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市场调查报告书
商品编码
1549787

全球无线连接晶片组市场：市场占有率分析、产业趋势/统计、成长预测（2024-2029）

Wireless Connectivity Chipset - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 153 Pages | 商品交期: 2-3个工作天内

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简介目录

全球无线连接晶片组市场规模预计到 2024 年为 85.2 亿美元，2029 年达到 127.2 亿美元，在预测期内（2024-2029 年）复合年增长率为 8.36%。

无线连接晶片组市场

主要亮点

  • 随着高速网路的普及，连网型设备和智慧家庭应用的采用不断增加，特别是在欧洲、北美和亚太地区等地区。主要解决方案包括语音助理、智慧恆温器、智慧照明、安全摄影机和智慧家电。
  • 此外，联发科技于 2024 年 5 月宣布推出两款新晶片组，可提供强大的效能并支援跨多个产业的最新 AI 增强功能。其中包括用于高阶 Chromebook 的 Kompanio 838 SoC 和用于 4K 高阶智慧型电视和显示器的 Pentonic 800 SoC。该公司公布了人工智慧、汽车、物联网、电视、Chromebook 和无线连接等产品类型的重大进展。
  • 例如，中国成立了IMT-2030（6G）推进组，以加速6G技术的研发。预计6G商用将于2030年前后在全球开始。中国率先支持5G商用，为6G发展提供了坚实基础。
  • 增加多个设备（如在物联网中）会增加网路的表面积，并在此过程中增加潜在的攻击向量。即使连接到网路的单一不安全设备也可能成为对网路进行主动攻击的网关。
  • 根据经济合作暨发展组织(OECD) 的一项研究，到 2025 年，拥有电脑的家庭数量预计将增加到 12.6247 亿。拥有至少一台电脑的家庭称为电脑户。电脑普及率的显着提高为市场公司扩大其 Wi-Fi 晶片组产品系列、扩大其在各个地区的业务并增加市场占有率创造了机会。
  • 市场上的各个公司正在开发新产品以保持竞争力，这可能会进一步推动市场成长。例如，Wi-Fi 7技术的早期先驱联发科于2023年11月发布了最新产品Filogic 860和Filogic 360，巩固了其市场领导的地位。这些新增功能显着扩展了联发科的尖端产品线，重点关注最新的连接技术，以实现卓越的性能和坚定的可靠性。
  • Filogic 860 晶片组配备双频网路基地台和先进的网路处理器，专为企业网路基地台、服务供应商网关、网状节点以及各种零售和物联网路由器应用而客製化。另一方面，Filogic 360 在单一晶片中提供 Wi-Fi 7 2x2 功能和双蓝牙 5.4 无线电。该设计专门为边缘设备、串流媒体设备和各种消费性电子产品带来下一代 Wi-Fi 7 连接。
  • 开发和製造先进 Wi-Fi 晶片组的高成本给市场带来了重大挑战。製造这些晶片组所需的先进且昂贵的技术增加了最终产品的成本，并可能阻碍采用，特别是在对价格敏感的消费者中。
  • 新冠肺炎 (COVID-19) 疫情后，人们开始更加重视采用协作工具，同时选择数位模式进行相关会议和讨论。此外，5G 的新使用案例，例如支持学校教育和增加在家工作的需要，预计将推动 5G 投资。此外，许多职场正在采用混合工作模式，部署 5G 连线可以增强连接性。儘管供应链短缺导致供应中断，但此类案例仍积极推动市场发展。

无线连接晶片组市场趋势

Wi-Fi独立机占最大市场份额

  • Wi-Fi 网路技术的进步使用户能够体验更快、更低延迟的通讯。这促进了资料密集型服务和应用程式的使用。 Wi-Fi 网路承载的资料量显着增加主要是由客户对视讯和业务的需求以及消费者向云端服务的迁移所推动的。这项因素预计将增加对高速、高容量网路的无线 5G 连线的需求。
  • 现代世界的网路普及率正在不断提高。根据通讯的数据，截至 2023 年，全球网路使用者数量预计将达到 54 亿，高于前一年的 51 亿。这一比例相当于世界人口的 67%。
  • 根据 Snapchat 的报告，到 2025 年，全球约 75% 的人口和几乎所有智慧型手机用户都将频繁使用 AR 技术，预计将有超过 15 亿人是千禧世代。根据GSMA中国行动经济预测，到2025年，中国将拥有约3.4亿智慧型手机连接，渗透率达到十分之九，其中中国当地15亿，香港1230万，预计销量将达到190万台。有2570万台。
  • 2024年2月，韩国公司Stage该公司计划投资 4.62 亿美元（6,128 亿韩元）建设 6,000 个基地台，并在韩国各地部署 28GHz 5G 网路。
  • 根据爱立信的行动报告，到 2026 年，北美智慧型手机的平均每月行动资料使用量预计将达到 49GB。精通智慧型手机的消费者、丰富的视讯应用程式和大容量资料方案正在推动流量成长。虽然每部智慧型手机的流量可能在短期内稳定成长，但从长远来看，采用 AR 和 VR 的身临其境型消费者 5G 连结预计将推动更高的成长率。
  • 凭藉低延迟，它可以提供快速、无故障、无延迟的虚拟实境和扩增实境影像。行动连线由小型基地台基础设施提供支持，可增强 5G 无线讯号密度并改善穿过混凝土建筑物和墙壁的移动。小型基地台天线还增强了无线连接并支援同一网路上同时连接更多设备。预计这些发展将推动市场。

亚太地区预计将成为成长最快的市场

  • 5G在亚太地区的到来加速了用于高速网路连接的无线连接晶片组的部署。日本政府已批准在全国 208,000 个交通号誌上安装 5G基地台。地方政府和通讯业者分担使用红绿灯进行5G部署的成本。这将导致在更短的时间内部署更多解决方案，并更快地覆盖整个国家的 5G 连线。
  • Biju等多家印度跨国教育科技公司向学生提供平板电脑作为其教育课程的一部分，并透过数位方法和传统教学方法教育学生。市场上公司的这些努力将进一步推动平板电脑、智慧型手机和其他消费性电子产品的需求，并预计将在预测期内推动该地区平板电脑市场的无线连接晶片组的发展。
  • 亚太地区对网路服务的需求不断增长预计也将推动无线连接晶片组在该地区的采用。印度总理表示，5G网路服务在印度的推出预计将为印度带来新的经济可能性和社会效益。
  • 此外，中国在5G发展方面处于全球领先地位。全国已建成5G基地台超过254万个，拥有5G智慧型手机的人数超过5.75亿。中国也计划到2025年投资1.2兆元人民币（1742亿美元）用于5G网路建设。对稳定 5G 网路不断增长的需求正在加速小型基地台解决方案在该国的部署。
  • 随着5G智慧型手机变得越来越容易取得且负担得起，以及智慧型手机在大都会圈和农村地区的普及率迅速提高，5G用户数量预计将迅速增加，到2023年终，同一地区的5G用户数量将增加预计数量将达到5000万左右。
  • 2023年2月，新加坡网路营运商M1和StarHub结盟，名为Antina。两家公司已延长与诺基亚的协议，以改善全国室内和室外 5G 覆盖范围。诺基亚已经安装了名为 ASiR（空中尺度室内无线电）和 MIMO（多重输入、多重输出）的小型基地台解决频宽，以自适应天线覆盖新建筑。

无线连接晶片组产业概览

无线连接晶片组市场较为分散，参与者众多，包括博通公司、高通公司、联发科公司、英特尔公司和德州仪器公司。此外，公司还透过推出新产品、扩展业务以及进行策略性合併、联盟和收购来扩大市场占有率。

  • 2023 年 6 月：Broadcom 发布第二代 Wi-Fi 7 晶片组。 BCM6765住宅Wi-Fi 7网路基地台晶片、BCM47722 企业 Wi-Fi 7网路基地台晶片，具有双 IoT 无线电，支援蓝牙低功耗 (BLE)、Zigbee、Thread 和 Matter通讯协定操作，适用于行动装置设计的BCM4390 低功耗Wi-Fi 7 ，蓝牙，802.15.4复合晶片。 BCM47722 企业 Wi-Fi 7网路基地台SoC 规格支援无线连线。
  • 2023 年 4 月：德克萨斯) 宣布推出其 SimpleLink 系列 Wi-Fi 6伴同性积体电路 (IC) 的最新产品。这些 IC 旨在帮助设计人员实现稳健、安全和高效的 Wi-Fi 连接，特别适合在高密度或高达 105 度C 的高温环境中的应用。 TI CC33xx 系列中的首款产品在一个 IC 中同时支援 Wi-Fi 6 和蓝牙低功耗 5.3。

其他好处：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争程度
  • 评估宏观经济趋势对市场的影响

第五章市场动态

  • 市场驱动因素
    • 由于家庭自动化，对连网家庭的需求增加
    • 提高网路对家庭和企业的渗透率
  • 市场挑战
    • 资料安全和隐私、设备连接和互通性问题
    • 一些行动装置的需求疲软

第六章 市场细分

  • 按类型
    • 独立 Wi-Fi
    • 蓝牙独立
    • Wifi 和蓝牙组合
    • 低功耗无线IC
  • 按最终用户使用情况
    • 消费者
    • 公司
    • 行动装置
    • 车
    • 工业的
    • 其他最终用户
  • 按地区
    • 北美洲
    • 欧洲
    • 亚洲
    • 澳洲/纽西兰
    • 拉丁美洲
    • 中东/非洲

第七章 竞争格局

  • 公司简介
    • Broadcom Inc.
    • Qualcomm Incorporated
    • Mediatek Inc.
    • Intel Corporation
    • Texas Instruments Incorporated
    • STMicroelectronics NV
    • NXP Semiconductors NV
    • On Semiconductor Corporation
    • Infineon Technologies AG
    • Microchip Technology Inc.
    • Qorvo Inc.
    • Skyworks Solutions Inc.
    • Hisilicon Technologies Co. Ltd
    • Tsinghua Unigroup Co. Ltd（unisoc（Shanghai）Technologies Co. Ltd）

第八章供应商市场占有率分析

第九章投资分析

第10章市场的未来

简介目录
Product Code: 92355

The Wireless Connectivity Chipset Market size is estimated at USD 8.52 billion in 2024, and is expected to reach USD 12.72 billion by 2029, growing at a CAGR of 8.36% during the forecast period (2024-2029).

Wireless Connectivity Chipset - Market

Key Highlights

  • With the growing penetration of high-speed internet, the adoption of connected devices and smart home applications is increasing, especially in regions such as Europe, North America, and Asia-Pacific. Some major solutions include voice assistants, smart thermostats, smart lighting, security cameras, and smart appliances.
  • Further, in May 2024, MediaTek announced the debut of two new chipsets with powerful performance and support for the latest AI enhancements across multiple verticals. These included the Kompanio 838 SoC for premium Chromebooks and the Pentonic 800 SoC for 4K premium smart TVs and displays. The company highlighted major developments in product categories such as AI, automotive, IoT, TVs, Chromebooks, and wireless connectivity.
  • For instance, the IMT-2030 (6G) Promotion Group was formed in China to speed up the R&D of 6G technology. Around 2030, the world is anticipated to witness the commercialization of 6G. China is leading the charge in supporting the commercialization of 5G, which will provide a solid basis for developing 6G.
  • Adding several devices, such as in IoT, increases the surface area of a network, creating more potential attack vectors in the process. Even a single unsecured device connected to a network may serve as a point of entry for an active attack on the network.
  • According to the Organisation for Economic Co-operation and Development survey, by 2025, the number of households with computers is anticipated to increase to 1,262.47 million. Homes with at least one computer are referred to as computer households. Such a massive boost in computer adoption will create an opportunity for the market players to expand their Wi-Fi chipset product portfolio, expand their presence in different regions, and advance their market share.
  • Various players in the market are developing new products to stay competitive, which may further propel market growth. For instance, in November 2023, MediaTek, an early pioneer in Wi-Fi 7 technology, solidified its position as a market leader with the launch of its latest offerings, the Filogic 860 and Filogic 360. These additions significantly expanded MediaTek's cutting-edge product line, emphasizing the latest connectivity technologies for superior performance and unwavering reliability.
  • The Filogic 860 chipsets, featuring a dual-band access point and an advanced network processor, are tailored for enterprise access points, service provider gateways, mesh nodes, and various retail and IoT router applications. On the other hand, the Filogic 360 facilitates Wi-Fi 7 2x2 capabilities and dual Bluetooth 5.4 radios in a single chip. This design is specifically crafted to bring next-gen Wi-Fi 7 connectivity to edge and streaming devices, as well as a wide range of consumer electronics.
  • High costs associated with developing and producing advanced Wi-Fi chipsets pose a significant challenge in the market. The sophisticated and expensive technology needed for manufacturing these chipsets inflates the final product's cost, potentially hindering adoption, especially among price-sensitive consumers.
  • Post-COVID-19, there was a shift to opting for digital modes for relevant meetings and discussions while focusing more on adopting collaborative tools. Furthermore, emerging use cases for 5G, including the need to support increasing numbers of individuals schooling and working from home, are expected to drive 5G investment. In addition, many workplaces have adopted a hybrid model of working, for which 5G connections can be deployed for better connectivity. Such cases have positively driven the market despite the disruptions caused due to shortages in the supply chain.

Wireless Connectivity Chipset Market Trends

Wi-Fi Standalone Holds the Maximum Share of the Market

  • The evolution of Wi-Fi network technology allows users to experience faster speeds and lower latency. It boosted the use of data-heavy services and applications. The significant rise in the volume of data carried by Wi-Fi networks has been primarily driven by customer demand for video and business and consumer moves to cloud services. This factor is expected to drive the need for a wireless 5G connection with fast and high-capacity networks.
  • Internet penetration has scaled up in the modern world. According to the International Telecommunication Union, as of 2023, the estimated number of internet users worldwide was 5.4 billion, up from 5.1 billion in the previous year. This share represented 67% of the global population.
  • According to a report from Snapchat, by 2025, around 75% of the global population and almost all smartphone users will be frequent AR technology users, out of which more than 1.5 billion are anticipated to be millennials. According to GSMA's Mobile Economy China, China will add around 340 million smartphone connections by 2025, with adoption rising to 9 in 10 connections, 1.5 billion in Mainland China, 12.3 million in Hong Kong, 1.9 million in Macao, and 25.7 million in Taiwan.
  • In February 2024, Stage X, a South Korean company, announced that it was awarded a spectrum that will enable it to be the nation's fourth mobile carrier and planned to launch nationwide mobile network services in the first half of 2025. The company invested USD 462 million (KRW 612.8 billion) to deploy its 28 GHz 5G network across South Korea with a plan to build 6,000 base stations; it also involved the mandated installation standard for the 28 GHz frequency network.
  • According to Ericsson's Mobility Report, the monthly average usage of mobile data in North America is expected to reach 49 GB per month for smartphones in 2026. A smartphone-savvy consumer base, video-rich applications, and large data plans will drive traffic growth. While there may be robust growth in traffic per smartphone in the near term, the adoption of immersive consumer 5G connections utilizing AR and VR is expected to lead to an even better growth rate in the long term.
  • Lower latency is also poised to enable high-speed virtual and augmented reality video without glitches or delays. Mobile connectivity can be strengthened with small cell infrastructure, densifying 5G wireless signals and improving their movement through concrete buildings and walls. Small-cell antennas will also enhance wireless connection, supporting more devices on the same network simultaneously. Such developments are expected to drive the market.

Asia-Pacific is Expected to be the Fastest-growing Market

  • The advent of 5G in the Asia-Pacific region accelerated wireless connectivity chipset deployment for high-speed network connectivity. Japan's government granted permission to install 5G base stations on 208,000 traffic lights across the country. Local administrations and operators shared the costs of using the traffic lights for 5G deployments. This will help with more solution deployment in less time, thereby circulating 5G connectivity faster throughout the country.
  • Various Indian multinational educational technology companies, such as Byju's, provide their students with a tablet as a part of their educational curriculum to educate the students via digital methods along with the traditional methods of teaching. Such initiatives by the companies in the market are expected to promote further the demand for tablets, smartphones, and other consumer electronics in the market, thereby driving the market for wireless connectivity chipsets for tablets in the region during the forecast period.
  • The increasing demand for internet services in the Asia-Pacific region is also expected to promote the adoption of wireless connectivity chipsets in the region. As per the prime minister of India, the launch of 5G internet services in India is expected to bring new economic possibilities and societal benefits to the nation.
  • In addition, China is leading 5G development on a worldwide scale. More than 2.54 million 5G base stations have been built nationwide, and more than 575 million people now own 5G smartphones. The country further plans to invest CNY 1.2 trillion (USD 174.2 billion) in 5G network construction by 2025. This growing demand for a 5G stable network is accelerating the deployment of small-cell solutions in the country.
  • Due to the increasing availability and affordability of 5G smartphones and the rapid adoption of smartphones in metropolitan and rural areas, 5G subscriptions are expected to rapidly increase to reach approximately 50 million in the region by the end of 2023.
  • In February 2023, Network operators M1 and StarHub in Singapore formed an alliance named Antina. They extended their contract with Nokia to improve indoor and outdoor 5G coverage nationwide. To provide a better 5G user experience with high bandwidth, breakneck speeds, and minimal latency, Nokia will install its small cell solution called airscale indoor radio (ASiR), covering new buildings with multiple input, multiple outputs (MIMO) adaptive antennas.

Wireless Connectivity Chipset Industry Overview

The wireless connectivity chipset market is fragmented, with many players like Broadcom Inc., Qualcomm Incorporated, Mediatek Inc., Intel Corporation, and Texas Instruments Incorporated. The companies are also increasing their market presence by introducing new products, expanding their operations, and entering strategic mergers, partnerships, and acquisitions.

  • June 2023: Broadcom unveiled its second-generation Wi-Fi 7 chipsets: the BCM6765 residential Wi-Fi 7 access point chip, the BCM47722 enterprise Wi-Fi 7 access point chip with dual IoT radios that support operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols, and the BCM4390 low-power Wi-Fi 7, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices. BCM47722 enterprise Wi-Fi 7 access point SoC specifications allow wireless connectivity.
  • April 2023: Texas Instruments unveiled its latest SimpleLink family, a line of Wi-Fi 6 companion integrated circuits (ICs). These ICs are designed to empower designers to create robust, secure, and efficient Wi-Fi connections, particularly for applications in high-density or high-temperature settings, reaching up to 105 °C. The initial offerings from TI's CC33xx family cater to both Wi-Fi 6 and Bluetooth Low Energy 5.3, all within a single IC.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitutes
    • 4.2.5 Degree of Competition
  • 4.3 Assessment of the Impact of Macroeconomic Trends on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increased Demand for Connected Homes Through Home Automation
    • 5.1.2 Increasing Internet Penetration into Homes and Enterprises
  • 5.2 Market Challenges
    • 5.2.1 Issues Related to Security and Privacy of Data and Connectivity of Devices and Interoperability
    • 5.2.2 Slow Demand for Some Mobile Handset Types

6 MARKET SEGMENTATION

  • 6.1 By Type
    • 6.1.1 Wi-Fi Standalone
    • 6.1.2 Bluetooth Standalone
    • 6.1.3 Wifi and Bluetooth Combo
    • 6.1.4 Low-power Wireless IC
  • 6.2 By End-user Application
    • 6.2.1 Consumer
    • 6.2.2 Enterprise
    • 6.2.3 Mobile Handsets
    • 6.2.4 Automotive
    • 6.2.5 Industrial
    • 6.2.6 Other End-user Applications
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia
    • 6.3.4 Australia and New Zealand
    • 6.3.5 Latin America
    • 6.3.6 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Broadcom Inc.
    • 7.1.2 Qualcomm Incorporated
    • 7.1.3 Mediatek Inc.
    • 7.1.4 Intel Corporation
    • 7.1.5 Texas Instruments Incorporated
    • 7.1.6 STMicroelectronics NV
    • 7.1.7 NXP Semiconductors NV
    • 7.1.8 On Semiconductor Corporation
    • 7.1.9 Infineon Technologies AG
    • 7.1.10 Microchip Technology Inc.
    • 7.1.11 Qorvo Inc.
    • 7.1.12 Skyworks Solutions Inc.
    • 7.1.13 Hisilicon Technologies Co. Ltd
    • 7.1.14 Tsinghua Unigroup Co. Ltd (unisoc (Shanghai) Technologies Co. Ltd

8 VENDOR MARKET SHARE ANALYSIS

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET