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市场调查报告书
商品编码
1734877

2032 年桥接晶片市场预测：按类型、功能、配置、技术、应用、最终用户和地区进行的全球分析

Bridging Chips Market Forecasts to 2032 - Global Analysis By Type, Function, Configuration, Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球桥接晶片市场预计在 2025 年达到 17 亿美元，到 2032 年将达到 57 亿美元，预测期内的复合年增长率为 18.2%。

桥接晶片是专用的半导体元件，用于促进不同硬体介面和系统结构之间的通讯。它们充当中介，实现跨各种通讯协定（包括 PCIe、USB 和乙太网路）的无缝资料传输。这些晶片透过管理讯号转换并确保不同电子元件之间的兼容性来优化性能。桥接晶片常用于运算、网路和嵌入式系统，可增强连接性，支援高效的资料交换，并支援在复杂的硬体环境中整合进阶功能。

根据美国商务部预测，到2030年半导体产业规模将达到1兆美元，而桥接晶片在这项扩张中扮演至关重要的角色。

资料中心和云端处理的成长

随着企业越来越依赖高速资料处理和连接解决方案，资料中心和云端处理的蓬勃发展也推动了桥接晶片的需求。随着云端基础服务呈指数级增长，桥接晶片在确保不同硬体架构之间的无缝通讯方面发挥关键作用。桥接晶片促进了伺服器、储存设备和网路元件之间的高效资料传输，从而提升了系统效能。

製造商之间的硬体标准存在差异

桥接晶片的采用面临挑战，因为不同製造商的硬体标准存在差异，这在整合不同系统时会产生相容性问题。每个产业都有其专有的架构，因此桥接晶片需要支援多种通讯协定才能实现有效的互通性。硬体规格的多样性使设计变得复杂，增加了製造成本，并减缓了采用速度。

5G 和边缘运算的进步

5G 和边缘运算的进步为桥接晶片带来了新的可能性，因为即时资料处理需要设备之间的高效互连。随着物联网和智慧技术的日益普及，桥接晶片能够实现分散式系统之间的无缝通讯，并优化回应时间。它们与行动网路、嵌入式运算和边缘人工智慧的集成，将增强整体连接性，并降低下一代数位应用的延迟。

地缘政治紧张局势和晶片短缺

贸易限制和半导体製造限制导致供应和定价的不确定性，影响全球业务运作。此外，对集中于特定地区的关键供应商的依赖使市场容易受到干扰。为了降低这些风险，企业正专注于多元化筹资策略，并投资于晶片製造的在地化，以确保稳定的供应链。

COVID-19的影响：

疫情扰乱了半导体製造和物流，导致暂时的供不应求和供应链受限，从而影响了桥接晶片市场。然而，疫情期间对云端运算和资料密集型应用的依赖日益增加，增强了对高效能连接解决方案的需求。向远端工作、线上服务和数位协作的转变加速了对高效能桥接晶片的需求，以确保系统的可靠性和性能。

PCI/PCIe 桥接晶片市场预计将成为预测期内最大的市场

由于 PCI/PCIe 桥接晶片在运算、网路和企业解决方案中的广泛应用，预计将在预测期内占据最大的市场占有率。这些桥接晶片有助于将基于 PCI 的周边设备与现代架构无缝集成，从而确保高效的资料交换和系统互通性。它们在优化资料中心和嵌入式系统内的高速资料传输方面发挥的作用，进一步巩固了其市场主导地位。

预测期内通讯协定转换部分预计以最高复合年增长率成长

由于对跨平台连接解决方案的需求不断增长，预计通讯协定转换领域将在预测期内实现最高增长率。各行各业越来越多地使用通讯协定转换晶片来实现各种介面（例如USB、乙太网路、Thunderbolt等）之间的无缝通讯。这些晶片提高了工业自动化、智慧型设备和云端运算的兼容性，支援跨多个系统的高效资​​料处理。

占比最大的地区：

在预测期内，北美预计将占据最大的市场占有率，这得益于其在云端运算、半导体创新和高效能运算解决方案方面的大量投资。领先的科技公司以及在桥接晶片开发方面的广泛研究巩固了该地区在该领域的领导地位。此外，数据驱动应用的兴起将继续推动市场对先进连接解决方案的需求。

复合年增长率最高的地区：

预计亚太地区将在预测期内实现最高的复合年增长率，这得益于高速运算和半导体製造技术的快速发展。中国大陆、韩国和台湾等国家和地区在晶片製造和下一代通讯技术的投资方面处于领先地位。 5G、人工智慧主导的数据处理和智慧自动化的日益普及，进一步推动了该地区市场的扩张。

提供免费客製化：

订阅此报告的客户将获得以下免费自订选项之一：

  • 公司简介
    • 全面分析其他市场参与者（最多 3 家公司）
    • 主要企业的SWOT分析（最多3家公司）
  • 地理细分
    • 根据客户兴趣对主要国家市场进行估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 研究范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 限制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买家的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

第五章全球桥接晶片市场（按类型）

  • PCI/PCIe桥接晶片
  • I2C/SPI桥接晶片
  • USB桥接晶片
  • HDMI/显示桥接晶片
  • SATA/SAS桥接晶片
  • 乙太网路桥接晶片
  • 其他类型

6. 全球桥接晶片市场（按功能）

  • 通讯协定转换
  • 介面桥接
  • 频宽扩展
  • 讯号转换
  • 其他功能

7. 全球桥接晶片市场（依产品类型）

  • 单晶片解决方案
  • 多晶片解决方案

8. 全球桥接晶片市场（按技术）

  • 基于现场可程式闸阵列（FPGA）
  • 专用积体电路（ASIC）
  • 分立桥接晶片
  • 系统晶片(SoC)

第九章全球桥接晶片市场（按应用）

  • 消费性电子产品
  • 计算设备
  • 资讯娱乐系统
  • 自动化设备
  • 路由器/交换机
  • 基地台
  • 其他用途

第 10 章全球桥接晶片市场（依最终用户）

  • 家电製造商
  • 通讯服务供应商
  • OEM（原始设备製造商）
  • 售后市场

第十一章全球桥接晶片市场（按地区）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十二章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十三章 公司概况

  • Analog Devices
  • Broadcom Inc.
  • FTDI
  • Fujitsu
  • JMicron Technology
  • Marvell Technology
  • MaxLinear
  • MediaTek Inc.
  • Microchip Technology
  • NXP Semiconductors
  • Realtek Semiconductor
  • Renesas Electronics
  • Silicon Labs
  • Silicon Motion
  • STMicroelectronics
  • Texas Instruments（TI）
  • Toshiba
Product Code: SMRC29514

According to Stratistics MRC, the Global Bridging Chips Market is accounted for $1.7 billion in 2025 and is expected to reach $5.7 billion by 2032 growing at a CAGR of 18.2% during the forecast period. Bridging chips are specialized semiconductor components that facilitate communication between different hardware interfaces or system architectures. They function as intermediaries, enabling seamless data transfer across varying protocols, such as PCIe, USB, and Ethernet. These chips optimize performance by managing signal conversion and ensuring compatibility between disparate electronic components. Commonly used in computing, networking, and embedded systems, bridging chips enhance connectivity, support efficient data exchange, and enable the integration of advanced functionalities within complex hardware environments.

According to the U.S. Department of Commerce, the semiconductor industry is projected to reach a value of $1 trillion by 2030, with bridging chips playing a pivotal role in this expansion.

Market Dynamics:

Driver:

Growth in data centers and cloud computing

The expanding growth in data centers and cloud computing is driving demand for bridging chips, as businesses increasingly rely on high-speed data processing and connectivity solutions. With cloud-based services growing exponentially, bridging chips play a critical role in ensuring seamless communication between different hardware architectures. They facilitate efficient data transfer across servers, storage devices, and network components, enhancing system performance.

