半导体材料：市场占有率分析、产业趋势与统计、2024年至2029年成长预测

本财年半导体材料市场规模预估为703亿美元。

预计未来五年将达886.6亿美元，预测期内复合年增长率为4.75%。半导体材料是电子产业的关键创新之一。硅 (Si)、锗 (Ge) 和砷化镓 (GaAs) 等材料使电子製造商能够取代传统的热电子装置，这些装置使电子装置变得笨重且昂贵。自从半导体装置问世以来，先进的小型化取得了进展，电子设备变得更小、更移动。

主要亮点

• 随着半导体产业继续加速其小型化趋势，需要更多的处理步骤来製造先进节点 IC、异质整合和 3D 记忆体架构，预计对半导体材料的需求将会成长。
• 半导体正在从刚性基板转向更柔性的塑胶材料和纸张。更柔性基板的趋势催生了从发光二极体到太阳能电池和电晶体的多种装置。
• 半导体产业随着小型化而不断发展，该领域的进步和创新对所有下游技术产生直接影响。随着高端封装解决方案需求的激增和封装成本的不断上升，OSAT供应商正在见证所有最终用户产业，尤其是家用电子电器和汽车应用的需求大幅激增。
• 半导体产业是最复杂的产业之一，因为製造不同产品涉及 500 多个加工步骤，而产业工人面临着充满挑战的环境，包括不稳定的电子市场和不可预测的需求。据认为。根据製造流程的复杂程度，仅半导体晶圆製造就可能涉及多达 1,400 个步骤。重复此过程，在底层形成晶体管，并组装许多电路以创建最终产品。
• 俄罗斯-乌克兰战争正在影响半导体供应链。它是製造半导体和电子元件（包括各种设备）的原材料的重要供应商。衝突可能会扰乱供应链，导致这些原材料短缺和价格上涨，从而影响製造商并导致最终用户的成本更高。
• 此外，据 UkraineInvest 称，2022 年 3 月初，铜价升至 10,845 美元/吨。俄罗斯和乌克兰之间持续的战争、高能源成本以及欧洲更严格的废气法规被认为是铜持续短缺的主要原因。

半导体材料市场趋势

家电需求增加带动市场

• 消费电子 (CE) 是一个价值数十亿美元的行业，它正在稳步推进技术并增加新的产品线，以满足不断变化的生活方式。随着物联网的出现，各个终端用户产业正在采用先进的家用电器来增强业务。
• 据思科称，物联网 (IoT) 已成为一个通用系统，人员、流程、设备和资料可以连接到互联网并相互连接。全球整体M2M 连线预计将从 2018 年的 61 亿增加到 2023 年的 147 亿。此外，思科预测，到 2023 年，全球每人将拥有 1.8 个机器对机器 (M2M) 连线。
• 到 2023 年，消费者将占所有设备（包括固定和行动装置）的 74%，企业将占剩余的 26%。然而，据思科称，与业务部门的复合年增长率预计为 12.0% 相比，消费者份额的复合年增长率预计将略慢于 9.1%。
• NB-IoT 和 Cat-M 等大规模物联网技术的部署（主要是涉及大量低成本、低复杂性、电池寿命长、吞吐量低的设备的广域使用案例）正在增加。因此，预计到2023 年，透过Cat-M 和NB-IoT 技术连接的物联网设备数量将超过2G/3G 连接的物联网设备。到 2027 年，宽频物联网将占当时所有蜂巢式物联网连线的 51%（资料来源：爱立信）。这些趋势预计将显着改变消费性电子产业的格局，从而导致对支援连接功能的半导体晶片的需求增加。
• 该领域半导体的主要消费者是智慧型手机市场。近年来，智慧型手机市场的竞争变得异常激烈。行动电话使用量的增加预计将推动全球市场的发展。例如，爱立信表示，到 2027 年，智慧型手机用户数量预计将从 2021 年的 63 亿增加到 78 亿。
• 需求成长的其他主要驱动因素是 5G 和物联网的推出。随着通讯业者投资和推出5G技术的兴趣增加，对5G设备的需求预计将增加，消费者和产业将选择5G设备。例如，爱立信预计，全球5G行动用户数量预计将从2020年的2.7396亿增加到2021年的6.6418亿，并在2027全球整体达到43.8977亿，并在此过程中带动对半导体晶片和半导体材料的需求。
• 5G网路采用大规模MIMO，在基地台放置大量天线，并广泛使用半导体晶片。因此，5G 在预测期内将为所研究的市场带来巨大的机会。

中国正在经历显着的成长

• 中国政府的国家战略计画「中国製造2025」是该国半导体产业成长的关键要素。该计划的中心目标是半导体行业的成长。此外，中国国家智慧财产局（CNIP）2021年预算目标是到2023年每年註册量达到200万件，这有望重振半导体材料市场。
• 中国政府于2021年3月公布的2021-2025年新五年规划中，将加强基础研究列为重要优先事项。 2021年中央财政基础研究支出预期成长11%，远高于计画中国内生产总值整体投入7%及GDP成长6%的目标。半导体被列为应优先获得资金和资源的七个领域之一。设计公司开发奈米级积体电路，执行电子设备运作的关键任务，包括运算、储存、网路连接和电源管理。
• 此外，穿戴式电子产品的成长也导致了新型微型晶片的采用，推动了半导体成长，增加了晶圆需求，并进一步推动了研究市场。根据Cisco，中国的连网穿戴装置数量预计将从 2021 年的 3.788 亿台增至 2022 年的 4.39 亿台。此外，爱立信预计，2022年全球智慧型手机行动网路用户数量预计将达到约66亿，到2028年将超过78亿。这有望进一步推动研究目标市场的发展。
• 此外，中国汽车工业不断发展，中国在全球汽车市场中的地位日益重要。中国政府将汽车工业，包括汽车零件产业，视为其重点产业之一。政府预计，2020年中国汽车产量将达3,000万辆，到2025年将达到3,500万辆。
• 儘管疫情对中国汽车产业产生了明显影响，但最近的资料显示，中国汽车产业预计将实现2025年的目标。例如，根据中国工业协会（CAAM）的数据，2021年，中国生产的汽车总数约为2,610万辆。此外，2022年，汽车产业将稳定成长。例如，2022年9月，该国销售了约260万辆汽车。
• 根据半导体设备与材料国际公司统计，2022年中国半导体设备收益达129.7亿美元。对半导体晶片不断增长的需求以及对製造设施和设备的投资增加预计将为在该市场运营的供应商提供新的成长机会。

半导体材料产业概况

鑑于最终用户对半导体製造商的品质期望的重要性，品牌标识在半导体材料市场中发挥重要作用。此外，由于BASF、LG 化学有限公司和京瓷公司等现有主要公司的存在，市场渗透率很高。总体而言，竞争公司之间的敌意预计在预测期内将温和成长。

2022 年 11 月，美国电子组装和半导体封装公司的全球材料供应商 Indium Corporation 在美国槟城开设了一家最先进的 37,500 平方英尺生产设施。新工厂将开始製造业务并提高产能，以更好地服务马来西亚及週边地区的客户，特别是泰国和越南。

LG化学将于2022年5月开始开发用于半导体后端製程的抗蚀剂（PR），旨在将其提供给全球半导体业务。在半导体前端製程雕刻超精细电路设计后，该公司为后端製程开发PR，以提高晶片性能。

其他福利：

• Excel 格式的市场预测 (ME) 表
• 3 个月的分析师支持

目录

第一章简介

• 研究假设和市场定义
• 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

• 市场概况
• 产业吸引力－波特五力分析
  • 供应商的议价能力
  • 消费者议价能力
  • 新进入者的威胁
  • 替代品的威胁
  • 竞争公司之间敌对关係的强度
• 评估主要宏观趋势对市场的影响

第五章市场动态

• 市场驱动因素
  • 电子材料技术进步与产品创新
  • 家电需求不断成长
  • OSAT/封装公司的需求增加
• 市场抑制因素
  • 製造流程复杂

第六章市场区隔

• 按用途
  • 製造
    • 过程化学
    • 光罩
    • 电子气体
    • 抗蚀剂
    • 溅镀靶材
    • 硅
    • 其他製造材料
  • 包装
    • 基板
    • 引线框架
    • 陶瓷封装
    • 键合线
    • 封装树脂（液体）
    • 晶片贴装材料
    • 其他包装应用
• 按最终用户产业
  • 消费性电子产品
  • 通讯业
  • 製造业
  • 车
  • 能源/公共产业
  • 其他最终用户产业
• 按地区
  • 北美洲
  • 欧洲
  • 亚太地区
  • 其他的

第七章竞争形势

• 公司简介
  • BASF SE
  • LG Chem Ltd
  • Indium Corporation
  • Showa Denko Materials Co. Ltd（showa Denko KK）
  • KYOCERA Corporation
  • Henkel AG & Company KGAA
  • Sumitomo Chemical Co. Ltd
  • Dow Chemical Co.（Dow Inc.）
  • International Quantum Epitaxy PLC
  • Nichia Corporation
  • CAPLINQ Europe BV
  • ShinEtsu Microsi

第八章投资分析

第9章市场的未来

The semiconductor materials market size is estimated at USD 70.30 billion in the current year. It is expected to reach USD 88.66 billion by the next five years, registering a CAGR of 4.75% during the forecast period. Semiconductor materials represent one of the significant innovations in the electronics industry. By using materials such as silicon (Si), germanium (Ge), and gallium arsenide (GaAs), electronics manufacturers can replace traditional thermionic devices that make electronic devices heavy and expensive. Since the introduction of semiconductor devices, advanced miniaturization has progressed, and electronic devices have become more compact and mobile.

Key Highlights

• With the miniaturization trend gaining momentum in the semiconductor industry, the demand for semiconductor materials is also expected to grow as manufacturing advanced node ICs, heterogeneous integration, and 3D memory architectures require more processing steps; this drives higher wafer fabrication and packaging materials consumption.
• Semiconductors are moving away from rigid substrates to more flexible plastic material and paper, all due to new material and fabrication discoveries. The trend toward more flexible substrates has led to numerous devices, from light-emitting diodes to solar cells and transistors.
• The semiconductor industry has been growing with miniaturization, and advancements and innovations in this field have directly impacted all downstream technologies. With the surging demand for high-end packaging solutions and rising packaging costs, OSAT vendors witnessed a considerable surge in demand from all the end-user industries, especially consumer electronics and automotive applications.
• The semiconductor industry is one of the most complex because of the more than 500 processing steps involved in manufacturing different products and the challenging environment faced by industry workers, including volatile electronics markets and unpredictable demand. It is considered. Depending on the complexity of the manufacturing process, there can be up to 1,400 process steps in semiconductor wafer manufacturing alone. Transistors are formed on the bottom layer, and the process is repeated as many circuits are assembled to create the final product.
• The Russia-Ukraine war is impacting the supply chain of semiconductors. Being a significant supplier of raw materials for producing semiconductors and electronic components, including various equipment. The dispute has disrupted the supply chain, causing shortages and price increases for these materials, impacting manufacturers and potentially leading to higher costs for end-users.
• Further, according to UkraineInvest, copper prices escalated to USD 10,845/mt in early March 2022. The ongoing war between Russia and Ukraine, high energy costs, and stricter emissions standards in Europe have been noted as the primary reasons for the continued shortage of copper.

Semiconductor Materials Market Trends

Rising Demand for Consumer Electronics Goods to Drive the Market

• Consumer electronics (CE) forms a multibillion-dollar industry, steadily progressing and developing technology and adding new product lines toward changing lifestyles. With the advent of IoT, various end-user industries are increasingly adopting advanced consumer electronic products to enhance their operations.
• According to Cisco, the Internet of Things (IoT) has become a prevalent system by which people, processes, devices, and data connection to the Internet and each other. M2M connections are anticipated to grow from 6.1 billion in 2018 to 14.7 billion globally in 2023. Furthermore, Cisco predicts that, by 2023, there will be 1.8 M2M (machine-to-machine) connections for each member of the global population.
• By 2023, the consumer share of the total devices, including fixed and mobile devices, will be 74 percent, with businesses claiming the remaining 26 percent. However, according to Cisco, consumer share will grow at a slightly slower rate, at a 9.1 percent CAGR relative to the business segment, which is expected to witness a 12.0 percent CAGR.
• With the growing deployment of massive IoT technologies such as NB-IoT and Cat-M - primarily consisting of wide-area use cases involving large numbers of low-cost, low-complexity devices with long battery life and low throughput, the number of IoT devices connected by Cat-M and NB-IoT technologies is expected to overtake 2G/3G connected IoT devices in 2023. Broadband IoT in 2027 made up 51 percent of all cellular IoT connections at that time (Source: Ericsson). Such trends are expected to significantly transform the outlook of the consumer electronics industry, which in turn will drive the demand for semiconductor chips to support connectivity features.
• The smartphone market is the major consumer of semiconductors in this segment. The smartphone market has been very competitive in recent years. The increasing usage of cell phones is anticipated to drive the global market. For instance, according to Ericsson, smartphone subscriptions are expected to reach 7.8 billion by 2027, from 6.3 billion in 2021.
• Other significant drivers behind the demand growth are the 5G rollout and IoT. The growing interest of telecom operators to invest and launch in 5G technology is expected to fuel the demand for 5G capable devices, where consumers and industries are expected to opt for 5G devices. For instance, according to Ericsson, 5G mobile subscription, which grew from 273.96 million in 2020 to 664.18 million in 2021, is expected to reach 4,389.77 million globally by 2027, driving the demand for semiconductor chips and semiconductor materials in the process.
• 5G networks use massive MIMO in which many antennas are deployed at the base station, wherein semiconductor chips are widely used. Therefore, 5G will offer an enormous opportunity for the market studied during the forecast period.

China to Witness Significant Growth

• The Chinese government's national strategic plan, ``Made in China 2025,'' has become a key factor in the growth of the country's semiconductor industry. A central goal of this plan is the growth of the semiconductor industry. Furthermore, the 2021 budget of the China National Intellectual Property Administration (CNIP) targets 2 million registrations per year by 2023, which is expected to revitalize the semiconductor materials market.
• China's new five-year plan for 2021-25, announced in March 2021 by the government, establishes boosting basic research as a critical priority. Central government spending on basic research was expected to increase by 11 percent in 2021, well above the 7 percent planned for the overall R&D investment and the 6 percent target for GDP (Gross Domestic Product) growth. Semiconductors have been identified as one of seven areas for priority funding and resources. Design companies develop nanoscale integrated circuits that perform important tasks that make electronic devices work, such as computing, storage, network connectivity, and power management.
• Furthermore, the growth in wearable electronic devices has also been leading to the adoption of new miniaturized chips, propelling the semiconductor's growth and increasing the demand for wafers, further driving the studied market. As per Cisco Systems, the number of connected wearable devices in China is expected to reach 439 million by 2022 from 378.8 million in 2021. Additionally, according to Ericsson, the number of smartphone mobile network subscriptions is expected to reach approximately 6.6 billion worldwide in 2022 and exceed 7.8 billion by 2028. This will further promote the studied market.
• Furthermore, China's automotive industry has been increasing, and the country plays an increasingly important role in the global automotive market. The Chinese government positions the automobile industry, including the auto parts sector, as one of its key industries. The government predicted that China's car production would reach 30 million vehicles by 2020 and 35 million by 2025.
• Although the pandemic had a notable impact on the country's automobile industry, recent data suggests that the country's automotive industry is on track to its 2025 goals. For instance, according to the China Association for Automobile Manufacturers (CAAM), in 2021, the total number of cars produced in China was about 26.1 million. Furthermore, in 2022, the automotive industry has reported steady growth. For instance, in September 2022, about 2.6 million vehicles were sold in the country.
• According to Semiconductor Equipment and Materials International, China's revenue from semiconductor equipment reached USD 12.97 billion in 2022. The growing demand for semiconductor chips and increasing investment in manufacturing facilities and equipment are expected to create new growth opportunities for the vendors operating in the market.

Semiconductor Materials Industry Overview

Brand identity plays a major role in the Semiconductor Materials market, considering the importance of quality that the end-users expect from a semiconductor manufacturing player. The market penetration is also high with the presence of large market incumbents, such as BASF, L.G Chem Ltd., and KYOCERA Corporation. Overall, the intensity of competitive rivalry is expected to grow moderately over the forecast period.

In November 2022, Indium Corporation, a worldwide materials provider to the electronics assembly and semiconductor packaging company in the United States, opened its newest 37,500-square-foot production plant in Penang, Malaysia. The new plant has begun manufacturing operations and will increase production capacity to service better the company's clients in Malaysia and the neighboring area, notably Thailand and Vietnam.

In May 2022, L.G. Chem began developing photoresist (P.R.) utilized in the semiconductor back-end processes with the intention of providing it to worldwide semiconductor businesses. After engraving ultra-fine circuit designs on the front-end procedure of semiconductors, the company is creating P.R. for the back-end technique to improve chip performance.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 Study Assumptions and Market Definition
• 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

• 4.1 Market Overview
• 4.2 Industry Attractiveness - Porter's Five Forces Analysis
  • 4.2.1 Bargaining Power of Suppliers
  • 4.2.2 Bargaining Power of Consumers
  • 4.2.3 Threat of New Entrants
  • 4.2.4 Threat of Substitutes
  • 4.2.5 Intensity of Competitive Rivalry
• 4.3 Assessment of the Impact of Key Macro Trends on the Market

5 MARKET DYNAMICS

• 5.1 Market Drivers
  • 5.1.1 Technical Advancements and Product Innovation of the Electronic Materials
  • 5.1.2 Rising Demand for Consumer Electronics Goods
  • 5.1.3 Increased Demand From OSAT/Packaging Companies
• 5.2 Market Restraints
  • 5.2.1 Complexity in the Manufacturing Process

6 MARKET SEGMENTATION

• 6.1 By Application
  • 6.1.1 Fabrication
    • 6.1.1.1 Process Chemicals
    • 6.1.1.2 Photomasks
    • 6.1.1.3 Electronic Gases
    • 6.1.1.4 Photoresists Ancilliaries
    • 6.1.1.5 Sputtering Targets
    • 6.1.1.6 Silicon
    • 6.1.1.7 Other Fabrication Materials
  • 6.1.2 Packaging
    • 6.1.2.1 Substrates
    • 6.1.2.2 Lead-frames
    • 6.1.2.3 Ceramic Packages
    • 6.1.2.4 Bonding Wire
    • 6.1.2.5 Encapsulation Resins (Liquid)
    • 6.1.2.6 Die Attach Materials
    • 6.1.2.7 Other Packaging Applications
• 6.2 By End User Industry
  • 6.2.1 Consumer Electronics
  • 6.2.2 Telecommunication
  • 6.2.3 Manufacturing
  • 6.2.4 Automotive
  • 6.2.5 Energy and Utility
  • 6.2.6 Other End User Industries
• 6.3 By Geography
  • 6.3.1 North America
  • 6.3.2 Europe
  • 6.3.3 Asia Pacific
  • 6.3.4 Rest of the World

7 COMPETITIVE LANDSCAPE

• 7.1 Company Profiles
  • 7.1.1 BASF SE
  • 7.1.2 LG Chem Ltd
  • 7.1.3 Indium Corporation
  • 7.1.4 Showa Denko Materials Co. Ltd (showa Denko K.K)
  • 7.1.5 KYOCERA Corporation
  • 7.1.6 Henkel AG & Company KGAA
  • 7.1.7 Sumitomo Chemical Co. Ltd
  • 7.1.8 Dow Chemical Co. (Dow Inc.)
  • 7.1.9 International Quantum Epitaxy PLC
  • 7.1.10 Nichia Corporation
  • 7.1.11 CAPLINQ Europe BV
  • 7.1.12 ShinEtsu Microsi

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET