3D IC 封装市场 - COVID-19 的增长、趋势、影响和预测 (2023-2028)

全球 3D IC 封装市场预计在预测期内 (2022-2027) 的复合年增长率为 16.8%。

人工智能、物联网、5G 和高性能计算等先进技术的采用增加了对 3D IC 的需求，这些 IC 可提供增强的性能和带宽以及低延迟。 因此，在预测期内，对 3D IC 封装的需求将出现显着增长。

主要亮点

• 微电子和半导体行业的趋势正在推动需要更高性能、更高功能和更低功耗的垂直堆迭集成电路 (IC) 以满足电子设备的要求。作为一种现实的解决方案，它正在引起人们的关注实现了。 联网设备、平板电脑和智能手机等电子产品正迅速需要先进的架构，以提高能效、性能并实现短信和通话以外的功能。 这些因素有望推动 3D IC 封装市场的增长。
• 随着半导体应用的扩展，CMOS 缩放速度放缓和成本上升迫使该行业依赖 IC 封装发展。 3D堆迭技术已成为满足机器学习、人工智能和数据中心等应用性能需求的有利解决方案。 因此，对高性能计算应用不断增长的需求将在预测期内推动 3D-TSV（硅通孔）市场。
• 此外，电子设备的持续小型化预计也将成为市场增长的推动力。 平板电脑、智能手机和游戏机对先进架构的需求不断增长，以及先进晶圆级封装技术在传感器和 MEMS 中的使用激增，将□□在预测期内为 3D IC 封装市场带来增长前景。 根据 WSTS 的数据，2021 年半导体 IC 市场的收入将达到 4630 亿美元，预计到 2022 年将增长 10% 以上，达到 5109.6 亿美元。
• COVID-19 大流行对各个行业产生了重大影响，同时推动了全球先进医疗设备和设备的发展。 大流行爆发后，各种医疗设备製造商已宣布增加几种新设备和设备的产量。 随着 3D IC 封装在医疗和保健行业的广泛应用中使用，製造活动的增加预计对 3D IC 封装的需求将会增加。
• 但是，半导体 IC 设计的高初始投资和日益复杂预计会限制市场发展。

3D IC 封装市场趋势

IT 和电信有望显着增长

• 3D IC 封装是半导体製造和设计不可或缺的一部分。 在宏观层面，它直接影响性能、功耗和成本，在微观层面，它直接影响每个芯片的基本功能。
• 对 5G 基础设施、物联网连接的投资不断增加以及数据中心服务器和网络设备数量的增加是推动 IT 和电信行业 3D IC 封装增长的因素。 例如，KT、LG Uplus 和 SK Telecom 等韩国移动运营商已同意到 2022 年共投资 25.7 万亿韩元，以支持全国的 5G 基础设施建设。 这笔额外投资将侧重于提高包括首尔在内的六个城市的 5G 质量。
• 数据中心的扩张为接受调查的 3D IC 封装供应商提供了增长机会。 据思科系统称，2021年全球数据中心存储的大数据量预计将达到403艾字节，其中美国占据很大份额。 到 2021 年，超大规模数据中心将从 2015 年的 259 个增加到 700 个。
• 此外，物联网市场的扩张和对无线技术需求的激增（其中更小的占地面积和更高的效率至关重要）预计将推动 3D IC 封装市场的发展。 据爱立信称，广域物联网设备将从 2021 年的 21 亿增加到 2027 年的 52 亿。