Restraint:

Variability in hardware standards across manufacturers

Variability in hardware standards across manufacturers poses a challenge to bridging chip adoption, as compatibility issues arise when integrating disparate systems. Different industry players employ proprietary architectures, requiring bridging chips to support multiple protocols for effective interoperability. This diversity in hardware specifications complicates design and increases production costs, slowing widespread adoption.

Opportunity:

Advancement in 5G and edge computing

The advancement of 5G and edge computing is opening new possibilities for bridging chips, as real-time data processing requires efficient interconnectivity between devices. With the proliferation of IoT and smart technologies, bridging chips enable seamless communication across distributed systems, optimizing response times. Their integration into mobile networks, embedded computing, and edge-based AI enhances overall connectivity, reducing latency in next-generation digital applications.

Threat:

Geopolitical tensions and chip shortages

Trade restrictions and semiconductor manufacturing constraints create uncertainties in availability and pricing, affecting business operations worldwide. Additionally, reliance on key suppliers concentrated in specific regions makes the market vulnerable to disruptions. To mitigate these risks, companies are focusing on diversifying sourcing strategies and investing in localized chip fabrication to ensure stable supply chains.

Covid-19 Impact:

The pandemic affected the bridging chips market by disrupting semiconductor manufacturing and logistics, leading to temporary shortages and supply chain constraints. However increasing reliance on cloud computing and data-intensive applications during the crisis reinforces demand for high-performance connectivity solutions. The transition to remote work, online services, and digital collaboration accelerated the need for efficient bridging chips, ensuring system reliability and performance.

The PCI/PCIe bridging chips segment is expected to be the largest during the forecast period

The PCI/PCIe bridging chips segment is expected to account for the largest market share during the forecast period owing to its extensive adoption in computing, networking, and enterprise solutions. These bridging chips facilitate seamless integration between PCI-based peripherals and modern architectures, ensuring efficient data exchange and system interoperability. Their role in optimizing high-speed data transfers within data centers and embedded systems further reinforces their market dominance.

The protocol conversion segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the protocol conversion segment is predicted to witness the highest growth rate driven by the rising need for cross-platform connectivity solutions. Industries are increasingly utilizing protocol conversion chips to enable seamless communication between diverse interfaces such as USB, Ethernet, and Thunderbolt. These chips enhance compatibility in industrial automation, smart devices, and cloud computing, supporting efficient data handling across multiple systems.

Region with largest share:

During the forecast period, the North America region is expected to hold the largest market share attributed to significant investments in cloud computing, semiconductor innovation, and high-performance computing solutions. The presence of leading technology firms and extensive research in bridging chip development reinforces the region's leadership in the sector. Additionally, the expansion of data-driven applications continues to fuel market demand for advanced connectivity solutions.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR propelled by rapid advancements in high-speed computing and semiconductor manufacturing. Countries such as China, South Korea, and Taiwan are at the forefront of investment in chip fabrication and next-generation communication technologies. The growing adoption of 5G, AI-driven data processing, and smart automation is further accelerating market expansion in the region.

Key players in the market

Some of the key players in Bridging Chips Market include Analog Devices, Broadcom Inc., FTDI, Fujitsu, JMicron Technology, Marvell Technology, MaxLinear, MediaTek Inc., Microchip Technology, NXP Semiconductors, Realtek Semiconductor, Renesas Electronics, Silicon Labs, Silicon Motion, STMicroelectronics, Texas Instruments (TI) and Toshiba.

Key Developments:

In April 2025, MaxLinear introduced a new line of broadband access SoCs, supporting the latest DOCSIS 4.0 standard. These SoCs are designed to deliver multi-gigabit speeds to meet the growing demand for high-speed internet services.

In April 2025, FTDI launched a new series of USB-to-serial converter chips, offering enhanced data transfer rates and improved power efficiency. These chips are designed to meet the growing demand for reliable and fast data communication in industrial and consumer electronics.

In March 2025, Texas Instruments announced the expansion of its semiconductor manufacturing facility in Richardson, Texas, to increase production capacity. This expansion is part of TI's strategy to meet the growing demand for analog and embedded processing chips across various industries.

Types Covered:

  • PCI/PCIe Bridging Chips
  • I2C/SPI Bridging Chips
  • USB Bridging Chips
  • HDMI/Display Bridging Chips
  • SATA/SAS Bridging Chips
  • Ethernet Bridging Chips
  • Other Types

Functions Covered:

  • Protocol Conversion
  • Interface Bridging
  • Bandwidth Expansion
  • Signal Translation
  • Other Functions

Configurations Covered:

  • Single Chip Solutions
  • Multi-Chip Solutions

Technologies Covered:

  • Field-Programmable Gate Array (FPGA)-based
  • Application-Specific Integrated Circuit (ASIC)
  • Discrete Bridging Chips
  • System-on-Chip (SoC)

Applications Covered:

  • Consumer Electronics
  • Computing Devices
  • Infotainment Systems
  • Automation Equipment
  • Routers/Switches
  • Base Stations
  • Other Applications

End Users Covered:

  • Consumer Electronics Manufacturers
  • Telecommunication Service Providers
  • OEMs (Original Equipment Manufacturers)
  • Aftermarket

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Bridging Chips Market, By Type

  • 5.1 Introduction
  • 5.2 PCI/PCIe Bridging Chips
  • 5.3 I2C/SPI Bridging Chips
  • 5.4 USB Bridging Chips
  • 5.5 HDMI/Display Bridging Chips
  • 5.6 SATA/SAS Bridging Chips
  • 5.7 Ethernet Bridging Chips
  • 5.8 Other Types

6 Global Bridging Chips Market, By Function

  • 6.1 Introduction
  • 6.2 Protocol Conversion
  • 6.3 Interface Bridging
  • 6.4 Bandwidth Expansion
  • 6.5 Signal Translation
  • 6.6 Other Functions

7 Global Bridging Chips Market, By Configuration

  • 7.1 Introduction
  • 7.2 Single Chip Solutions
  • 7.3 Multi-Chip Solutions

8 Global Bridging Chips Market, By Technology

  • 8.1 Introduction
  • 8.2 Field-Programmable Gate Array (FPGA)-based
  • 8.3 Application-Specific Integrated Circuit (ASIC)
  • 8.4 Discrete Bridging Chips
  • 8.5 System-on-Chip (SoC)

9 Global Bridging Chips Market, By Application

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Computing Devices
  • 9.4 Infotainment Systems
  • 9.5 Automation Equipment
  • 9.6 Routers/Switches
  • 9.7 Base Stations
  • 9.8 Other Applications

10 Global Bridging Chips Market, By End User

  • 10.1 Introduction
  • 10.2 Consumer Electronics Manufacturers
  • 10.3 Telecommunication Service Providers
  • 10.4 OEMs (Original Equipment Manufacturers)
  • 10.5 Aftermarket

11 Global Bridging Chips Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Analog Devices
  • 13.2 Broadcom Inc.
  • 13.3 FTDI
  • 13.4 Fujitsu
  • 13.5 JMicron Technology
  • 13.6 Marvell Technology
  • 13.7 MaxLinear
  • 13.8 MediaTek Inc.
  • 13.9 Microchip Technology
  • 13.10 NXP Semiconductors
  • 13.11 Realtek Semiconductor
  • 13.12 Renesas Electronics
  • 13.13 Silicon Labs
  • 13.14 Silicon Motion
  • 13.15 STMicroelectronics
  • 13.16 Texas Instruments (TI)
  • 13.17 Toshiba

List of Tables

  • Table 1 Global Bridging Chips Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Bridging Chips Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global Bridging Chips Market Outlook, By PCI/PCIe Bridging Chips (2024-2032) ($MN)
  • Table 4 Global Bridging Chips Market Outlook, By I2C/SPI Bridging Chips (2024-2032) ($MN)
  • Table 5 Global Bridging Chips Market Outlook, By USB Bridging Chips (2024-2032) ($MN)
  • Table 6 Global Bridging Chips Market Outlook, By HDMI/Display Bridging Chips (2024-2032) ($MN)
  • Table 7 Global Bridging Chips Market Outlook, By SATA/SAS Bridging Chips (2024-2032) ($MN)
  • Table 8 Global Bridging Chips Market Outlook, By Ethernet Bridging Chips (2024-2032) ($MN)
  • Table 9 Global Bridging Chips Market Outlook, By Other Types (2024-2032) ($MN)
  • Table 10 Global Bridging Chips Market Outlook, By Function (2024-2032) ($MN)
  • Table 11 Global Bridging Chips Market Outlook, By Protocol Conversion (2024-2032) ($MN)
  • Table 12 Global Bridging Chips Market Outlook, By Interface Bridging (2024-2032) ($MN)
  • Table 13 Global Bridging Chips Market Outlook, By Bandwidth Expansion (2024-2032) ($MN)
  • Table 14 Global Bridging Chips Market Outlook, By Signal Translation (2024-2032) ($MN)
  • Table 15 Global Bridging Chips Market Outlook, By Other Functions (2024-2032) ($MN)
  • Table 16 Global Bridging Chips Market Outlook, By Configuration (2024-2032) ($MN)
  • Table 17 Global Bridging Chips Market Outlook, By Single Chip Solutions (2024-2032) ($MN)
  • Table 18 Global Bridging Chips Market Outlook, By Multi-Chip Solutions (2024-2032) ($MN)
  • Table 19 Global Bridging Chips Market Outlook, By Technology (2024-2032) ($MN)
  • Table 20 Global Bridging Chips Market Outlook, By Field-Programmable Gate Array (FPGA)-based (2024-2032) ($MN)
  • Table 21 Global Bridging Chips Market Outlook, By Application-Specific Integrated Circuit (ASIC) (2024-2032) ($MN)
  • Table 22 Global Bridging Chips Market Outlook, By Discrete Bridging Chips (2024-2032) ($MN)
  • Table 23 Global Bridging Chips Market Outlook, By System-on-Chip (SoC) (2024-2032) ($MN)
  • Table 24 Global Bridging Chips Market Outlook, By Application (2024-2032) ($MN)
  • Table 25 Global Bridging Chips Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 26 Global Bridging Chips Market Outlook, By Computing Devices (2024-2032) ($MN)
  • Table 27 Global Bridging Chips Market Outlook, By Infotainment Systems (2024-2032) ($MN)
  • Table 28 Global Bridging Chips Market Outlook, By Automation Equipment (2024-2032) ($MN)
  • Table 29 Global Bridging Chips Market Outlook, By Routers/Switches (2024-2032) ($MN)
  • Table 30 Global Bridging Chips Market Outlook, By Base Stations (2024-2032) ($MN)
  • Table 31 Global Bridging Chips Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 32 Global Bridging Chips Market Outlook, By End User (2024-2032) ($MN)
  • Table 33 Global Bridging Chips Market Outlook, By Consumer Electronics Manufacturers (2024-2032) ($MN)
  • Table 34 Global Bridging Chips Market Outlook, By Telecommunication Service Providers (2024-2032) ($MN)
  • Table 35 Global Bridging Chips Market Outlook, By OEMs (Original Equipment Manufacturers) (2024-2032) ($MN)
  • Table 36 Global Bridging Chips Market Outlook, By Aftermarket (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.