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封面
市场调查报告书
商品编码
1332090

高密度互相连接(HDI)PCB的全球市场 - 预测(～2032年)

High Density Interconnect PCB Market Research Report - Forecast till 2032
出版日期: | 出版商: Market Research Future | 英文 100 Pages | 订单完成后即时交付

价格

预计 2023 年至 2032 年研究期间，全球高密度互连 (HDI) PCB 市场规模将以 17.3% 的复合年增长率大幅成长。

地区的考察

亚太地区在预测期间内将占市场大占有率。

对技术创新的兴趣日益浓厚，特别是中国和日本等国家对研发的关注度不断提高，以及政府的支持是商业领域扩张的推动因素。考虑到未来在各个最终用途领域的应用，印刷电路板研究和开发的稳步努力预计将在预测期内推动市场发展。

本报告提供全球高密度互相连接(HDI)PCB市场相关调查分析，提供市场动态，地区和市场区隔的分析，企业简介等资讯。

目录

第1章 摘要整理

  • 市场魅力分析
    • 全球高密度互相连接(HDI)PCB市场:互相连接层
    • 全球高密度互相连接(HDI)PCB市场:各用途
    • 全球高密度互相连接(HDI)PCB市场:各地区

第2章 市场简介

第3章 调查手法

第4章 市场动态

  • 简介
  • 促进因素
    • 高密度互连技术的优势越来越大
    • 复杂电子设备对 HDI PCB 的需求不断成长
    • 电路小型化的需求不断增加
    • 促进因素影响分析
  • 课题
    • 将 HDI 技术引入太空应用 PCB
    • 与 5G 技术相关的 PCB 设计挑战
    • ALV HDI量产面临的挑战
    • 抑制因素影响分析
  • 机会
    • HDI PCB技术进步
    • 5G 技术为 PCB 设计师带来成长机会
    • 消费性电子产品需求不断成长
  • COVID-19影响
    • 半导体产业的影响
    • 医疗电子工业的影响
    • 全球PCB供应链的影响
    • 供应链的数位化的需求提升

第5章 市场要素的分析

  • 价值链分析/供应链分析
  • 波特的五力分析模式

第6章 全球高密度互相连接(HDI)PCB市场:互相连接层

  • 简介
  • 1层(1+N+1)HDI
  • 2层以上的(2+N+2)HDI
  • 全层HDI

第7章 全球高密度互相连接(HDI)PCB市场:各用途

  • 简介
  • 消费者电子产品
  • 汽车
  • 军事·防卫
  • 医疗
  • 工业/製造
  • 其他

第8章 全球高密度互相连接(HDI)PCB的市场规模的估计与预测:各地区

  • 简介
  • 北美
    • 市场估计与预测:各国(2018年～2032年)
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)
    • 美国
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)
    • 加拿大
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)
    • 墨西哥
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)
  • 欧洲
    • 市场估计与预测:各国(2018年～2032年)
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)
    • 英国
    • 德国
    • 法国
    • 其他的欧洲
  • 亚太地区
    • 市场估计与预测:各国(2018年～2032年)
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)
    • 中国
    • 日本
    • 印度
    • 其他的亚太地区
  • 中东·非洲
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)
  • 南美
    • 市场估计与预测:各互相连接层(2018年～2032年)
    • 市场估计与预测:各用途(2018年～2032年)

第9章 竞争情形

  • 简介
  • 主要的发展与成长策略
  • 竞争的基准
  • 厂商市场占有率分析(2021年)

第10章 企业简介

  • UNIMICRON, EPEC, LLC
  • TTM TECHNOLOGIES INC.
  • RAYMING TECHNOLOGY
  • HITECH CIRCUITS
  • NCAB GROUP CORPORATION
  • MILLENNIUM CIRCUITS LIMITED
  • TRIPOD TECHNOLOGY
  • ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED
  • AKM MEADVILLE
  • MEIKO ELECTRONICS CO., LTD.
  • SIERRA CIRCUITS INC.
  • COMPEQ MANUFACTURING CO., LTD.
  • AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
  • ADVANCED CIRCUITS
  • DAP CORPORATION
Product Code: MRFR/SEM/5821-CR

Market Overview

High-Density Interconnect PCB Market is projected to exhibit a significant CAGR of 17.3% during the review period 2023 - 2032. HDI is a truncation for High Density Interconnector, which is a circuit board with a moderately high line circulation density that utilizes miniature visually impaired and covered opening innovation. It is vital in improving electrical execution and bringing down the weight and size of hardware. HDI PCB plans push the limits of innovation, and key market organizations are at the very front of the development, meeting the most tough particulars. The interest for HDI PCB fabricating has been growing because of innovative leap forwards and the various benefits HDI PCBs accommodate high-tech applications. Squeezing more innovation into less space with less layers limits numerous PCB makers who need particular gear and the capacity for cutting edge highlights, better lines, and tighter resiliences. HDI printed circuit board plans utilize complex elements, for example, miniature vias, blind vias, through in-cushion, and stacked and staggered vias to expand board region while upgrading execution and convenience.

Market Segment Insights

By Interconnection Layers, the High Density Interconnect (HDI) PCB market has been categorized as 1 Layer (1+N+1) HDI, 2 or more layers (2+N+2) HDI, and All Layers HDI. During the projected period, the demand for All Layers HDI segment is expected to grow rapidly.

Based on Application, the High Density Interconnect (HDI) PCB market has been segmented into Consumer Electronics, Automotive, Military and Defense, Healthcare, Industrial/ Manufacturing, and Others. During the projected period, the automotive segment is expected to rise rapidly.

Regional Insights

Asia Pacific is expected to have a significant share of the High Density Interconnect PCB Market during the projected period.

The rising utilization of printed circuit sheets in the hardware, aviation, IT, and telecom, modern, and auto businesses is driving business sector extension regarding esteem deals. Developing interest for innovation, more noteworthy interest in Research and development by undertakings in nations like China and Japan, and government backing are a portion of the drivers driving business sector extension. Consistent endeavors in printed circuit board Research and development to examine forthcoming applications in various end-use areas are supposed to drive market development during the projected period. Developing interest for printed circuit sheets in view of the expanded utilization of modern gadgets is supposed to drive market extension during the gauge time frame. China, for instance, has a muddled modern chain that incorporates copper foil, glass fiber, tar, copper-clad covers, and PCBs as its last part. The market has extended significantly more as Western nations' longing for Asian purchaser hardware has taken off.

Major Players

The major players in the global High Density Interconnect (HDI) PCB are Compeq Manufacturing Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unimicron, Tripod Technology, and Zhen Ding Tech. Unimicron, Epec, LLC, TTM Technologies Inc., RayMing Technology, HiTech Circuits, NCAB Group Corporation, Millennium Circuits Limited, Tripod Technology, AKM Meadville, Meiko Electronics Co., Ltd., Sierra Circuits Inc., Compeq Manufacturing Co., Ltd., Advanced Circuits, and DAP Corporation.

TABLE OF CONTENTS

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. MARKET ATTRACTIVENESS ANALYSIS
    • 1.1.1. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS
    • 1.1.2. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION
    • 1.1.3. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY REGION

2. MARKET INTRODUCTION

  • 2.1. DEFINITION
  • 2.2. SCOPE OF THE STUDY
  • 2.3. MARKET STRUCTURE
  • 2.4. KEY BUYING CRITERIA
  • 2.5. MACRO FACTOR INDICATOR ANALYSIS

3. RESEARCH METHODOLOGY

  • 3.1. RESEARCH PROCESS
  • 3.2. PRIMARY RESEARCH
  • 3.3. SECONDARY RESEARCH
  • 3.4. MARKET SIZE ESTIMATION
  • 3.5. FORECAST MODEL
  • 3.6. LIST OF ASSUMPTIONS

4. MARKET DYNAMICS

  • 4.1. INTRODUCTION
  • 4.2. DRIVERS
    • 4.2.1. INCREASING BENEFITS OF HIGH DENSITY INTERCONNECT TECHNOLOGY
    • 4.2.2. RISING DEMAND OF HDI PCBS IN COMPLEX ELECTRONIC DEVICES
    • 4.2.3. GROWING DEMAND FOR CIRCUIT MINIATURIZATION
    • 4.2.4. DRIVERS IMPACT ANALYSIS
  • 4.3. CHALLENGES
    • 4.3.1. INTRODUCING HDI TECHNOLOGY IN PCB FOR SPACE APPLICATION
    • 4.3.2. 5G TECHNOLOGY RELATED PCB DESIGN CHALLENGES
    • 4.3.3. CHALLENGES FACED IN ANY-LAYER INTERCONNECTION HIGH DENSITY (ALV HDI) IN MASS PRODUCTIONS
    • 4.3.4. RESTRAINTS IMPACT ANALYSIS
  • 4.4. OPPORTUNITIES
    • 4.4.1. TECHNOLOGICAL ADVANCEMENT IN HDI PCB
    • 4.4.2. 5G TECHNOLOGY AS A GROWTH OPPORTUNITY FOR PCB DESIGNERS
    • 4.4.3. RISING DEMAND FOR CONSUMER ELECTRONICS
  • 4.5. IMPACT OF COVID-19
    • 4.5.1. IMPACT ON SEMICONDUCTOR INDUSTRY
    • 4.5.2. IMPACT ON THE MEDICAL ELECTRONIC INDUSTRY
    • 4.5.3. IMPACT ON GLOBAL PCB SUPPLY CHAIN
    • 4.5.4. RISING NEED FOR DIGITALIZATION OF THE SUPPLY CHAIN

5. MARKET FACTOR ANALYSIS

  • 5.1. VALUE CHAIN ANALYSIS/SUPPLY CHAIN ANALYSIS
  • 5.2. PORTER'S FIVE FORCES MODEL
  • 5.3. BARGAINING POWER OF SUPPLIERS
  • 5.4. BARGAINING POWER OF BUYERS
  • 5.5. THREAT OF NEW ENTRANTS
  • 5.6. THREAT OF SUBSTITUTES
  • 5.7. INTENSITY OF RIVALRY

6. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY INTERCONNECTION LAYERS

  • 6.1. INTRODUCTION
  • 6.2. 1 LAYER (1+N+1) HDI
  • 6.3. 2 OR MORE LAYERS (2+N+2) HDI
  • 6.4. ALL LAYERS HDI

7. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET, BY APPLICATION

  • 7.1. INTRODUCTION
  • 7.2. CONSUMER ELECTRONICS
  • 7.3. AUTOMOTIVE
  • 7.4. MILITARY AND DEFENSE
  • 7.5. HEALTHCARE
  • 7.6. INDUSTRIAL/ MANUFACTURING
  • 7.7. OTHERS

8. GLOBAL HIGH DENSITY INTERCONNECT PCB MARKET SIZE ESTIMATION & FORECAST, BY REGION

  • 8.1. INTRODUCTION
  • 8.2. NORTH AMERICA
    • 8.2.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.2.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.4. US
    • 8.2.5. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.6. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.7. CANADA
    • 8.2.8. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.9. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.2.10. MEXICO
    • 8.2.11. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.2.12. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.3. EUROPE
    • 8.3.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.3.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.3.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.4. UK
      • 8.3.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.5. GERMANY
      • 8.3.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.6. FRANCE
      • 8.3.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.3.7. REST OF EUROPE
      • 8.3.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.3.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.4. ASIA-PACIFIC
    • 8.4.1. MARKET ESTIMATES & FORECAST, BY COUNTRY, 2018-2032
    • 8.4.2. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.4.3. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.4. CHINA
      • 8.4.4.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.4.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.5. JAPAN
      • 8.4.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.6. INDIA
      • 8.4.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
    • 8.4.7. REST OF ASIA-PACIFIC
      • 8.4.7.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
      • 8.4.7.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.5. MIDDLE EAST & AFRICA
    • 8.5.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.5.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032
  • 8.6. SOUTH AMERICA
    • 8.6.1. MARKET ESTIMATES & FORECAST, BY INTERCONNECTION LAYERS, 2018-2032
    • 8.6.2. MARKET ESTIMATES & FORECAST, BY APPLICATION, 2018-2032

9. COMPETITIVE LANDSCAPE

  • 9.1. INTRODUCTION
  • 9.2. KEY DEVELOPMENTS & GROWTH STRATEGIES
  • 9.3. COMPETITOR BENCHMARKING
  • 9.4. VENDOR SHARE ANALYSIS, 2021(% SHARE)

10. COMPANY PROFILES

  • 10.1. UNIMICRON, EPEC, LLC
    • 10.1.1. COMPANY OVERVIEW
    • 10.1.2. FINANCIAL OVERVIEW
    • 10.1.3. SOLUTION/SERVICES OFFERED
    • 10.1.4. KEY DEVELOPMENTS
    • 10.1.5. SWOT ANALYSIS
    • 10.1.6. KEY STRATEGIES
  • 10.2. TTM TECHNOLOGIES INC.
    • 10.2.1. COMPANY OVERVIEW
    • 10.2.2. FINANCIAL OVERVIEW
    • 10.2.3. SOLUTION/SERVICES OFFERED
    • 10.2.4. KEY DEVELOPMENTS
    • 10.2.5. SWOT ANALYSIS
    • 10.2.6. KEY STRATEGIES
  • 10.3. RAYMING TECHNOLOGY
    • 10.3.1. COMPANY OVERVIEW
    • 10.3.2. FINANCIAL OVERVIEW
    • 10.3.3. SOLUTION/SERVICES OFFERED
    • 10.3.4. KEY DEVELOPMENTS
    • 10.3.5. SWOT ANALYSIS
    • 10.3.6. KEY STRATEGIES
  • 10.4. HITECH CIRCUITS
    • 10.4.1. COMPANY OVERVIEW
    • 10.4.2. FINANCIAL OVERVIEW
    • 10.4.3. SOLUTION/SERVICES OFFERED
    • 10.4.4. KEY DEVELOPMENTS
    • 10.4.5. SWOT ANALYSIS
    • 10.4.6. KEY STRATEGIES
  • 10.5. NCAB GROUP CORPORATION
    • 10.5.1. COMPANY OVERVIEW
    • 10.5.2. FINANCIAL OVERVIEW
    • 10.5.3. SOLUTION/SERVICES OFFERED
    • 10.5.4. KEY DEVELOPMENTS
    • 10.5.5. SWOT ANALYSIS
    • 10.5.6. KEY STRATEGIES
  • 10.6. MILLENNIUM CIRCUITS LIMITED
    • 10.6.1. COMPANY OVERVIEW
    • 10.6.2. FINANCIAL OVERVIEW
    • 10.6.3. SOLUTION/SERVICES OFFERED
    • 10.6.4. KEY DEVELOPMENTS
    • 10.6.5. SWOT ANALYSIS
    • 10.6.6. KEY STRATEGIES
  • 10.7. TRIPOD TECHNOLOGY
    • 10.7.1. COMPANY OVERVIEW
    • 10.7.2. FINANCIAL OVERVIEW
    • 10.7.3. SOLUTION/SERVICES OFFERED
    • 10.7.4. KEY DEVELOPMENTS
    • 10.7.5. SWOT ANALYSIS
    • 10.7.6. KEY STRATEGIES
  • 10.8. ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED
    • 10.8.1. COMPANY OVERVIEW
    • 10.8.2. FINANCIAL OVERVIEW
    • 10.8.3. SOLUTION/SERVICES OFFERED
    • 10.8.4. KEY DEVELOPMENTS
    • 10.8.5. SWOT ANALYSIS
    • 10.8.6. KEY STRATEGIES
  • 10.9. AKM MEADVILLE
    • 10.9.1. COMPANY OVERVIEW
    • 10.9.2. FINANCIAL OVERVIEW
    • 10.9.3. SOLUTION/SERVICES OFFERED
    • 10.9.4. KEY DEVELOPMENTS
    • 10.9.5. SWOT ANALYSIS
    • 10.9.6. KEY STRATEGIES
  • 10.10. MEIKO ELECTRONICS CO., LTD.
    • 10.10.1. COMPANY OVERVIEW
    • 10.10.2. FINANCIAL OVERVIEW
    • 10.10.3. SOLUTION/SERVICES OFFERED
    • 10.10.4. KEY DEVELOPMENTS
    • 10.10.5. SWOT ANALYSIS
    • 10.10.6. KEY STRATEGIES
  • 10.11. SIERRA CIRCUITS INC.
    • 10.11.1. COMPANY OVERVIEW
    • 10.11.2. FINANCIAL OVERVIEW
    • 10.11.3. SOLUTION/SERVICES OFFERED
    • 10.11.4. KEY DEVELOPMENTS
    • 10.11.5. SWOT ANALYSIS
    • 10.11.6. KEY STRATEGIES
  • 10.12. COMPEQ MANUFACTURING CO., LTD.
    • 10.12.1. COMPANY OVERVIEW
    • 10.12.2. FINANCIAL OVERVIEW
    • 10.12.3. SOLUTION/SERVICES OFFERED
    • 10.12.4. KEY DEVELOPMENTS
    • 10.12.5. SWOT ANALYSIS
    • 10.12.6. KEY STRATEGIES
  • 10.13. AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT)
    • 10.13.1. COMPANY OVERVIEW
    • 10.13.2. FINANCIAL OVERVIEW
    • 10.13.3. SOLUTION/SERVICES OFFERED
    • 10.13.4. KEY DEVELOPMENTS
    • 10.13.5. SWOT ANALYSIS
    • 10.13.6. KEY STRATEGIES
  • 10.14. ADVANCED CIRCUITS
    • 10.14.1. COMPANY OVERVIEW
    • 10.14.2. FINANCIAL OVERVIEW
    • 10.14.3. SOLUTION/SERVICES OFFERED
    • 10.14.4. KEY DEVELOPMENTS
    • 10.14.5. SWOT ANALYSIS
    • 10.14.6. KEY STRATEGIES
  • 10.15. DAP CORPORATION
    • 10.15.1. COMPANY OVERVIEW
    • 10.15.2. FINANCIAL OVERVIEW
    • 10.15.3. SOLUTION/SERVICES OFFERED
    • 10.15.4. KEY DEVELOPMENTS
    • 10.15.5. SWOT ANALYSIS
    • 10.15.6. KEY STRATEGIES

LIST OF TABLES

  • TABLE 1 MARKET SYNOPSIS 17
  • TABLE 2 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 41
  • TABLE 3 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 43
  • TABLE 4 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2018-2032 (USD MILLION) 46
  • TABLE 5 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 48
  • TABLE 6 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 49
  • TABLE 7 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 49
  • TABLE 8 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50
  • TABLE 9 US HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 50
  • TABLE 10 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 50
  • TABLE 11 CANADA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51
  • TABLE 12 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 51
  • TABLE 13 MEXICO HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 51
  • TABLE 14 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 55
  • TABLE 15 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 55
  • TABLE 16 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 56
  • TABLE 17 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57
  • TABLE 18 GERMANY HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 57
  • TABLE 19 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 57
  • TABLE 20 FRANCE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58
  • TABLE 21 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 58
  • TABLE 22 UK HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 58
  • TABLE 23 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 59
  • TABLE 24 REST OF EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 59
  • TABLE 25 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 61
  • TABLE 26 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 62
  • TABLE 27 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 62
  • TABLE 28 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63
  • TABLE 29 CHINA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 63
  • TABLE 30 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 63
  • TABLE 31 JAPAN HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64
  • TABLE 32 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 64
  • TABLE 33 INDIA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 64
  • TABLE 34 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 65
  • TABLE 35 REST OF ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 65
  • TABLE 36 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2018-2032 (USD MILLION) 67
  • TABLE 37 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 67
  • TABLE 38 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 68
  • TABLE 39 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69
  • TABLE 40 MIDDLE EAST & AFRICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 69
  • TABLE 41 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 69
  • TABLE 42 SOUTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 70
  • TABLE 43 BUSINESS EXPANSIONS/ACQUISITIONS 73
  • TABLE 44 UNIMICRON: PRODUCTS/SOLUTIONS/SERVICES OFFERED 77
  • TABLE 45 EPEC, LLC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 78
  • TABLE 46 EPEC, LLC: KEY DEVELOPMENTS 78
  • TABLE 47 TTM TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 81
  • TABLE 48 RAYMING TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 83
  • TABLE 49 HITECH CIRCUITS: PRODUCTS/SOLUTIONS/SERVICES OFFERED 84
  • TABLE 50 NCAB GROUP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 86
  • TABLE 51 NCAB GROUP CORPORATION: KEY DEVELOPMENTS 86
  • TABLE 52 MILENNIUM CIRCUITS LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 89
  • TABLE 53 TRIPOD TECHNOLOGY: PRODUCTS/SOLUTIONS/SERVICES OFFERED 90
  • TABLE 54 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: PRODUCTS/SOLUTIONS/SERVICES OFFERED 93
  • TABLE 55 AKM MEADVILLE: PRODUCTS/SOLUTIONS/SERVICES OFFERED 96
  • TABLE 56 MEIKO ELECTRONICS CO., LTD: PRODUCTS/SOLUTIONS/SERVICES OFFERED 99
  • TABLE 57 MEIKO ELECTRONICS CO., LTD: KEY DEVELOPMENTS 100
  • TABLE 58 SIERRA CIRCUITS INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 102
  • TABLE 59 COMPEQ MANUFACTURING CO. LTD.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 104
  • TABLE 60 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT: PRODUCTS/SOLUTIONS/SERVICES OFFERED 106
  • TABLE 61 ADVANCED CIRCUIT.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 108
  • TABLE 62 DAP CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED 109 L

LIST OF FIGURES

  • FIGURE 1 MARKET ATTRACTIVENESS ANALYSIS: GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 18
  • FIGURE 2 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: MARKET STRUCTURE 20
  • FIGURE 3 BOTTOM-UP AND TOP-DOWN APPROACHES 25
  • FIGURE 4 MARKET DYNAMIC ANALYSIS OF THE GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 28
  • FIGURE 5 DRIVER IMPACT ANALYSIS 30
  • FIGURE 6 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: SUPPLY CHAIN ANALYSIS 36
  • FIGURE 7 PORTER'S FIVE FORCES ANALYSIS OF THE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET 38
  • FIGURE 8 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2022 (% SHARE) 40
  • FIGURE 9 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2022 VS 2032 (USD MILLION) 40
  • FIGURE 10 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2022 (% SHARE) 42
  • FIGURE 11 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2022 VS 2032 (USD MILLION) 42
  • FIGURE 12 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2022 (% SHARE) 45
  • FIGURE 13 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY REGION, 2022 VS 2032 (USD MILLION) 45
  • FIGURE 14 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 47
  • FIGURE 15 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 48
  • FIGURE 16 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 48
  • FIGURE 17 NORTH AMERICA HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 49
  • FIGURE 18 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 53
  • FIGURE 19 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 53
  • FIGURE 20 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 55
  • FIGURE 21 EUROPE HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 56
  • FIGURE 22 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 60
  • FIGURE 23 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 61
  • FIGURE 24 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 61
  • FIGURE 25 ASIA-PACIFIC HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 62
  • FIGURE 26 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 (% SHARE) 66
  • FIGURE 27 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY COUNTRY, 2022 VS 2032 (USD MILLION) 66
  • FIGURE 28 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY INTERCONNECTION LAYERS, 2018-2032 (USD MILLION) 67
  • FIGURE 29 REST OF THE WORLD HIGH DENSITY INTERCONNECT (HDI) PCB MARKET, BY APPLICATION, 2018-2032 (USD MILLION) 68
  • FIGURE 30 GLOBAL HIGH DENSITY INTERCONNECT (HDI) PCB MARKET: COMPETITIVE BENCHMARKING 72
  • FIGURE 31 VENDOR SHARE ANALYSIS, 2021 (%) 73
  • FIGURE 32 UNIMICRON: FINANCIAL OVERVIEW SNAPSHOT 76
  • FIGURE 33 UNIMICRON: SWOT ANALYSIS 77
  • FIGURE 34 EPEC, LLC: SWOT ANALYSIS 79
  • FIGURE 35 TTM TECHNOLOGIES INC.: FINANCIAL OVERVIEW SNAPSHOT 81
  • FIGURE 36 TTM TECHNOLOGIES INC.: SWOT ANALYSIS 82
  • FIGURE 37 NCAB GROUP CORPORATION: FINANCIAL OVERVIEW SNAPSHOT 85
  • FIGURE 38 NCAB GROUP CORPORATION: SWOT ANALYSIS 88
  • FIGURE 39 TRIPOD TECHNOLOGY: FINANCIAL OVERVIEW SNAPSHOT 90
  • FIGURE 40 TRIPOD TECHNOLOGY: SWOT ANALYSIS 91
  • FIGURE 41 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: FINANCIAL OVERVIEW SNAPSHOT 92
  • FIGURE 42 ZHEN DING TECH. GROUP TECHNOLOGY HOLDING LIMITED: SWOT ANALYSIS 93
  • FIGURE 43 AKM MEADVILLE (AKM INDUSTRIAL COMPANY LIMITED): FINANCIAL OVERVIEW SNAPSHOT 95
  • FIGURE 44 AKM MEADVILLE: SWOT ANALYSIS 97
  • FIGURE 45 MEIKO ELECTRONICS CO., LTD.: FINANCIAL OVERVIEW SNAPSHOT 99
  • FIGURE 46 MEIKO ELECTRONICS CO., LTD: SWOT ANALYSIS 100
  • FIGURE 47 COMPEQ MANUFACTURING CO., LTD: FINANCIAL OVERVIEW SNAPSHOT 103
  • FIGURE 48 COMPEQ MANUFACTURING CO. LTD.: SWOT ANALYSIS 104
  • FIGURE 49 AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT): FINANCIAL OVERVIEW SNAPSHOT 105
  • FIGURE 50 AT & S (AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT): SWOT ANALYSIS 107