亚太地区有望实现强劲增长

• 亚太地区是一些最大的半导体芯片製造商和公司的所在地，包括台积电、中芯国际、联电和韩国三星。 一家主要的台湾芯片代工厂正与一家日本供应商联手，共同争夺至关重要的 3 纳米芯片市场的领先地位。 例如，2021年2月，台积电宣布计划在日本科技城筑波设立研发中心，与日本供应商合作开发3D IC封装材料。
• 2021 年 5 月，日本经济产业省及其下属产业技术综合研究所宣布约 20 家日本公司将与台积电日本 3D IC 研发中心合作。
• 亚太地区在 3D IC 封装市场中也占有很大份额。 这是由于该地区存在大量半导体製造业务，以及三星电子、东芝公司、日月光集团和联合微电子公司等大型市场参与者的存在。
• 亚太地区以其蓬勃发展的汽车行业而闻名。 此外，5G 技术在汽车行业的日益商业化将为在研究市场运营的供应商提供新的收入来源。 基于 5G NR 的 C-V2X 的出现有望为自动驾驶汽车提供独特的功能。 因此，它可以推动对更高级别的自主性和可预测性以及车辆中其他 ADAS 传感器技术的需求。
• 此外，该地区的市场参与者正在关注可以为 3D 封装工具开闢新可能性的下一代芯片技术。 例如，日本工具製造商 Disco 专注于 3D 芯片封装，将集成电路堆迭在几乎透明的薄硅晶圆上。 随着摩尔定律接近其物理极限，芯片製造商正在寻找新的设计和材料来提高下一代硬件的性能。 预计这种趋势将促进该地区的增长。
• 在智能设备和互联世界的当前场景中，客户要求下一代设备更紧凑、功能更丰富、性能更好且功耗更低。 这推动了对具有成本效益的高性能 IC 的需求。 例如，STAR 的微电子实验室与领先的半导体製造商合作开发具有成本效益的 3D 晶圆级集成电路封装解决方案。 该公司推出了 Chip-on-Wafer Consortium II 和 Cost-effective Interposer Consortium，以推广用于大规模生产的芯片封装解决方案。 这个以行业为中心的联盟将解决晶圆级封装中的关键挑战，以保持较低的总体製造成本，从而加快下一代电子产品的上市时间。

3D IC封装市场竞争者分析

由于 Amkor Technology Inc.、ASE Group 和 Siliconware Precision Industries (SPIL) 等重要参与者的存在，全球 3D IC 封装市场呈现碎片化。 市场参与者必须不断创新，提供领先和全面的产品，以保持相关性。

• 2021 年 5 月：英特尔计划投资 35 亿美元改造其 Rio Rancho 工厂，将这个庞大的工厂（美国三大製造基地之一）的员工人数增加 35% 以上。 它正在扩大其在新墨西哥州的业务，以製造基于 Foreveros 3D 封装技术的新一代芯片，这可能有助于该公司重新获得其在半导体行业的领导地位。

其他福利。

• Excel 格式的市场预测 (ME) 表
• 三个月的分析师支持

内容

第一章介绍

• 研究假设和市场定义
• 调查范围

第二章研究方法论

第 3 章执行摘要

第 4 章市场洞察

• 市场概览
• 产业吸引力 - 波特五力分析
  • 新进入者的威胁
  • 买方/消费者议价能力
  • 供应商的议价能力
  • 替代品的威胁
  • 竞争公司之间的敌对关係
• 价值链分析
• 评估 COVID-19 对市场的影响

第 5 章市场动态

• 市场驱动力
  • 扩展电子产品中的高级架构
  • 电子设备的小型化
• 市场挑战/限制
  • 半导体 IC 设计的初始投资高且复杂

第 6 章市场细分

• 包装技术
  • 3D 晶圆级芯片级封装
  • 3D TSV
• 最终用户行业
  • 消费类电子产品
  • 航空航天与国防
  • 医疗设备
  • 通讯/电信
  • 汽车
  • 其他
• 按地区
  • 北美
  • 欧洲
  • 亚太地区
  • 拉丁美洲
  • 中东

第七章竞争格局

• 公司简介
  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • ASE Group
  • Amkor Technology
  • Intel Corporation
  • Siliconware Precision Industries Co. Ltd（SPIL）
  • GlobalFoundries
  • Invensas
  • Powertech Technology Inc.

第8章 投资分析

第9章 市场未来性

The Global 3D IC Packaging Market is expected to register a CAGR of 16.8% during the forecast period (2022-2027). The growing adoption of advanced technologies such as AI, IoT, 5G, and high-performance computing is escalating the demand for 3D ICs, which deliver enhanced performance and bandwidth with lower latency. As such, the demand for 3D IC packaging will register significant growth over the forecast period.

Key Highlights

• The growing microelectronics and semiconductor industry is developing a trend for vertically stacked integrated circuits (ICs), emerging as a viable solution for providing high performance, increased functionality, and reducing power consumption to fulfill electronic device requirements. The surging need for advanced architecture in electronic products such as connected devices, tablets, and smartphones to increase their energy efficiency and performance to do more than just texting and calling. Such factors are expected to bolster the growth of the 3D IC packaging market.
• As a result of the growing semiconductor applications, the slowdown in CMOS scaling and escalating costs have forced the industry to depend on packaging advancements for ICs. 3D stacking technologies have emerged as lucrative solutions that meet the required performance of applications such as machine learning, AI, and data centers. Therefore, the growing need for high-performance computing applications drives the 3D-TSV (Through Silicon Via) market over the forecast period.
• The increasing miniaturization of electronics devices is also anticipated to drive market growth. Growing demand for advanced architecture in tablets, smartphones, and gaming devices, along with surging usage of advanced wafer-level packaging technologies in sensors and MEMS, is expected to provide growth prospects for the 3D IC packaging market during the forecast period. According to WSTS, the IC market for semiconductors reached USD 463 billion in revenue in 2021 and is expected to grow by over 10% to USD 510.96 billion in 2022.
• The COVID-19 pandemic has significantly impacted various industries and has simultaneously propelled the development of advanced medical equipment and devices across the globe. Various medical equipment manufacturing companies announced to increase in the production of several new equipment and devices post the pandemic outbreak. As the applications of 3D IC packaging are numerous within the medical and healthcare industry, the increased manufacturing initiatives are expected to boost the demand for 3D IC packaging.
• However, the high Initial Investment and Increasing Complexity of Semiconductor IC Designs are expected to restrain the evolution of the market.

3D IC Packaging Market Trends

IT & Telecommunication is Expected to Witness Significant Growth

• 3D IC Packaging is an essential part of semiconductor manufacturing and design. It directly affects performance, power, and cost on a macro level and the basic functionality of all chips on a micro level.
• The increasing investment in 5G infrastructure and the growing number of data center servers coupled with IoT connections and networking devices are the factors propelling the growth of 3D IC packaging in the IT and telecommunication sector. For instance, mobile operators in Korea such as KT, LG Uplus, and SK Telecom agreed to invest a total of KRW 25.7 trillion through 2022 to support 5G infrastructure across the country. The additional investment is focused on enhancing the 5G quality in Seoul and six other cities.
• The expansion of data centers provides a growth opportunity for the vendors in the 3D IC packaging studied. According to Cisco Systems, the amount of big data in data center storage global is anticipated to reach 403 exabytes in 2021, with a significant share in the US. Hyperscale data centers reached 700 in 2021, compared to 259 in 2015.
• Moreover, the growing IoT market and surging demand for wireless technologies, wherein reduced footprint and enhanced efficiency are critical, are expected to develop the market for 3D IC packaging. According to Ericson, wide-area IoT devices will reach 5.2 billion by 2027 from 2.1 billion in 2021.

Asia-Pacific is Expected to Witness Significant Growth Rate

• Asia Pacific is home to some of the biggest semiconductor chip manufacturers and companies like TSMC, SMIC, UMC, and South Korea's Samsung. Taiwan's leading chip foundry is teaming up with Japanese suppliers in the race to lead the crucial 3-nanometer chip market. For instance, in February 2021, TSMC announced that the company plans to establish an R&D center in Japan's science city of Tsukuba to develop 3D IC packaging materials in cooperation with its Japanese suppliers.
• Also, in May 2021, Japan's Ministry of Economy, Trade, and Industry and its subsidiary, the National Institute of Advanced Industrial Science and Technology, announced that approximately 20 Japanese companies would work with TSMC Japan's 3D IC R&D Center.
• The Asia Pacific region also holds a significant share in the 3D IC packaging market due to a considerable number of semiconductor manufacturing operations happening in the region, along with the presence of major market players such as Samsung Electronics Co., Ltd., Toshiba Corp, ASE Group, and United Microelectronics Corp. among others.
• The Asia Pacific region is known for its robust Automotive manufacturing capabilities. Moreover, the growing commercialization of 5G technology in the automotive industry will provide a new revenue stream for the vendors operating in the studied market. The advent of 5G NR-based C-V2X is anticipated to offer unique capabilities for the autonomous vehicle. Thus, it can propel the need for higher levels of autonomy and predictability and other ADAS sensor technologies in the vehicle.
• Additionally, market players in the region are forcing on Next-gen chip technology, which could unlock new potential with 3D packaging tools. For instance, Japanese tool-making company Disco focuses on 3D chip packaging by stacking integrated circuits on silicon wafers of near-transparent thinness. As Moore's Law nears its physical limits, chipmakers seek new designs and materials to get better performance out of next-generation hardware. Such trends are expected to propel growth in the region.
• In the current scenario of smart devices and the connected world, customers demand next-generation devices that are more compact, multi-functional, offer better performance, and consume less power. This has propelled the demand for cost-efficient and high-performance IC. For instance, STAR's Institute of Microelectronics has partnered with leading semiconductor companies to develop cost-effective 3D wafer-level integrated circuit packaging solutions. The company has launched chip-on-wafer consortium II and the cost-effective Interposer consortium to advance chip packaging solutions for high-volume manufacturing. The industry-focused consortium will address key challenges in wafer-level packaging to low overall manufacturing costs to accelerate time-to-market for next-generation electronics devices.

3D IC Packaging Market Competitor Analysis

The Global 3D IC Packaging Market is fragmented due to the presence of significant players such as Amkor Technology Inc., ASE Group, and Siliconware Precision Industries Co. Ltd (SPIL), among others. The market players must constantly innovate advanced and comprehensive products to stay relevant.

• In May 2021: Intel plans to invest USD 3.5 billion to upgrade its Rio Rancho plant and increase its headcount by more than 35% at the sprawling complex, one of its three largest US manufacturing hubs. It is expanding its New Mexico operations to manufacture new generations of chips based on its Foveros 3D packaging technology, which could aid the company's attempts to regain its leadership status in the semiconductor industry.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHT

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Threat of New Entrants
  • 4.2.2 Bargaining Power of Buyers/Consumers
  • 4.2.3 Bargaining Power of Suppliers
  • 4.2.4 Threat of Substitute Products
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Value Chain Analysis
• 4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Growing Advanced Architecture in Electronic Products
  • 5.1.2 Miniaturization of Electronics Devices
• 5.2 Market Challenges/Restrains
  • 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs

6 MARKET SEGMENTATION

• 6.1 Packaging Technology
  • 6.1.1 3D wafer-level chip-scale packaging
  • 6.1.2 3D TSV
• 6.2 End-User Industry
  • 6.2.1 Consumer electronics
  • 6.2.2 Aerospace and Defense
  • 6.2.3 Medical Devices
  • 6.2.4 Communications and Telecom
  • 6.2.5 Automotive
  • 6.2.6 Others
• 6.3 Geography
  • 6.3.1 North America
  • 6.3.2 Europe
  • 6.3.3 Asia-Pacific
  • 6.3.4 Latin America
  • 6.3.5 Middle-East

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 Taiwan Semiconductor Manufacturing Company Limited
  • 7.1.2 Samsung Electronics Co., Ltd.
  • 7.1.3 ASE Group
  • 7.1.4 Amkor Technology
  • 7.1.5 Intel Corporation
  • 7.1.6 Siliconware Precision Industries Co. Ltd (SPIL)
  • 7.1.7 GlobalFoundries
  • 7.1.8 Invensas
  • 7.1.9 Powertech Technology Inc.

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET