权
  • 简称和技术单位
  • 关于 Lucintel
  • 询问

The future of the global automatic silver sintering die attach machine market looks promising with opportunities in the power semiconductor device, rf power device, and high performance led markets. The global automatic silver sintering die attach machine market is expected to grow with a CAGR of 7.1% from 2025 to 2031. The major drivers for this market are the increasing demand for high power devices, the rising use in advanced packaging technologies, and the growing need for thermal management solutions.

  • Lucintel forecasts that, within the type category, fully automatic is expected to witness higher growth over the forecast period.
  • Within the application category, power semiconductor device, RF power device, and high performance LED is expected to witness the highest growth.
  • In terms of region, APAC is expected to witness the highest growth over the forecast period.

Emerging Trends in the Automatic Silver Sintering Die Attach Machine Market

The automatic silver sintering die attach machine market is evolving rapidly, driven by the need for more efficient and reliable die attachment solutions in advanced electronics packaging. Several key trends are shaping this evolution.

  • Increased Automation and Throughput: A primary trend is the development of fully automated machines capable of higher throughput to meet the demands of mass production, especially in automotive and consumer electronics. This involves faster cycle times and integrated material handling systems.
  • Enhanced Precision for Miniaturization: With the trend towards smaller and more integrated electronic devices, there's a growing need for die attach machines with higher placement accuracy and finer control over the sintering process for miniaturized components.
  • Integration of Advanced Process Control: Modern machines are incorporating sophisticated sensors and software for real-time monitoring and control of pressure, temperature, and time during the sintering process, ensuring consistent and high-quality die attachment.
  • Flexibility in Handling Diverse Substrates: There's an increasing demand for machines that can handle a wider variety of substrate materials and sizes, catering to the diverse requirements of applications like power modules, LEDs, and RF devices.
  • Development of Pressureless Sintering Capabilities: While pressure-assisted sintering is common, there's a growing interest in and development of machines supporting pressureless silver sintering for certain applications, simplifying the process and potentially reducing stress on delicate dies.

These emerging trends are reshaping the automatic silver sintering die attach machine market towards more automated, precise, flexible, and controlled solutions, enabling wider adoption and higher quality in advanced electronic assembly.

Recent Developments in the Automatic Silver Sintering Die Attach Machine Market

Recent developments in the automatic silver sintering die attach machine market are focused on improving efficiency, reliability, and the range of applications these machines can serve in semiconductor packaging.

  • Development of High-Force Sintering Heads: New machine designs incorporate sintering heads capable of applying higher and more precisely controlled forces, leading to improved bonding strength and reduced void formation in the sintered joint.
  • Integration of Advanced Vision Systems: Enhanced vision systems are being implemented for more accurate die placement and alignment, crucial for high-precision applications and handling of very small dies.
  • Introduction of Multi-Head Machines: To increase throughput, some manufacturers are developing machines with multiple sintering heads operating in parallel, significantly boosting production capacity.
  • Improved Temperature Control Uniformity: Advancements in heating systems ensure more uniform temperature distribution across the sintering area, resulting in consistent bonding quality for larger dies and multi-die packages.
  • Real-time Process Monitoring and Data Logging: Modern machines are equipped with sophisticated sensors and software that monitor key process parameters in real-time and log the data for traceability and quality assurance.

These developments are impacting the automatic silver sintering die attach machine market by enabling higher production volumes, greater precision, and improved quality control, making silver sintering a more viable and efficient die attach solution for a wider range of electronic devices.

Strategic Growth Opportunities in the Automatic Silver Sintering Die Attach Machine Market

The automatic silver sintering die attach machine market has significant strategic growth opportunities by targeting key applications where the benefits of silver sintering are particularly advantageous.

  • Electric Vehicle Power Modules: The increasing demand for high-performance and reliable power modules in EVs drives the need for advanced silver sintering die attach machines due to the superior thermal management required.
  • High-Power LED Packaging: Silver sintering provides excellent thermal dissipation for high-power LEDs, leading to growth opportunities for die attach machines in the manufacturing of efficient and long-lasting lighting solutions.
  • Silicon Carbide (SiC) and Gallium Nitride (GaN) Devices: These wide-bandgap semiconductors, used in power electronics and RF applications, benefit significantly from the high thermal conductivity of silver sintering, creating growth in their assembly.
  • Automotive Electronics (Non-EV): Applications like advanced driver-assistance systems (ADAS) and engine control units require robust die attachment, making silver sintering machines a strategic choice.
  • 5G Infrastructure Components: The high power and thermal management requirements of components used in 5G base stations and other communication equipment present growth opportunities for silver sintering die attach.

These strategic growth opportunities highlight the increasing importance of automatic silver sintering die attach machines in enabling the advancement and wider adoption of high-performance electronic devices across various rapidly growing sectors.

Automatic Silver Sintering Die Attach Machine Market Driver and Challenges

The automatic silver sintering die attach machine market is propelled by the performance advantages of silver sintering in demanding applications, but its growth is also shaped by certain economic and technological considerations.

The factors responsible for driving the automatic silver sintering die attach machine market include:

1. Superior Thermal and Electrical Conductivity: Silver sintering offers significantly better thermal and electrical performance compared to traditional solder, crucial for high-power and high-frequency devices.

2. Demand for High Reliability: Applications in automotive, aerospace, and power electronics require highly reliable die attachment, which silver sintering can provide.

3. Miniaturization and Higher Power Density: The trend towards smaller and more powerful electronic devices necessitates advanced die attach solutions like silver sintering.

4. Stringent Environmental Regulations: The move towards lead-free assembly processes favors alternatives like silver sintering.

5. Increasing Adoption of Wide-Bandgap Semiconductors: SiC and GaN devices, with their high operating temperatures, benefit greatly from silver sintering's thermal properties.

Challenges in the automatic silver sintering die attach machine market are:

1. Higher Initial Equipment Cost: Automatic silver sintering die attach machines typically have a higher upfront cost compared to traditional die bonders.

2. Material Costs of Silver Paste/Film: The cost of silver sintering materials can be higher than that of solder.

3. Process Optimization and Standardization: Optimizing the sintering process parameters for different applications and achieving industry-wide standardization can be complex.

The automatic silver sintering die attach machine market is driven by the performance and reliability advantages of silver sintering in advanced electronics. Overcoming the challenges related to initial costs, material expenses, and process optimization will be key to broader market adoption.

List of Automatic Silver Sintering Die Attach Machine Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies automatic silver sintering die attach machine companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the automatic silver sintering die attach machine companies profiled in this report include-

  • Boschman
  • ASMPT
  • AMX Automatrix
  • NIKKISO
  • PINK GmbH Thermosysteme
  • Zhuhai Silicon Cool Technology
  • Shenzhen Advanced Joining
  • Quick Intelligent Equipment
  • Chenglian Kaida Technology
  • JH Advanced Semiconductor

Automatic Silver Sintering Die Attach Machine Market by Segment

The study includes a forecast for the global automatic silver sintering die attach machine market by type, application, and region.

Automatic Silver Sintering Die Attach Machine Market by Type [Value from 2019 to 2031]:

  • Fully Automatic
  • Semi-Automatic

Automatic Silver Sintering Die Attach Machine Market by Application [Value from 2019 to 2031]:

  • Power Semiconductor Device
  • RF Power Device
  • High Performance LED
  • Others

Automatic Silver Sintering Die Attach Machine Market by Region [Value from 2019 to 2031]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Automatic Silver Sintering Die Attach Machine Market

The automatic silver sintering die attach machine market is witnessing increased adoption due to the superior thermal and electrical conductivity offered by silver sintering compared to traditional soldering. Recent developments focus on enhancing throughput, precision for smaller components, and the ability to handle diverse substrate materials to meet the growing demands of power electronics, automotive, and advanced packaging industries globally.

  • United States: The US market emphasizes advanced equipment for high-reliability applications in aerospace, defense, and electric vehicles. Recent developments include machines with enhanced force control and temperature profiling for consistent sintering quality, alongside integration with automation systems for higher production efficiency of complex power modules.
  • China: China's market is characterized by rapid expansion in semiconductor manufacturing and electric vehicle production, driving demand for high-volume, cost-effective silver sintering die attach machines. Recent developments include domestic manufacturers improving the speed and stability of their equipment and focusing on localization of key components.
  • Germany: Germany, with its strong automotive and industrial sectors, demands high-precision and robust silver sintering die attach machines. Recent advancements include machines with integrated quality control systems and the ability to handle large power modules with consistent sintering across the entire die area.
  • India: The Indian market is in a growth phase, driven by increasing electronics manufacturing and the adoption of EVs. Recent developments may include the introduction of more automated and versatile silver sintering machines, catering to a wider range of applications beyond basic semiconductor assembly.
  • Japan: Japan, a leader in precision manufacturing and advanced electronics, focuses on high-accuracy and reliable silver sintering die attach machines for miniaturized components and power devices. Recent developments include machines with finer placement accuracy and improved process control for complex multi-chip modules.

Features of the Global Automatic Silver Sintering Die Attach Machine Market

  • Market Size Estimates: Automatic silver sintering die attach machine market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.
  • Segmentation Analysis: Automatic silver sintering die attach machine market size by type, application, and region in terms of value ($B).
  • Regional Analysis: Automatic silver sintering die attach machine market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the automatic silver sintering die attach machine market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the automatic silver sintering die attach machine market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the automatic silver sintering die attach machine market by type (fully automatic and semi-automatic), application (power semiconductor device, rf power device, high performance led, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Market Overview

  • 2.1 Background and Classifications
  • 2.2 Supply Chain

3. Market Trends & Forecast Analysis

  • 3.2 Industry Drivers and Challenges
  • 3.3 PESTLE Analysis
  • 3.4 Patent Analysis
  • 3.5 Regulatory Environment

4. Global Automatic Silver Sintering Die Attach Machine Market by Type

  • 4.1 Overview
  • 4.2 Attractiveness Analysis by Type
  • 4.3 Fully Automatic: Trends and Forecast (2019-2031)
  • 4.4 Semi-automatic: Trends and Forecast (2019-2031)

5. Global Automatic Silver Sintering Die Attach Machine Market by Application

  • 5.1 Overview
  • 5.2 Attractiveness Analysis by Application
  • 5.3 Power Semiconductor Device: Trends and Forecast (2019-2031)
  • 5.4 RF Power Device: Trends and Forecast (2019-2031)
  • 5.5 High Performance LED: Trends and Forecast (2019-2031)
  • 5.6 Others: Trends and Forecast (2019-2031)

6. Regional Analysis

  • 6.1 Overview
  • 6.2 Global Automatic Silver Sintering Die Attach Machine Market by Region

7. North American Automatic Silver Sintering Die Attach Machine Market

  • 7.1 Overview
  • 7.2 North American Automatic Silver Sintering Die Attach Machine Market by Type
  • 7.3 North American Automatic Silver Sintering Die Attach Machine Market by Application
  • 7.4 United States Automatic Silver Sintering Die Attach Machine Market
  • 7.5 Mexican Automatic Silver Sintering Die Attach Machine Market
  • 7.6 Canadian Automatic Silver Sintering Die Attach Machine Market

8. European Automatic Silver Sintering Die Attach Machine Market

  • 8.1 Overview
  • 8.2 European Automatic Silver Sintering Die Attach Machine Market by Type
  • 8.3 European Automatic Silver Sintering Die Attach Machine Market by Application
  • 8.4 German Automatic Silver Sintering Die Attach Machine Market
  • 8.5 French Automatic Silver Sintering Die Attach Machine Market
  • 8.6 Spanish Automatic Silver Sintering Die Attach Machine Market
  • 8.7 Italian Automatic Silver Sintering Die Attach Machine Market
  • 8.8 United Kingdom Automatic Silver Sintering Die Attach Machine Market

9. APAC Automatic Silver Sintering Die Attach Machine Market

  • 9.1 Overview
  • 9.2 APAC Automatic Silver Sintering Die Attach Machine Market by Type
  • 9.3 APAC Automatic Silver Sintering Die Attach Machine Market by Application
  • 9.4 Japanese Automatic Silver Sintering Die Attach Machine Market
  • 9.5 Indian Automatic Silver Sintering Die Attach Machine Market
  • 9.6 Chinese Automatic Silver Sintering Die Attach Machine Market
  • 9.7 South Korean Automatic Silver Sintering Die Attach Machine Market
  • 9.8 Indonesian Automatic Silver Sintering Die Attach Machine Market

10. ROW Automatic Silver Sintering Die Attach Machine Market

  • 10.1 Overview
  • 10.2 ROW Automatic Silver Sintering Die Attach Machine Market by Type
  • 10.3 ROW Automatic Silver Sintering Die Attach Machine Market by Application
  • 10.4 Middle Eastern Automatic Silver Sintering Die Attach Machine Market
  • 10.5 South American Automatic Silver Sintering Die Attach Machine Market
  • 10.6 African Automatic Silver Sintering Die Attach Machine Market

11. Competitor Analysis

  • 11.1 Product Portfolio Analysis
  • 11.2 Operational Integration
  • 11.3 Porter's Five Forces Analysis
    • Competitive Rivalry
    • Bargaining Power of Buyers
    • Bargaining Power of Suppliers
    • Threat of Substitutes
    • Threat of New Entrants
  • 11.4 Market Share Analysis

12. Opportunities & Strategic Analysis

  • 12.1 Value Chain Analysis
  • 12.2 Growth Opportunity Analysis
    • 12.2.1 Growth Opportunities by Type
    • 12.2.2 Growth Opportunities by Application
  • 12.3 Emerging Trends in the Global Automatic Silver Sintering Die Attach Machine Market
  • 12.4 Strategic Analysis
    • 12.4.1 New Product Development
    • 12.4.2 Certification and Licensing
    • 12.4.3 Mergers, Acquisitions, Agreements, Collaborations, and Joint Ventures

13. Company Profiles of the Leading Players Across the Value Chain

  • 13.1 Competitive Analysis
  • 13.2 Boschman
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.3 ASMPT
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.4 AMX Automatrix
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.5 NIKKISO
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.6 PINK GmbH Thermosysteme
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.7 Zhuhai Silicon Cool Technology
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.8 Shenzhen Advanced Joining
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.9 Quick Intelligent Equipment
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.10 Chenglian Kaida Technology
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.11 JH Advanced Semiconductor
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing

14. Appendix

  • 14.1 List of Figures
  • 14.2 List of Tables
  • 14.3 Research Methodology
  • 14.4 Disclaimer
  • 14.5 Copyright
  • 14.6 Abbreviations and Technical Units
  • 14.7 About Us
  • 14.8 Contact Us

List of Figures

  • Figure 1.1: Trends and Forecast for the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 2.1: Usage of Automatic Silver Sintering Die Attach Machine Market
  • Figure 2.2: Classification of the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 2.3: Supply Chain of the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 3.1: Driver and Challenges of the Automatic Silver Sintering Die Attach Machine Market
  • Figure 3.2: PESTLE Analysis
  • Figure 3.3: Patent Analysis
  • Figure 3.4: Regulatory Environment
  • Figure 4.1: Global Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 4.2: Trends of the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Type
  • Figure 4.3: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Type
  • Figure 4.4: Trends and Forecast for Fully Automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 4.5: Trends and Forecast for Semi-automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.1: Global Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 5.2: Trends of the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Application
  • Figure 5.3: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Application
  • Figure 5.4: Trends and Forecast for Power Semiconductor Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.5: Trends and Forecast for RF Power Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.6: Trends and Forecast for High Performance LED in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.7: Trends and Forecast for Others in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 6.1: Trends of the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Region (2019-2024)
  • Figure 6.2: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Region (2025-2031)
  • Figure 7.1: North American Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 7.2: Trends of the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 7.3: Forecast for the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 7.4: North American Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 7.5: Trends of the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 7.6: Forecast for the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 7.7: Trends and Forecast for the United States Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 7.8: Trends and Forecast for the Mexican Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 7.9: Trends and Forecast for the Canadian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.1: European Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 8.2: Trends of the European Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 8.3: Forecast for the European Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 8.4: European Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 8.5: Trends of the European Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 8.6: Forecast for the European Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 8.7: Trends and Forecast for the German Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.8: Trends and Forecast for the French Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.9: Trends and Forecast for the Spanish Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.10: Trends and Forecast for the Italian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.11: Trends and Forecast for the United Kingdom Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.1: APAC Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 9.2: Trends of the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 9.3: Forecast for the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 9.4: APAC Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 9.5: Trends of the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 9.6: Forecast for the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 9.7: Trends and Forecast for the Japanese Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.8: Trends and Forecast for the Indian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.9: Trends and Forecast for the Chinese Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.10: Trends and Forecast for the South Korean Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.11: Trends and Forecast for the Indonesian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 10.1: ROW Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 10.2: Trends of the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 10.3: Forecast for the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 10.4: ROW Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 10.5: Trends of the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 10.6: Forecast for the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 10.7: Trends and Forecast for the Middle Eastern Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 10.8: Trends and Forecast for the South American Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 10.9: Trends and Forecast for the African Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 11.1: Porter's Five Forces Analysis of the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 11.2: Market Share (%) of Top Players in the Global Automatic Silver Sintering Die Attach Machine Market (2024)
  • Figure 12.1: Growth Opportunities for the Global Automatic Silver Sintering Die Attach Machine Market by Type
  • Figure 12.2: Growth Opportunities for the Global Automatic Silver Sintering Die Attach Machine Market by Application
  • Figure 12.3: Growth Opportunities for the Global Automatic Silver Sintering Die Attach Machine Market by Region
  • Figure 12.4: Emerging Trends in the Global Automatic Silver Sintering Die Attach Machine Market

List of Tables

  • Table 1.1: Growth Rate (%, 2023-2024) and CAGR (%, 2025-2031) of the Automatic Silver Sintering Die Attach Machine Market by Type and Application
  • Table 1.2: Attractiveness Analysis for the Automatic Silver Sintering Die Attach Machine Market by Region
  • Table 1.3: Global Automatic Silver Sintering Die Attach Machine Market Parameters and Attributes
  • Table 3.1: Trends of the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 3.2: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 4.1: Attractiveness Analysis for the Global Automatic Silver Sintering Die Attach Machine Market by Type
  • Table 4.2: Market Size and CAGR of Various Type in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 4.3: Market Size and CAGR of Various Type in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 4.4: Trends of Fully Automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 4.5: Forecast for Fully Automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 4.6: Trends of Semi-automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 4.7: Forecast for Semi-automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.1: Attractiveness Analysis for the Global Automatic Silver Sintering Die Attach Machine Market by Application
  • Table 5.2: Market Size and CAGR of Various Application in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.3: Market Size and CAGR of Various Application in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.4: Trends of Power Semiconductor Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.5: Forecast for Power Semiconductor Device in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.6: Trends of RF Power Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.7: Forecast for RF Power Device in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.8: Trends of High Performance LED in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.9: Forecast for High Performance LED in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.10: Trends of Others in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.11: Forecast for Others in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 6.1: Market Size and CAGR of Various Regions in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 6.2: Market Size and CAGR of Various Regions in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.1: Trends of the North American Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 7.2: Forecast for the North American Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.3: Market Size and CAGR of Various Type in the North American Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 7.4: Market Size and CAGR of Various Type in the North American Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.5: Market Size and CAGR of Various Application in the North American Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 7.6: Market Size and CAGR of Various Application in the North American Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.7: Trends and Forecast for the United States Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 7.8: Trends and Forecast for the Mexican Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 7.9: Trends and Forecast for the Canadian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.1: Trends of the European Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 8.2: Forecast for the European Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 8.3: Market Size and CAGR of Various Type in the European Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 8.4: Market Size and CAGR of Various Type in the European Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 8.5: Market Size and CAGR of Various Application in the European Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 8.6: Market Size and CAGR of Various Application in the European Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 8.7: Trends and Forecast for the German Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.8: Trends and Forecast for the French Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.9: Trends and Forecast for the Spanish Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.10: Trends and Forecast for the Italian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.11: Trends and Forecast for the United Kingdom Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.1: Trends of the APAC Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 9.2: Forecast for the APAC Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 9.3: Market Size and CAGR of Various Type in the APAC Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 9.4: Market Size and CAGR of Various Type in the APAC Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 9.5: Market Size and CAGR of Various Application in the APAC Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 9.6: Market Size and CAGR of Various Application in the APAC Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 9.7: Trends and Forecast for the Japanese Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.8: Trends and Forecast for the Indian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.9: Trends and Forecast for the Chinese Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.10: Trends and Forecast for the South Korean Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.11: Trends and Forecast for the Indonesian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 10.1: Trends of the ROW Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 10.2: Forecast for the ROW Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 10.3: Market Size and CAGR of Various Type in the ROW Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 10.4: Market Size and CAGR of Various Type in the ROW Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 10.5: Market Size and CAGR of Various Application in the ROW Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 10.6: Market Size and CAGR of Various Application in the ROW Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 10.7: Trends and Forecast for the Middle Eastern Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 10.8: Trends and Forecast for the South American Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 10.9: Trends and Forecast for the African Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 11.1: Product Mapping of Automatic Silver Sintering Die Attach Machine Suppliers Based on Segments
  • Table 11.2: Operational Integration of Automatic Silver Sintering Die Attach Machine Manufacturers
  • Table 11.3: Rankings of Suppliers Based on Automatic Silver Sintering Die Attach Machine Revenue
  • Table 12.1: New Product Launches by Major Automatic Silver Sintering Die Attach Machine Producers (2019-2024)
  • Table 12.2: Certification Acquired by Major Competitor in the Global Automatic Silver Sintering Die Attach Machine Market